Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), and NVIDIA (NASDAQ: NVDA) today announced an expansion of their strategic collaboration to deliver the most-advanced infrastructure, software and services to power customers' generative artificial intelligence (AI) innovations. The companies will bring together the best of NVIDIA and AWS technologies—from NVIDIA's newest multi-node systems featuring next-generation GPUs, CPUs and AI software, to AWS Nitro System advanced virtualization and security, Elastic Fabric Adapter (EFA) interconnect, and UltraCluster scalability—that are ideal for training foundation models and building generative AI applications.

The expanded collaboration builds on a longstanding relationship that has fueled the generative AI era by offering early machine learning (ML) pioneers the compute performance required to advance the state-of-the-art in these technologies.

TrendForce's latest research into the HBM market indicates that NVIDIA plans to diversify its HBM suppliers for more robust and efficient supply chain management. Samsung's HBM3 (24 GB) is anticipated to complete verification with NVIDIA by December this year. The progress of HBM3e, as outlined in the timeline below, shows that Micron provided its 8hi (24 GB) samples to NVIDIA by the end of July, SK hynix in mid-August, and Samsung in early October.

Given the intricacy of the HBM verification process—estimated to take two quarters—TrendForce expects that some manufacturers might learn preliminary HBM3e results by the end of 2023. However, it's generally anticipated that major manufacturers will have definite results by 1Q24. Notably, the outcomes will influence NVIDIA's procurement decisions for 2024, as final evaluations are still underway.

MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Based on TSMC's 2nd generation 4 nm process, the Dimensity 8300 has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm's latest v9 CPU architecture. With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. Additionally, the Dimensity 8300's Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Plus, the chipset's impressive memory and storage speeds ensure users can enjoy smooth and dynamic experiences in gaming, lifestyle applications, photography, and more.

With the reality of high performance Arm processors from Apple and Qualcomm threatening Intel's market share in the client computing space, Intel is working on learner more PCB-efficient client SoCs that can take the fight to them, while holding onto the foundations of x86. The first such form-factor of processors are dubbed -MX. These are essentially -U segment processors with memory on package, to minimize PCB footprint. Intel has fully integrated the PCH into the processor chip with "Meteor Lake," with PCH functions scattered across the SoC and I/O tiles of the processor. An SoC package with dimensions similar to those of -UP4 packages meant for ultrabooks, can now cram main memory, so the PCBs of next-generation notebooks can be further compacted.

Intel had recently shown Meteor Lake-MX packages to the press as a packaging technology demonstration in its Arizona facility. It's unclear whether this could release as actual products, but in a leaked company presentation, confirmed that its first commercial outing will be with Lunar Lake-MX. The current "Alder Lake-UP4" package measures 19 mm x 28.5 mm, and is a classic multi-chip module that combines a monolithic "Alder Lake" SoC die with a PCH die. The "Meteor Lake-UP4" package measures 19 mm x 23 mm, and is a chiplet-based processor, with a Foveros base tile that holds the Compute (CPU cores), Graphics (iGPU), SoC and I/O (platform core-logic) tiles. The "Lunar Lake-MX" package is slightly larger than its -UP4 predecessors, measuring 27 mm x 27.5 mm, but completely frees up space on the PCB for memory.

MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with today's introduction of the company's new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.

AMI is pleased to announce that it has become one of the first Independent Firmware Vendors (IFV) to receive the Arm SystemReady SR v2.4 with Security Interface Extension (SIE) v1.2 certificate for the NVIDIA GH200 P4352 Reference Platform with AMI's Aptio V System Firmware solution. This marks another noteworthy achievement for AMI's solutions as they continue to enable Arm SystemReady SR certificates on NVIDIA GH200-based platforms. "The certification allows them to bet on a wide range of software applications, infrastructure solutions, firmware, and even entire operating systems with drivers that may have never been run before on our latest silicon before with the confidence that it "just works," says Ian Finder, Principal Product Lead, Grace at NVIDIA.

As the leading UEFI and BMC firmware provider for the Arm and x86 ecosystem, AMI recognizes the significance of the Arm SystemReady certification program, ensuring that Arm-based systems and solutions "just work" out of the box with standard operating systems, hypervisors, and software. AMI is focused on delivering interoperable, scalable, and secure foundational firmware solutions to the Arm ecosystem to reduce development and maintenance costs while enhancing reliability and hardware support.

During its Ignite conference, Microsoft introduced a duo of custom-designed silicon made to accelerate AI and excel in cloud workloads. First of the two is Microsoft's Azure Cobalt 100 CPU, a 128-core design that features a 64-bit Armv9 instruction set, implemented in a cloud-native design that is set to become a part of Microsoft's offerings. While there aren't many details regarding the configuration, the company claims that the performance target is up to 40% when compared to the current generation of Arm servers running on Azure cloud. The SoC has used Arm's Neoverse CSS platform customized for Microsoft, with presumably Arm Neoverse N2 cores.

The next and hottest topic in the server space is AI acceleration, which is needed for running today's large language models. Microsoft hosts OpenAI's ChatGPT, Microsoft's Copilot, and many other AI services. To help make them run as fast as possible, Microsoft's project Athena now has the name of Maia 100 AI accelerator, which is manufactured on TSMC's 5 nm process. It features 105 billion transistors and supports various MX data formats, even those smaller than 8-bit bit, for maximum performance. Currently tested on GPT 3.5 Turbo, we have yet to see performance figures and comparisons with competing hardware from NVIDIA, like H100/H200 and AMD, with MI300X. The Maia 100 has an aggregate bandwidth of 4.8 Terabits per accelerator, which uses a custom Ethernet-based networking protocol for scaling. These chips are expected to appear in Microsoft data centers early next year, and we hope to get some performance numbers soon.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

Arm Holdings plc (Nasdaq: ARM, "Arm") and Raspberry Pi Ltd today announced an agreement by Arm to make a strategic investment in Raspberry Pi. Arm has acquired a minority stake in Raspberry Pi, further extending a successful long-term partnership between the two companies as they collaborate to deliver critical solutions for the Internet of Things (IoT) developer community.

As the demand for edge compute accelerates, with the proliferation of more demanding IoT and AI applications, Raspberry Pi's solutions are putting the power of low-cost, high-performance computing into the hands of people and businesses all over the world. This investment further cements a partnership that began in 2008, and which has seen the release of many popular Arm-based Raspberry Pi products for students, enthusiasts and commercial developers. Raspberry Pi's most recent flagship product, Raspberry Pi 5, became available at the end of October.

Qualcomm Snapdragon X is out to change the thin-and-light notebook market, and is out to eat the lunches of U-segment and possibly P-segment processors from Intel and AMD. The Arm based processor promises to be a competitor to Apple's M2 and M2 Max SoCs powering the latest generation of Macbooks, so Windows 11 and Chrome OS-based thin-and-lights could offer similar levels of performance and battery life. Geekerwan put the Adreno iGPU of the Snapdragon X Elite through a couple of benchmarks to show how they compare to the iGPUs of contemporary 15 W to 28 W class SoCs across Arm and x64 machine architectures, and a discrete NVIDIA GeForce RTX 3050 Laptop GPU.

In the 3DMark Wildlife Extreme benchmark, designed for graphics solutions of this class, the Snapdragon X Elite scored 39.2 FPS (average), compared to 60 FPS of the Apple M2 Max, 40 FPS of the Apple M2. The Core i7-13700H "Raptor Lake" is a 45 W mobile processor with an Intel Xe-LP based iGPU that has 96 EU. This chip scored just 22.5 FPS in this test. The surprise here is the Radeon 780M, the iGPU of the AMD Ryzen 7 7840HS, based on the latest RDNA3 architecture, with 12 compute units (768 stream processors). This chip did just 28 FPS, falling behind even the M2. The other benchmark is "Control" at 1080p with its lowest graphics settings, and here the results are fundamentally different. With "Control," we see the Snapdragon X Elite post a respectable 53 FPS, which is almost as fast as the 56 FPS by the Radeon 780M powering the Ryzen 7 7740HS, but ahead of the 43 FPS put by the Apple M2, and a whopping 145 FPS by the M2 Max.

During the Q3 2023 earnings call, Intel CEO Pat Gelsinger was answering some questions from analysts regarding the company's future and its position on emerging competition. One of the most significant problems the company could face is the potential Arm-based chip development not coming from x86 vendors like Intel and AMD. Instead, there could be fierce competition in the near future with the recently announced Qualcomm Snapdragon Elite X, possible NVIDIA Arm-based PC processor, and in the future, even more Arm CPU providers that Intel would have to compete against in the client segment. During the call, Pat Gelsinger noted that "Arm and Windows client alternatives, generally, they've been relegated to pretty insignificant roles in the PC business. And we take all competition seriously. But I think history as our guide here, we don't see these potentially being all that significant overall. Our momentum is strong. We have a strong roadmap."

Additionally, the CEO noted: "When thinking about other alternative architectures like Arm, we also say, wow, what a great opportunity for our foundry business." If the adoption of Arm-based CPUs for Windows PCs becomes more present, Intel plans to compete with its next-generation x86 offerings like Meteor Lake, Arrow Lake, Lunar Lake, and even Panther Lake in the future. As stated, the CEO expects the competition to manufacture its chips at Intel's foundries so that Intel can provide a platform for these companies to serve the PC ecosystem.

According to sources close to Reuters, NVIDIA is reportedly developing its custom CPUs based on Arm instruction set architecture (ISA), specifically tailored for the client ecosystem, also known as PC. NVIDIA has already developed an Arm-based CPU codenamed Grace, which is designed to handle server and HPC workloads in combination with the company's Hopper GPU. However, as we learn today, NVIDIA also wants to provide CPUs for PC users and to power Microsoft's Windows operating system. The push for more vendors of Arm-based CPUs is also supported by Microsoft, which is losing PC market share to Apple and its M-series of processors.

The creation of custom processors for PCs that Arm ISA would power makes the decades of x86-based applications either obsolete or in need of recompilation. Apple allows users to emulate x86 applications using the x86-to-Arm translation layer, and even Microsoft allows it for Windows-on-Arm devices. We are left to see how NVIDIA's solution would compete in the entire market of PC processors, which are expected to arrive in 2025. Still, the company could make some compelling solutions given its incredible silicon engineering history and performant Arm design like Grace. With the upcoming Arm-based processors hitting the market, we expect the Windows-on-Arm ecosystem to thrive and get massive investment from independent software vendors.

Phytium, a Chinese semiconductor company that faced U.S. government sanctions from 2021, has introduced its latest data center processor, the 64-core Feiteng Tengyun S2500. Designed for cloud and high-performance computing applications, this processor features a large-capacity shared L3 cache, enhanced security capabilities for cloud servers, and improved memory subsystem reliability. The Feiteng Tengyun S2500 features 64 FTC661 cores developed by Phytium, which are based on Armv8 ISA. Reportedly, the CPU features 64 MB of L3 cache and 512 KB of L2 per core, bringing the total to 96 MB of processor cache. Compared to the previous generation line, the S2500 brings an L3 cache and TDP of 150 Watts, up from 90 Watts of previous generation.

This is Phytium's first new CPU in several years, raising questions about its production capacity and access to foundries, given its sanctions-related restrictions. It is currently unknown which foundry will manufacture the Feiteng Tengyun S2500, and we expect to hear more about it as (if) units get shipped. So far only display units have made appearance. Nonetheless, the company has continued its hardware development efforts and garnered interest in collaborating with Huawei to unify hardware and software ecosystems, which has yet to come to fruition.

Realizing the full potential of next-generation deep learning requires highly efficient AI infrastructure. For a computing platform to be scalable and cost efficient, optimizing every layer of the AI stack, from algorithms to hardware, is essential. Advances in narrow-precision AI data formats and associated optimized algorithms have been pivotal to this journey, allowing the industry to transition from traditional 32-bit floating point precision to presently only 8 bits of precision (i.e. OCP FP8).

Narrower formats allow silicon to execute more efficient AI calculations per clock cycle, which accelerates model training and inference times. AI models take up less space, which means they require fewer data fetches from memory, and can run with better performance and efficiency. Additionally, fewer bit transfers reduces data movement over the interconnect, which can enhance application performance or cut network costs.

Socionext today announced a collaboration with Arm and TSMC for the development of an innovative power-optimized 32-core CPU chiplet in TSMCʼs 2 nm silicon technology, delivering scalable performance for hyperscale data center server, 5/6G infrastructure, DPU and edge-of- network markets.

The engineering samples are targeted to be available in 1H2025. This advanced CPU chiplet proof-of-concept using Arm Neoverse CSS technology is designed for single or multiple instantiations within a single package, along with IO and application-specific custom chiplets to optimize performance for a variety of end applications.

The drawn out merger talks between Kioxia and Western Digital's memory and NAND flash manufacturing businesses appears to have hit an unexpected bump on the road, in the shape of SK Hynix according to the Nikkei. As it happens, SK Hynix holds an indirect stake in Kioxia and as such, they need to approve the merger for it to be able to happen. Today, SK Hynix is the second biggest manufacturer of NAND flash, somewhat behind Samsung, but if the Kioxia WD merger were to take place, SK Hynix would be pushed into a third place in the market, which wouldn't benefit the company.

As such, SK Hynix is trying to push for a rather odd option for Kioxia, where SK Hynix wants Japanese SoftBank—who owns among other things, Arm—to step in as a partner with Kioxia. However, what SK Hynix seems to have forgotten is that WD's memory chips are made in the same fab as Kioxia's and it's highly unlikely that WD would be keen on seeing this last minute proposal by SK Hynix play out. The Kioxia WD merger would result in a new company where Kioxia would own 63 percent and WD 37 percent, based on current assets. However, WD is meant to add further capital to the merger, so it can get a 50.1 percent stake in the final company for its shareholders, with Kioxia ending up with 49.9 percent.

Synopsys today announced it has expanded its collaboration with Arm to provide optimized IP and EDA solutions for the newest Arm technology, including the Arm Neoverse V2 platform and Arm Neoverse Compute Subsystem (CSS). Synopsys has joined Arm Total Design where Synopsys will leverage their deep design expertise, the Synopsys.ai full-stack AI-driven EDA suite, and Synopsys Interface, Security, and Silicon Lifecycle Management IP to help mutual customers speed development of their Arm-based CSS solutions. The expanded partnership builds on three decades of collaboration to enable mutual customers to quickly develop specialized silicon at lower cost, with less risk and faster time to market.

"With Arm Total Design, our aim is to enable rapid innovation on Arm Neoverse CSS and engage critical ecosystem expertise at every stage of SoC development," said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business at Arm. "Our deep technical collaboration with Synopsys to deliver pre-integrated and validated IP and EDA tools will help our mutual customers address the industry's most complex computing challenges with specialized compute."

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced four new GIGABYTE R-series servers for AmpereOne Family of processors for cloud-native computing where high compute density per rack and power-efficiency matter.

For cloud-native computing, hyperscalers or cloud service providers (CSPs) rely on predictable high-performance, scalable infrastructure, and power efficient nodes. GIGABYTE servers running the AmpereOne Family platform achieve those expectations, but this is not the first time GIGABYTE has worked with Ampere Computing. The partnership first started in 2020 with the launch of the Ampere Altra platform. And this new family of AmpereOne processors will not supersede the Altra platform, rather it is an extension of what Arm architecture is capable of by Ampere Computing. For instance, the CPU core count goes beyond 128 cores in Altra to 136-192 cores in AmpereOne for new levels of performance and VM density. On top of that, the private L2 cache per core has doubled and there is support for DDR5 memory and PCIe Gen 5.

Ever since the creation of A64FX for the Fugaku supercomputer, Fujitsu has been plotting the development of next-generation CPU design for accelerating AI and general-purpose HPC workloads in the data center. Codenamed Monaka, the CPU is the latest creation for TSMC's 2 nm semiconductor manufacturing node. Based on Armv9-A ISA, the CPU will feature up to 150 cores with Scalable Vector Extensions 2 (SVE2), so it can process a wide variety of vector data sets in parallel. Using a 3D chiplet design, the 150 cores will be split into different dies and placed alongside SRAM and I/O controller. The current width of the SVE2 implementation is unknown.

The CPU is designed to support DDR5 memory and PCIe 6.0 connection for attaching storage and other accelerators. To bring cache coherency among application-specific accelerators, CXL 3.0 is present as well. Interestingly, Monaka is planned to arrive in FY2027, which starts in 2026 on January 1st. The CPU will supposedly use air cooling, meaning the design aims for power efficiency. Additionally, it is essential to note that Monaka is not a processor that will power the post-Fugaku supercomputer. The post-Fugaku supercomputer will use post-Monaka design, likely iterating on the design principles that Monaka uses and refining them for the launch of the post-Fugaku supercomputer scheduled for 2030. Below are the slides from Fujitsu's presentation, in Japenese, which highlight the design goals of the CPU.

Qualcomm is poised to significantly rebrand its PC chip lineup as it transitions from the existing 8cx series to the Snapdragon X Series, designed to differentiate its PC chips from Snapdragon processors in mobile devices. The new Snapdragon X Series will incorporate Qualcomm's Oryon CPU SKU, based on Nuvia's IP and praised for its advanced performance and power efficiency. In addition to the new CPU core, Qualcomm also plans to use a dedicated NPU for accelerating on-device AI applications. However, questions remain regarding the reactions of hardware partners, particularly in response to Qualcomm's request for proprietary power management integrated circuits (PMICs) to be used alongside Oryon SoCs.

This strategic rebranding also entails new logos and badges for the system, symbolizing the shift in the product lineup, and the company plans to introduce a simplified tiering structure for its PC ecosystem. Qualcomm currently holds a dominant position as an Arm-based SoC manufacturer for Windows-on-Arm devices. With this rebranding, Qualcomm hopes to position itself competitively in performance and in marketing as well, with established PC chip providers like AMD and Intel, potentially expanding Arm's market share in the PC industry. Further insights and details regarding the Snapdragon X Series will be revealed during the forthcoming Snapdragon Summit, scheduled from October 24 to 26.

It has been over four years since the release of the Raspberry Pi 4, and in that time a lot has changed in the maker board and single-board computer landscape. For the Raspberry Pi Foundation there were struggles with worldwide demand and production capacity brought on by the global pandemic starting in 2020, and plenty of new competitors came to the scene to offer ready to order alternatives to the venerable RPi 4. Today however the production woes have been assuaged and a new generation of Raspberry Pi is here; the Raspberry Pi 5.

Raspberry Pi 5 is being announced in advance of availability unlike every prior RPi device launch. Pre-orders are open with many of the listed Approved Resellers on RPi's website starting today but unit shipments aren't expected until near the end of October 2023. As part of this pre-order scheme, RPi Foundation is withholding pre-orders from bulk customers and will be dealing in single-unit sales for individuals until at least the end of the year, as well as running some promotions with The MagPi and HackSpace magazines to give priority access to their subscribers. Genuinely nice to see, considering how hard it was to obtain a Pi 4 for the average Joe over the last couple years. The two announced prices for the RPi 5 are $60 USD for the 4 GB variant, and $80 USD for the 8 GB variant; or about $5 USD more than current reseller pricing on comparable configurations of the Raspberry Pi 4.

Taiwan Semiconductor Manufacturing Company (TSMC) yesterday made the announcement that it has approved an investment in Arm Holdings Plc. The market leader in contract chipmaker is prepared to spend around $100 million, upon the UK-headquartered semiconductor design firm going public. Regulatory filing information has SoftBank Group aiming to raise about $4.87 billion with its initial public offering (IPO) of Arm. The listing has, so far, attracted a number of "cornerstone investors" including NVIDIA, Intel, AMD, Apple, Samsung Electronics and Alphabet.

Mark Liu, TSMC's chairman, stated last week that "Arm is an important element of our ecosystem, our technology and our customers' ecosystem. We want it to be successful, we want it to be healthy. That's the bottom line." The spending spree announcements also extended to something Team Blue related—TSMC declared that it has reached an agreement with Intel to purchase a 10% equity interest in IMS Nanofabrication Global, LLC. This deal is valued at roughly $432.8 million. Intel has already sold 20% of IMS to Bain Capital, but it still retains majority ownership—the two business deals valued IMS Nanofabrication at approximately $4.3 billion, according to an Intel statement.

British semiconductor specialist firm, Arm Ltd., has has confirmed that it will be offering its clients the option to license "SoC solutions," as opposed to the usual model of paying for intellectual properties. A new Bloomberg article reaffirms previous claims that Arm's engineering department was beavering away on reference chip designs. An IPO filing, registered with the SEC, reveals that various system-on-chip designs are in the pipeline—likely targeting fast-growing tech markets.

An Arm statement explained: "More recently, we have invested in a holistic, solution-focused approach to design, expanding beyond individual design IP elements to providing a more complete system. By delivering SoC solutions optimized for specific use cases, we can ensure that the entire system works together seamlessly to provide maximum performance and efficiency. At the same time, by designing an increasingly greater portion of the overall chip design, we are further reducing incremental development investment and risk borne by our customers while also enabling us to capture more value per device." Arm is probably keen to boost its profit margins, and become more attractive in the eyes of potential investors—lately their designs have been implemented in more expensive product segments, namely automotive, client PCs, and cloud data center solutions.

We heard rumblings about Intel considering a stake in Arm earlier this summer—Reuters picked up on the multinational corporation's leadership negotiating with Japan's SoftBank about becoming a potential anchor investor in the latter's initial public offering (IPO) of Arm Holdings plc. Several big players have reportedly been courted as key strategic partners—Arm already counts some of these corporations as major clients and business partners. The looming IPO has an estimated value of around $60 billion and $70 billion. Intel has made their investment public today, as announced this morning by Stuart Pann, Senior Vice President and General Manager of Foundry Services.

Pann elaborated on his company's major strategic decision, during proceedings at the Goldman Sachs Communacopia & Technology Conference: "80% of TSMC wafers have an Arm processor in them...The fact that our organization, the IFS organization, is embracing Arm at this level, investing in Arm, doing partnerships with Arm should give you a signpost that we are absolutely serious about playing this business. Because if you are not working with Arm, you cannot be a foundries provider." Despite competing in several market segements, Intel Foundry Services (IFS) and Arm announced a multi-generation agreement, earlier this year, to enable chip designers to build low-power compute system-on-chips (SoCs) on the former's 18A process. The now tighter relationship appears to be steering Team Blue back to formerly abandoned pastures—Pann stated: "Our focus will be for now, much more on ARM and around RISC-V, because that is where the volumes is at, but expect more to come out in the coming months...For example, we announced something with Arm, we will do more with them, clearly as they expand their base. They have multiple interests in multiple areas, and they have been a superb partner."

Maxon, developers of professional software solutions for editors, filmmakers, motion designers, visual effects artists and creators of all types, is thrilled to announce the highly anticipated release of Cinebench 2024. This latest iteration of the industry-standard benchmarking software, which has been a cornerstone in computer performance evaluation for two decades, sets a new standard for performance evaluation, embracing cutting-edge technology to provide artists, designers, and creators with a more accurate and relevant representation of their hardware capabilities.

Redshift Rendering Engine Integration
Cinebench 2024 ushers in a new era by embracing the power of Redshift, Cinema 4D's default rendering engine. Unlike its predecessors, which utilized Cinema 4D's standard renderer, Cinebench 2024 utilizes the same render algorithms across both CPU and GPU implementations. This leap to the Redshift engine ensures that performance testing aligns seamlessly with the demands of modern creative workflows, delivering accurate and consistent results.