AMD Zen 2 Architecture: Socket AM4, 2019, Code-named "Matisse"
AMD's Zen-based Ryzen and Threadripper have been said by the company as representing the "worst case scenario" of performance for their architecture. This is based on the fact that there are clear areas for improvement that AMD's engineers were keenly aware of even at the moment of Zen's tapping-out; inadvertently, some features or improvements were left on the chopping block due to time and budget constraints. As unfortunate as this is - who wouldn't love to have even more performance on their AMD processors - this also means AMD has a clear starting point in terms of improving performance of their Zen micro-architecture.
Spanish website Informatica Cero have gotten their hands on what they say is an exclusive, real piece of information from inside AMD, which shows the company's CPU roadmap until 2019, bringing some new details with it. On the desktop side, there's mention of AMD's "Pinacle Ridge" as succeeding the current Zen-based "Summit Ridge" Ryzen CPUs in 2018. These leverage the same Summit Ridge architecture, but with a performance uplift; this plays well into those reports of 12 nm being used to manufacture the second-generation Ryzen: it's an AMD tick, so to say. As such, the performance uplift likely comes from increased frequencies at the same power envelope, due to 12 nm's denser manufacturing design.
Spanish website Informatica Cero have gotten their hands on what they say is an exclusive, real piece of information from inside AMD, which shows the company's CPU roadmap until 2019, bringing some new details with it. On the desktop side, there's mention of AMD's "Pinacle Ridge" as succeeding the current Zen-based "Summit Ridge" Ryzen CPUs in 2018. These leverage the same Summit Ridge architecture, but with a performance uplift; this plays well into those reports of 12 nm being used to manufacture the second-generation Ryzen: it's an AMD tick, so to say. As such, the performance uplift likely comes from increased frequencies at the same power envelope, due to 12 nm's denser manufacturing design.