OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) high-speed DDR3 desktop memory, providing the optimal balance of performance and power efficiency in one solution. Committed to staying ahead of the curve, OCZ is offering enthusiast-grade memory that complies with the latest JEDEC "DDR3L" low-voltage standards which ensures that system RAM runs cooler and more efficiently during intensive multi-tasking, gaming, and productivity applications.

"We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings."

At the keynote of Intel Developer Forum 2010, the silicon giant gave a sneak-peak into its upcoming processor brand, revealing new product logos (case badges), and a die-shot of the Sandy Bridge quad-core silicon. Intel retains the Core i3, Core i5, and Core i7 brand identifiers, but refers to the family of processors based on the Sandy Bridge architecture as second-generation Core processors or the 2011 Intel Core processors. For the same reason, processor model numbers start with the 2000 series as detailed in this article.

The die shot reveals integration of the IGP-embedded northbridge component completely into the processor die. In "Clarkdale" Core i3 and Core i5 processors, the northbridge component was present on a separate die from the CPU die, with a QPI link connecting the two dies on the same package. The Sandy Bridge quad-core die is known to feature 6 MB of L3 cache, a dual-channel DDR3 IMC, and a DirectX 10.1 compliant graphics processor. Apart from merely driving graphics, the IGP also feature several media-acceleration features that speed up video encoding. Sandy Bridge is fabricated on the 32 nanometer HKMG process. The evolution of Intel's architectures is shown on the last picture. The "Nehalem" chip there is the Lynnfield quad-core processor that completely lacks an IGP, "Westmere" is the Clarkdale dual-core processor that has an IGP and memory controller on a second (larger) 45 nm die. The chip to the right is a 32 nm Sandy Bridge that integrates a quad-core chip with an IGP-embedded northbridge.

Samsung Electronics Co., Ltd, a global leader in digital media and digital convergence technologies, today announced the launch of the SF series of ultra-portable notePCs and NF series netbooks. Without compromising on powerful performance and enhanced features, the Samsung SF Series notePCs and NF Series netbooks set a new standard for design in mobile computing.

Coupling a unique, streamlined design with optimal features for mobile convenience, the new lineup of SF series notePCs and NF series netbookshave been designed to match the dynamic and ever-changing lives of mobile users. Smooth and refined body design attracts the most sophisticated of today's computer users.

AMD's answer to a lot of Intel's processors in the low-power category, be it the Core i3/i5 "Clarkdale", Core CULV, or even the Atom, seems to have finally taken shape with "Bobcat". This processor is a major design overhaul, as it integrates a number of key components, including a GPU. Since the GPU component is so complex and integrated with the rest of the processor at such a level, AMD decided to name the processor an "Accelerated Processing Unit" or APU. Beyond just driving video and 3D graphics, the GPU component of Bobcat is designed to lend a hand to the CPU cores whenever needed.

The GPU doubles up as a raw SIMD engine array that works with applications over OpenCL and ATI Stream technologies to step up performance. The "Bobcat" Fusion APU integrates x86 processor cores with a high-performance switch that doubles up as a memory controller, which connects to a SIMD engine, a UVD display controller, and platform interfaces that include connection to the southbridge chipset and display I/O.

Targeting the "back to school" shopping season, Toshiba announced two new Satellite Pro notebooks based on the Intel Calpella platform, the 15.6 inch Satellite Pro S500-131, and the 17.3 inch Satellite Pro L670-172. Despite the Satellite Pro series traditionally catering to the mobile performance segment, Toshiba seems to have adopted a "value" approach, with the two being priced at just 649 EUR and 749 EUR, respectively. The 17.3 inch L670-172 has an LED-backlit display with 1600 x 900 pixels resolution, and is driven by the Intel Core i3-350M dual-core processor running at 2.26 GHz, with 3 MB of cache. It is backed up by 4 GB of memory, a 320 GB hard drive, and DVD writer drive.

The 15.6 inch Satellite Pro S500-131 carried an LED-backlit screen with 1366 x 768 pixels resolution, the same Core i3-350M processor, but with 2 GB of memory. Both models make use of Intel's integrated graphics, are powered by Windows 7 Home Premium 64-bit, and offer connectivity that includes gigabit Ethernet, WiFi b/g/n, and battery life of up to 4 hours, but the 17.3 inch model also offers a multi-gesture trackpad and Bluetooth. Toshiba's new notebooks are available in Europe starting now.

Having turned its most profitable quarter, Intel is banking on its vast lineup of the 2010 Core processors, which will be updated towards the end of the year. By 2011, Intel will have a new series of second generation Core i7, Core i5, and Core i3 processors, based on a brand new architecture, and built for new sockets and chipsets. A roadmap of the same reached sections of the European media, which shows the company to be almost ready with a full-fledged lineup of desktop processors covering most price-points, by 2011.

The new architecture on which these processors are based is referred to by Intel as "Sandy Bridge", key features of which include the inclusion of the new Advanced Vector Extensions (AVX), a more advanced instruction set than SSE, to accelerate complex applications. AVX aside, there's Turbo Boost technology 2.0 that comes with even smarter algorithms to automatically manage clock speeds of individual processor cores to maximize performance within the processor's TDP envelope, AES-NI, which is a more manageable hardware data encryption instruction set, and processors with integrated graphics (IGP) controllers will have even faster ones, because Intel will be relocating the IGP and memory controller to the same die as the processor cores, this IGP is referred to as Intel "GT2" graphics.

Over half an year after its introduction, Zotac's feature-rich H55-ITX WiFi motherboard got a minor (or major, depending on your application) specification update, with the company dropping in USB 3.0 support. Making use of the common NEC controller, the board features two USB 3.0 ports on its rear-panel. The new model is thus named H55U3 WiFi. Sticking strictly to the mini-ITX specs, the H55U3 is a socket LGA1156 motherboard supporting processors with TDP of up to 95W, which translates to all dual-core Core i3, i5 processors with room for light overclocking, and quad-core Core i5, i7 with no overclocking.

Being based on the Intel H55 chipset, it supports Intel FDI, connecting processors with Intel HD graphics to display connectors that include DVI and HDMI. The socket is wired to two DDR3 DIMM slots for dual-channel memory, and one PCI-Express 2.0 x16 slot. Connectivity includes six SATA 3 Gb/s from the H55 PCH, 8-channel HD audio with optical SPDIF, WiFi b/g/n, gigabit Ethernet, eSATA, USB 2.0, and USB 3.0. The board uses ATX 24+4 pin power input. Zotac's H55U3 WiFi has started selling in China for US $118.

Eurocom launches line of gamer-friendly notebooks with Optimus, the latest in graphics switching technology from NVIDIA. Eurocom's new line of gamer-friendly notebooks features NVIDIA's Optimus technology, which intelligently switches graphics between 1GB DDR3 NVIDIA GeForce GT330M and Intel HD integrated graphics to deliver optimal battery life (up to 240 minutes).

It also offers a choice of 15.6" and 17.3" Full HD 1920x1080 displays and comes with Intel Core i5 and Core i7 technology. The Eurocom Fox line is available for order today starting at $999 for 15.6" B5100M FOX and $1199 for 17.3" B7110 FOX model.

Apple today announced a large-scale refresh of its Mac line of computers. The refresh includes new models, and hardware updates on existing ones. Highlights include: 1. a complete transition to Intel 2010 Core Series processors (i3/i5/i7, across the board), a speed step up on existing SKUs, and a brilliant new Cinema display. To begin with, the entire range of iMac desktops now feature Core i3/i5/i7 processors, moving forward from Core 2 Duo that featured on the lower models. The lineup starts with Core i3 processors with speeds of up to 3.06 GHz (at the 21.5" $1,199 point), Core i3 3.20 GHz (at 21.5" $1,499 and 27" $1,699 points), and 2.80 GHz Core i5 quad-core (at the 27" $1,999 point).

Earlier, the 27", $1,999 model featured a 2.66 GHz Core i5 processor. Each of these models optionally offer faster processors. While the 21.5" $1,199 model packs ATI Radeon HD 4670 512 MB graphics, the $1,499 and $1,699 models come with ATI Radeon HD 5670 512 MB graphics, and the 27" one packs ATI Radeon HD 5750 1 GB. All models pack 4 GB of dual-channel DDR3-1333 MHz memory.

Shuttle Inc., a leading developer and manufacturer of multi-form-factor solutions such as the world-famous XPC Mini-PC Barebones, today announces the launch of its new XPC Barebone SH55J2. Now, for the first time, a single Mini-PC supports all Intel Core variants for socket 1156.

From today, the SH55J2 brings you a Mini-PC platform which utilizes all the features of the new Intel Core series - whether it is the integrated HD graphics chip, the turbo boost function or two and four CPU cores. The energy-efficient processor generation is ideally suited for Mini-PCs.

SilverStone is ready with a Nitrogon NT07 series CPU cooler compatible with the LGA1156 socket. Like the NT07-775 (made for LGA775), the NT07-1156 from SilverStone is a low-profile CPU cooler that is positioned to be a Intel reference HSF replacement. It bears resemblance with the Intel HSF, using essentially the same design, with its own additions of a base made entirely of copper, and manual speed control. The base conveys heat to a heatsink with spirally-projecting, forked, aluminum fins. A 90 mm fan circulates air, it measures 90mm (W) x 90mm (H) x 16mm (D), with two speed modes selectable by a tiny switch on the fan-frame: 1200~3000rpm ± 10% and 1200~1800rpm ± 10%; pushing 12~40 CFM / 12~23 CFM on the two modes, respectively.

The cooler measures 93mm (W) x 36.5mm (H) x 93mm (D), weighing 310 g. With LGA1156 push-pins, the cooler is easy to install and remove. It supports CPUs with TDP of up to 95W, which means that it should be able to run dual-core Core i3, Core i5 processors with mild overclocking, or quad-core Core i5, Core i7 within default speeds. The cooler will reach stores soon, it will be moderately priced around US $20.

Samsung Electronics, a global leader in digital media and digital convergence technologies, today announced the release of its Q-Series range of notebooks, the Q530, Q430 and Q330.

"We've designed the Q Series to offer the most exciting, powerful and stylish mobile computing experience on the market. Each model in the range will maximize mobile productivity through a combination of state-of-the-art features and ergonomic design," said Yonghwan Park, senior vice president, IT Solutions Business, Samsung Electronics. "The Q series line-up realizes the perfect IT experience, delivering both portability and performance without compromise."

A recent report by HKEPC shows that Intel will be cutting the prices of certain key SKUs to make them and the price-point they're targeting, more competitive. For instance, until now available for over US $500, and replaced by the Core i7 960, the Core i7 950 (LGA1366, 3.06 GHz, quad-core) chip will be placed at the $294 price-point, displacing the Core i7 930 2.80 GHz chip.

With the value segment, the socket LGA1156 Core i3 500 series chips will have a new SKU, the Core i3 560. This dual-core chip is clocked at 3.33 GHz, and priced at $138. Intel has recently released its new $200 LGA1156 quad-core chip, the Core i5 760 2.80 GHz. The new pricing will be effective from August 29.

MSI, the global leading brand in All-in-One PC, today announced the release of its new high-end performance All-in-One PC model featuring the all-new Intel Core i5/i3 series processors: The Wind Top AE2280.The Wind Top AE2280 comes with a glossy 21.5" 16:9 cinematic widescreen display with Full HD 1080p high resolution and multi-touch capabilities. Featuring the all-new Intel Core i5/i3 series processors, enhanced performance and intelligent multifunction operation, it allows for even more efficient handling of daily work tasks. And with the ATI Mobility Radeon HD series discrete graphics card, you can enjoy a more detailed and smoother picture when watching movies or playing 3D/HD games. The Wind Top AE2280 is also the world's first to feature Hollywood-grade THX TruStudio Pro audio performance technology that revolutionizes computer audio and video quality. As both a performance and home theatre All-in-One PC, it comes equipped with an abundance of MSI's exclusive touch control technologies that mark a new era in the computer user experience.

Intel Corporation introduced new Intel Core processors today, extending the availability of its award-winning Intel Core processor family to more stylish, ultra-thin laptops. Ultraportable laptops - less than an inch thick and weighing just 2 to 5 pounds - offer the performance, battery life and connectivity consumers need on-the-go.

Based on Intel's 32 nanometer (nm) technology manufacturing, the processors are more than 32 percent smaller1 and deliver more than 32 percent better performance, all in a lightweight, sleek design. These new processors also reduce power consumption3 more than 15 percent, resulting in great battery life.

The Intel juggernaut rolls on in Q1 2010, according the latest IDC report covering PC processor sales. Similar to the GPU market, processor sales grew by 39% compared to this time last year (Q1 2009), but declined by 5.6% compared to Q4 2009. Revenues went up 40.4% year-on-year and down just 2% sequentially. Intel's market share grew by 0.5%, slightly at the expense of AMD, which went down 0.6%.

Intel holds 81% of the processor market, while 'rival' AMD holds 18.8%. VIA holds a tiny 0.2% of the market. In the x86 server market, Intel holds 90.2%, with AMD and others at 9.8%. With the notebook and desktop segments it reached 87.8% and 71.7%, respectively. For 2010 IDC is predicting a CPU unit growth of 15.1%. Q1 2010 saw Intel propagating processors based on its new architecture to the crucial value and mainstream market segments, with the Core i3, Core i5, and Pentium dual-core processors in the LGA-1156 package.

Lenovo today is introducing a new Series of ThinkPad - the L Series. Designed for business, government and education customers, the ThinkPad L412 and L512 laptops feature high performance with the latest Intel processing technologies, military tough durability and strong web conferencing features in an affordable laptop starting under $700. Additionally, the laptops are the greenest on the market by integrating the highest amounts of post consumer recycled content.

The laptops come with technologies students and employees need to be productive in their daily work, like:

• Choices of the latest Intel Core i3 and i5 processors with Turbo Boost and Hyperthreading technologies
• 16:9 HD antiglare displays on the 14-inch L412 and 15-inch L512
• Choices of Intel integrated or ATI Mobility Radeon graphics
• 3G/4G wireless connectivity options with Gobi 2000 module support for AT&T, Sprint and Verizon
• Multitouch touchpads
• Up to 8 hours of battery life
• Expansion with 4 USB ports/1 powered, combo eSATA/USB port, support for DisplayPort and VGA
• Windows 7 with Lenovo Enhanced Experience featuring up to 57% faster bootup and shutdown

Today, HP introduced its first multitouch-enabled tablet for business users as well as notebook PCs tailored for both enterprise and small and midsize businesses (SMBs). The HP EliteBook 2740p starts at 1.73kg and includes a 12.1-inch diagonal LED display or optional outdoor-view display with less reflection and a higher contrast for easier viewing in natural light. The touchscreen option allows users to get work done more intuitively and faster based on their choice of input methods. Multitouch gestures, finger taps and swipes across the screen allow users to navigate through applications and menus, as well provide access to information and websites.

The HP EliteBook 2740p offers a variety of battery solutions for lightweight configurations, including a six-cell li-ion prismatic battery, which provides up to 5 hours of uptime, and an optional HP 2700 Ultra-Slim Battery that provides up to 11 hours when combined with the standard battery.

NEC gave its ValueStar W line of all-in-one PCs which it released last year a specifications upgrade. Variants feature Intel's new dual-core processors, with a choice between the Core i5 650 which runs at 3.20 GHz, and the Core i3 530 clocked at 2.93 GHz. Other features include 4 GB of DDR3 memory, 1 TB of storage, Blu-ray disc drive, and Intel integrated graphics. TV tuner and USB 3.0 controllers are also optional. Another major change is the Windows 7 Home Premium operating system, which takes place of Windows Vista, on the specs sheet. The PCs come with bezel colors of red, black and white. They feature screen sizes of 21.5" and 23", both with resolutions of 1920 x 1080 pixels.

Followed by Intel recent 32nm "Clarkdale" Core i5 / i3 processor launch with built-in GPU engine, it is now a brand new page and competition for all-in-one PC. BIOSTAR, a professional manufacturer of motherboards after its top-line H55 motherboards "TH55XE" being released, today we see another main stream board "TH55B HD" in the market remains high quality component design, outstanding over clocking capabilities and new colorful slots. And of course, it also offers more competitive prices.

"TH55B HD" - a member of BIOSTAR famous "T-Series" with Micro ATX form factor design, black color PCB, and supporting latest Intel 32nm "Clarkdale" Core i5 / i3 processor.

Shuttle, an industry leading designer and manufacturer of high-performance small form factor (SFF) PC solutions and creator of the XPC, today released details and images for the Shuttle models that will be showcased at the 2010 International CES, the world's largest tradeshow for consumer technology, from January 7-10, 2010.

Shuttle will be unveiling its forthcoming XPC models slated for release in the first half of the year, from the new J Series and re-designed All-In-One PC product lines. These models include the latest technology and new features from Intel, including the next-generation Intel Atom platform and the all new Intel Core i3, Intel Core i5, and Intel Core i7 processors.

EVGA introduced its lineup of three motherboards based on the new Intel H55 Express and H57 Express chipsets. These motherboards feature LGA-1156 sockets to support all current LGA-1156 Core i3, Core i5, and Core i7 processors. With the Intel Flexible Display Interface support, the boards let you make use of the integrated GPUs on some dual-core Intel Core i3, Core i5, and Pentium processors. Models include EVGA H57 (123-CD-E637-KR), EVGA H55 (123-CD-E635-KR), and EVGA H55V (111-CD-E630-TR), with the H55V being a micro-ATX model.

The EVGA H55 and EVGA H57 offer a little more than the chipset's feature-set, with Firewire, and additional storage controllers for IDE and two additional SATA 3 Gb/s ports. The two feature nearly identical board layouts with 5+1 phase CPU VRM, DVI and D-Sub for display connectivity, 8-channel audio, and a number of USB 2.0 ports. The EVGA H55 has one set of internal USB headers less, and does away with the PCI-Express x1 slots between the PCI-E 2.0 x16 and PCI-E x16 (x4) slots.

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel H55 and Intel H57 chipset and leveraging the success of the GIGABYTE Ultra Durable 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6 PC management tools, Dynamic Energy Saver 2 power saving utilities, DualBIOS and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.

"GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices," commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. "Featuring next generation storage capabilities including USB 3.0 and high performance digital DisplayPort connectivity, as well as GIGABYTE's own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system."

World-renowned mainboard and graphics card manufacturer, MSI, today officially released H57/H55 Intel chipset products that offer outstanding performance, effective heat dissipation and remarkable power efficiency and stability. After installation of the 32nm Intel Core i5 and Core i3 processors with graphics cores integrated, ultra-strong display performance and outstanding multi-display capability complement MSI's exclusive OC Genie one-second overclocking technology. This enhances 3D performance by up to 45%, allowing smooth BD movie playback, and seize the advantage while gaming.

MSI H57/H55 Series mainboards with built-in industry leading OC Genie auto overclocking technology: Just press the OC Genie button on the mainboard and within one second; enjoy auto overclocking and an optimized processor. Memory module and chipset setting values give overall 3D performance a boost of up to 45%. Whether users want to watch a high bit-rate HD movie or go online for some head-to-head gaming, both can be enjoyed with image performance that is smoother and lag-free.

Support for the latest generation of Intel Core i3, Core i5 and Core i7 takes the ZOTAC H55-ITX WiFi to performance levels previously unattainable by the mini-ITX form factor. The ZOTAC H55-ITX WiFi supports Intel QuickPath technology for lightning-fast communications to high-speed dual-channel DDR3 memory for superior bandwidth and quicker memory access that delivers the chart-topping performance enthusiasts and performance-hungry users desire.

"Since Intel announced its latest generation of Nehalem CPUs, there's been great demand for a mini-ITX platform for the CPUs, unfortunately the power consumption and heat output of the original Intel Core i7 900 series would've been too high for such a small form factor," said Carsten Berger, marketing director, ZOTAC International (MCO), Ltd. "With the latest generation of Intel Core i3, Core i5 and Core i7 processors, greater energy efficiency and improved thermal management, the ZOTAC H55-ITX WiFi is able to deliver a mini-ITX platform capable of accommodating the new high-performance processors with no compromises."