Team Group Inc., the world's leading memory brand, today announced the launch of the all new generation of luminous memory for gaming - Delta. Stability and performance are already the basic requirement for a high speed memory. With the ever growing gamers and modders, the appearance and the visual features of the product has become the new focus of gamers' attention. The all new Delta series from Team Group has inherited the excellence of Team Group's overclocking and mainstream memories. In addition, through the recent coalition with AVEXIR, we are able to combine its patented LED lighting technology with our aluminum forged high-efficiency heat spreader to create Delta, a bionic memory with pulse-like LED light effect.

Delta is Team Group's first visual style memory. It is using the exclusive LED luminous cooling system to provide a steady pulse rhythm and soothe gamer's nervous tension during an intense game, so the gamer is able to win with an optimum state. To satisfy gamers' demand for high performance memories, Delta releases two high specification memories, DDR4 2400 CL15-15-15-35 and DDR4 3000 CL16-16-16-36. And it also offers two packages, 4GBx2 and 8GBx2 for gamers to choose from. With computer modding trend on the rise around the globe, Delta is not only gamer's best companion, its red and black heat spreader design with breathing LED light in three colors of red, white and blue also provide modders more options to build various styles of PC.

More details of AMD's upcoming common socket for both its desktop APUs and high-end CPUs emerged from a recent article by Italian tech-site Bits-n-Chips. To begin with, AM4 will be an µOPGA (pin-grid array), in which the pins will continue to be located on the processor package, and contact points on the socket. The package will be square, and 40 mm in length, making it about as big as a current socket FM2+ package. It will have a pin-count of 1,331 pins, a big increase from the 942 pins of AM3+, and 906 pins of FM2+. AMD could continue to develop LGA sockets for its multi-socket capable Opteron processors based on the "Zen" architecture.

The AM4 platform layout will be functionally closer to that of the FM2+ than the AM3+. Besides the integrated memory controller, the northbridge will be entirely located on the processor die; and so the HyperTransport main system bus will be wired internally. Besides hundreds of electrical pins, the AM4 pin-map will consist of memory I/O, integrated graphics I/O, PCI-Express, and the chipset bus; besides other low-level system I/O interfaces. The memory controller on some of the first AM4 chips, such as "Summit Ridge," will natively support DDR4-2400 MHz, and DDR4-2933 MHz through overclocking.

To welcome the spring flower season, KINGMAX has launched a line of stylish gaming RAM with a metallic look. Colors such as jewel red, star blue and cool silver are sure to catch your eye. The gaming community has rushed to test and evaluate the ZEUS DDR4 instant-cooling heatsink since its release. It provides a number of high-performance gaming RAM combinations with speeds of 2800 MHz, 3000 MHz and up to 3200 MHz and single module memory of 4 GB, 8 GB and up to 16 GB.

That amount may even go up to a maximum of 32 GB as it also supports dual-channel memory with a heatsink. At the same time, the ZEUS DDR3 line has also been released with speeds of 1600 MHz, 1866 MHz and up to 2133 MHz, all possessing overclocking, low CAS latency and low voltage capabilities. This allows gamers to survive system upgrading waves brought about by Intel's new generation Skylake platform processors by comprehensively satisfying all system upgrade needs.

According to a leaked company slide doing rounds on the web, Intel plans to launch its workstation-grade Xeon "Broadwell-EP" processors by March 31, 2016. These chips will be branded under the Xeon E5-2600 V4 series. HP is ready with a workstation based on these chips, the HP Z640, which succeeds the Z620 that's driven by "Haswell-EP" Xeon chips. Dollar-for-Dollar, Intel is positioning the "Broadwell-EP" to offer at least "20% more cores and last-level cache" than "Haswell-EP."

This would mean Intel leveraging the 14 nm process to cram 10-core chips at the price of an 8-core chip from the previous generation, 8-core chips at the price of 6-core ones, and so on. The same slide mentions that "Broadwell-EP" offers, on average, 18% more performance than "Haswell-EP." Intel is also hinting at native support for DDR4-2400 MHz. Haswell-EP supports DDR4-2133 MHz.

QNAP Systems, Inc. today announced the release of the powerful Double Server TDS-16489U that integrates an application server and storage server into one chassis. Distinguishably powered by dual Intel Xeon E5 processors with up to 1TB RAM, the server-grade TDS-16489U supports Qtier Technology, 12Gb/s SAS and 10GbE/40GbE networks to provide unrivaled performance for Big Data computing and to assist enterprises in mission-critical tasks as a one-device solution for applications, storage and virtualization.

"The TDS-16489U resolves the difficulty of building virtualization environment infrastructures for businesses," said David Tsao, Product Manager of QNAP. "Its unrivaled power from its dual processors also facilitates Big Data computing to process the data deluge created by Internet of Things applications." With its server-grade hardware design, the TDS-16489U features two Intel Xeon E5-2600 v3 processors (with 4-core, 6-core and 8-core configurations), up to 1TB DDR4 2133MHz RDIMM/LRDIMM RAM (16 DIMM) and three independent SAS 12Gb/s controllers that deliver outstanding performance for data transmission and applications.

Intel announced its first "gaming grade" NUC. As if the very concept of NUC wasn't disruptive to the small form-factor desktop segment enough, the company is upping the ante with one that's prepped for gaming. Codenamed NUC6i7KYK, the new Skull Canyon NUC is about double the size of the average NUC. It has sufficient muscle for sub-1080p gaming, but is also prepped for external graphics solutions, such as the Razer Core.

To begin with, the Skull Canyon is driven by a Core i7-6770HQ processor based on the "Skylake" architecture. This quad-core chip features HyperThreading, which enables 8 logical CPUs, 6 MB of L3 cache, 128 MB L4 cache, and Intel Iris Pro Graphics 580. The CPU cores run at speeds between 2.60 GHz and 3.50 GHz, while the iGPU ticks at 950 MHz. With 576 execution units, 72 TMUs, and 9 ROPs, the integrated graphics core is good enough for gaming at sub-1080p resolutions such as 720p and 900p.

Razer, a world leader in connected devices and software for gamers, today announced its new Razer Blade gaming laptop. The Blade's specs have been improved across the board from its predecessor, and it is now more affordable than ever before. The new Razer Blade houses the latest 6th generation Intel Core i7 quad-core processor and an NVIDIA GeForce GTX 970M GPU with 6 GB of VRAM. PCIe SSD technology offers up to three times faster speeds than traditional solid-state drives. Killer Wireless-AC is included. All models will feature 16 GB of DDR4 dual-channel RAM.

All Razer Blade models also come with a stunning 3200x1800 QHD+ display. The laptop remains 0.70 inches thin, but now weighs only 4.25 pounds, making it even more portable than previous generations. The screen and internals are housed in a CNC-milled aircraft grade aluminum chassis. The Razer Blade - following Razer's Blade Stealth Ultrabook - will be the second laptop in the world equipped with individually backlit RGB keys. Millions of color options for the anti-ghosted keyboard are available thanks to Razer's Chroma technology.

The new AMD Radeon Pro Duo, announced earlier today, takes the crown for being the world's fastest graphics card. According to the company's internal testing, in which it compared the card to its previous-generation flagship Radeon R9 295X2, and NVIDIA's fastest card, the GeForce GTX TITAN Z, on 3DMark FireStrike, at resolutions of 1080p, 1440p, and 2160p; the Pro Duo was found to be as much as 51 percent faster than the GTX TITAN Z. The three cards were tested on a machine with a Core i7-5960X processor, 16 GB of quad-channel DDR4 memory, Windows 10, v15.301 driver for the AMD cards, and GeForce 361.91 drivers for the NVIDIA card.

At 1080p, the Radeon Pro Duo scores 20150 points, compared to 16717 points of the R9 295X2, and 14945 points of the GTX TITAN Z, the Radeon Pro Duo leads the GTX TITAN Z by 34.8 percent in this resolution. At 1440p, the Radeon Pro Duo scores 11466 points, compared to 9250 points for the R9 295X2, and 7740 points of the GTX TITAN Z; the Pro Duo leads the GTX TITAN Z by 48.13 percent. Finally, at the resolution which really matters for this product, 4K Ultra HD, the Radeon Pro Duo scores 6211 points, compared to the 5121 points of the R9 295X2, and 4099 points of the GTX TITAN Z.

Up to now mini-PCs have been designed in classic cube format for three drives, normally two hard disks/SSDs and an optical drive. A new type of case is being launched today that breaks through these restrictions. The SZ170R8 in R8 case design accommodates four 3.5" drives and does away with the need for an optical drive bay. This structural modification also enables larger graphics cards to be installed. More free space has been created inside the aluminium case. This has also resulted in benefits in terms of easier installation, better cooling and increased compatibility with very large graphics cards.

With four possible hard disks in the SZ170R8, reliable cooling of the machine is of course vital. The heatpipe-based cooling system has therefore been expanded to include a second fan fitted to the front of the case. This device sucks in fresh air through a large opening in the front panel and directs it over all four hard disks, thus preventing a build-up of heat. Another feature of the R8 design, which immediately catches the eye, is the increased number of significantly larger vents on either side of the machine. This change is a response to the more demanding requirements of modern graphics cards. Dual-slot cards with large heatsinks and powerful fans now receive more fresh air and work more reliably and quietly.

ASUS today announced the VivoMini VM65 Series, a range of mini PCs featuring the latest technologies to deliver blazing-fast performance and stunning 4K UHD visuals. VivoMini VM65 Series mini PCs are powered by a choice of Intel Core 'Skylake' processors with DDR4 RAM, and feature discrete NVIDIA GeForce graphics and ASUS SonicMaster-enhanced audio to make them an ideal choice for a daily computing platform or home entertainment hub.

The VivoMini VM65 Series is a range of sub-2-liter ASUS consumer PCs that will bear the new ASUS VivoMini name. Existing VivoPC models (VM62N, VM62, VM60, VM42, VM40B, VC62B, VC60V, and VC60) will retain the VivoPC branding.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, thrilled to announce the commencement of the 3rd annual "OC World Cup 2016" overclocking competition. Each year, G.SKILL hosts the OC World Cup overclocking competition with the live four-day finals at the G.SKILL booth during Computex. This year, G.SKILL will be providing a $16,200 USD total cash prize pool for the winners. Following the tradition of the event, the Grand Champion of the OC World Cup 2016 will walk away with a grand cash prize of $10,000 USD.

G.SKILL OC World Cup is split into three rounds: Online Qualifier, Live Qualifier, and Grand Finals. Live Qualifier and Grand Finals will be held live at the G.SKILL booth during Computex from 31st May to 3rd June 2016. The Online Qualifiers round will be held on HWBOT from 7th March to 11th April 2016, featuring 3 benchmarks: Highest DDR4 Frequency, 3Dmark 01 with IGP, and 3DMark 11 with IGP. The benchmarks are selected to challenge the memory tweaking skills of overclockers on G.SKILL DDR4 memory, 6th Gen Intel Core processor, and Z170 platforms. The top 6 Online Qualifier contestants will win the tickets to participate in the OC World Cup 2016 Live Qualifiers at Computex 2016.

MSI, world leading in gaming hardware design, is heartened to announce a new M-ATX GAMING motherboard, the B150M GAMING PRO. This new Micro-ATX motherboard is based on the Intel B150 chipset supporting 6th Gen Intel Core processors for LGA1151, and is designed for gamers looking for a small gaming PC while getting the best gaming features & performance. DDR4 Boost technology is available, providing maximum performance and stability while also offering improved memory compatibility. Audio Boost and GAMING LAN ensure you have upper hand on your enemies on the battlefield, ready to finish on top. But there's more... For a limited time, with the new B150M GAMING PRO you get the great and nimble MSI DS B1 GAMING mouse for free.

By fully isolating the memory circuitry from other components, DDR4 Boost ensures the purest possible memory signal for maximum performance and stability. Get ready to crush your enemies on the battlefield with MSI GAMING LAN, featuring carefully selected components to ensure the best online gaming experience without lag. With optimized traffic prioritization and low latency, MSI GAMING LAN Manager automatically classifies and prioritizes the latency-sensitive applications for online games. The LED illuminated LAN connector features 15KV anti-surge protection for safety.

SFF desktop major Aleutia unveiled pictures of its latest Core "Skylake" NUC derived desktop, that's completely fanless. The new Aleutia R50 is built up of a stack of metal plates, with copper plates among the middle ridges; which serve as heatsink for the Core "Skylake" chip. CPU options include Core i3-6100U and Core i5-6260U. Memory options include 8 GB, 16 GB, and 32 GB dual-channel DDR4; and storage options include 128 GB, 256 GB, and 512 GB SSDs. Prices range between 599 GBP to 1,099 GBP.

At Embedded World today, AMD announced its 3rd Generation AMD Embedded G-Series SoCs and the Embedded G-Series LX SoC, providing customers a broadened portfolio of performance options. The latest offerings expand developers' ability to scale x86 platforms, starting with the entry-level AMD Embedded G-Series LX SoC, which is pin compatible to the previous generation G-Series SoC devices. Also announced today are two new, higher performing 3rd Generation AMD Embedded G-Series SoCs, codenamed "Prairie Falcon" and "Brown Falcon," which introduce for the first time pin compatibility for G-Series processors with the higher performance AMD Embedded R-Series SoC.

The new products expand upon the low power capabilities of the award-winning AMD Embedded G-Series SoC platform, bringing scalable performance, power, and price across the CPU, GPU, multimedia, and I/O controller hardware, helping to lower development costs for AMD customers. Together, the new G-Series processors deliver immersive, graphically rich experiences across a broad range of platforms, from entry-level to mainstream gaming, digital signage, imaging, and industrial control.

The latest Intel Xeon D-1571 SoC, designed for high-density data-centers and micro-servers, sets a new benchmark for energy efficiency. If the fact that it's an SoC (a combination of CPU and chipset) wasn't enough, the chip also crams in 16 CPU cores based on the "Broadwell" architecture, with HyperThreading enabling 32 logical CPUs, running at 1.30 GHz clock speed, a dual-channel DDR4 memory controller that supports up to 128 GB ECC DDR4 memory, and 24 MB of shared L3 cache; all at a TDP rated at just 45W. On most high-density server boards, such as the X10SDV-series by Supermicro (pictured below), the chip will cooled by just a small fan-heatsink. Such specs won't come cheap. Server board vendors will buy the Xeon D-1571 at $1,222 a piece in 1000-unit quantities.

CERN engineer Liviu Valsan, in a recent presentation on datacenter hardware trends, presented a curious looking slide that highlights some of the key features of AMD's upcoming "Zen" CPU architecture. We know from a recent story that the architecture is scalable up to 32 cores per socket, and that AMD is building these chips on the 14 nanometer FinFET process.

Among the other key features detailed on the slide are symmetric multi-threading (SMT). Implemented for over a decade by Intel as HyperThreading Technology, SMT exposes a physical core as two logical CPUs to the software, letting it make better use of the hardware resources. Another feature is talk of up to eight DDR4 memory channels. This could mean that AMD is readying a product to compete with the Xeon E7 series. Lastly, the slide mentions that "Zen" could bring about IPC improvements that are 40 percent higher than the current architecture.

Patriot, a long time, leading manufacturer of computer memory has announced the qualification of their 4GB and 8GB DDR4 2133MHz SODIMMs for compatibility with Intel's latest GEN 6 i3 NUC (Next Unit of Computing) and GEN 6 i5 NUC.

The qualification of Patriot's 4GB and 8GB SODIMMs was completed by CMTL, an independent compatibility testing lab used by Intel to qualify memory for their motherboards and platforms. Each DIMM submitted by Patriot was put through rigorous physical and environmental testing in order to be qualified as compatible with Intel's GEN 6 NUC, mini PC. Both the i3 and i5 models of the Intel GEN 6 NUCs have a maximum capacity of 32GB between its two DIMM slots and up to 2133MHz making Patriot a first rate option for a computer memory solution.

Apacer is pleased to announce its groundbreaking achievement in DDR history, BLADE FIRE DDR4 with heartbeat LED, perfectly for gaming, overclocking, and M.O.D enthusiasts. It is astonishing to see speed at 3200 MHz with LED pulsing at 44 beats per minute yet it is still consuming low voltage at 1.35V. It is compatible with Intel Z170 platforms, providing unprecedented performance and energy-saving efficiency. Backed by the world's best technology in industrial memory module and storage, BLADE FIRE DDR4 makes users on fire in the gaming/ overclocking star-war.

The world-class BLADE FIRE DDR4 is an advanced generation of Blade DDR4 which was published in Feb 2015, featured a sensational armory design on heat spreader as well as LED lights heartbeat effect. The meticulously screened ICs allow the optimized stability and compatibility while playing in the heavy workload games. BLADE FIRE is available in 4 GB, 8 GB, and 16 GB capacities in dual-module package and comes equipped with total capacity of 32 GB (16 GB x2). The fastest memory kit available is clocked at 3200 MHz, and BLADE FIRE kits are ranged in four different clock speeds from 2400 MHz 1.2V to 3200 MHz 1.35V with 16-16-18-38. The XMP 2.0 support for simple overclocking setup delivers instant top-level performance for motherboards with Intel's 100 Series. Not only low latency for outstanding DDR4 performance but also lower power consumption with less heat and higher reliability provides users the fastest speeds and the highest stability when it comes to gaming and overclocking.

ASUS today announced B150I Pro Gaming/WiFi/Aura, B150I Pro Gaming/Aura and B150M Pro Gaming, three new small-form-factor gaming motherboards packed with exclusive features and the latest technologies to maximize gaming performance and fun.

Accompanied by the ASUS BEST brand promise - built on the four core pillars of Best-selling, Easy to use, Stable and Trusted - the mini-ITX (mITX) B150I Pro Gaming/WiFi/Aura and B150I Pro Gaming/Aura both include the all-new Aura RGB lighting technology to cast spectacular illumination effects, flexible cooling with an integrated water-pump header and lightning-speed game loads with exclusive RAMCache technology. B150I Pro Gaming/WiFi/Aura also has built-in 2×2 (2T2R) 802.11ac Wi-Fi with Multi-User MIMO (MU-MIMO) for maximized range and reliability.

Team Group announced the Team Xtreem DDR4-4000 memory module. Available in heatspreader colors of black and silver, the module comes with density of 4 GB, and serves up its rated speed of DDR4-4000 MHz (PC4-32000), with timings of 18-22-22-40, and module voltage of 1.35V. The modules are cooled by chunky aluminium heatspreaders, making contact with a copper ground-layer of the module's PCB, besides the DRAM chips, for additional cooling. Team Group is offering lifetime warranty with these modules, which are yet to be priced. The modules will be sold in single-piece and 8 GB dual-channel kits.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is truly excited to announce yet another breakthrough in high-performance, high-capacity DDR4 memory kit by taking a full 128GB (16GBx8), the maximum supported capacity on an X99 motherboard, to an searing speed of DDR4-3200MHz CL14-14-14-34 under 1.35V.

Not only does this massive memory kit manage to max out on supported capacity at high speeds, its latency is also improved to CL14-14-14-34, which is also more efficient than the standard DDR4-2133MHz latency of CL15-15-15-35. At this point, there's nowhere else to go but faster.

Taipei Game Show 2016, a major event for pros in the competitive gaming scene around the world, will soon be opening. Running from Jan 29 through Feb 2, the theme for this year's show is "Game Connect". Never a company to miss such an opportunity, KINGMAX will be unveiling our latest ZEUS DDR4 Gaming RAM with heatsink - the product will ensure that your PC gaming platform runs stable under extreme gaming conditions.

As a popular brand name for competitive gaming PC products among overclocking gamers, KINGMAX will be launching our brand new ZEUS DDR 4 Gaming RAM with heatsink that delivers ultra-speed and unparalleled performance right around the Chinese New Year. Featuring an impressive array of features including overclocking, low CAS latency and low voltage to ensure stable operation, the ZEUS DDR 4 Gaming RAM also comes in a variety of value selections, ranging from 2800MHz, 3000MHz and up to 3200MHz with capacities ranging from 4GB, 8GB and 16GB. With support for dual channel operation, users will essentially be getting 32GB of memory. For those looking to set up a new system for the New Year, a good combination to consider would be the Intel Z170 system chipset, Intel's latest Skylake processor and with Intel's XMP 2.0 overclocking technology, ZEUS DDR4's aluminum alloy cast heatsink will deliver even more significant cooling performance. The product is an ideal choice as a vital upgrade option for gamers wishing to challenge the limit of PC performance.

MSI proudly presents the upgraded Gaming All-in-One PC: MSI Gaming 24. Equipped with more powerful hardware than its predecessor, this system is capable and ready to run the newest PC games in full glory. The large 24" Full HD display offers an outstanding gaming experience with fast response times for improved gaming performance. By using the HDMI input, the display can also be used to connect a game console. The display also comes with MSI Anti-flicker technology, to prevent screen flickering and blue light emission through a smartly stabilized power current, thereby reducing eyestrain and fatigue.

The MSI Gaming 24 utilizes Intel's new Skylake-H platform enabling a better CPU performance with reduced power consumption. It supports up to 32 GB dual-channel DDR4 memory to take care of the most demanding tasks. To run the newest games, the system is equipped with a NVIDIA GeForce GTX 950M or 960M graphics chip. This time with 4GB GDDR5 memory, which is twice as much as its predecessor. The Gaming 24 features the next generation Intel Wireless-AC 3165 Wi-Fi adapter and Killer E2400 Ethernet. Ensuring faster network speeds and prioritization of network traffic for online games.

Corsair, a world leader in enthusiast memory, PC hardware and components, is pleased to announce the global availability of its fastest ever Vengeance LPX 128GB, 64GB and 32GB DDR4 kits. Boasting frequencies of up to 3,600MHz, these new XMP 2.0 kits bring high-frequency performance to even the largest capacity DDR4 modules.

Corsair's fastest 128GB DDR4 kit ever, the Vengeance LPX 128GB (4x16GB) 3,000MHz is designed to push Intel's X99 quad-channel platform to the next level, reaching frequencies of 3,000MHz or higher. With full XMP 2.0 support and running at 1.35V with CL16-18-18-36 low latency timings, the kit offers both the massive capacity and high-frequency DDR4 performance required by top-end work stations running the most demanding applications.

Intel's first 5-gigahertz CPU will bear an unlikely brand - Xeon. The company's upcoming Xeon E5-2602 V4 quad-core chip based on the 14 nm "Broadwell-EP" silicon, is rumored to ship with a staggering 5.10 GHz clock speed out of the box. Getting there won't be easy for this socket LGA2011v3 chip. Despite being a quad-core chip, with just four out of ten cores on the "Broadwell-EP" silicon bring physically enabled, the chip's TDP is rated at 165W. Other features include 10 MB of L3 cache, and a quad-channel DDR4 memory interface.