At its 2016 Annual Shareholders Meeting website, AMD reportedly posted a wafer shot of its upcoming 14 nm "Summit Ridge" CPU die. The "Summit Ridge" silicon is rumored to drive a number of performance-thru-enthusiast processor SKUs for AMD. The die pictured features eight CPU cores based on the "Zen" micro-architecture, a dual-channel DDR4 memory controller, 512 KB of L2 cache per core, and 16 MB of shared L3 cache split between two blocks of four CPU cores, each.

"Summit Ridge," much like the "Bristol Ridge" APU silicon, will be a true SoC, in that it integrates the southbridge on the processor die. With "Summit Ridge," AMD is also introducing a new inter-socket interconnect replacing its ageing HyperTransport technology. The new Global Memory Interconnect (GMI) bus provides a 100 GB/s path between two sockets. The "Summit Ridge" die features two such interconnect ports.

GeIL, a leading global manufacturer of PC components and peripherals, presents the all new DDR4 EVO X Hardcore Gaming Memory with GeIL's latest innovation of HILM - Hybrid-Independent-Light-Module enabling dynamic RGB LED illumination. The EVO X Seires not only excels from the Super Luce Series asthetically, the technological breakthrough in high performance memory illumination transcends even further.

HILM - Hybrid-Independent-Light-Module (Figure A) fuses LEDs, micro processor, circuits, switch and dual-power-source in one modular solution, separating the entire lighting solution and circuitry from the memory module. Thus, allowing high performance DDR4 memory module to perform at its full potential and stability.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, announces an all-new high performance breakthrough in DDR4 SO-DIMM memory with an intense speed of 3200MHz CL16 in large capacity kits of 32GB (2x16GB) or 16GB (2x8GB), all at 1.35V. Built with ultra-high performance Samsung DDR4 8Gb ICs, the performance of laptops and small form factor systems will never be the same again.

Tested and validated on the latest Intel platform featuring the latest 6th Gen Intel Core processor, this new DDR4-3200MHz SO-DIMM memory kit allows you to wield the power of a desktop system in a portable laptop or mini PC, perfect for casual gaming or working on-the-go. For a screenshot of the validation, please see below.

EVGA welcomes you to the next generation of ground-breaking performance: the X99 FTW K! The X99 platform redefines high-performance with the introduction of the first ever quad-channel DDR4 architecture fueled by Intel's Haswell-E/Broadwell-E CPU family for up to 128GBs of RAM running at a maximum memory speed of up to 3200MHz+ (OC), all made possible due to the 4-layer memory T-Routing design.

The X99 FTW-K is built with an 8-layer Hybrid Black PCB, featuring a CPU socket with 150% higher Gold content powered by an Advanced 8-phase Digital VRM (IR3563B+IR3350), providing industry-leading stability for all your applications. This board also features a Killer NIC E2400 Ethernet which helps to prioritize and reduce network latency to keep you at the top of your game.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce a new series of high performance DDR4 kits based on 8GB & 16GB modules, from ultra low CAS Latency DDR4 3200MHz CL13 and DDR4 3466MHz CL14 to an extreme speed of DDR4 4266MHz CL19. All these new extreme performance memory are built with ultra high performance Samsung DDR4 8Gb ICs and will join G.SKILL flagship Trident Z series family.

G.SKILL is excited to continuously push the performance of DDR4 technology to the boundaries. These newly released memory kits provide PC enthusiasts, extreme gamers, and overclockers ultimate memory speed, as well as ultra high density for professional applications.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of Ballistix Sport LT DDR4 SODIMMs. Ideal for gamers and performance enthusiasts, the new modules accelerate gaming laptops and small form factor systems by packing faster speeds into every memory slot, enabling users to run demanding games and applications with ease.

With speeds starting at 2400 MT/s, Ballistix Sport LT SODIMMs offer better latencies, reduced load times, and improved frame rates with integrated graphics. The new modules also feature a sleek black PCB and digital camo design and support Intel XMP 2.0 profiles for easy installation. "We're constantly seeking ways to empower gamers with affordable, easy-to-use products that help them gain that competitive, performance edge," explained Jeremy Mortenson, product marketing manager, Crucial. "With new platforms supporting faster DDR4 SODIMMS coming to the market, the newest Ballistix SODIMM module does just that."

MSI is proud to announce the latest X99 Performance GAMING motherboard, the X99A GAMING PRO CARBON, world's first motherboard offering front USB 3.1 Type-C. This new motherboard has been built from the ground up and has a completely new design for its heavy plated heatsinks and covers, based on the latest CARBON look & feel. Besides this totally new design, the X99A GAMING PRO CARBON motherboard also comes packed with several new and unique MSI features such as new Mystic Light with smartphone control over WIFI including a Mystic Light extension RGB cable and pin header.

Onboard Turbo U.2 is present to support the latest and greatest SSDs available in the market supporting NVMe. DDR4 Boost is accompanied by DDR4 Steel Armor to ensure the best memory performance. The X99A GAMING PRO CARBON is the first X99 model featuring Game Boost with 8 gears up to 5 GHz of one-second-overlocking! Last but not least, this model has been designed and optimized for next-generation Intel "Broadwell-E(P)" processors. So whether looking for extreme performance or endless customization, the new X99A GAMING PRO CARBON is sure to deliver.

ASUS and Republic of Gamers (ROG) today announced ASUS Signature X99-Deluxe II, X99-A II and X99-E, and ROG Strix X99 Gaming from the latest lineup of ROG Strix series - all-new four ATX motherboards based on the Intel X99 chipset and loaded with exclusive technologies to maximize the potential of the latest LGA 2011-3 Intel Core i7 X-series processors.

Commenting on the new product line-up, Joe Hsieh, ASUS Corporate Vice President & General Manager of Motherboard Business Unit said: "Our X99 motherboards have won awards from many respected publications and editors around the world, with ASUS consistently praised as the number-one motherboard brand. We are keen to offer best-selling, easy-to-use, stable and trusted motherboards - that's why we call them BEST. And we're proud to introduce our all-new X99 motherboards allowing users to customize their experience and maximize performance in ways that simply aren't possible with any other brand of motherboard."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is introducing 5 new color schemes to the highly popular extreme performance Trident Z series to select specifications. Aside from the classic Trident Z design of silver and black brushed aluminum heatspreader with a red top-bar highlight, the new color schemes include a black brushed aluminum body paired with orange, yellow, or white top-bar or a silver brushed aluminum body with white or black top-bar.

With a rise in popularity of modding and cases with window designs, these 5 new Trident Z color schemes are developed for enthusiasts, gamers, and modders who not only wish to include high performance memory in their systems, but also to add attractive visual appeal and show off their unique selection of hardware. Available in yellow, orange, white, and black highlights, these new color schemes pair exceedingly well with modern motherboard designs based on the X99 and Z170 chipsets.

Silicon Lottery at OCN got their hands on Intel's upcoming flagship high-end desktop (HEDT) processor, the Core i7-6950X. Based on the 14 nm "Broadwell-E" silicon, the processor offers a staggering 10 cores, with HyperThreading enabling 20 logical CPUs, 25 MB L3 cache, and a quad-channel DDR4 memory controller. The i7-6950X is expected to occupy a price point that's above the $999 traditionally reserved for the top-end HEDT chip. Silicon Lottery successfully overclocked the i7-6950X to 4.50 GHz, from its rumored stock frequency of 3.00 GHz, and compared it to a previous-generation Core i7-5960X 8-core processor. The common platform consisted of an ASUS Rampage V Extreme motherboard, 16 GB of quad-channel DDR4-3000 memory, and GeForce GTX 750 Ti graphics.

At its top overclock of 4.50 GHz, the i7-6950X achieved a Cinebench R15 score of 2327 points. At 4.00 GHz, it scored 1904 points, 19.5 percent higher than the i7-5960X at the same clocks (the i7-6950X features two extra cores). The two chips were also put through AIDA64 memory tests. The memory read speeds were nearly the same, but the memory write speeds were found to be a staggering 37 percent higher on the i7-6950X. The memory copy speeds, however, were 10.5 percent lower on the i7-6950X. Intel is expected to launch its next-generation Core i7 HEDT lineup, including two six-core, one eight-core, and one ten-core chips, in a few weeks from now.

Innodisk, the service-driven flash and DRAM module provider, introduces a brand new DDR4 Mini DIMM DRAM that is fully compliant with ATCA (Advanced Telecom Computing Architecture). Featuring a 228 pin (a mere 0.72" in height) and a capacity of up to 16GB, it is simply the best choice for small, high-speed, large-capacity storage devices.

Innodisk uses original ICs in DDR4 Mini DIMM and has upgraded the transfer speed up to 2400MHz. Its ECC modules are designed to detect and correct single-bit errors that may occur during data storage and transmission. In addition, the DDR4 Mini DIMM series' built-in thermal sensor provides temperature monitoring and system reliability. Innodisk also utilizes value-added conformal coating on the module that protects against moisture, contaminants, dust and acid materials, thus ensuring high-performance operation in harsh environments.

Shuttle Computer Group, Inc., a world leader in the design of small form factor computers, announced its new SZ170R8 Cube PC that continues Shuttle's cube legacy and incorporates a new internal design that accepts up to four 3.5" hard disk drives as well as extra room for oversized PCI-E X16 cards. The SZ170R8 will be showcased in Booth #746 at InterOp, the IT and Networking Expo, at the Mandalay Bay Convention Center in Las Vegas, May 5-6, 2016.

This new high performance Mini PC supports Intel 6th Generation Skylake LGA1151 95W processors, and the expanded storage is perfect for applications that require large capacity storage like high-end graphics, CAD/CAM and 4K media files. Combined with Intel's Rapid Storage Technology, the SZ170R8 load time is lightning fast. Its internal design provides more flexibility and oversized slots can accept large graphics cards, video surveillance cards, RAID cards and others.

Intel introduced a trio of embedded CPUs for SFF desktops and industrial PCs (IPCs), based on its "Skylake-R" silicon. This variant of Skylake features the largest integrated GPU Intel ever made - the Intel Iris Pro 580. This IGP features 72 execution units (compared to 24 on, say, the i7-6700K), and relies on a 128 MB eDRAM L4 cache for fast frame-buffering operations. The IGP uses this tiny yet fast cache, in conjunction with its traditional UMA system memory share, as video memory. The "Skylake-R" package is a multi-chip module of the main die with four "Skylake" CPU cores and the 72-EU IGP, and a second die housing the L4 cache.

Among the three "Skylake-R" chips Intel launched are the Core i7-6785R, the Core i5-6685R, and the Core i5-6585R. The i7-6785R features HyperThreading enabling 8 logical CPUs, 8 MB of L3 cache, and 3.30 GHz nominal clock speed, with 3.90 GHz Turbo Boost. The i5-6685R and the Core i5-6585R lack HyperThreading, and feature just 6 MB of L3 cache; the former features clock speeds of 3.20 GHz nominal with 3.80 GHz Turbo Boost, while the latter offers 2.80 GHz nominal with 3.60 GHz Turbo Boost. All three feature iGPU clocks of 350 MHz nominal, with up to 1150 MHz boost. The 14 nm chips further feature TDP of 65W, and feature dual-channel memory controllers that support both DDR4 and DDR3L memory. Sold in the OEM channel, the i7-6785R, i5-6685R, and i5-6585R, are priced at US $370, $288, and $255, respectively, per-piece, and in 1000-unit tray quantities.

ADATA Technology, a leading manufacturer of highperformance DRAM modules and NAND Flash products, today launched XPG Dazzle,itsfirst line of LED DDR4 memory modules. The modules feature illuminated LED strips and DDR4 specificationsforan exciting look that complements their high performance and power efficiency. Utilizing patented LED memory module technology by AVEXIR, XPG Dazzle makes PCs much more eye-catching to meet growing demand by case modders, PC enthusiasts, and gamers for unique, colorful, and vibrant system builds.

XPG Dazzle LED DDR4 memory modules maintain and evolve the aggressive but sleek style of XPG products, featuring a tough outline, cool color combinations, and their own unique highlight in the form of a shining LED strip built into the heatsink. With a special design and alluring red LED, XPG Dazzle accentuates chassis appearance and revitalizes performance PCs, whether for overclocking, gaming, or pure case modding showcases. XPG Dazzle memory modules are available in different kits: 8GBx2, 8GB x4, 16GBx2, and 16GBx4, giving users greater flexibility when assembling high-end systems.

Crucial unveiled the Ballistix Sport LT Red DDR4 memory module. Available in densities of 4 GB, 8 GB, and 16 GB, and in kits of single-module, dual-channel, and quad-channel; the module offers PC4-19200 (DDR4-2400 MHz) speeds, with timings of 16-16-16, and module voltage of 1.2V. The module is characterized by a full-height black PCB, and a racy red heatspreader, with a very G.Skill-like styling. The company didn't reveal pricing or availability.

ASRock introduced the H110M-HDVP entry-level socket LGA1151 motherboard with additional legacy connectivity for office PC builds to cope with old peripherals. The board is built in the slim micro-ATX form-factor, drawing power from a combination of 24-pin and 4-pin ATX power connectors, conditioning it with a basic 3+1 phase VRM. The board features two DDR4 DIMM slots, supporting up to 32 GB of dual-channel memory.

Expansion slots on the H110M-HDVP include one each of PCI-Express 3.0 x16, legacy PCI, and two PCIe 2.0 x1. Storage connectivity includes four SATA 6 Gb/s ports. Display outputs include one each of HDMI, D-Sub, and DVI. Among its legacy connectivity options are two RS-232 serial COM ( one on the rear panel, one via header), parallel LPT (through header), and separate PS/2 mouse and keyboard ports. Four USB 3.0 ports (two via headers, two on the rear panel), 6-channel HD audio, and gigabit Ethernet, make for its modern connectivity. Expect a sub-$80 price.

Crucial, a leading global brand of memory and storage upgrades, today announced the availability of two new offerings in its server memory product portfolio: 32 GB DDR4 VLP RDIMMs and 64 GB DDR4 LRDIMMs. With speeds of 2400 MT/s and engineered to enable higher densities by implementing a dual stack of 8 Gb DDR4 DRAM die to engineer a single 16 Gb component, these new DDR4 server memory modules allow for increased memory density, performance and bandwidth.

The 32 GB VLP RDIMMs are the highest density server memory modules Crucial offers for that module form factor, and are almost half the height (40 percent shorter) of a standard RDIMM module. These high density modules help enable memory dense systems like blade servers and microservers without compromising performance. Additionally, they can be installed at a 90-degree angle to the motherboard in these height-constrained systems, which enables better airflow to keep the system cool..

ECS introduced the H110I-C4P value mini-ITX motherboard based on the Intel H110 Express chipset, and designed for 6th generation Core, Pentium, and Celeron processors, in the LGA1151 package. The board draws power from a combination of 24-pin ATX and 4-pin CPU power connectors; conditioning it for the CPU with a simple 4-phase VRM. The CPU is wired to a pair of DDR4 DIMM slots, supporting up to 32 GB of dual-channel DDR4-2133 memory.

Expansions slots include a PCI-Express 3.0 x16, and an M.2 2242 slot with 20 Gb/s bandwidth. Storage connectivity includes four SATA 6 Gb/s connectors. Display connectivity includes one each of DisplayPort and HDMI. Other modern connectivity includes four USB 3.0 ports (two on the rear panel, two by headers), 6-channel HD audio, and gigabit Ethernet. Expect a sub-$80 price-tag.

Not in the wake of Poseidon, but the intense quests of DDR4 memory overclocking, G.SKILL has released its Trident Z DDR4 4333MHz memory modules. Apparently, these overpowered memory sticks named after the destructive weapon of Neptune are meant to operate at a brain melting 4333MHz frequency, however they are not destined to be wielded by just any mortal, currently only ASRock's overclocking oriented motherboard - Z170M OC Formula has what it takes to support these legendary memory DIMMs.

Frank, marketing manager from G.SKILL further illustrated, "G.SKILL Trident Z DDR4 4333MHz memory kit is specifically designed for extreme overclocking on the latest ASRock Z170M OC Formula motherboard and 6th Gen Intel Core Processors. Using only specially selected performance components, it is the speediest DDR4 memory kit on the market today that pushes the Z170 platform to its extreme limits."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing a new DDR4 memory kit at DDR4 3600 MHz CL15-15-15-35 1.35V under its legendary Trident Z flagship series! This memory kit will be made available in 8 GBx2 configuration for a total of 16 GB, making this Trident Z kit an essential part of any high performance system builds.

High Performance, High Efficiency
Utilizing specially selected high performance memory components, G.SKILL has continued to improve upon the specifications of DDR4 to maintain a latency of CL15 at 3600 MHz, a high frequency that typically could only be achieved with slower latencies. Designed with XMP 2.0 profiles, achieving a highly efficient system is now easier than ever. A stress testing screenshot of the high efficiency memory kit with ASUS Z170-DELUXE motherboard and Intel Core i5 6600K processor can be found below.

Worldwide Availability
The Trident Z DDR4 3600 MHz CL15 16 GB (8 GBx2) memory kit will be available via authorized G.SKILL worldwide distribution partners at the end of April 2016.

Although AMD's upcoming socket AM4 heralds new lines of processors and APUs based on the company's next-generation "Zen" CPU micro-architecture, some of the first APUs will continue to be based the current "Excavator" architecture. The "Bristol Ridge" is one such chip. It made its mobile debut as the 7th generation A-Series and FX-Series mobile APUs, and is en route to the desktop platform, in the AM4 package. What sets the AM4 package apart from the FM2+ package, and in turn "Bristol Ridge" from "Carrizo" is that the platform integrates even the southbridge (FCH) into the APU die. This could explain the 1,331-pin count of the AM4 socket.

The "Bristol Ridge" silicon is likely built on the existing 28 nm process. That's not the only thing "current-gen" about this chip. Its CPU component consists of two "Excavator" modules that make up four CPU cores, with 4 MB total cache; and its integrated GPU will likely be based on the Graphics CoreNext 1.2 "Volcanic Islands" architecture, the same one which drives the "Tonga" and "Fiji" discrete GPUs. The integrated memory controller supports dual-channel DDR4 memory. In its performance benchmarks, an AM4 APU based on the "Bristol Ridge" silicon was pitted against older 6th generation APUs, in which it was found to be as much as 23 percent faster.

Shuttle makes it even easier to enter the world of Mini PCs. There is now a whole series of affordable entry-level machines for the latest Intel "Skylake" processor architecture. From the 43 mm flat version housed in a steel chassis and the popular 3-litre format through to the classic aluminium cube - there is now a suitable Mini PC for every requirement. All four machines are based on the versatile Intel H110 chipset and support a large number of processors for socket LGA1151. Thanks to the variety of chassis formats, the individual machines offer different benefits.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today that it has begun mass producing the industry's first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them. DDR4 is quickly becoming the most widely produced memory for personal computers and IT networks in the world, and Samsung's latest advancement will help to accelerate the industry-wide shift to advanced DDR4 products.

Samsung opened the door to 10nm-class DRAM for the first time in the industry after overcoming technical challenges in DRAM scaling. These challenges were mastered using currently available ArF (argon fluoride) immersion lithography, free from the use of EUV (extreme ultra violet) equipment. Samsung's roll-out of the 10nm-class (1x) DRAM marks yet another milestone for the company after it first mass produced 20-nanometer (nm) 4Gb DDR3 DRAM in 2014.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, announces new high-frequency, high-capacity additions to the Ripjaws SO-DIMM family with DDR4-3000MHz CL16 kits at 1.2V, available in 8GB to 32GB (16GBx2) configurations. Foreseeing the growing demand of high-end gaming laptops and small form-factor PCs, G.SKILL continues the development of higher speed DDR4 SO-DIMM memory.

Today, G.SKILL is excited to raise the maximum support of DDR4 SO-DIMM frequency to 3000MHz CL16. Most importantly, this frequency speed is achieved at a low voltage of 1.2V, while DDR4-3000MHz kits typically require a higher 1.35V. A lower operating voltage is the ideal power-efficient solution for laptops and small form-factor PCs with a smaller thermal footprint.

Dell today announced new Virtual Reality-ready solutions that feature refined criteria for optimal VR experience, whether consuming or creating VR content. Dell has defined VR-ready solutions by three criteria:

• Minimum CPU, memory, and graphics requirements to support optimal VR viewing experiences;
• Graphics drivers that are qualified to work reliably with these solutions; and,
• Passing performance tests conducted by Dell using test criteria based on HMD (head-mounted display) suppliers, ISVs or 3rd party benchmarks where available.

Working closely with its hardware and software partners, Dell is formalizing its commitment to the future of VR by delivering solutions that are optimized for VR consumption and creation alongside ISV applications for professional customers.