G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

AMD's Ryzen 9 9950X3D processor with 16 cores, 32 threads, and 3D V-Cache is an exceptional content creation and gaming workload machine. However, MSI's proprietary BIOS features reportedly enable substantial performance headroom beyond stock settings. MSI's latest internal testing confirms that specific firmware configurations can deliver up to 14.5% performance improvements in demanding titles like Monster Hunter Wilds. The performance uplift hinges on firmware update, with MSI recommending the installation of chipset driver v7.01.08.129 or higher, which includes the critical AMD Application Compatibility Database driver. Users who update to BIOS versions featuring AGESA 1.2.0.3 or newer may encounter an "Unknown Device" in Device Manager, which can be resolved by installing the AMD Application Compatibility Database driver included in the latest chipset package. When paired with AGESA 1.2.0.3+ BIOS implementations, this configuration yields measurable framerate improvements of approximately 10% in Metro Exodus and 8% in Far Cry 6 at 1080p resolution compared to legacy firmware.

MSI's BIOS feature suite provides several optimization pathways. Memory Try It! delivers pre-configured memory timing profiles, while High-Efficiency Mode optimizes graduated memory bandwidth across four performance tiers. The X3D Gaming Mode modifies core and SMT configurations and provides additional gaming-specific enhancements, though potentially at the expense of multi-threaded application performance. Benchmark data from MSI demonstrates that implementing DDR5-8000 CL38 Memory Try It! profiles alongside "Tighter" High-Efficiency Mode settings and X3D Gaming Mode activation delivers a 14.5% performance uplift in Monster Hunter Wilds compared to baseline DDR5-4800 configurations, and approximately 8% over XMP DDR5-7200 settings. Titles like Shadow of the Tomb Raider and Far Cry 6 both recorded approximately 6% performance gains under similar test conditions. MSI cautions that memory overclocking implementations may impact system stability, while X3D Gaming Mode's thread management modifications could reduce performance in heavily multi-threaded workloads. Performance benefits will necessarily vary based on GPU capabilities and system configuration.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the release of three new DDR5 memory specifications with AMD EXPO OC profiles for AMD platforms, including an extreme speed with low-latency at DDR5-8000 CL36-48-48 48 GB (24 GB x2), large-capacity & low-latency DDR5-6000 CL28-36-36 192 GB (48 GB x4), and a new DDR5-6000 CL26-39-39 with 48 GB (24 GB x2) kit capacity. Designed for PC enthusiasts, gamers, content creators, and AI applications, these cutting-edge DDR5 memory kits push the boundaries of speed, latency, and capacity on AMD AM5 platforms.

Pushing the Limits with Extreme DDR5-8000 CL36 24 GB x2
For users seeking top-tier performance, the new DDR5-8000 CL36-48-48 24 GB x2 memory kit with AMD EXPO OC profile is engineered for ultra-high memory speed at low CL36 latency timings. This extreme-speed and low-latency combination is ideal for exceptional system responsiveness and multitasking performance. See below for the Memtest validation screenshot showcasing its stability on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

Biwin, a leading innovator in storage and memory technology, in cooperation with the OC Lab, launches the new OC Lab Gold Edition DW100 RGB DDR5 at DDR5-8000 CL34 & CL36 32 GB (2×16 GB) along with a second DDR5-6400 CL28 EXPO profile.

Both DDR5-8000 options, with their ultra-high speeds and optimized timings, are tailored for overclocking and extreme performance scenarios that push the system to the limit. These profiles excel in scenarios where every ounce of speed is needed, such as high-end gaming, benchmarking, or other performance-demanding tasks. The DDR5-6400 option strikes a more balanced approach, prioritizing lower latencies while still delivering a strong performance. With its lower latency, the DDR5-6400 provides smooth gaming, faster application load times, and overall system responsiveness.

ADATA at the 2025 International CES brought several of its latest memory products. The technology dominating memory products this year is CKD, or client clock driver. But there's more, ADATA also introduced memory modules with RCD, or registered clock driver, or a clock driver for RDIMMs. We begin our tour with the XPG Lancer CUDIMM RGB series, the company's flagship PC overclocking memory product. The top-spec module shown here comes with speeds as high as DDR5-9733, a step above even the DDR5-9600 that most other brands brought. The module comes in densities of 16 GB and 24 GB; and speeds of DDR5-8400, DDR5-8800, DDR5-9200, DDR5-9600, besides the top DDR5-9733. When paired with a Core Ultra "Arrow Lake-S" processor in Gear 4 mode, these kits should easily cross 10,000 MT/s using manual overclocking.

Next up, the company showed us its AICore line of DDR5 RDIMMs for workstations and servers. The module packs an RCD, a registered clock driver, which is essentially a CKD for RDIMMs. It is a component that clears out and amplifies the DDR5 physical layer signal, letting the machine operate at higher memory frequencies. The AICore series comes in speeds of up to DDR5-8000, and densities of up to 16 GB per module. Other speed variants in the series include DDR5-6400 and DDR5-7200. The recommended platforms for these modules include Intel's Xeon W-3500/W-2500 series "Sapphire Rapids," and AMD Ryzen Threadripper 7000-series "Storm Peak."

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

TechPowerUp partners with the PC enthusiast and creator memory experts over at Team Group to bring you the 2024 Black Friday and Cyber Monday (BFCM) Giveaway, open worldwide. 2024 sees the advent of high frequency DDR5 memory, with both Intel and AMD supporting speeds as high as DDR5-8000 using their latest Core Ultra "Arrow Lake" and Ryzen 9000 "Zen 5" processors. To celebrate this, we are giving away two of Team Group's latest T-Force Xtreem DDR5-8000 memory kits. Up for grabs is a T-Force Xtreem ARGB DDR5-8000 48 GB (2x 24 GB) CL38 memory kit, and a T-Force Xtreem White DDR5-8000 32 GB (2x 16 GB) CL38 kit. But wait, there's more. There is also a T-Force G70 PRO 2 TB M.2 NVMe Gen 4 SSD with heatsink. This giveaway is open world-wide. To win, all you need to do is fill up a tiny form to help us get back to you if you've won. Entries are open till November 28, Hurry!

For more details, and to participate, visit this page.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

ASUS today unveiled a lineup of Z890 motherboards from the ROG Maximus, ROG Strix, TUF Gaming, Prime and ProArt families, supporting Intel Core Ultra processors (Series 2). ASUS is marking the occasion with all-new motherboard features that accelerate performance and streamline the build process. ASUS AI Advisor is a new natural-language build assistant powered by AI. AEMP III, NitroPath DRAM Technology and DIMM Fit unleash DDR5 memory kits. NPU Boost provides overclocking of the integrated NPU in an Intel Core Ultra (Series 2) CPU for accelerated AI performancei. ROG M.2 PowerBoost provides more M.2 slots on a motherboard than ever before. On top of all that, there is Thunderbolt 5, WiFi 7 and new PC DIY features to discuss.

Primed to perform with Intel Core Ultra processors (Series 2) in a new socket
Intel Core Ultra processors (Series 2) use the new LGA 1851 socket. Users of these processors will need an Intel 800 series motherboard to use one, and a Z890 motherboard specifically to take advantage of CPU overclocking. These options feature up to 24 cores in a new disaggregated architecture. Performance-cores, aka P-cores, take center stage with their high clock rates, while a cluster of Efficient-cores, aka E-cores, provide high-end multithreaded performance.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.