DFI, the world's leading brand in embedded motherboards and industrial computers, introduces its latest innovation: the ASL9A2 System-on-Module (SoM). With an Intel Atom processor, the ASL9A2 achieves speeds up to 3.6 GHz and is based on Intel's Gracemont architecture. Designed for high-performance, low-power, and ruggedized edge applications, the ASL9A2 is perfect for continuous 24/7 operation, supporting a wide range of Internet of Things (IoT) solutions at the edge.

As reported by The Business Research Company, the SoM market has experienced robust growth, increasing from 2.22 billion in 2023 to 2.43 billion in 2024, with a CAGR of 9.6%. From DFI's business viewpoint, a variety of SoM projects are yielding positive results. Furthermore, DFI enhances its Intel x86 COM Express modules with value-added enhancements to improve customers' applications efficiency, earning praise from customers.

DFI, the world's leading brand in embedded motherboards and industrial computers, is thrilled to announce two of the world's first Industrial MicroATX motherboards to support Intel Core 12th, 13th, and 14th (Alder Lake-S, Raptor Lake-S and Raptor Lake-S Refresh) Gen Processors. "With support for the latest Intel Core processors and features including dual GPU slots and dual 10GbE ports, RPS310 and ADS310 represent a significant leap forward in innovation for industrial and medical computing, empowering manufacturing and healthcare professionals to achieve new levels of efficiency," said Jarry Chang, General Manager of Products Center at DFI.

RPS310
Featuring dual PCIe x16 Gen 4 GPU slots, addresses key challenges for Factory Automation professionals working in Smart manufacturing field, enabling improved visualized data, complex imagery processing and quality monitoring in automated production lines. RPS310 is also perfect for medical professionals to analyze Medical imaging data with unprecedented image quality and efficiency, improving diagnosis accuracy on MRIs and CT Scanners and X-rays.

DFI, the world's leading brand in embedded motherboards and industrial computers, proudly announced the launch of its innovative product lineup featuring Windows on Arm (WoA) at Embedded World 2024. DFI NXP products deliver high power efficiency and seamlessly integrate Windows on Arm, introducing a new era in computing where the traditional stronghold of Windows on x86 processors is evolving.

Arm and Microsoft revealed a compelling study that projected an 81% growth in the Windows on Arm market within the next five years. DFI's commitment to embracing this dynamic landscape is evident in its latest product offerings, designed to unlock the true potential of WoA. The diverse NXP product lineup included Single Board Computers, system-embedded Box PCs, and Panel PCs tailored to various customer needs.

DFI, the world's leading brand in embedded motherboards and industrial computers, has introduced its latest KS101-EHL industrial touchscreen PC designed for reliability and durability in semi-outdoor applications. Equipped with energy efficient Intel Atom Processors, the Panel PC provides the high performance required by various industries such as automatic car wash machines, ticket machines, and parking payment machines. Combined with its rugged design and intuitive interface, the KS101-EHL ensures operational and energy efficiency.

With sustained growth in recent years, the car wash industry has a growing demand for the optimization of human-machine interfaces and other equipment. Various environmental conditions such as high temperature, strong light, high humidity, and road dust can cause damage to sensors, connections, and screens. Therefore, products used in car wash systems must meet industry requirements of different application environments to maintain the safety, durability, and efficiency. Industrial-grade touchscreen tablets with robust designs play a crucial role in similar applications.

DFI, the world's leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM) MTH968 equipped with the latest Intel Core Ultra processor. It is the first product integrated with an NPU (Neural Processor Unit) processor, representing the official integration of AI with industrial PCs (IPCs). With the expansion into AI IPC, DFI expects to inject new momentum into the AI edge computing market.

According to the STL Partners report, the potential market value of global edge computing will increase from US$9 billion in 2020 to US$462 billion in 2030, representing a compound annual growth rate (CAGR) of 49%. Therefore, the development of products that utilize the core capabilities of chips to rapidly execute AI edge computing in devices has become a key focus for many major technology companies.

DFI, the global provider of industrial computers, has introduced its ECX700-AL ruggedized x86 PC for outdoor edge computing applications. Its impeccable performance capabilities, compact size, and high durability make it the ideal solution for outdoor operations. The ECX700-AL is a rugged computer with a waterproof and dust-proof design to withstand harsh environments and any type of climate. Stable performance is ensured with its wide operating temperature of -40 to 70 degrees Celsius. It is also equipped with a smart vent that drains water automatically, preventing typical problems such as condensation within the system or excessive heat.

An external SIM slot provides convenience for users when changing SIM cards, and the high-gain antenna delivers a high-quality signal. Versatile I/O settings including a combo port that supports 2 CANs and 2 COMs as well as selective display ports (HDMI/VGA) help integrators meet demands for various applications.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

DFI, the global leader in embedded solutions, today announced their latest PCSF51 next-generation 1.8" Single Board Computer at Embedded World 2023. The 1.8" SBC powered by the revolutionary AMD Ryzen Embedded R2000 Processor, the PCSF51 features advanced graphics processing and computing capabilities in a miniature form factor. Equipped with flexible expandability and I/O versatility, this energy-efficient SBC is tailored for use in industrial applications, robotics, edge computing, AI vision systems, and more.

"By leveraging the latest AMD Ryzen Embedded R2000 Processor, we have achieved many advantages for the tiny yet powerful PCSF51," said DFI President Alexander Su. "We have a positive outlook for future Industrial Pi innovations." Compared to its previous generation GHF51 with the AMD Ryzen R1000 Processor, the latest R2000 processor built into the PCSF51 delivers upgraded performance with double the max CPU core count, scalability up to four CPU cores and eight threads, and a 50% increase in CPU power. Graphics performance is boosted by 15% with up to eight graphic compute units. The design of the PCSF51 has also been enhanced from the previous GHF51, with an easier-to-use on board power/reset and HDMI, in addition to a thinner thermal module. With rich multimedia capabilities, it can support ultra-high-resolution displays in 4K resolution.

DFI, the global leader in embedded motherboards and industrial computers, has stepped into the electric vehicle (EV) market in recent years. Alongside VicOne, the automotive cybersecurity expert and the subsidiary of Trend Micro, they will demonstrate technologies related to vehicle software security application that enable more comprehensive network security protection for smart cities.

This year, to demonstrate the AI computing and vehicle-to-everything technology used in Connected Vehicles and Smart Poles, DFI has built an actual smart traffic intersection at the venue with road side units (RSU), digital signage, intelligent edge computers, onboard units (OBU), in-vehicle AI computers, and driver HMIs.

DFI, the leading global provider of embedded solutions and Edge AI computing technology across multiple industries, is releasing the new Edge AI inference computer EC70A-TGU. EC70A-TGU is powered by Intel 11th Gen Tiger Lake Core processors, with 8 GB onboard memory in a compact platform. Equipped with an all-new GPU in Iris Xe embedded graphics, EC70A-TGU delivers disruptive GPU graphics performance and enables faster processing of images and video streams. Users can leverage the GPU to power cutting-edge AI solutions for various applications, including Industrial Automation, AMR/AGV, Smart Transportation, Medical Imaging, etc.

Maintaining the small size of the previous generation fanless embedded system, the EC70A-TGU is equipped with a compact fanless design, measuring only 181.6 mm x 57 mm x 118.4 mm, while providing significantly upgraded performance. In addition, EC70A-TGU supports multiple I/Os, outperforming its counterparts with up to 6 USB 3.1 ports, and can be connected to more sensors and devices.

DFI, the world's leading brand in embedded motherboards and industrial computers, was invited to participate in "AMD Datacenter Solutions Day" in September, based on the theme of high-performance computing (HPC). As the first in the world to launch the smallest industrial motherboard equipped with AMD products, DFI partnered with its subsidiary, AEWIN, to present their star products and share how ultra-small products can help the trend of software virtualization technologies in the forum. We hope to optimize the development of diverse services in IoT applications.

AMD invited industry giants to the event to discuss the future of high-performance computing and conduct in-depth discussions with their partners related to high-performance computing, cloud computing, and AI. DFI was a speaker in the digital learning AI session during the event. DFI shared their views on software-defined IoT and explained the role of ultra-small products in the application environment.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x 16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz enhances high end performance for advanced inspection equipment and improves efficiency.

DFI, the global leading provider of high-performance computing technology across multiple embedded industries, unveils a server-grade ATX motherboard, designed for Intel Ice Lake platform, powered by the 3rd Generation Intel Xeon Scalable processors, and equipped with ultra-high speed computing that can support up to 205 W. ICX610-C621A also comes with built-in Intel Speed Select Technology (Intel SST), which provides an excellent load balancing between CPUs and multiple accelerator cards to effectively distribute CPU resource, stabilize computation loads and maximize computing power. As a result, it improves the performance by 1.46 times compared to previous generation.

Featuring powerful performance, the offers three PCIe x16, two PCIe x8 slots and one M.2 Key and enables ultra-performance computing, AI workload and deep learning, specifically for high-end inspection equipment, such as AOI, CT, and MRI application. The ICX610 also supports ECC RDIMM up to 512 GB 3200 MHz, enhances high end performance for advanced inspection equipment and improves efficiency.

As AI technology becomes ubiquitous, the impact of unusual weather also gains more attention. The most impressive case was the sudden weather change in Denver, the US, last September that the temperature dropped from 37°C to minus overnight. Faced with such fluctuation, the devices which maintained the daily life of the city in order, like the facilities for traffic flow analysis, surveillance, and AI visual analytics, could no longer operate normally, or even damaged, due to the lack of endurance to the extreme weathers.

Inspired by the situation, DFI brought an innovative design into the newly-released CS551, the "World's First 3.5" desktop SBC with auto heat-up". This breakthrough gives devices high performance with smaller footprint for image analysis or heavy workloads, no matter at subzero temperatures or under heat waves.

In the era of Artificial Intelligence of Things (AIoT), Industrial PC (IPC) is expected more than just a computer for general data processing. Faced with the increasing workload at the edge, end devices are required to be smart, automated and interconnected, which reflects on the demands of AI computing and M2M (Machine-to-Machine) communication in small-sized PCs.

The demand for AI computing emerged on the account of the decentralization trends in recent years to reduce cloud computing workloads and costs, and to reinforce AI performance at the edge, high-end embedded solutions is a must. But to downsize them and meanwhile support the conditions required by edge environments, like tight spaces and abrupt temperature changes, it's definitely a challenge for IPC manufactures.

Remember DFI? Those guys are into industrial PCs and embedded systems these days, and put out data sheets of upcoming products implementing the new Intel W480 chipset. A possible step-up from Intel Qx70 series chipset family, the W480 is positioned between the Q470 and Z490, and enables certain quasi-workstation features relevant to client desktops in very big organizations. The chipset enables vPro, and certain other features that helps with remote management.

The DFI specs, without taking model numbers, names several kinds of upcoming Xeon vPro and 10th generation Core E-SKUs. Among these are Xeon vPro processors in core-counts of 10, 8, and 6; and TDP levels of 80 W, and 35 W. It's not known if the 10th gen Xeon vPro succeed the workstation-segment Xeon E-series, which typically don't work on client-segment chipsets. We also see an assortment of Core i9, Core i7, Core i5, Core i3, Pentium and Celeron processors with the "E" brand extension, across a variety of TDP options. Unless we're horribly mistaken, the "E" brand extension could denote ECC memory support, at least in the case of the W480E and Q470E chipset variants.

DFI, which is focusing on IPC motherboards these days, launched the SD630-H110, an entry-level socket LGA1151 motherboard based on Intel H110 Express chipset, and built in the ATX form-factor. Designed with a focus on legacy connectivity, the board seats a 6th generation Core "Skylake" processor, powers it with a simple 6-phase VRM, and wires it to two DDR3 DIMM slots, supporting up to 16 GB of dual-channel DDR3L-1600 memory; and a PCI-Express 3.0 x16 slot. A PCI-Express 2.0 x4 slot (open-ended) and five legacy PCI slots make up the rest of its expansion area.

Storage connectivity includes four SATA 6 Gb/s ports. Legacy connectivity includes four serial COM ports, with one RS232 connector, an LPT port by header, 8-bit GPIO, a feature-rich LPCIO controller with EXT-RS232/RS485 connector options, PS/2 combo port, and a number of USB 2.0 ports. Modern connectivity includes two gigabit Ethernet interfaces, driven by Intel I210AT and Intel I219LM controllers; 6-channel HD audio, four USB 3.0 ports, DVI, and HDMI 2.0 display output.

DFI has announced a new mini-ITX form factor motherboard in the LR100-N16M which offers low power consumption, higher-performance, and fanless cooling. This board utilizes the latest two-chip Intel Atom processor N450 and Intel 82801HM I/O Controller (also referred to as "ICH8M") system solution. This smaller integrated two-chip platform uses approximately 40% less board space than previous generation three-chip solutions, and provides higher performance per watt than any previous Intel Atom processor-based platform.

The LR100-N16M mini-ITX motherboard is equipped with a 45nm Hi-K technology Intel Atom processor N450 with 5.5W TDP, 667MHz front side bus (FSB) and 1.67GHz core frequency. In addition, this single core processor features a 512kb 8-way L2 cache, 64bit computing support using Intel 64 architecture, on-die memory and graphics controllers, all in a small Micro-GCBGA8 package. Integrating the memory and graphics controllers on the processor die increases performance, reduces the board footprint, and lowers power consumption over the previous generation three-chip platforms.

Due to the serious issue of global warming, in order to reduce carbon dioxide emissions, saving energy has become the responsibility of every global citizen. DFI is committed to developing energy saving products, not only to provide consumers a better platform, but also to do the best for the earth. Therefore, Hybrid platform was invented. Besides saving plenty of energy, Hybrid platform also brings consumers the benefits of time saving, space saving, and money saving. In addition, it is simple to use. Via a control panel, two systems can be easily switched and using condition can be known.

Hybrid platform, adopts the latest DFI patent technology. That is, a board combines a powerful platform of the current mainstream (P45 + ICH10R) and a green platform (NVIDIA ION). In other words, Hybrid has two platforms which operate completely independently. What is more, files can be shared between platforms. Through integrated hardware switch chips as well as network switch chips, Hybrid platform features a KVM and LAN switch on board. So Hybrid platform can be used with a monitor and keyboard/mouse, or with two sets of devices to work separately. This product will bring you the following four benefits.

DFI LANParty today introduces its new motherboard, the Blood Iron BI P43-T34, after the launch of the high-end P55 motherboard. BI P43-T34 makes LANParty Blood Iron series a more complete product line. For those who like LANParty products, it is the best value motherboard.

To provide consumers with better value platform, BI P43-T34 is equipped with exclusive LANParty ABS II, CPU auto upgrade technology. CPU performance can be automatically promoted!! As long as users choose ABS II started while boosting system at the first time, the system's performance can be upgraded immediately. Therefore, users do not have to spend a lot of time and effort to set up for better performance. That is, even with limited budget, consumers still can obtain higher performance easily and fast.

DFI releases the new ES951 fanless embedded system equipped with the 3.5" subcompact NP951-B16C SBC. Featuring an Intel Atom N270 Processor and Intel 945GSE / ICH7M chipset with low power consumption, the ES951 is ideal for embedded computing applications requiring a compact passively-cooled platform.

The NP951-B16C SBC features up to 2GB of system memory using one 200-pin DDR2 400/533MHz SO-DIMM, VGA display port, and 24-bit HD audio with S/PDIF I/O support. The compact embedded system is constructed of electro-galvanized cold-rolled steel and aluminum, with provision for use in wall mount or desktop applications. It is supplied with a universal 60-watt power adaptor for use with 100-240 VAC at 50-60Hz line input.

The term 'Hybrid' these days probably relates most to hybrid cars. DFI has taken the concept of two machines - a high-power one, and an energy-efficient one, to a whole new level with its Hybrid P45-ION-T2A2 socket LGA 775 motherboard. This motherboard literally packs two motherboards sharing a PCB: one P45+ICH10R based socket LGA-775 system, and another portion holding an Intel Atom processor powered by NVIDIA ION chipset. Each has its own memory and storage subsystems, and share the machine's IO (input devices and display) in a somewhat KVM-style. So even as the major system is busy playing games, transcoding media, or running other power-hungry tasks, the minor system is quietly running the downloads, playing music, etc. When the major system is not needed, the minor system provides enough juice for media consumption and internet browsing, and general productivity at a really low energy footprint. A pretty neat concept. DFI's engineers describe it further in this YouTube video.

Possessing industrial grade technology, DFI LANParty is going to launch the newest Blood Iron series product, 785G-M35 Micro ATX motherboard. Accommodating AMD 785 chipset, BI 785G-M35 incorporates integrated ATI Radeon HD 4200, which supports DirectX10.1, Shader Model 4.1, and UVD 2.0. With 128MB DDR3 Sideport Memory, graphics performance of BI 785G-M35 can be improved up to 10%~15%. What is more, it comes with LANParty exclusive "ABS II" CPU Auto Upgrade technology and leading-edge digital PWM so as to let users enjoy the ultimate high performance and simultaneously save a huge amount of budget and electric pay.

CPU can be upgraded. Users do not need to spend a huge amount of money on high degree CPU, but still can obtain the same high performance. "ABS II" CPU Auto Upgrade Technology exempts users from complicated set-up steps. As long as users choose upgrade option at the first boost time, ABS II then will detect CPU and upgrade it automatically. As a result, performance is improved easily and money is saved accordingly.

Equipped with Industrial grade technology, DFI LANParty motherboard is always the best choice of enthusiasts in terms of performance and quality. This time, DK P55-T3eH9 does not only deliver brilliant performance, but also includes several exclusive and advanced technologies to satisfy user's needs. Accommodating Intel newest single chipset, P55, DK P55-T3eH9 comes with processor socket of LGA 1156. It also supports dual channel DDR3-1333 express memory. As for its unique features, DK P55-T3eH9 is provided with exclusive "ABS II" CPU auto upgrade technology, pioneering digital PWM of high power efficiency , as well as superior extreme cooler design. What is more, DK P55-T3eH9 adopts Creative X-Fi extreme fidelity technology and BIOSecure technology, providing marvelous audio and 100 % recovery of BIOS crash.

Using exclusive "ABS II" CPU auto upgrade technology, DK P55-T3eH9 can save around 35% budget for high degree CPU, when still rendering the same high performance. Without complicated set-up steps, CPU performance can be improved automatically as system is turned on. In addition, with the pioneering digital PWM, the power efficiency of DK P55-T3eH9 is much higher than traditional one's. By virtue of this, energy can be saved all the time. Besides, more stable power can be provided and then component lifespan can be extended.

DFI's retail-grade pack of motherboards for socket LGA-1156 platform will be lead by the LANParty Dark P55-T3eH9. Dressed in black and orange, the P55-T3eH9 sports a fairly standard feature-set for the Intel P55 chipset. The CPU socket is powered by a 6+2 phase VRM, and is wired to four DDR3 DIMM slots for dual-channel memory. Expansion slots include three PCI-Express x16, depending on what's under the heatsink south of the CPU socket, the orange slots could be (dual x16 or x8). The black slot looks like PCI-E x4, wired to the PCH. Two PCI-E x1 and PCI slots make for the rest of the expansion.

Apart from all the features the P55 PCH provides, including six SATA II ports, an additional controllers add two SATA II, an eSATA and one IDE connector for two devices. Connectivity is care of one gigabit Ethernet controller, and a number of USB ports, including one mini-USB. A high-grade HD audio codec also provides digital audio connectivity through optical and coaxial SPDIF connectors. The LANParty Dark P55-T3eH9 is expected to be priced at 175€.