Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC8 has been certified as a go to market partner with Microsoft for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC8 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Supertalent RC8 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Acer America today unveiled new commercial desktop PCs specified for corporate customers, government agencies and educational institutions. Multi-monitor support, significant power and expandability make the new Veriton 6620G Series desktops well-suited for enterprise environments.

The Acer Veriton X6620G, a small form factor (SFF) desktop and the Acer Veriton M6620G, a mini tower, offer a three-year warranty(1) and support up to a third-generation Intel Core i7 processor with significant application and graphics performance benefits when compared to prior generations.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping their new line of Mac compatible DDR3 memory modules. Upon completion of our testing conducted at Apple's Compatibility Lab headquarters (Cupertino, CA)-STT engineers unveiled their new line of Apple approved DDR3 memory modules.

SuperTalent now features eco-friendly modules that reduce the voltage requirements a full 10% from the traditional 1.5-volt to the new 1.35-volt standard. SuperTalent offers a wide variety of green DDR3 modules to meet the needs of new and existing server designs. Now is the perfect time to implement this cost cutting module by adding it to, or replacing your current DRAM memory.

To provide the best user experience on the AMD platform, ASUS has refreshed a variety of motherboards, including mainstream channel models, dedicated products from ROG and the TUF Series, plus FM1 socket-compatible and power-efficient APU-based models. Each product offers a variety of new ASUS exclusive technologies such as digital power control, Remote GO!, and Network iControl, alongside innovative Fast Boot, ASUS Boot Setting, and DirectKey, all specifically leveraging upcoming Windows 8 capabilities. Both new and existing features have been tailored and tested to comply with the Windows 8 architecture for total stability and maximized utility, while all motherboards have gone through a full series of compatibility assurance tests in getting ready for the move to Windows 8.

ADATA Technology Co., Ltd. today announced the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2400G modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Unigen Corporation, a leading OEM designer and manufacturer of enterprise-grade flash storage, DRAM, and wireless communication modules, today announced the launch of its 6Gb/s mSATA and mini mSATA solid state drive modules for embedded applications.

The modules are available in three models. The Unigen Model 2202 and 2204 feature high random access performance, while Model 2512 is optimized for incompressible data or multimedia files such as video, image, and audio files. These new SSD modules will be available for shipment in August 2012.

Themis Computer today announced the NanoPAK Small Form Factor Computer with AMD Fusion processors. Designed with a new generation of high performance, low-power processors to survive in demanding environments, the NanoPAK is a compact, mobile standalone rugged computer targeted for a myriad of extreme commercial and military applications that include stand alone and embedded computers, real time control, man wearable systems, smart displays, mobile computing, and robotics.

The NanoPAK system is now available with either the AMD Fusion processor or the Intel Atom processor and FLASH storage in a small, light footprint that optimizes size, weight, and power. Leveraging Themis thermal and kinetic management expertise, the hardened aluminum NanoPAK enclosure withstands the toughest environmental conditions.

Micron Technology, Inc., and Elpida Memory, Inc.'s ("Elpida") trustees announced today that the parties have signed a definitive sponsor agreement for Micron to acquire and support Elpida. The agreement has been entered into in connection with Elpida's corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court.

Under the agreement, 200 billion Yen (approximately USD $2.5 billion assuming 80 Yen/USD) total consideration, less certain reorganization proceeding expenses, will be used to satisfy the reorganization claims of Elpida's secured and unsecured creditors. Micron will acquire 100 percent of the equity of Elpida for 60 billion Yen (approximately USD $750 million) to be paid in cash at closing. In addition, 140 billion Yen (approximately USD $1.75 billion) in future annual installment payments through 2019 will be paid from cash flow generated from Micron's payment for foundry services provided by Elpida, as a Micron subsidiary. As a result of these payments, all pre-petition debt obligations of Elpida will be fully discharged under the corporate reorganization proceedings. The agreement also calls for Micron to provide certain financing support for Elpida capital expenditures, subject to specified conditions, and to maintain Elpida's operations and employees.

With the notion that simplicity and clarity lead to good design, KINGMAX, a world renowned leading brand of DRAM and flash memory, has launched PD-06 USB flash drive -- a retractable and capless flash drive that makes data storage easy to use with a simple flick of one thumb. The capless design thoughtfully avoids the risk of losing cap. The curve of grip is streamlined and ergonomic; the two choices of splendid color: bright red or lake green match white housing perfectly, rise fresh mien for hot summer time and again makes simple design even more eye-catching. Also, the wide range of capacities from 2GB to 32GB suits individual's need.

PD-06 becomes the latest product of KINGMAX POP flash drive series; POP series, suitable for general consumers, emphasizes trendy and fashionable elements as well as consistent high quality at a reasonable price range. PD-06 is light-weighting and the retractable design with a push-key design makes user plug into or remove from USB port quite easy with only a simple flick of one thumb. Whenever using it, users are free of losing cap. Streamlined white housing appears great attention to each curve - aesthetical and ergonomic - and makes PD-06 smoothly for use. In addition, the bright red / lake green color on the front presents elegance and good taste. What makes it more interesting is the end especially designed with the hanging strap hole, which allows user to attach to a lanyard or decorative phone string and to make a portable and fashionable technological accessory.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced the acquisition of Schooner Information Technology, Inc., an enterprise software company located in Silicon Valley that develops flash-optimized database and data store solutions. Schooner's products complement SanDisk's growing portfolio of enterprise solid state disk (SSD) and flash-optimized software offerings that enable customers to accelerate the performance of data-intensive applications and reduce overall cost of ownership. Schooner's team of database and flash optimization experts have joined SanDisk's Enterprise Storage Solutions (ESS) team. Schooner's products will be optimized for SanDisk's enterprise SSD portfolio as well as for enterprise SSDs from third parties.

Schooner's products are currently deployed by U.S. and international customers, including several Fortune 500 companies. Designed to fill the gap between stock do-it-yourself open source solutions and expensive high-end database deployments, Schooner's products deliver enterprise-grade performance, powering data center consolidation at a lower cost. Engineered for flash acceleration and enhanced with enterprise features, Schooner's products deliver up to five times the throughput of competing configurations. In addition, they deliver near in-memory response times to mission critical applications along with enterprise-grade replication and failover capabilities. In-memory database solutions are enabling breakthroughs in database and Business Intelligence applications that are only possible with solid state memories. Schooner's ability to combine DRAM and flash memory seamlessly in a single solution offers near DRAM performance at a lower cost.

Hard drive prices refuse to budge after last year's floods that struck manufacturing facilities in Thailand, even as manufacturers turn record profit. The solid-state drive market, on the other hand, is finally rolling with competition, high volume production, and advancements in NAND flash technologies. With memory majors such as Hynix adding new NAND flash manufacturing facilities to their infrastructure, SSD is expected to finally get its big break in the mainstream market.

SSD prices, according to price aggregators, are on a free-fall. Models which once held relative pricing as high as $2 per gigabyte, and going deep within the $1 mark. For example, Crucial's widely-praised M4 256 GB SSD has a price per GB of 'just' $0.82, and a market price around $200, something unheard of, for a 256 GB SSD with transfer rates of over 500 MB/s. With SSD major OCZ Technology releasing new generations of drives under the Vertex 4 and Agility 4 series that use Indilinx processors, older Vertex 3 and Agility 3 models are being phased out, some of these are seeing sub $1/GB prices. Intel is also responding to market trends, with prices of its SSD 520 series dropping sharply. Find a boat-load of stats at the source.

Corsair launched a new affordable high-density DDR3-1600 MHz dual-channel memory kit, model: CMZ16GX3M2A1600C9. The kit consists of two 8 GB modules, which operate at 1600 MHz (PC3-12800), with timings of 9-9-9-24, and DRAM voltage of 1.5V. The modules pack an Intel XMP v1.3 profile that enables the advertised speeds. Apart from these, the kit is built in the conventional Corsair Vengeance module design. It is expected to be priced at US $135.

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or 'PCRAM') technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM's expertise in such disciplines with SK Hynix's cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of new Secure Digital High Capacity (SDHC) and Secure Digital Extended Capacity (SDXC) Ultra High Speed I (UHS-I) U1 memory cards.

These latest additions to the company's Flash storage lineup bring breakthrough performance in speed and capacity, and are expected to strengthen the company's already formidable Premier Pro memory solutions.

Century Japan started selling a [relatively] affordable 16 GB DDR3-1600 MHz (PC3-12800) ECC Registered DIMM. The module runs at 1600 MHz with timings of 11-11-11, and has been tested on EVGA SR-X platform to achieve 192 GB (12 x 16 GB), scraping the address-space limits of Windows 7 64-bit client operating systems. The 240-pin RDIMM uses 36 Hynix-made DRAM chips. In Japan, Century's new 16 GB RDIMM is priced at 25,000 JPY (US $314) a pop. For reference, DDR3-1066 MHz 16 GB RDIMMs are priced around $300.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Dominator Platinum range of DDR3 memory kits, the world's most technologically-advanced performance memory. The new design adds a customizable light bar to the list of exclusive features, which includes patented DHX cooling, Corsair Link support, and hand-screened, super-overclockable DRAM ICs.

The new Dominator Platinum will be available in dual and quad-channel kits with 8GB, 16GB, 32GB, and 64GB capacities, and frequencies up to 2800MHz. Dominator Platinum DDR3 memory is designed to fully exploit the performance potential of the latest Intel and AMD platforms, including the "Ivy Bridge" 3rd generation Intel Core processor family. All Dominator Platinum kits support Intel's latest XMP 1.3 profiles for easy performance tuning.

Corsair is finally giving its high-end DRAM family some love, with the new Dominator Platinum family of high-speed DDR3 memory modules. With it, the company also came up with its newest DRAM module heatsink design. The new DHX heatsink uses a revamped design that extracts heat from the DRAM chips more efficiently. At its top portion, the module features a user-swappable "light bar", which is purely an aesthetic touch. Further, the modules support Corsair Link, which lets the user monitor temperatures and voltages of each module via software, in real-time. Pictured below is a DDR3-3000 MHz variant of the Dominator Platinum. The module packs an XMP 1.4 profile for 3000 MHz (1500 MHz actual), with CAS latency of 12T.

According to a stock market analyst with Seeking Alpha, Corsair is going public, with an initial public offering (IPO), in an effort to raise US $78 million, with a market capitalization of $223 million. Stifel, Nicolaus & Co., and RBC Capital Markets, will be underwriting it. Corsair will use the name "Corsair Components", and market symbol "CRSR" in its IPO.

Corsair has two main branches of products, memory products (DRAM and NAND flash products), and peripherals (power supply, cases, and gaming peripherals). Its income fluctuates with consumers' seasonal purchasing patterns. The company plans to net $42.5 million from its IPO, some of its proceeds go toward repaying a cumulative debt of $28 million, the rest of the proceeds go toward working capital and general corporate purposes. An estimated 4.1 million shares are expected to be sold by Corsair.

Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry's first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class* technology. The mobile DRAM (dynamic random access memory) chip, which went into mass production last month, will help the market to deliver advanced devices that are faster, lighter and provide longer battery life than today's mobile devices.

"Samsung began expanding the market for 4Gb DRAM last year with the first mass-produced 30nm-class DRAM, and now we are working on capturing most of the advanced memory market with our new 20nm-class 4Gb DRAM," said Wanhoon Hong, executive vice president, memory sales & marketing, Samsung Electronics. "In the second half of this year, we expect to strongly increase the portion of 20nm-class DRAM within our overall DRAM output to make the 4Gb DRAM line-up the mainstream product in DRAM production, and therefore keeping the leadership position in the premium market and strengthening our competitive edge."

Following a rapid turn of events, Micron Technology has emerged as a front-runner in the race to buy out ailing Japanese DRAM major Elpida. Elpida revealed Micron as the winner of the second round of bidding for the right to negotiate exclusively to buy it. DRAMeXchange predicts that Micron may offer up to 300 billion JPY (US $3.75 billion) for the deal, and the Micron+Elpida combine that emerges out of the deal, with its DRAM capacity, could bring about a revolutionary change in the industry.

The Elpida buyout, according to market analysts at TrendForce, will give Micron the capability to compete with Korean DRAM heavyweights SK Hynix and Samsung Electronics, in high-volume DRAM manufacturing. Elpida has been known for investments in DRAM R&D, and isn't behind the two Korean companies in terms of volume manufacturing. Its 30 nm-class DRAM yield-rate is nearly mature, while the next-generation 25 nm process is in testing phase.

Japanese DRAM maker Elpida has been reporting chronic financial problems since the beginning of 2012. It soon filed for bankruptcy, driving interest in competitors Toshiba, Global Foundries, Micron and Hynix (SK Hynix), to acquire it. Hynix has now reportedly withdrawn from the Elpida takeover bid. The withdrawal is likely due to its own financial situation. Hynix is not the first to withdraw from the bid, the first to drop out was Toshiba. With the two gone, Micron Technology is next in line, with a bid of US $1.4 billion to buy out Elpida.

Green House Japan released a pair of new 8 GB DDR3-1333 MHz (PC3-10600) memory modules. These consist of the GH-DRT1333-8GB and GH-DVT1333-8GB, which are 240-pin standard DIMM, and differ by the former having lifetime warranty, while the latter has 5 year warranty; and GH-DNT1333 and GH-DWT1333, which are 204-pin SO-DIMM modules with lifetime and 5-year warranties, respectively. Both kinds of modules are JEDEC standards-compliant, and run at DDR3-1333 MHz speeds with CAS latency of 9T, and 1.50V DRAM voltage.

OCZ introduced a new high capacity variant of its Octane consumer SSD series, the OCT1-25SAT3-1T. Built in the 2.5-inch form-factor with SATA 6 Gb/s interface, the new Octane variant provides 1 TB of unformatted capacity. Based on the Indilinx Everest processor, the drive packs 25 nm MLC NAND flash, and utilizes 512 MB of DRAM cache. It is rated to provide sequential transfer speeds of up to 460 MB/s (reads), 330 MB/s (writes), with 4K read/write random access performance of up to 24,000 IOPS and 32,000 IOPS, respectively. All modern consumer SSD features are present, including TRIM, NCQ, ECC, and 256-bit AES data-encryption. Slated for mid-May, the Octane 1 TB by OCZ won't exactly be cheap.

Worldwide semiconductor revenues increased more than 3.7% year over year to $301 billion in 2011, according to the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF). The industry weathered the macroeconomic uncertainties in the U.S and Europe, the earthquake and tsunami in Japan, China's slow down in the second half of the year, and floods in Thailand. Meanwhile, device applications, such as smartphones, media tablets and e-readers, automotive infotainment, notebook PCs, datacenter servers, and wireless and wired communication infrastructure drove robust consumption of semiconductors.

IDC's SAF tracks more than 100 semiconductor companies. Over 40 of these companies experienced year-over-year revenue growth greater than 5%, while about the same number of companies saw their revenue decline by more than 5%.

Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products - SSD (Solid Sate Drive), memory cards, DRAM and embedded memory - on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.

KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD-both withstand wide operation temperature(-40℃~ 85 ℃. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.