Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the industry's first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM, which is being produced at a 20 nanometer (nm) class* process node. The new 4Gb LPDDR3 mobile DRAM enables performance levels comparable to the standard DRAM utilized in personal computers, making it an attractive solution for demanding multimedia-intensive features on next-generation mobile devices such as high-performance smartphones and tablets.

"By providing the most efficient next-generation mobile memory with a very large data capacity, we are now enabling OEMs to introduce even more innovative designs in the marketplace," said Young-Hyun Jun, executive vice president, memory sales & marketing, Samsung Electronics. "Our 20nm-class four gigabit mobile DRAM provides another example of our ability to deliver well-differentiated, high-performance, high-density memory to customers in a timely manner."

ADATA Technology Co., Ltd. a world leader in DRAM modules and NAND Flash storage application products, today announced the start of shipments of its latest advanced in gaming technology, the XPG Gaming v2.0 Series DDR3-2600 MHz DRAM 8GB modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2600G 8GB modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

To tackle upcoming generations of Ultrabooks and NUC that lack space for discrete graphics, yet having to keep up with the demands of higher display resolutions (i.e. proliferation of 3840 x 2160), Intel is designing special variants of its Core "Haswell" processors that feature large integrated graphics cores bolstered by fourth-level eDRAM caches on-package. Pictured below, is one such contraption.

The graphics-enhanced Core "Haswell" processor is an MCM (multi-chip module) of two dies, the larger one is the actual "Haswell" processor complex with cores, uncore, and the larger GT3 integrated graphics core. While the standard Haswell silicon with GT1 and GT2 integrated GPU options, physically features up to 20 execution units (EUs), the large GT3 silicon features double that, at 40 EUs.

During her keynote at the Intel Developer Forum today in Beijing, Diane Bryant, senior vice president and general manager of Intel's Datacenter and Connected Systems Group, discussed how her company is helping users harness powerful new capabilities that will improve the lives of people by building smarter cities, healthier communities and thriving businesses.

Bryant unveiled details of upcoming technologies and products that show how Intel aims to transform the server, networking and storage capabilities of the datacenter. By addressing the full spectrum of workload demands and providing new levels of application optimized solutions for enterprise IT, technical computing and cloud service providers, unprecedented experiences can be delivered.

More than 100 developer and adopter members of the Hybrid Memory Cube Consortium (HMCC) today announced they've reached consensus for the global standard that will deliver a much-anticipated, disruptive memory computing solution. Developed in only 17 months, the final specification marks the turning point for designers in a wide range of segments-from networking and high-performance computing, to industrial and beyond-to begin designing Hybrid Memory Cube (HMC) technology into future products.

A major breakthrough with HMC is the long-awaited utilization of advanced technologies to combine highperformance logic with state-of-the-art DRAM. With this first HMC milestone reached so quickly, consortium members have elected to extend their collaborative effort to achieve agreement on the next generation of HMC interface standards.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the enterprise grade SX1000L solid state drive (SSD). While the company is well-established in the consumer SSD market, this is ADATA's first offering specifically tailored towards server applications.

Taking advantage of its expertise in NAND flash memory technology, ADATA is emphasizing the reliability and performance of the SX1000L. It employs static wear-leveling technology to maximize device mean time between failures (MTBF) to 1,500,000 hours, providing the long-term dependability required by high density computing and heavy load server operations. Available in 2.5" standard SATA form factor, the SX1000L implements advanced controller technology to enhance read/write performance. Sequential read speeds reach 560 MB/sec, and sequential write is as high as 340 MB/sec, with IOPS of 73,000 and 45,000 (Maximum 4K random read and write, respectively).

Known more for its graphics cards, Galaxy has an SSD lineup, with which it targets the Greater China region. It rolled out the Thunder GT 128 Pro, a 128 gigabyte SSD in the 2.5-inch form-factor, with SATA 6 Gb/s interface. The drive utilizes Toshiba-made Toggle-NAND flash, JMicron JMF667H processor, and an unknown amount of DRAM cache. The drive offers sequential transfer rates as high as 480 MB/s reads, 300 MB/s writes, 70,000 IOPS QD64 reads, and 58,000 IOPS QD64 writes. Available in China from later this month, the Galaxy Thunder GT 128 Pro is priced at 799¥ (US $128).

In addition to its 2.5-inch SATA 6 Gb/s TLC NAND flash SSD, Plextor showed off its upcoming SSD in the NGFF form-factor, designed for next-generation Ultrabooks. Based on the same Marvell 88SS9189 processor and triple-level cell (TLC) NAND flash memory as its 2.5-inch cousin, the drive differs in being a 42 x 22 mm (LxW) NGFF module, with PCI-Express 2.0 x2 interface. The drives will be sold in 128 GB and 256 GB capacities, featuring 256 MB and 512 MB DDR3 DRAM caches, respectively. On offer are read speeds of up to 700 MB/s, writes of up to 550 MB/s, and maximum 4K random write performance of 100,000 IOPS. The NGFF drives should arrive around the same time as Ultrabooks based on 4th generation Core "Haswell" processors.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of the DashDrive Elite UE700 USB flash drive. Building on the company's past successes and increasing brand strength, the UE700 is a striking blend of technological development and design aesthetics.

The improved transfer speed of the UE700 arrives at an opportune time, with USB flash drives being called on to store and deliver personal media content of higher quality and file size than ever before. Making extensive use of the enhanced bandwidth available to the USB 3.0 interface, it delivers transfer speeds up to an unbelievable 200 MB/sec read and 100 MB/sec write, outperforming the vast majority of USB flash drives available on the market today.

Transcend Information, Inc., a worldwide leader in storage and multimedia products, today announced the arrival of its 32GB DDR3 Load-Reduced DIMM (LRDIMM) memory module. An important component of today's powerful servers, LRDIMMs use a specially designed buffer to minimize the load on the server memory bus, allowing administrators to maximize memory capacity, increase performance, and reduce the power consumption of their systems.

In standard RDIMM technology, the data bus connects directly to the multiple ranks of DRAM chips on the module, which increases electrical load and limits system speed as more modules are added. In contrast, Transcend's DDR3 Low Voltage LRDIMMs feature a full memory buffer chip on the module, which acts as a go-between for all signals sent from the host to the DRAM chips, reducing the electrical load on all interfaces. Compared to standard RDIMMs or UDIMMs, a system using Transcend LRDIMMs can support more modules per channel and higher maximum memory capacity without sacrificing speed.

At CeBIT, Plextor showed off a yet unnamed line of consumer SSDs featuring 19 nm triple-level cell (TLC) NAND flash memory. The series consists of 128 GB, 256 GB, and 512 GB variants, with 256 MB, 512 MB, and 768 MB of DDR3 DRAM cache, respectively. The three are driven by Marvell 88SS9189 processor, and are built in the 2.5-inch form-factor, with SATA 6 Gb/s interface.

The 128 GB variant offers sequential read speeds as high as 530 MB/s, with up to 380 MB/s writes, and 72,000 IOPS 4K random write performance. The 256 GB variant ups that with 540 MB/s reads, and 450 MB/s writes. Leading the pack is the 512 GB variant, with 540 MB/s reads, and 465 MB/s writes. The lineup is expected to be launched this August.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today introduced its Premier series SDHC, SDXC and microSDHC ,microSDXC memory cards, all of which implement the UHS-I U1 (compatible with SDA 2.0 speed Class 10) specification. The new cards are designed especially to economically meet the performance needs of the most commonly used portable electronics.

With the increasing expectations for smart phones and tablet computers to handle high definition media recording and playback, the memory cards used with these devices require higher read and write speeds than ever before. The Premier series targets those who are looking for a cost-effective entry solution to extend their device's capacity and speed.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC4 has been certified for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. The RC4 is SuperTalent's second drive to be certified to date. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC. SuperTalent plans to continue to work with firms to unveil its "hardware secure" version in the near future.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC4 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Super Talent's RC4 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, showcases its PCIe and mini PCIe Flash Disk Modules.

Bypassing the SATA speed bottleneck, Super Talent's PCIe and mini PCIe FDMs offer huge performance gains with the ability to deliver read speeds up to 350 MB/sec and write speeds up to 220 MB/sec. The ultra-compact form factor is just right for solutions where space is limited, such as embedded applications, industrial PCs, all-in-one PCs, notebooks and netbooks.

Super Talent Technology, a leader of NAND Flash storage solutions and DRAM memory modules, today highlights its extensive collection of Flash Disk Modules (FDMs). These FDMs are ideal for embedded computing applications with their ability to plug directly into motherboards and their compact size which allows them to fit into small spaces. These FDMs also provide lower power consumption and greater ability to withstand harsh environments than mechanical hard disks, making them a wise upgrade choice or an excellent initial choice.

With offerings of MLC or SLC 40-pin, 44-pin, 7-pin, horizontal, vertical, and USB flash disk modules this collection provides businesses with a plethora of options. Stay alert as STT could expand this line even more in 2013. For more information, visit the product page.

Rambus Inc., the innovative technology solutions company that brings invention to market, today announced its first LPDDR3 offering targeted at the mobile industry. In the Rambus R+ solution set, the R+ LPDDR3 memory architecture is fully compatible with industry standards while providing improved power and performance. This allows customers to differentiate their products in a cost-effective manner with improved time-to-market. Further helping improve design and development cycles, the R+ LPDDR3 is also available with Rambus' collaborative design and integration services.

The R+ LPDDR3 architecture includes both a controller and a DRAM interface and can reduce active memory system power by up to 25% and supports data rates of up to 3200 megabits per second (Mbps), which is double the performance of existing LPDDR3 technologies. These improvements to power efficiency and performance enable longer battery life and enhanced mobile device functionality for streaming HD video, gaming and data-intensive apps.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

Plextor implemented a design change in the NAND flash memory of its M5S and M5 Pro series consumer SSDs. The two see a transit from 20 nm-class NAND flash chips in the BGA package, to 19 nm chips in the TSOP (pins along the shorter edges) package. Both chips are Toshiba-made. The controller and latest firmware (FW 1.02) remain unchanged. The move to chips in the TSOP package doesn't impact on the specifications or price of the products, but gives the controller the ability to handle greater page-size on the chips.

The TSOP chips feature maximum page-size of 16 KB/page, while the BGA chips feature 8 KB/page. In theory, this should improve "buffer management," when the controller decides to use NAND flash as scratchpads, in spite of having a gigabyte of DRAM cache at its disposal. Further, the new TSOP package NAND flash chips have lighter thermal requirements, letting Plextor get rid of the conductive thermal pads over the chips, saving a Dollar or two. The company did not release any markers on how to identify the two variants of drives by looking at serial numbers.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its updated mSATA 3 SSD drive. Super Talent's mSATA 3 boasts read speeds up to 550 MB/s and write speeds up to 500 MB/s. This mSATA SSD can be installed into tablets and netbooks using an mSATA form factor and the SATA III interface is backwards compatible with previous versions. This drive also has a mean time before failure (MTBF) of over 2 million hours, which is over 200 years of around the clock use.

Tessera Technologies, Inc. announced today that its Tessera, Inc. and Invensas Corporation subsidiaries each entered into new eight-year patent license agreements with SK hynix Inc.

"We are delighted that these new and broader agreements build on our long-standing and positive relationship with SK hynix, which has become the first DRAM manufacturer to reach agreements that give it access to both our Tessera, Inc. and our Invensas Corporation patent portfolios," said Robert A. Young, chief executive officer and president, Tessera Technologies, Inc. "Multi-year agreements like these benefit our customers with secure pricing and provide us with running royalties that fund new innovations."

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its UltraDrive MX2 for those that crave the need for speed in a computing environment.

With sequential read and write speeds up to 240 MB/sec, UltraDrive MX2 allows firms to cover bases from lightning fast transaction speeds for database servers to faster load times in high end gaming rigs. The UltraDrive MX2 also supports the latest garbage collection and TRIM features which are designed to keep this SSD running at peak performance.

Micron Technology, Inc., (NASDAQ: MU) today announced results of operations for its first quarter of fiscal 2013, which ended November 29, 2012. For the first quarter, the company had a net loss attributable to Micron shareholders of $275 million, or $0.27 per diluted share, on net sales of $1.8 billion. The results for the first quarter of fiscal 2013 compare to a net loss of $243 million, or $0.24 per diluted share, on net sales of $2.0 billion for the fourth quarter of fiscal 2012, and a net loss of $187 million, or $0.19 per diluted share, on net sales of $2.1 billion for the first quarter of fiscal 2012.

Revenues from sales of NAND Flash products were 4 percent lower in the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012, due to a 9 percent decrease in sales volume, partially offset by a 5 percent increase in average selling prices. Trade NAND Flash sales volume in the first quarter of fiscal 2013 decreased compared to the fourth quarter of fiscal 2012 primarily as a result of lower production of NAND Flash products. Revenues from sales of DRAM products in the first quarter of fiscal 2013 were 9 percent lower compared to the fourth quarter of fiscal 2012 primarily due to an 11 percent decrease in average selling prices. Sales of NOR Flash products were relatively unchanged for the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announces a facelift of the company's popular XPG line of DRAM modules that gives PC enthusiasts a choice of easily distinguishable performance options in three different stylish heat spreader colors.

The XPG level of DRAM modules are available in the following heat spreader colors and performance options: blue XPG DRAM modules that run at 1600 MHz with CL11 timing, black modules at 1600 MHz and CL9, and red ones at 1866 MHz and 2133 MHz with timing of CL10.

InnoDisk, a global leader in Industrial Flash and DRAM Storage Solutions, announces two whitepapers that present our solutions for Wear Leveling & Read Disturbance, Garbage Collection & TRIM for solid state drives (SSD's). InnoDisk is a service-driven organization, and is proud to provide useful, technical documentation to our customers and colleagues.

InnoDisk's wear leveling architecture and technology delivers an innovative method of spreading write/erase operations on an SSD evenly across blocks. By using system buffer blocks along with sophisticated block swapping and a configurable wear leveling performance frequency setting, SSDs using this technology can prolong their lifespan and prevent read disturbance.

Japanese PC memory maker OCMemory launched a new line of high-speed PC memory that stays cool without need fancy heatsinks or heatspreaders. The OCM2400CL10D-8GBN, launched in the series, takes advantage of Hynix high-density CFR DRAM chips to achieve DDR3-2400 MHz speeds, with timings of 10-12-12-31, and 1.65V, without needing any additional cooling components. In addition to a JEDEC-approved DDR3-1600 MHz fallback SPD profile, it includes an XMP profile to use its advertised speeds. The sticks use 8-layer black PCBs to improve signaling efficiency. The kit includes two 4 GB modules, and is priced at 6,000¥ ($72).