Last week's 7.443 GHz overclocking feat of the AMD FX-8350 certainly wasn't the last of it, for the chip. Korean overclocker NAMEGT achieved a clock speed of 8176.47 MHz, with all eight cores enabled, and both DRAM channels populated. 8176.47 MHz was achieved with a base clock of 281.94 MHz, multiplier of 29X, and 1.932V to fuel the chip. ASUS ROG Crosshair V Formula-Z motherboard and Samsung-made DDR3 memory was used. The best performing chip was binned from two 12-chip trays. Cooling it all was trusty liquid nitrogen. Find the CPU-Z validation here, and HWBot certification here.

Korean DRAM makers Samsung and SK Hynix have each stepped up efforts to scale up production on the new 20 nanometer silicon fabrication process, to make in the mainstream DRAM manufacturing process in 2013. The two have already begun volume production of DRAM on the 20 nm process in 2012, however, 30 nm remains as the mainstream DRAM production process. By 2H-2012, the 20 nm process could take its place. The two companies will gradually shift their focus from PC DRAM to enterprise and mobile DRAM, as PC DRAM continues to reel with oversupply.

According to DRAMeXchange, a research division of TrendForce, PC-ODM shipment figures indicate this year's peak shipment period for PCs has passed. Notebook shipments have shown a downtrend in October, indication that DRAM demand is slipping. As 4 GB modules are now the mainstream specification, price decline was more significant than for the 2 GB modules; average 4 GB price fell by 1.54% to US$16, while the lowest price broke the US$16 mark, arriving at US$15.75, amounting to a mere US$0.83 for 2 Gb chips - nearly the same as spot price. 2 GB module price, on the other hand, stayed the same at US$9.25. As module prices fall to such lows, DRAM suppliers are strategically focusing on high-density 4GB module shipments in hopes of stimulating sales due to content per unit increases.

TSMC today announced that it has taped out the foundry segment's first CoWoS (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. The milestone demonstrates the industry's system integration trend to achieve increased bandwidth, higher performance and superior energy efficiency.

This new generation of TSMC's CoWoS test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with significantly improved die-to-die connectivity bandwidth.

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for 'many-core' enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

AMD today announced the SeaMicro SM15000 server, another computing innovation from its Data Center Server Solutions (DCSS) group that cements its position as the technology leader in the micro server category. AMD's SeaMicro SM15000 server revolutionizes computing with the invention of Freedom Fabric Storage, which extends its Freedom Fabric beyond the SeaMicro chassis to connect directly to massive disk arrays, enabling a single ten rack unit system to support more than five petabytes of low-cost, easy-to-install storage. The SM15000 server combines industry-leading density, power efficiency and bandwidth with a new generation of storage technology, enabling a single rack to contain thousands of cores, and petabytes of storage -- ideal for big data applications like Apache Hadoop and Cassandra for public and private cloud deployments.

AMD's SeaMicro SM15000 system is available today and currently supports the Intel Xeon Processor E3-1260L ("Sandy Bridge"). In November, it will support the next generation of AMD Opteron processors featuring the "Piledriver" core, as well as the newly announced Intel Xeon Processor E3-1265Lv2 ("Ivy Bridge"). In addition to these latest offerings, the AMD SeaMicro fabric technology continues to deliver a key building block for AMD's server partners to build extremely energy efficient micro servers for their customers.

Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC8 has been certified as a go to market partner with Microsoft for usage with Windows To Go, a new feature of Microsoft's Windows 8 Enterprise edition. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC.

Certified through the Windows 8 Hardware certification kit, Super Talent's RC8 is one of the world's top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Supertalent RC8 meets and surpasses many of the performance requirements of Windows To Go certified drives.

Acer America today unveiled new commercial desktop PCs specified for corporate customers, government agencies and educational institutions. Multi-monitor support, significant power and expandability make the new Veriton 6620G Series desktops well-suited for enterprise environments.

The Acer Veriton X6620G, a small form factor (SFF) desktop and the Acer Veriton M6620G, a mini tower, offer a three-year warranty(1) and support up to a third-generation Intel Core i7 processor with significant application and graphics performance benefits when compared to prior generations.

Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today began shipping their new line of Mac compatible DDR3 memory modules. Upon completion of our testing conducted at Apple's Compatibility Lab headquarters (Cupertino, CA)-STT engineers unveiled their new line of Apple approved DDR3 memory modules.

SuperTalent now features eco-friendly modules that reduce the voltage requirements a full 10% from the traditional 1.5-volt to the new 1.35-volt standard. SuperTalent offers a wide variety of green DDR3 modules to meet the needs of new and existing server designs. Now is the perfect time to implement this cost cutting module by adding it to, or replacing your current DRAM memory.

To provide the best user experience on the AMD platform, ASUS has refreshed a variety of motherboards, including mainstream channel models, dedicated products from ROG and the TUF Series, plus FM1 socket-compatible and power-efficient APU-based models. Each product offers a variety of new ASUS exclusive technologies such as digital power control, Remote GO!, and Network iControl, alongside innovative Fast Boot, ASUS Boot Setting, and DirectKey, all specifically leveraging upcoming Windows 8 capabilities. Both new and existing features have been tailored and tested to comply with the Windows 8 architecture for total stability and maximized utility, while all motherboards have gone through a full series of compatibility assurance tests in getting ready for the move to Windows 8.

ADATA Technology Co., Ltd. today announced the start of shipments of the XPG Gaming v2.0 Series DDR3 2400G DRAM modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2400G modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Unigen Corporation, a leading OEM designer and manufacturer of enterprise-grade flash storage, DRAM, and wireless communication modules, today announced the launch of its 6Gb/s mSATA and mini mSATA solid state drive modules for embedded applications.

The modules are available in three models. The Unigen Model 2202 and 2204 feature high random access performance, while Model 2512 is optimized for incompressible data or multimedia files such as video, image, and audio files. These new SSD modules will be available for shipment in August 2012.

Themis Computer today announced the NanoPAK Small Form Factor Computer with AMD Fusion processors. Designed with a new generation of high performance, low-power processors to survive in demanding environments, the NanoPAK is a compact, mobile standalone rugged computer targeted for a myriad of extreme commercial and military applications that include stand alone and embedded computers, real time control, man wearable systems, smart displays, mobile computing, and robotics.

The NanoPAK system is now available with either the AMD Fusion processor or the Intel Atom processor and FLASH storage in a small, light footprint that optimizes size, weight, and power. Leveraging Themis thermal and kinetic management expertise, the hardened aluminum NanoPAK enclosure withstands the toughest environmental conditions.

Micron Technology, Inc., and Elpida Memory, Inc.'s ("Elpida") trustees announced today that the parties have signed a definitive sponsor agreement for Micron to acquire and support Elpida. The agreement has been entered into in connection with Elpida's corporate reorganization proceedings conducted under the jurisdiction of the Tokyo District Court.

Under the agreement, 200 billion Yen (approximately USD $2.5 billion assuming 80 Yen/USD) total consideration, less certain reorganization proceeding expenses, will be used to satisfy the reorganization claims of Elpida's secured and unsecured creditors. Micron will acquire 100 percent of the equity of Elpida for 60 billion Yen (approximately USD $750 million) to be paid in cash at closing. In addition, 140 billion Yen (approximately USD $1.75 billion) in future annual installment payments through 2019 will be paid from cash flow generated from Micron's payment for foundry services provided by Elpida, as a Micron subsidiary. As a result of these payments, all pre-petition debt obligations of Elpida will be fully discharged under the corporate reorganization proceedings. The agreement also calls for Micron to provide certain financing support for Elpida capital expenditures, subject to specified conditions, and to maintain Elpida's operations and employees.

With the notion that simplicity and clarity lead to good design, KINGMAX, a world renowned leading brand of DRAM and flash memory, has launched PD-06 USB flash drive -- a retractable and capless flash drive that makes data storage easy to use with a simple flick of one thumb. The capless design thoughtfully avoids the risk of losing cap. The curve of grip is streamlined and ergonomic; the two choices of splendid color: bright red or lake green match white housing perfectly, rise fresh mien for hot summer time and again makes simple design even more eye-catching. Also, the wide range of capacities from 2GB to 32GB suits individual's need.

PD-06 becomes the latest product of KINGMAX POP flash drive series; POP series, suitable for general consumers, emphasizes trendy and fashionable elements as well as consistent high quality at a reasonable price range. PD-06 is light-weighting and the retractable design with a push-key design makes user plug into or remove from USB port quite easy with only a simple flick of one thumb. Whenever using it, users are free of losing cap. Streamlined white housing appears great attention to each curve - aesthetical and ergonomic - and makes PD-06 smoothly for use. In addition, the bright red / lake green color on the front presents elegance and good taste. What makes it more interesting is the end especially designed with the hanging strap hole, which allows user to attach to a lanyard or decorative phone string and to make a portable and fashionable technological accessory.

SanDisk Corporation, a global leader in flash memory storage solutions, today announced the acquisition of Schooner Information Technology, Inc., an enterprise software company located in Silicon Valley that develops flash-optimized database and data store solutions. Schooner's products complement SanDisk's growing portfolio of enterprise solid state disk (SSD) and flash-optimized software offerings that enable customers to accelerate the performance of data-intensive applications and reduce overall cost of ownership. Schooner's team of database and flash optimization experts have joined SanDisk's Enterprise Storage Solutions (ESS) team. Schooner's products will be optimized for SanDisk's enterprise SSD portfolio as well as for enterprise SSDs from third parties.

Schooner's products are currently deployed by U.S. and international customers, including several Fortune 500 companies. Designed to fill the gap between stock do-it-yourself open source solutions and expensive high-end database deployments, Schooner's products deliver enterprise-grade performance, powering data center consolidation at a lower cost. Engineered for flash acceleration and enhanced with enterprise features, Schooner's products deliver up to five times the throughput of competing configurations. In addition, they deliver near in-memory response times to mission critical applications along with enterprise-grade replication and failover capabilities. In-memory database solutions are enabling breakthroughs in database and Business Intelligence applications that are only possible with solid state memories. Schooner's ability to combine DRAM and flash memory seamlessly in a single solution offers near DRAM performance at a lower cost.

Hard drive prices refuse to budge after last year's floods that struck manufacturing facilities in Thailand, even as manufacturers turn record profit. The solid-state drive market, on the other hand, is finally rolling with competition, high volume production, and advancements in NAND flash technologies. With memory majors such as Hynix adding new NAND flash manufacturing facilities to their infrastructure, SSD is expected to finally get its big break in the mainstream market.

SSD prices, according to price aggregators, are on a free-fall. Models which once held relative pricing as high as $2 per gigabyte, and going deep within the $1 mark. For example, Crucial's widely-praised M4 256 GB SSD has a price per GB of 'just' $0.82, and a market price around $200, something unheard of, for a 256 GB SSD with transfer rates of over 500 MB/s. With SSD major OCZ Technology releasing new generations of drives under the Vertex 4 and Agility 4 series that use Indilinx processors, older Vertex 3 and Agility 3 models are being phased out, some of these are seeing sub $1/GB prices. Intel is also responding to market trends, with prices of its SSD 520 series dropping sharply. Find a boat-load of stats at the source.

Corsair launched a new affordable high-density DDR3-1600 MHz dual-channel memory kit, model: CMZ16GX3M2A1600C9. The kit consists of two 8 GB modules, which operate at 1600 MHz (PC3-12800), with timings of 9-9-9-24, and DRAM voltage of 1.5V. The modules pack an Intel XMP v1.3 profile that enables the advertised speeds. Apart from these, the kit is built in the conventional Corsair Vengeance module design. It is expected to be priced at US $135.

SK Hynix Inc., today announced a joint development agreement and a technology license agreement with IBM for the development of Phase Change Random Access Memory (or 'PCRAM') technology.

IBM brings years of research experience in phase change memory technology, as well as profound know-how in developing multi-level cell (MLC) technology. Last June, IBM researchers demonstrated a reliable multi-bit, phase-change memory technology that would allow computers and servers to boot instantaneously and significantly enhance the overall performance of IT systems. Combining IBM's expertise in such disciplines with SK Hynix's cutting-edge manufacturing process optimization and cost competitiveness will help to accelerate the commercialization of PCRAM technology.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announced the launch of new Secure Digital High Capacity (SDHC) and Secure Digital Extended Capacity (SDXC) Ultra High Speed I (UHS-I) U1 memory cards.

These latest additions to the company's Flash storage lineup bring breakthrough performance in speed and capacity, and are expected to strengthen the company's already formidable Premier Pro memory solutions.

Century Japan started selling a [relatively] affordable 16 GB DDR3-1600 MHz (PC3-12800) ECC Registered DIMM. The module runs at 1600 MHz with timings of 11-11-11, and has been tested on EVGA SR-X platform to achieve 192 GB (12 x 16 GB), scraping the address-space limits of Windows 7 64-bit client operating systems. The 240-pin RDIMM uses 36 Hynix-made DRAM chips. In Japan, Century's new 16 GB RDIMM is priced at 25,000 JPY (US $314) a pop. For reference, DDR3-1066 MHz 16 GB RDIMMs are priced around $300.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Dominator Platinum range of DDR3 memory kits, the world's most technologically-advanced performance memory. The new design adds a customizable light bar to the list of exclusive features, which includes patented DHX cooling, Corsair Link support, and hand-screened, super-overclockable DRAM ICs.

The new Dominator Platinum will be available in dual and quad-channel kits with 8GB, 16GB, 32GB, and 64GB capacities, and frequencies up to 2800MHz. Dominator Platinum DDR3 memory is designed to fully exploit the performance potential of the latest Intel and AMD platforms, including the "Ivy Bridge" 3rd generation Intel Core processor family. All Dominator Platinum kits support Intel's latest XMP 1.3 profiles for easy performance tuning.

Corsair is finally giving its high-end DRAM family some love, with the new Dominator Platinum family of high-speed DDR3 memory modules. With it, the company also came up with its newest DRAM module heatsink design. The new DHX heatsink uses a revamped design that extracts heat from the DRAM chips more efficiently. At its top portion, the module features a user-swappable "light bar", which is purely an aesthetic touch. Further, the modules support Corsair Link, which lets the user monitor temperatures and voltages of each module via software, in real-time. Pictured below is a DDR3-3000 MHz variant of the Dominator Platinum. The module packs an XMP 1.4 profile for 3000 MHz (1500 MHz actual), with CAS latency of 12T.

According to a stock market analyst with Seeking Alpha, Corsair is going public, with an initial public offering (IPO), in an effort to raise US $78 million, with a market capitalization of $223 million. Stifel, Nicolaus & Co., and RBC Capital Markets, will be underwriting it. Corsair will use the name "Corsair Components", and market symbol "CRSR" in its IPO.

Corsair has two main branches of products, memory products (DRAM and NAND flash products), and peripherals (power supply, cases, and gaming peripherals). Its income fluctuates with consumers' seasonal purchasing patterns. The company plans to net $42.5 million from its IPO, some of its proceeds go toward repaying a cumulative debt of $28 million, the rest of the proceeds go toward working capital and general corporate purposes. An estimated 4.1 million shares are expected to be sold by Corsair.