Super Talent Technology, a leader of NAND Flash storage solutions and DRAM memory modules, today highlights its extensive collection of Flash Disk Modules (FDMs). These FDMs are ideal for embedded computing applications with their ability to plug directly into motherboards and their compact size which allows them to fit into small spaces. These FDMs also provide lower power consumption and greater ability to withstand harsh environments than mechanical hard disks, making them a wise upgrade choice or an excellent initial choice.

With offerings of MLC or SLC 40-pin, 44-pin, 7-pin, horizontal, vertical, and USB flash disk modules this collection provides businesses with a plethora of options. Stay alert as STT could expand this line even more in 2013. For more information, visit the product page.

Rambus Inc., the innovative technology solutions company that brings invention to market, today announced its first LPDDR3 offering targeted at the mobile industry. In the Rambus R+ solution set, the R+ LPDDR3 memory architecture is fully compatible with industry standards while providing improved power and performance. This allows customers to differentiate their products in a cost-effective manner with improved time-to-market. Further helping improve design and development cycles, the R+ LPDDR3 is also available with Rambus' collaborative design and integration services.

The R+ LPDDR3 architecture includes both a controller and a DRAM interface and can reduce active memory system power by up to 25% and supports data rates of up to 3200 megabits per second (Mbps), which is double the performance of existing LPDDR3 technologies. These improvements to power efficiency and performance enable longer battery life and enhanced mobile device functionality for streaming HD video, gaming and data-intensive apps.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, introduces its updated green memory modules.
With no tradeoffs in price or performance, choosing VLP DIMMs for computing can have an enormous environmental impact when the hundreds of thousands of memory modules produced monthly are taken into account.

"Decreasing overhead in a data center is an easy way for a company to reduce costs. With Super Talent's Green Memory, power and cooling costs can be easily cut while maintaining speed and reliability for a company," said Shimon, VP of Engineering, Super Talent Technology.

Plextor implemented a design change in the NAND flash memory of its M5S and M5 Pro series consumer SSDs. The two see a transit from 20 nm-class NAND flash chips in the BGA package, to 19 nm chips in the TSOP (pins along the shorter edges) package. Both chips are Toshiba-made. The controller and latest firmware (FW 1.02) remain unchanged. The move to chips in the TSOP package doesn't impact on the specifications or price of the products, but gives the controller the ability to handle greater page-size on the chips.

The TSOP chips feature maximum page-size of 16 KB/page, while the BGA chips feature 8 KB/page. In theory, this should improve "buffer management," when the controller decides to use NAND flash as scratchpads, in spite of having a gigabyte of DRAM cache at its disposal. Further, the new TSOP package NAND flash chips have lighter thermal requirements, letting Plextor get rid of the conductive thermal pads over the chips, saving a Dollar or two. The company did not release any markers on how to identify the two variants of drives by looking at serial numbers.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its updated mSATA 3 SSD drive. Super Talent's mSATA 3 boasts read speeds up to 550 MB/s and write speeds up to 500 MB/s. This mSATA SSD can be installed into tablets and netbooks using an mSATA form factor and the SATA III interface is backwards compatible with previous versions. This drive also has a mean time before failure (MTBF) of over 2 million hours, which is over 200 years of around the clock use.

Tessera Technologies, Inc. announced today that its Tessera, Inc. and Invensas Corporation subsidiaries each entered into new eight-year patent license agreements with SK hynix Inc.

"We are delighted that these new and broader agreements build on our long-standing and positive relationship with SK hynix, which has become the first DRAM manufacturer to reach agreements that give it access to both our Tessera, Inc. and our Invensas Corporation patent portfolios," said Robert A. Young, chief executive officer and president, Tessera Technologies, Inc. "Multi-year agreements like these benefit our customers with secure pricing and provide us with running royalties that fund new innovations."

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, announces its UltraDrive MX2 for those that crave the need for speed in a computing environment.

With sequential read and write speeds up to 240 MB/sec, UltraDrive MX2 allows firms to cover bases from lightning fast transaction speeds for database servers to faster load times in high end gaming rigs. The UltraDrive MX2 also supports the latest garbage collection and TRIM features which are designed to keep this SSD running at peak performance.

Micron Technology, Inc., (NASDAQ: MU) today announced results of operations for its first quarter of fiscal 2013, which ended November 29, 2012. For the first quarter, the company had a net loss attributable to Micron shareholders of $275 million, or $0.27 per diluted share, on net sales of $1.8 billion. The results for the first quarter of fiscal 2013 compare to a net loss of $243 million, or $0.24 per diluted share, on net sales of $2.0 billion for the fourth quarter of fiscal 2012, and a net loss of $187 million, or $0.19 per diluted share, on net sales of $2.1 billion for the first quarter of fiscal 2012.

Revenues from sales of NAND Flash products were 4 percent lower in the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012, due to a 9 percent decrease in sales volume, partially offset by a 5 percent increase in average selling prices. Trade NAND Flash sales volume in the first quarter of fiscal 2013 decreased compared to the fourth quarter of fiscal 2012 primarily as a result of lower production of NAND Flash products. Revenues from sales of DRAM products in the first quarter of fiscal 2013 were 9 percent lower compared to the fourth quarter of fiscal 2012 primarily due to an 11 percent decrease in average selling prices. Sales of NOR Flash products were relatively unchanged for the first quarter of fiscal 2013 compared to the fourth quarter of fiscal 2012.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash storage application products, today announces a facelift of the company's popular XPG line of DRAM modules that gives PC enthusiasts a choice of easily distinguishable performance options in three different stylish heat spreader colors.

The XPG level of DRAM modules are available in the following heat spreader colors and performance options: blue XPG DRAM modules that run at 1600 MHz with CL11 timing, black modules at 1600 MHz and CL9, and red ones at 1866 MHz and 2133 MHz with timing of CL10.

InnoDisk, a global leader in Industrial Flash and DRAM Storage Solutions, announces two whitepapers that present our solutions for Wear Leveling & Read Disturbance, Garbage Collection & TRIM for solid state drives (SSD's). InnoDisk is a service-driven organization, and is proud to provide useful, technical documentation to our customers and colleagues.

InnoDisk's wear leveling architecture and technology delivers an innovative method of spreading write/erase operations on an SSD evenly across blocks. By using system buffer blocks along with sophisticated block swapping and a configurable wear leveling performance frequency setting, SSDs using this technology can prolong their lifespan and prevent read disturbance.

Japanese PC memory maker OCMemory launched a new line of high-speed PC memory that stays cool without need fancy heatsinks or heatspreaders. The OCM2400CL10D-8GBN, launched in the series, takes advantage of Hynix high-density CFR DRAM chips to achieve DDR3-2400 MHz speeds, with timings of 10-12-12-31, and 1.65V, without needing any additional cooling components. In addition to a JEDEC-approved DDR3-1600 MHz fallback SPD profile, it includes an XMP profile to use its advertised speeds. The sticks use 8-layer black PCBs to improve signaling efficiency. The kit includes two 4 GB modules, and is priced at 6,000¥ ($72).

According to DRAMeXchange, a division of global research firm TrendForce, as forecast in a previous report, DRAM contract price showed signs of stabilization in November; the previous US$1 to $2 monthly decline is narrowing, and DDR3 4 GB contract price is holding at the US$15 mark. TrendForce expects the contract price trend will only show a slight decrease in December, and may even stay flat for the month.

As spot market prices fluctuate more than contract prices, the spot market is often a good indicator of future DRAM prices. This week the spot market is seeing increased activity; DDR2 and 2 Gb eTT and DDR2 prices have increased by 1.24% and 1.09%, respectively. Top-tier memory makers began quietly building inventory in October, and spot market buyers seem to be following suit, providing an opportunity for a price rebound. TrendForce believes the DRAM spot price uptrend is due prior capacity cuts taking effect as well as strong entry-level tablet, or "Mobile Internet Device", shipments in China.

PNY Technologies, Inc., a leading designer, manufacturer and a worldwide leader in DRAM Memory and Flash Memory products, continue adding to its enormously successful HP USB Flash Drives the stylish and fashionable HP v280w.

The HP USB Flash Drive v280w ideal of a knife shaped USB drive, coming as a capless swivel design that is easy to open and close. Furthermore, its capless design also prevents cap loss and better protects the drive. Using high quality aluminum brushed-metal brings stylish glamour and also durable for long term use. HP v280w offers large capacity (from 4GB to 64GB) for a slim way to store and share all of your digital contents. There is no hindrance anymore if you want to carry your precious data on the go.

Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, and South Korean fabless semiconductor company Novachips Inc. announces a development project to make the dedicated Automotive Solid State Drive (SSD) based on Novachips SATA 6Gbps SSD controller, NVS3600.

Super Talent is a leading manufacturer and provider of Automotive SSD that currently delivers the SATA 3 6Gbps-based automotive SSD as the main storage device of the AVN system mounted on a luxury car. It is the world's first SSD mounted on the AVN system for regular cars.

According to DRAMeXchange, a research division of TrendForce, as PC shipments are continually adjusted downwards and yearly growth has decreased by 5% YoY, demand for the peak season is not as strong as expected and the oversupply situation continues to worsen. As a result, contract price for 2 Gb chips fell by 22.5% in the third quarter, from US$1.11 in July to US$0.86 in September. Server and mobile DRAM are also showing falling price trends, resulting in an 8.5% drop in the value of the DRAM industry compared to the previous quarter; DRAM suppliers' revenues are falling across the board. However, looking at third quarter demand, with strong shipments for mobile devices like smartphones and tablet PCs, mobile DRAM accounted for 25% of total DRAM output, a significant increase from less than 20% in the second quarter. Consequently, market share is on the rise for memory makers with higher mobile DRAM ratios, like Samsung and Elpida. For the DRAM industry, improving core competitiveness lies in proper product adjustment, the key to profitability with such bleak market conditions.

Acer America has unveiled a new all-in-one (AIO) desktop, the Veriton Z2650G-UG645X featuring a 20-inch widescreen LED display and the convenience of the Windows 8 Pro and Windows 7 Professional operating systems for commercial customers. A sleek design, solid performance and smart management tools make the new Veriton Z2650G ideal for commercial environments where space and aesthetics are key considerations.

Developed to save space and provide a professional look to businesses and institutions, this all-in-one desktop is ideal for reception areas, call centers, hotel business centers, school libraries, news rooms and financial bullpens. Encased in a slim and elegant black chassis, the Veriton Z2650G enhances the décor of any work space and has adjustable legs to optimize viewing for maximum comfort. It also features a 20-inch widescreen LCD display with a 1600 x 900 resolution and 5ms response time to provide clear presentations, spreadsheets and images.

Market research firm TrendForce released NAND flash shipment figures for 3Q 2012. The global NAND flash market is valued at US $4.626 billion, a healthy 6.6% growth over the previous quarter. A TrendForce DRAMeXchange report provided a break-down of shipments of NAND flash by manufacturers. Leading the pack is Samsung, with 41.2% market-share, registering a 1.8% QoQ growth. Trailing behind is Toshiba, with 24.7% market share, and a significant 12.9% QoQ growth. In September, Toshiba cut prices and scaled up production, which may have contributed to the growth. Micron holds 14.4% of the market with 2.8% growth, SK Hynix 11.6% with 6.4% growth (the company began mass-production of SSD-grade NAND flash this quarter), and Intel with 7.6% of the market-share, growing at 19.7%. Bear in mind, these numbers represent NAND flash components used not only in SSDs, but also USB flash drives, memory cards, etc.

According to DRAMeXchange, a research division of TrendForce, given the persistent oversupply situation in the global DRAM market, along with the -5% YoY shipment growth for PCs, October contract prices have dropped below $16 USD, and are continuing to approach the $15 USD mark. The trends pose as yet another test to the cost structures of DRAM makers. With prices approaching or dropping below cash cost, manufacturers are faced with the option of either undergoing production cuts or shifting their focus towards non-DRAM products.

Other than ProMOS, which chose to quit the DRAM market due to financial woes, manufacturers like Elpida and Rexchip have taken the initiative to lower their output levels in August. Powerchip, beginning September, took a similar initiative by adjusting P3 wafer levels, whereas in the following month, Nanya and Inotera made the official announcement to implement 20% production cuts. For the South Korean DRAM manufacturers, whose cost structures appear to be superior to those of other competitors, no production cuts have been announced nor taken, although efforts to control output ratios have been intensified. At the same time that production of commodity DRAM is being lowered, an increasing amount of emphasis is being placed on the production of the more profitable mobile and server DRAMs.

Last week's 7.443 GHz overclocking feat of the AMD FX-8350 certainly wasn't the last of it, for the chip. Korean overclocker NAMEGT achieved a clock speed of 8176.47 MHz, with all eight cores enabled, and both DRAM channels populated. 8176.47 MHz was achieved with a base clock of 281.94 MHz, multiplier of 29X, and 1.932V to fuel the chip. ASUS ROG Crosshair V Formula-Z motherboard and Samsung-made DDR3 memory was used. The best performing chip was binned from two 12-chip trays. Cooling it all was trusty liquid nitrogen. Find the CPU-Z validation here, and HWBot certification here.

Korean DRAM makers Samsung and SK Hynix have each stepped up efforts to scale up production on the new 20 nanometer silicon fabrication process, to make in the mainstream DRAM manufacturing process in 2013. The two have already begun volume production of DRAM on the 20 nm process in 2012, however, 30 nm remains as the mainstream DRAM production process. By 2H-2012, the 20 nm process could take its place. The two companies will gradually shift their focus from PC DRAM to enterprise and mobile DRAM, as PC DRAM continues to reel with oversupply.

According to DRAMeXchange, a research division of TrendForce, PC-ODM shipment figures indicate this year's peak shipment period for PCs has passed. Notebook shipments have shown a downtrend in October, indication that DRAM demand is slipping. As 4 GB modules are now the mainstream specification, price decline was more significant than for the 2 GB modules; average 4 GB price fell by 1.54% to US$16, while the lowest price broke the US$16 mark, arriving at US$15.75, amounting to a mere US$0.83 for 2 Gb chips - nearly the same as spot price. 2 GB module price, on the other hand, stayed the same at US$9.25. As module prices fall to such lows, DRAM suppliers are strategically focusing on high-density 4GB module shipments in hopes of stimulating sales due to content per unit increases.

TSMC today announced that it has taped out the foundry segment's first CoWoS (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association's Wide I/O mobile DRAM interface. The milestone demonstrates the industry's system integration trend to achieve increased bandwidth, higher performance and superior energy efficiency.

This new generation of TSMC's CoWoS test vehicles added a silicon proof point demonstrating the integration of a logic SoC chip and DRAM into a single module using the Wide I/O interface. TSMC's CoWoS technology provides the front-end manufacturing through chip on wafer bonding process before forming the final component. Along with Wide I/O mobile DRAM, the integrated chips provide optimized system performance and a smaller form factor with significantly improved die-to-die connectivity bandwidth.

To address the significant increase in data over the next 10-15 years, and the demand for more energy-efficient network infrastructure and servers, ARM has announced the ARM CoreLink CCN-504 cache coherent network. This advanced system intellectual property (IP) can deliver up to one terabit of usable system bandwidth per second. It will enable SoC designers to provide high-performance, cache coherent interconnect for 'many-core' enterprise solutions built using the ARM Cortex-A15 MPCore processor and next-generation 64-bit processors.

LSI, a leading designer of intelligent semiconductors that accelerate storage, mobile networking and client computing, and Calxeda, an innovative supplier of disruptive SoC technology for the server market, are lead licensees for the CoreLink CCN-504 launch.

SK Hynix announced that it has introduced DDR3L-RS (Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.

By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.

AMD today announced the SeaMicro SM15000 server, another computing innovation from its Data Center Server Solutions (DCSS) group that cements its position as the technology leader in the micro server category. AMD's SeaMicro SM15000 server revolutionizes computing with the invention of Freedom Fabric Storage, which extends its Freedom Fabric beyond the SeaMicro chassis to connect directly to massive disk arrays, enabling a single ten rack unit system to support more than five petabytes of low-cost, easy-to-install storage. The SM15000 server combines industry-leading density, power efficiency and bandwidth with a new generation of storage technology, enabling a single rack to contain thousands of cores, and petabytes of storage -- ideal for big data applications like Apache Hadoop and Cassandra for public and private cloud deployments.

AMD's SeaMicro SM15000 system is available today and currently supports the Intel Xeon Processor E3-1260L ("Sandy Bridge"). In November, it will support the next generation of AMD Opteron processors featuring the "Piledriver" core, as well as the newly announced Intel Xeon Processor E3-1265Lv2 ("Ivy Bridge"). In addition to these latest offerings, the AMD SeaMicro fabric technology continues to deliver a key building block for AMD's server partners to build extremely energy efficient micro servers for their customers.