CHIEFTEC introduces the Hunter 3 (GS-03B-OP) and Night Hunter (GS-03B-BLK-OP) gaming cases, both supporting back-connect motherboards (ASUS BTF and MSI Project Zero compatible). The CHIEFTEC Hunter 3 improves on the Hunter 2 series, featuring a wider, sturdier chassis measuring 440 x 238 x 450 mm, tempered glass side panel, a perforated steel front panel (with removable dust filter), and improved radiator support. The new internal layout allows up to 360 mm radiators in the front and top, CPU coolers up to 178 mm tall, and graphics cards up to 425 mm long. It comes with four 120 mm A-RGB fans already installed, linked to a hub to sync with the motherboard and control fan speed. The front I/O panel features 1x USB 3.2 Gen 2 Type-C, 2x USB 3.0, Audio-out (AZALIA / HD-Audio), and Mic-In ports.

CHIEFTEC Night Hunter gaming case is "the black-out, airflow-focused variant of the Hunter 3 gaming case." The main difference being the four preinstalled 140 mm fans (no RGB) versus Hunter 3 120 mm A-RGB. Both cases support Mini ITX, microATX, ATX and E-ATX motherboards and plenty of internal drive bays (3x 2.5" and 1x 3.5" / 2x 2.5" and 2x 3.5").Presentation videos follow:

Advantech, a global leader in industrial and embedded computing, today announced the launch of seven new server platforms built on Intel Xeon 6 processors, optimized for industrial, transportation and communications applications. Designed to meet the increasing demands of complex AI storage and networking workloads, these innovative edge servers and network appliances provide superior performance, reliability, and scalability for system integrators, solutions, and service provider customers.

Intel Xeon 6 - Exceptional Performance for the Widest Range of Workloads
Intel Xeon 6 processors feature advanced performance and efficiency cores, delivering up to 86 cores per CPU, DDR5 memory support with speeds up to 6400 MT/s, and PCIe Gen 5 lanes for high-speed connectivity. Designed to optimize both compute-intensive and scale-out workloads, these processors ensure seamless integration across a wide array of applications.

Earlier in the week, ASRock debuted its Intel B860/H810 and full range of AMD B850 motherboards—the TechPowerUp team headed across CES 2025's showroom floor to check whether the Taiwanese manufacturer had some of these newly announced products on display. Various white Steel Legend models were present, including an intriguing B850 mainboard sample sporting ASRock's back mount design (BMD). The B860M Pro BMD board was not in sight (or not captured on camera)—according to a press release from earlier in the week, BMD had its premiere on this Intel-based solution.

AsRock reps happily showed off two Intel B860-chipset Steel Legend boards with traditional all-front facing connectors—an ATX option as well as an M-ATX (B860M) model were examined from close-up. A Phantom Gaming B860 Lightning Wi-Fi model was presented to TechPowerUp—its darker aesthetic contrasts sharply when lined up against its pale Steel Legend neighbors.

GameMax, an emerging brand of PC gaming components including gaming cases and power supply units, introduces the Titan Silent 2 chassis designed for content creators. The Titan Silent 2 is designed to support multiple hard drives and up to E-ATX motherboards - ideal for building workstation PCs. The chassis also has eight expansion slots for multi-GPU configurations.

For storage, the Titan Silent 2 supports up to 8x 3.5" HDDs on its tool-free drive bays and two 2.5" SSDs. Designed for silent high-performance computing, the chassis features sound-dampening on its panels to reduce noise. The chassis also has three 5.25" ODD bays for more expansions such as card readers, hot-swappable drive cages, and others. For cooling, the Titan Silent 2 comes with 3x pre-installed 120 mm cooling fans - supports up to 7x cooling fans. The chassis also supports liquid cooling solutions of up to 360 mm radiators to be mounted on top.

We are excited to announce the European release of the TRYX LUCA L70. Continuing with the launch of our highly anticipated products showcased at Computex, European PC enthusiasts can finally join the revolution, customers from Germany and UK can place the order on caseking.de and overclockers UK now, pre-orders are available for other regions in Europe.

Product Lineup for Europe
The European release of the TRYX LUCA L70 will feature two color options of black and white.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, launches the latest edition of its motorized desk series with the DK07. The LIAN LI DK07 motorized standing desk is designed with adaptability and performance in mind, seamlessly integrating a single powerful system or dual E-ATX setups. It offers ample space and efficient cable management, featuring built-in cable clips, a large underbelly cable tray, and 2 organizer drawers for a clutter-free workspace. It also includes convenient features like a wireless charging pad with built-in USB ports, ensuring your devices stay powered and your workspace remains organized. The DK07 is available in black at an MSRP of $1,399.99.

Built for power users, the desk seamlessly supports both single and dual-system configurations, with a modular bracket design at the rear that enhances compatibility and simplifies the installation process when switching between systems. Each system tray accommodates E-ATX motherboards, CPU coolers up to 180 mm, and GPUs up to 383 mm, vertically or horizontally mounted (for vertical installation, a riser cable sold separately is required). The desk supports various radiator sizes up to 360 mm, with multiple fan configurations for optimized cooling, including mounting locations for up to 12 x 120 mm fans or 6 x 120 mm 4 x 140 mm fans, and space for up to 6 x 3.5" HDDs in the front. The modular design allows even more flexibility, with the front radiator brackets supporting 480 mm or 420 mm + 240 mm radiators for enhanced cooling solutions.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, has introduced the latest model to its O11 series of PC cases with the O11 Vision Compact. Developed in collaboration with PC Master Race (PCMR), the O11 Vision Compact is a refinement of the previous O11 Vision. It maintains the 3-sided tempered glass showcase style while adding a top mesh panel and bracket for top cooling options. With a fixed motherboard tray and a more compact design, the O11 Vision Compact can support back-connect ATX motherboards. It features a large grommet passthrough for AIO radiators to connect to a side-mounted radiator in the second chamber. The O11 Vision Compact even integrates a rear passthrough for an internal IPS display, which can be easily mounted above the motherboard. The O11 Vision Compact is available in black and white at an MSRP of $119.99.

Two Configurations
The O11 Vision Compact now includes a top mesh option for excellent airflow in addition to the top glass configuration. The top glass mode provides a completely unobstructed view of the system with top, front, and left-side tempered glass panels. The magnetic mounting key in the top left corner performs double duty, securing the mesh configuration top bracket to the front glass, and with top glass, holding the three glass panels together with 35 kg of supporting force.

[Editor's note: Our in-depth review of the Lian Li O11 Vision Compact is now live]

In today's fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines cutting-edge innovation with unparalleled processing power and AI acceleration to drive the future of high-performance systems. Designed to elevate industry standards and redefine performance in demanding environments, the IMB-X1900 exemplifies ASRock Industrial's commitment to excellence. With powerful processing capabilities, expansive memory support, and advanced connectivity options, this motherboard is built on the robust Intel Xeon W-3500/3400 and W-2500/2400 Series Processors, ensuring it effortlessly manages even the most complex parallelized tasks, delivering exceptional efficiency and speed.

Key Features of the IMB-X1900 Motherboard:

• Unrivaled Processing Power: Featuring Intel Xeon W-3500/3400 and W-2500/2400 Series Processors with W790 chipset, the IMB-X1900 supports up to 60 cores, making it a powerhouse for computationally intensive workloads. This capability is crucial for industries such as 3D rendering, product simulation, and large-scale AI models training and inference.
• Expansive Memory Capacity: With support for up to 2 TB of DDR5 RDIMM ECC memory across 8 slots, the IMB-X1900 ensures seamless management of extensive datasets and complex simulations. This inclusion of ECC memory further enhances system reliability and data integrity, essential for industries like financial analysis, scientific research, and mission-critical applications.

MSI is set to launch its most advanced AM5 motherboard to date: the MEG X870E GODLIKE. This flagship model is designed to support AMD's Ryzen 9000 series processors and beyond. The MEG X870E GODLIKE boasts an impressive 28-phase power delivery system with 110 A power stages, surpassing its predecessor's capabilities. This robust VRM design ensures a stable power supply even for the most demanding scenarios of next-generation CPUs. The motherboard's E-ATX form factor provides ample space for its array of features, including support for DDR5 memory speeds exceeding 8000 MT/s and a capacity of up to 256 GB. Connectivity is a strong suit for this motherboard, featuring eight USB Type-C ports with varying speeds of up to 40 Gbps. Storage options include five M.2 slots (two PCIe Gen 5 and three Gen 4) and four SATA III ports.

For graphics, the board offers two PCIe Gen 5.0 slots. MSI has also included several user-friendly features, such as EZ M.2 and PCIe release mechanisms, making component installation and removal a breeze. The M.2 slots are equipped with MSI's Shield Frozr heatsinks, ensuring optimal thermal performance for NVMe SSDs. Perhaps most intriguing is the inclusion of an additional 8-pin power connector, specifically designed to support future multi-GPU setups like NVIDIA's anticipated RTX 50 "Blackwell" series. While pricing details are yet to be announced, the MEG X870E GODLIKE is expected to carry a premium price tag, reflecting its top-tier status in MSI's lineup. With the high-end power delivery setup, overclockers will find this motherboard interesting, and users are planning to upgrade to next-generation RTX 50 series GPUs. Availability is also unknown as of time of writing.

EVGA designed an enthusiast segment AMD X670E chipset motherboard for the Socket AM5 platform, which never made it to the mass market. It had even planned to give the board its coveted Classified brand, and sell as the X670E Classified. Prototypes of this board fetched over $1,300 in auction. The board is built in the E-ATX form-factor like most of the EVGA Classified series motherboards; and packs a powerful CPU VRM, besides several overclocker-friendly features, such as top-oriented DDR5 memory slots, side-facing I/O (including power inputs), and in general, a decluttered layout that won't get in the way of extreme cooling solutions.

There were four such prototypes with Jiacheng Liu, a hardware enthusiast, each of which went under the hammer. The only trouble with these prototypes is that they're bare—they don't include heatsinks for the CPU VRM or the chipset, let alone heatsinks for the two M.2 Gen 5 NVMe slots that don't eat into the Gen 5 x16 PEG. Another problem with these boards is that they're not supported by EVGA, and only come with their initial BIOS that supports Ryzen 7000 "Zen 4" processors, but not the upcoming Ryzen 9000 "Zen 5." We doubt if these even support the Ryzen 7000X3D series, which is probably the main reason the boards didn't fetch way more than $1,300 a piece at the auctions. Enthusiasts might still figure out a way to BIOS-mod and encapsulate the latest AGESA.

Expanding on the success of the O11D EVO, Lian Li has collaborated with Automobili Lamborghini to release a mid-tower case perfect for any petrolhead, the O11 EVO RGB Automobili Lamborghini.

Overview
Italian luxury meets Taiwanese innovation; the O11 EVO RGB Automobili Lamborghini is the next release from Lian Li in the O11 series. A mid-tower case crafted to be both aesthetically stunning and yet functional, the O11 EVO RGB Automobili Lamborghini case continues with the seamless look and dual chamber design of the O11 EVO RGB with additions to really drive home the Lamborghini collaboration.

At Computex last week, we got a first look at Gigabyte's new TRX50 AI TOP motherboard—where TOP stands for trillions of operations per second—designed for AMD's Threadripper and Threadripper Pro CPUs. Now the company has released the full specifications of the TRX50 AI TOP and the board is packed to the brim with features. The E-ATX board is home to four PCIe x16 slots, all of which can operate in PCIe 5.0, but one can be limited to PCIe 4.0, depending on your choice of CPU. There's also four NVMe M.2 slots, with CPU dependent functionality. Other features include eight DIMM slots, but these are again CPU dependent, two 10 Gbps Ethernet interfaces via a pair of Marvell AQtion AQC113C controllers, WiFi 7 via a Qualcomm QCNCM865 module and dual audio chips, one for the rear ports and one for the front panel audio.

As this is a 2024 model, USB4 is of course also part of the package, but only one of the two USB4 supports DP Alt-mode, due to there only being one DP input. The board also has an internal USB 3.2 Gen 2x2 (20 Gbps) header for a case mounted USB-C port, a further six rear 5 Gbps USB Type-A ports, plus a pair of internal headers for a further four 5 Gbps USB Type-A ports. The board also has four SATA ports, a 16+8+4 power phase design, a 14-layer PCB, a debug display and the now common easy release features for the M.2 drive heatsinks and the graphics card. The TRX50 AI TOP also sports what Gigabyte calls "UC BIOS" which has a "User-Centred intuitive UX with Quick Access function", but there's currently no details of how this differs from previous UEFI releases from Gigabyte. There was no word on pricing.

COUGAR's next generation of gear takes center stage at COMPUTEX, where we're excited to present our latest advancements in PC components and gaming chairs. Our focus this year is on disruptive design, subverting expectations on market trends: our gaming chairs address the needs of integrated work/play spaces as well as prioritizing lumbar health, powerhouse airflow PC cases apply thermodynamic principles to ventilation, and our interpretation of the increasingly ubiquitous panoramic view case puts a literal spin on the conventional design. COUGAR will be exhibiting from June 4-7 in the Nangang Exhibition Hall in Taipei, at Booth L0602: all are welcome to come check us out.

Transparency and brilliance are at the core of the FV270's design, featuring a polyhedral, tempered curved glass perimeter. The unobstructed view of the interior lets the world see your build not only as it is, but all that you imagine it to be. The innovative angled cooling fan placements and a lifted front panel enhance airflow, drawing in cold currents from below for optimal cooling. Cable management is seamless, hiding cable clutter behind the motherboard with reverse routing. Supporting E-ATX motherboards and GPUs up to 420 mm with horizontal and vertical mounting options, custom build potential for the FV270 is limitless. Easily removable filters guarantee protection from dust, and an optional illuminated rotating platform showcases your collectibles, putting a literal spin on conventional panoramic case design and making your PC a personal statement.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is excited to announce its participation at COMPUTEX 2024 from Jun 4 to Jun 7, 2024. COLORFUL Technology will be exhibiting its latest and upcoming products at the booth L0417a located at 4F, Hall 1 of the Nangang Exhibition Center. This year, COLORFUL Technology will expand its popular Vulcan, Neptune and Mini Series to more than just graphics cards and will include other PC components to complete a full gaming PC. COLORFUL will also be introducing new liquid cooling for the COLORFUL iGame GeForce RTX 4090 Vulcan LAB.

Featuring the themed gaming PCs launched and launching this year which includes the COLORFIRE MEOW and iGame ULTRA gaming PC Sets. Upcoming Vulcan, and MINI Series gaming PCs. The Vulcan Series consists of new concept products which will include a motherboard, DDR5 memory, chassis, peripherals, PSU, and liquid cooler featuring Asetek pump technology. The iGame Z790D5 Vulcan is designed to be a high-end motherboard. COLORFUL is already preparing a new Vulcan motherboard to the next-generation Intel Core processors.

EK, the leading name in custom loop liquid cooling, is proudly announcing the launch of the latest water-cooling-focused PC case made in collaboration with InWin, the renowned case manufacturer. The new EK-Quantum InWin 977EK was engineered from scratch with water cooling and ease of use in mind. It's a premium quality PC case that can accommodate two 420 mm radiators, has dedicated mounts for pumps, reservoirs, and combo units, and offers the ultimate user-friendly experience for custom loop liquid cooling enthusiasts.

EK-QUANTUM InWin 977EK
Crafted from a single, robust piece of 4 mm-thick, high-quality brushed aluminium, the outer shell of this PC case proudly embodies the iconic InWin aesthetic. Meticulously bent by skilled artisans using hand-operated techniques, it showcases their dedication to craftsmanship.

Thermaltake today rolled out the View 270 TG ARGB, a line of ATX mid-tower cases featuring a pillarless front-left corner, for a more unimpeded view of your build. Much like the ZALMAN P10, this case doesn't feature a wrap-around single-piece glass, but rather two planar tempered glass panels that meet at the corner, so you'll notice the edge line. Still, this is better than an inch-thick pillar. Also like the ZALMAN P10, the Thermaltake View 270 TG ARGB features a horizontally partitioned layout that extends to even its exterior—the tempered glasshouse only covers the upper compartment. The bottom compartment with the PSU- and drive bays feature static perforated panels along the left- and front sides; and is only accessible from the single piece right side-panel. The right panel features perforations toward the front, aligning with the side-facing radiator mount. An interesting aspect about this mount is that it's located entirely in the crawlspace behind the motherboard tray, it doesn't intrude into the motherboard tray compartment, and so you can mount a 360 mm radiator without its fans impeding your long graphics cards in any way.

The motherboard tray seats E-ATX (or smaller) motherboards with 7 expansion slots; you get room for graphics cards up to 42 cm in length, and CPU coolers up to 18 cm in height, so there's plenty of room to wrestle with your graphics card's 12VHPWR cable. Fan and radiator mounts, besides the 3x 120 mm side-facing mount detailed above, include three 140 mm / 120 mm top mounts that can hold a radiator as large as 360 mm; and a 120 mm rear exhaust. The partition dividing the bottom and top compartments is perforated, and you can mount up to three 120 mm fans here. The case measures 230 mm x 454 mm x 456 mm (WxDxH), weighing 6.3 kg. All its metal bits are made of SECC steel. The case comes in four color trims—Black (CA-1Y7-00M1WN-00), Snow (CA- 1Y7-00M6WN-00), Hydrangea Blue (CA-1Y7-00MFWN-000, and Matcha Green (CA-1Y7-00MEWN-00). The included rear 120 mm fan comes with addressable RGB lighting. The company didn't reveal pricing.

In addition to the new AIO coolers and PSUs, ENERMAX brought a full lineup of new PC cases to the CES 2024 show, including the new ENERPAZO lineup, the new EK98, and the SK30 V2 PC cases. The ENERPAZO lineup with the ENERPAZO EP33 mid-tower and the ENERPAZO EP23 mini-tower PC cases, and the EK98 mid-tower PC case, all come with built-in USB 3.2 Gen 1 and USB 3.2 Gen 2 Type C ports and reusable PCIe slots, as well as feature recognizable ENERMAX design with grill front and glass side panel.

The ENERPAZO EP33 supports up to an E-ATX motherboards, has support for a 420 mm AIO liquid CPU cooler and up to 11 fans, while the ENERPAZO EP23, as mini-tower PC case, supports up to a micro-ATX motherboard and a 360 mm AIO liquid CPU cooler and up to 8 fans. The EK98 supports up to a 360 mm AIO liquid CPU cooler and up to 9 fans, as well as comes with vertical GPU installation support with rotatable PCIe slots and pre-installed 4 ARGB PWM fans. ENERMAX also showcased the new SK30 V2 PC case mid-tower PC case which also comes with USB 3.2 Type-C ports, supports up to 360 mm AIO liquid CPU cooler ass well as comes with the same vertical GPU installation support and couple of pre-installed ARGB PWM fans.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is thrilled to announce the CTE E600 MX E-ATX Mid-tower PC Chassis today, and now showcased at the CES 2024 in Las Vegas. This cutting-edge Mid-tower chassis marks a significant addition to the award-winning CTE series. The CTE E600 MX inherits Thermaltake's innovative CTE (Centralized Thermal Efficiency) Form Factor as a dual-chamber mid-tower case. This design concept strongly emphasizes delivering high-level thermal performance to critical chassis components. The CTE E600 MX has a revolutionary 3-way GPU installation option and an interchangeable dual-front panel design for optimal flexibility and PC gaming build customization. It is now available in black, snow, and hydrangea blue editions.

"The CTE series PC case represents a significant leap in innovation, having been prominently featured at the last CES. Our latest addition, the CTE E600 MX, is remarkable. Our product design team closely studied feedback from gaming communities, particularly from hardcore gamers. They strongly preferred a PC case offering extensive installation options for critical gaming components, such as graphic cards. By balancing functionality with aesthetics, we ensured that the CTE E600 MX didn't compromise chassis ventilation while maintaining a sleek and appealing look," stated Michael Guo, the vice president of Thermaltake USA.

Lian Li collaborated with PC Master Race (PCMR) to create the PC-O11 Vision, a variation of the popular dual chambered case by Lian Li that's designed for maximum visibility of the internals of your build. The case features tempered glass on three of its sides—front, left side, and top—with no column along the front-left edge. The structure is held in place by a reinforced front-right column. The front- and left-side panels are made of 4 mm-thick glass, while the top is 3 mm thick. There are two variants of the PC-O11 Vision based on color—matte black, and white. The metal bits of the front panel feature a brushed aluminium finish.

The PC-O11 Vision has room for an E-ATX (or smaller) motherboard, with clearance for even the largest graphics cards such as the RTX 40-series ROG Strix. Cooling options include support for up to two 360 mm and one 240 mm radiators. A removable multi-function storage bracket provides three 2.5-inch drive mounts, and doubles up as a cable routing structure. There is an additional detachable drive cage that holds two 3.5-inch/2.5-inch drives. Available now in the UK through OverclockersUK, the black version of the PC-O11 Vision is priced at £139.98, and the white version £144.95, including VAT.

EK, the premium water cooling gear manufacturer, is proud to introduce the limited edition EK-Quantum Torsion A60 PC case, created specially for liquid-cooled builds. It is entirely built of CNC-milled aluminium, weighing around 22 kg. The EK-Quantum Torsion A60 is not just a case but a statement. Its machined channels for custom-sleeved cables and an integrated D5-powered distribution plate make it a true marvel for water-cooling enthusiasts. The case fits the mid-tower standard and fits up to three medium-thick EK-Quantum Surface P360 radiators. A tempered glass side panel, an integrated vertical GPU bracket, and support for ATX and E-ATX motherboards are only a few of the perks this chassis has to offer.

Crafted in Aluminium, Cooled in Style
EK-Quantum Torsion A60 boasts a chassis machined entirely out of 6082 aluminium alloy using state-of-the-art CNC machining. The 6082 alloy has the highest strength among the 6000 series alloys and boasts excellent corrosion resistance. This results in a case that not only exudes durability but radiates a sense of refined elegance. The precisely engineered design showcases attention to detail in every facet, making it the perfect canvas for your liquid cooling ambitions. Every piece is held together with hex screws, so you can disassemble, customize, and modify anything you desire.

InWin Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, has introduced the first ever fully modular case, the ModFree PC chassis. Fully interchangeable and expandable, it allows PC enthusiasts to freely transform the design, layout, and structure to meet their exact needs and preferences in hardware and cooling. InWin offers a Base Edition preset featuring Mod-I and Mod-II modules along with three InWin Jupiter AJ140 ARGB case fans. The Deluxe Edition preset comes with Mod-I, Mod-II, and two Mod-III modules, and four Jupiter AJ140 fans too.

ModFree: An Easy, Sustainable System
The ModFree ecosystem is designed around toolless interlocking clips that allow users to easily swap modules around. Unlike conventional chassis, ModFree uses an inverted motherboard design that allows users to showcase their hardware from the left side of the desk instead of competing for space with the mouse pad on the right. Investing in this ecosystem ensures an upgrade to add more cooling or more space is just a module away, which also helps to reduce the environmental impact considering you would no longer need to build an entire new system anytime you need to upgrade. ModFree offers a 3D interactive assembly guide with easy-to-follow demonstrations and ideas for how to use each module. Users can also experiment with designs directly in the app.

Cooler Master, a global leader in PC components, has today announced two groundbreaking products that promise to overhaul the way we think about building PCs: the Qube 500 Flatpack PC case and the next-gen MasterLiquid Atmos liquid cooler series. Both products epitomize the brand's commitment to innovation, functionality and sustainability.

"Throughout Cooler Master's journey, we've consistently driven innovation and elevated user experiences," said Jimmy Sha, Cooler Master CEO. " The Qube 500 and the MasterLiquid Atmos show our undying passion for revolutionizing the PC landscape. They're not just products; they're extensions of our commitment to empower our community's PC-building and gaming adventures."

GAMDIAS, the leading brand for PC gaming hardware, announced the brand-new full-tower case, NESO P1, which comes with a dual-chamber design with a unique trapezoidal form factor to showcase your hardware in a panoramic display. Available in four colors, the NESO P1 is a top-of-the-line chassis that offers prime lifestyle, functionality, and versatility for gamers, enthusiasts, and professionals who demand high performance and aesthetics.

Modualar Orientation and One-touch Release Mechanism
Crafted to elevate the building experience, NESO P1 provides two appearances in one model with modular pedestals which enable users to rotate the case from horizontal to vertical orientation with ease. The one-touch release mechanism allows you to access your hardware with a simple touch, and the dual-hinged tempered glass side panels are detachable for an improved modding experience.

Raijintek today introduced the ZOFOS Ultra, an ATX full-tower case for high-end gaming PC builds. The case measures 598 mm x 254 mm x 597 mm (DxWxH), and features a horizontally partitioned layout. Its motherboard tray supports boards as large as E-ATX. An interesting aspect about this case is its vast number of drive bays. There are as many as fourteen 3.5-inch drive bays, four of which are located in the lower compartment, and the rest along detachable drive cages toward the front of the case, making it fit for home-server or video production builds. With these drive cages in place, you have clearance for graphics cards up to 37 cm in length. Without them graphics cards can be as long as 54 cm. In place of the drive cages, four 120 mm fans, or a 360 mm x 120 mm radiator can be mounted. The lower two drive cages can be additionally detached to make room for liquid cooling hardware.

Ventilation options on the Raijintek ZOFOS Ultra include a 140 mm rear exhaust, either four 120 mm or three 140 mm top exhausts, either three 140 mm or four 120 mm front intakes, and four 120 mm side vents (replacing the drive cages). Besides the 14 3.5-inch drive cages, there are three additional 2.5-inch mounts behind the motherboard tray. Radiator mounting options include a 420 mm x 140 mm (or smaller) along the front intake, a 420 mm x 140 mm (or smaller) along the top, a 360 mm x 120 mm along the side, and a 240 mm x 120 mm along the base of the motherboard tray. There are 10 conventionally located expansion slots, and three vertical ones. A roomy crawl-space has been created around the region of the motherboard, behind the tray, for easy cable management. The case includes two ARGB LED lighting elements, which take in 3-pin ARGB inputs. Front-panel connectivity includes two USB 3.x type-A, one USB 3.1 type-C, and a 4-pole headset jack. The company didn't announce pricing information.

darkFlash, a Taiwanese maker of computer parts and peripherals, had a strong presence at Computex 2023, where the company had a wide range of products to expose to the masses. Starting with an all-in-one (AIO) water cooling, darkFlash had four AIO designs to showcase, each with a different theme going on. The first in line is the DXv3.0 line, which features a regular 360 mm radiator paired with a CPU water block that has a unique mesh design. On the mesh, users can attack fans that provide additional cooling. Next up are DSC 360, DN 360, and DC 360 white AIO versions that are only differentiated by their CPU water block and radiator design.