Advantech, a leading global provider of industrial edge AI solutions, is excited to introduce its GPU server SKY-602E3 equipped with the NVIDIA H200 NVL platform. This powerful combination is set to accelerate the offline LLM for manufacturing, providing unprecedented levels of performance and efficiency. The NVIDIA H200 NVL, requiring 600 W passive cooling, is fully supported by the compact and efficient SKY-602E3 GPU server, making it an ideal solution for demanding edge AI applications.

Core of Factory LLM Deployment: AI Vision
The SKY-602E3 GPU server excels in supporting large language models (LLMs) for AI inference and training. It features four PCIe 5.0 x16 slots, delivering high bandwidth for intensive tasks, and four PCIe 5.0 x8 slots, providing enhanced flexibility for GPU and frame grabber card expansion. The half-width design of the SKY-602E3 makes it an excellent choice for workstation environments. Additionally, the server can be equipped with the NVIDIA H200 NVL platform, which offers 1.7x more performance than the NVIDIA H100 NVL, freeing up additional PCIe slots for other expansion needs.

Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs.

As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs.

At AAEON Technology, we recognize growing demand for secure and reliable industrial systems. In collaboration with Canonical, AAEON Technology validates Ubuntu Pro across our Intel-based industrial systems. Each unit comes with a preinstalled Ubuntu image, an Ubuntu Pro license sticker, and 10 years of Canonical-backed updates for ongoing security and maintenance. "This collaboration means our customers benefit from cutting-edge hardware paired with the secure, long-term support offered with Ubuntu Pro enabled. With ongoing updates, they're always protected, allowing them to focus on their core goals," said Victor Lai, Managing Director at AAEON.

Ubuntu Pro provides enterprise-level security, compliance, and long-term stability for industrial and edge applications. It meets strict regulatory standards while delivering high performance in demanding environments.

The MS-CF16 Pico-ITX SBC is powered by Intel Alder Lake-N/Amston Lake series processors, offering up to 16 GB of LPDDR5X memory for efficient, high-performance computing. It supports dual independent displays via HDMI and LVDS/eDP interfaces, and features multiple I/O options including 2.5 GbE/1GbE, USB 10 Gbps/5 Gbps and two M.2 slots for flexible connectivity. The board's ultra-compact 2.5" Pico-ITX form factor ensures easy integration into space-constrained environments.

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.

ADLINK Technology Inc., a global leader in edge computing and a renowned supplier of industrial PCs and motherboards, is proud to announce the launch of the new SBC35 Series of 3.5" Single Board Computers (SBC). This innovative series introduces a range of motherboards specifically engineered to maximize efficiency in compact spaces. The SBC35 Series features two models: the high-performance SBC35-RPL, powered by the 13th Gen Intel Core processors, and the energy-optimized SBC35-ALN, equipped with the Intel N97 processor. Additionally, the series boasts an expansive range of I/O modules and SBC-FM Adaptive Function Modules (AFM) that significantly enhance system capabilities. These advancements make the SBC35 Series exceptionally suitable for a wide array of applications in automation, transportation, medical fields, and smart city projects, including Autonomous Mobile Robots (AMRs), Electric Vehicle (EV) charging stations, and self-service kiosks.

The SBC35 Series showcases two compact models in a 146x102mm 3.5" SBC form factor, each designed to maximize space and functionality in demanding settings. While the high-performance SBC35-RPL supports up to 64 GB DDR5 4800 MHz RAM and four independent displays, the efficiency-optimized SBC35-ALN accommodates up to 16 GB DDR5 4800 MHz RAM and three independent displays. Both units are equipped with an extensive array of connectivity options, including four USB ports and versatile M.2 slots (2280 M Key, 2230 E Key, 3042 B Key), supplemented by dual RS-232/422/485, and additional dual RS-232 ports, audio, and digital I/O capabilities. Optional TPM 2.0 further enhances security, making these models highly adaptable for a broad range of industrial applications. Their comprehensive I/O and expansion options ensure that they can be customized to meet specific project requirements, providing exceptional versatility and scalability.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, storage devices, and IPC products, is excited to introduce the all-new BIAST-PAT industrial motherboard solution. The BIAST-PAT motherboard is expertly designed to meet the diverse needs of System Integration (SI) businesses and industry professionals seeking to build robust, efficient, and future-proof systems for business and industrial applications. It is a highly versatile platform, perfectly suited for applications in AIOT machines, automation systems, edge computing devices, HMI machines, and digital signage.

The BIOSTAR BIAST-PAT motherboard, with its robust wide temperature and broad voltage support, is engineered to excel in a variety of demanding environments, making it a prime choice for numerous outdoor applications. Its design incorporates M.2 Key-M, Key-B, and Mini-PCIe slots, offering exceptional versatility in connectivity options. This compatibility extends to Hailo AI acceleration cards, further enhancing its edge AI utility.

Simply NUC, a global leading provider of customized PC solutions, proudly announced its most ambitious product launch to date: BMC-Enabled extremeEDGE Servers. Representing a massive leap in edge computing technology, the new product family of servers are positioned to reshape how businesses manage and process data in an ever-evolving digital landscape.

Traditional servers are bulky, expensive, and inefficient for edge computing applications. However, extremeEDGE Servers revolutionize this paradigm. Equipped with NANO-BMC technology, the product line offers server-like manageability in ultra-efficient compute nodes, resulting in enhanced energy efficiency by "right-sizing" hardware for specific workloads. Integrating AI inference at the edge enables machine learning directly at the source, reducing costs, machine power, network latency, and bandwidth usage compared to cloud-based solutions.

AEWIN provides a series of performant Network Appliances and Edge Server powered by single AMD Zen 4c EPYC 8004 processor codenamed Siena. The latest AMD Siena CPU is produced with 5 nm manufacturing technology to have up to 64 cores (extreme density of 2CCX/CCD) and 225 W TDP with lower energy consumption compared to EPYC SP5. Siena SP6 CPU has the best performance per watt and is with the support of rich I/O and CXL 1.1.

SCB-1945 (1U) and SCB-1947A (2U) are two performant Network Appliances supporting 12x DDR5 sockets and 4x/8x PCIe Gen 5 slots for AEWIN self-design NICs with 1G to 100G copper/fiber interfaces (with/without bypass function) or other accelerators and NVMe SSDs. Both models provide the flexibility to change 2x front panel PCIe slots to 1x PCIe x16 slot for installing off-the-shelf add-on card for additional functions required. It can support 400G NIC card installed such as NVIDIA Mellanox PCIe 5.0 NIC.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid state storage devices, today introduced its UFS (Universal Flash Storage) 4.0 controller, the SM2756, as the flagship of the industry's broadest merchant portfolio of UFS controller solutions for the growing requirements of AI-powered smartphones as well as other high-performance applications including automotive and edge computing. The company also added a new, second generation SM2753 UFS 3.1 controller to broaden its portfolio of controllers now supporting UFS 4.0 to UFS 2.2 standards. Silicon Motion's UFS portfolio delivers high-performance and low power embedded storage for flagship to mainstream and value mobile and computing devices, supporting the broadest range of NAND flash, including next-generation high speed 3D TLC and QLC NAND.

The new SM2756 UFS 4.0 controller solution is the world's most advanced controller, built on leading 6 nm EUV technology and using MIPI M-PHY low-power architecture, providing the right balance of high performance and power efficiency to enable the all day computing needs of today's premium and AI mobile devices. The SM2756 achieves sequential read performance exceeding 4,300 MB/s and sequential write speeds of over 4,000 MB/s and supports the broadest range of 3D TLC and QLC NAND flash with densities of up to 2 TB.

Seizing the Edge: Cervoz Adapts to Shifting Data Landscape—The rapid emergence of technologies like AIoT and 5G and their demand for high-speed data processing has accelerated the data transition from the cloud to the edge. This shift exposes data to unpredictable environments with extreme temperature variations, vibrations, and space constraints, making it critical for edge devices to thrive in these settings. Cervoz strategically targets the blooming edge computing sector by introducing an extensive array of compact product lines, enhancing its existing SSDs, DRAM, and Modular Expansion Cards to meet the unique needs of edge computing.

Cervoz Reveals NVMe M.2 SSDs and Connectivity Solutions to Power the Edge
Cervoz introduces its latest compact PCIe Gen. 3x2 SSD offerings, the T421 M.2 2242 (B+M key) and T425 M.2 2230 (A+E key). These space-efficient design and low power consumption feature offer exceptional performance, catering to the storage needs of fanless embedded PCs and motherboards for purpose-built edge applications. Cervoz is also leading the way in developing connectivity solutions, including Ethernet, Wi-Fi, Serial, USB, and CAN Bus all available in M.2 2230 (A+E key) and M.2 2242/2260/2280 (B+M) form factors. The M.2 (B+M key) 2242/2260/2280 card is a versatile three-in-one solution designed for maximum adaptability. While it initially comes in a 2280 form factor, it can be easily adjusted to fit 2260 or 2242 sizes. It offers an effortless upgrade of existing systems without sacrificing connection capability, especially in edge devices.

The World AI Cannes Festival (WAICF) is set to be the epicenter of artificial intelligence innovation, where the globe's top 200 decision-makers and AI innovators will converge for three days of intense discussions on groundbreaking AI strategies and use-cases. Against the backdrop of this premier event, GIGABYTE has strategically chosen to participate, unveiling its exponential growth in the AI and High-Performance Computing (HPC) market segments.

The AI industry has witnessed unprecedented growth, with Cloud Service Providers (CSP's) and data center operators spearheading supercomputing projects. GIGABYTE's decision to promote its GPU server portfolio with over 70+ models, at WAICF is a testament to the increasing demands from the French market for sovereign AI Cloud solutions. The spotlight will be on GIGABYTE's success stories on enabling GPU Cloud infrastructure, seamlessly powered by NVIDIA GPU technologies, as GIGABYTE aims to engage in meaningful conversations with end-users and firms dependent on GPU computing.

EdgeCortix, the Japan-based fabless semiconductor company focused on energy-efficient AI processing, predicts that 2024 is set to be a watershed moment for Edge AI. Through its predictions for the year, EdgeCortix believes that Edge AI landscape will be transformed during this exciting year for the industry. Next-gen AI chips, hybrid edge-cloud architectures, software supremacy and the rise of new generative-AI applications "at the edge," will revolutionize the world of business as we know it.

1. Next-Gen efficient Edge AI Chips will break barriers:
Prepare for a hardware uprising! EdgeCortix foresees next-gen energy-efficient AI chips that not only break the barriers of processing power but redefine them. These chips are not just powerful; they are customized for multi-modal generative AI and efficient language models, enabling cutting-edge AI capabilities at low power for a whole new spectrum of applications.

MemryX Inc. is announcing the availability of production level silicon of its cutting-edge AI Accelerator (MX3). MemryX is a pioneering startup specializing in accelerating artificial intelligence (AI) processing for edge devices. In less than 30 days after receiving production silicon from TSMC, MemryX will publicly showcase the ability to efficiently run hundreds of unaltered AI models at the 2024 Consumer Electronics Show (CES) in Las Vegas from Jan 9 through Jan 12.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Cisco today unveiled the next milestone of its ongoing work with NVIDIA to deliver AI-powered meetings for hybrid workers. Cisco announced the launch of Room Kit EQX and the expansion of its Cinematic Meetings capabilities—both powered by NVIDIA's AI engine—with the goal of enhancing collaboration experiences with audio and video intelligence and enabling more equitable hybrid meetings.

"In order for people to want to come to the office, companies must fundamentally reimagine and reconfigure workspaces to provide seamless and immersive collaboration experience," said Jeetu Patel, Executive Vice President and General Manager, Cisco Security and Collaboration. "Our collaboration with NVIDIA helps make this possible as we expand our portfolio of AI-powered solutions that unlock the potential of hybrid workers."

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

Intel has informed ecosystem partners about the cessation of direct investment in its Next Unit of Compute (NUC) business—ServeTheHome was the first outlet to report on this development earlier today, following industry rumors cropping up on Monday. Intel has been pulling back on non-core business operations—back in April its server building operation was sold to MiTAC. Today's announcement signals Team Blue's exit from the PC building industry—their (internally manufactured) NUC products included SFF computers, kits, laptop reference systems and boards.

Intel sent an official statement to HardwareLuxx (translated from German): "We have decided to stop direct investment in the Next Unit of Compute (NUC) Business and pivot our strategy to enable our ecosystem partners to continue NUC innovation and growth. This decision will not impact the remainder of Intel's Client Computing Group (CCG) or Network and Edge Computing (NEX) businesses. Furthermore, we are working with our partners and customers to ensure a smooth transition and fulfillment of all our current commitments."

Intel's marketing machine is not always all-encompassing with new product launches—case in point the recent whisper quiet appearance of a trio of "Arizona Beach" Atom SKUs on the market. It took a ServeTheHome reader to inform the publication about edge-based solutions becoming available to clients—mosty notably Silicom's Valencia Network Appliance. Ark site information from 2022 suggested that Team Blue launched its Arizona Beach series last summer, but zero marketing (at their end) has resulted in publications only taking notice a year later. Silicom started advertising its Valencia network models just before Christmas.

The Intel Atom C1100 (dual-core), C1110 (quad-core), and C1130 (octa-core) have been compared to the Alder Lake-N series—at first glance somebody could assume that the new platform is related to older E-core solutions. The site is already familiar with the previous generation since a staffer recently reviewed a Fanless Intel N100 Firewall. The top-end C1130 has a TDP rating of 32 W which comes as mild surprise—this is an Intel 7 part with a 2.5 GHz base and turbo frequency clock, alongside 6 MB L3 cache and 4 MB L2 cache. ServeTheHome compiled their own spec infographic of the Atom SKUs side-by-side, and soon discovered key selling points: support for dual-channel LPDDR5 memory and PCIe Gen 4 in "either 1x x16 + 1x x4 or 2x x8 + 1x x4 configurations." They conclude that the new Atom series has the potential to become an excellent platform for low-power edge devices, the author also hopes that a Mini-ITX option will turn up eventually.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

Aetina teams up with CVEDIA to launch advanced AI-powered video analytics solutions for enhanced public safety, smarter cities and safer traffic networks. The solutions involve Aetina's embedded computers built with the latest NVIDIA Jetson Orin system-on-modules (SoMs) and CVEDIA's synthetic AI models, enabling low-latency object and human motion detections at the edge. By adopting AI-enabled video analytics, security companies and system integrators can optimize operations and enhance security measures. During ISC West 2023, Aetina and CVEDIA will showcase the solutions to demonstrate how they leverage deep learning to accurately detect, track, and analyze objects and events from videos, enabling businesses to quickly generate insights and improve their decision-making processes.

Aetina's embedded computers that support the NVIDIA Jetson AGX Orin, Orin NX, or Orin Nano SoMs are designed for the creation of different types of vertical AI. The embedded computers provide the computing power for CVEDIA's AI solutions to run real-time inference processes; they are also compatible with any kind of camera to receive high-resolution videos for the analytics tasks.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

Think Silicon, the leading provider of ultra-low-power GPU IP for embedded systems, will showcase its latest graphics and AI solutions for edge computing devices in Hall 4, Booth 476 at Embedded World 2023 taking place in Nuremberg, Germany from March 14-16. The solutions demonstrate how Think Silicon is meeting the complex needs of ultra-low-power graphics and AI applications in the wearables, smart home, industrial and automotive markets.

Think Silicon's booth will feature the industry's first RISC-V-based GPU - the NEOX IP Series. NEOX represents a new era of smart GPU architectures with programmable compute shaders, running on a real-time operating system (RTOS) and supported by lightweight graphics and machine learning programming frameworks. NEOX serves as a GPU platform addressing a wide variety of vertical markets, including next-generation ultra-low-power smartwatches, augmented reality (AR) eyewear, surveillance and entertainment video, and smart displays for point-of-sale/point-of-interaction terminals.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."