Samsung Electronics Co., Ltd. announces its new Galaxy Tab S9 series, a premium product portfolio that redefines the tablet landscape and sets new standards for immersive viewing and creative freedom. Across all three models, Galaxy Tab S9, S9+ and S9 Ultra, Dynamic AMOLED 2X displays ensure epic viewing and entertainment experiences with the power of Qualcomm Snapdragon 8 Gen 2 for Galaxy. An in-box, IP68-rated S Pen helps users bring their ideas to life. And as the first Galaxy Tab S series to earn an IP68 rating, Galaxy Tab S9 series enables users to follow their inspiration, both indoors and out.

"There are no devices like the Galaxy Tab S9 series on the market today. A true disrupter in its category, it is the first of its kind to deliver experiences that users love most about tablets in one complete premium design," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The Galaxy Tab S9 series empowers users to take their big ideas and bring them to life, completely effortlessly."

Sony Electronics yesterday tweeted about an upcoming product launch date: "For the silence. For the sound. Stay tuned...you'll want to hear this." The teaser image and brief message could hint at the WF-1000XM5 wireless earbuds finally arriving at retail. The tweet puts emphasis on high quality sound reproduction and noise cancelling capabilities, so the company seems to be confident in marketing their next gen model as a leap over the popular WF-1000XM4.

Renders and specifications for the fifth generation Sony wireless earbuds have been leaked online several times this year. The WF-1000XM5 seems to be smaller and lighter than its predecessor with each bud weighing 5.9 grams, and the (likely Qi wireless charging capable) cradle coming in at 39 grams. Eye-balled dimensions suggest a profile closer to the WF-C700N. Many owners of the WF-1000XM4 have complained about inconsistent and uncomfortable fits in ear canals, due to the unit's relatively substantial design—a more compact bud would be most welcome. Multi-point connectivity seems to be the main feature that will be ready and present out of the box, otherwise leaked specs do not present anything else that really stands out. The WF-1000XM4 launched last Autumn with an MSRP of $280—will Sony be charging more for a mild set of improvements, or are they going to wow us with an amazing next-gen aural experience?

DEEPX, a leading AI semiconductor technology company, aims to drive innovation in the rapidly evolving edge AI landscape with its state-of-the-art, low-power, high-performance AI chip product lineup. With a focus on revolutionizing application areas such as smart cities, surveillance, smart factories, and other industries, DEEPX unveiled its latest AI semiconductor solutions at the 2023 Samsung Foundry Forum (SFF), under the theme of "For AI Everywhere."

Recognizing the importance of collaboration and technological partnerships, DEEPX leveraged Samsung Electronics' foundry processes, harnessing the power of 5 nm, 14 nm, and 28 nm technologies for its semiconductor chip designs. As a result, the company has developed a suite of four high-performance, energy-efficient AI semiconductor products: DX-L1, DX-L2, DX-M1, and DX-H1. Each product has been specifically engineered to cater to the unique demands of various market segments, from ultra-compact sensors with minimal data processing requirements to AI-intensive applications such as robotics, computer vision, autonomous vehicles, and many others.

The Institute of Electrical and Electronics Engineers (IEEE) has certified 802.11bb as a standard for light-based wireless communications—this development was announced yesterday, and warmly received by numerous Li-Fi businesses operating around the world, including pureLiFi and Fraunhofer HHI. These organizations hope that the (currently niche market) technology will get adopted at a greater rate thanks to the IEEE's approval. Proponents of the standard proclaim that it is "faster, more reliable wireless communications with unparalleled security compared to conventional technologies such as Wi-Fi and 5G (radio frequency networks)."

pureLiFi boasts that their Light Antenna ONE module is on the cusp of being ready for mass production: "This innovative device is the result of groundbreaking work by world-renowned LiFi engineers and marks a significant milestone in the development of LiFi technology. With Light Antenna ONE, millions of people can now be connected through light, opening up a new world of possibilities for high-speed, secure, and reliable communication. The design of this cutting-edge module enables mass integration of LiFi technology for the first time, paving the way for a future where LiFi plays a crucial role in our daily lives." Sample units can be sent to OEMs for evaluation purposes—the baseband agnostic (802.11 and G.hn) EVK consists of a solderable castellated module and motherboard.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has initiated mass production of its new automotive Universal Flash Storage (UFS) 3.1 memory solution optimized for in-vehicle infotainment (IVI) systems. The new solution offers the industry's lowest energy consumption, enabling car manufacturers to provide the best mobility experience for consumers.

The UFS 3.1 lineup will come in 128, 256 and 512-gigabyte (GB) variants to meet different needs of customers. The enhanced lineup allows more efficient battery life management to future automotive applications such as electric or autonomous vehicles. The 256 GB model, for instance, has reduced its energy consumption by about 33% compared to the previous generation product. The 256 GB model also provides a sequential write speed of 700-megabytes-per-second (MB/s) and a sequential read speed of 2,000 MB/s.

According to the latest report from Reuters, a former Samsung executive was arrested by the South Korean authorities yesterday, being accused of stealing company secrets to build a similar chip production facility in China. The former executive had worked for SK Hynix before joining Samsung, where he was involved in the Samsung Electronics division responsible for semiconductor factories. According to the report, the person planned to build a competing factory 1.5 km from a Samsung chip manufacturing facility in Xian, China. The suspect, who was not identified publically, has a collective of 28 years of experience with the South Korean chip makers.

Interestingly, the suspect also caused financial harm to the company, which the Suwon District Prosecutors' Office estimates to be around 300 billion won ($233 million). Prosecutors have announced the indictment of six additional individuals suspected of involvement in the case, including an employee of an inspection company who is charged with allegedly disclosing the architectural blueprint of Samsung's semiconductor plant. A police official commented, "We will sternly deal with any leakage of our technology abroad and strongly respond to illegal leak of domestic companies' core technologies in semiconductor, automobile and shipbuilding sectors among other."

With more countries creating initiatives to develop homegrown processors capable of powering powerful supercomputing facilities, India has just presented its development milestone with Aum HPC. Thanks to information from the report by The Next Platform, we learn that India has developed a processor for powering its exascale high-performance computing (HPC) system. Called Aum HPC, the CPU was developed by the National Supercomputing Mission of the Indian government, which funded the Indian Institute of Science, the Department of Science and Technology, the Ministry of Electronics and Information Technology, and C-DAC to design and manufacture the Aum HPC processors and create strong, strong technology independence.

The Aum HPC is based on Armv8.4 CPU ISA and represents a chiplet processor. Each compute chiplet features 48 Arm Zeus Cores based on Neoverse V1 IP, so with two chiplets, the processor has 96 cores in total. Each core gets 1 MB of level two cache and 1 MB of system cache, for 96 MB L2 cache and 96 MB system cache in total. For memory, the processor uses 16-channel 32-bit DDR5-5200 with a bandwidth of 332.8 GB/s. To expand on that, HBM memory is present, and there is 64 GB of HBM3 with four controllers capable of achieving a bandwidth of 2.87 TB/s. As far as connectivity, the Aum HPC processor has 64 PCIe Gen 5 Lanes with CXL enabled. It is manufactured on a 5 nm node from TSMC. With a 3.0 GHz typical and 3.5+ GHz turbo frequency, the Aum HPC processor is rated for a TDP of 300 Watts. It is capable of producing 4.6+ TeraFLOPS per socket. Below are illustrations and tables comparing Aum HPC to Fujitsy A64FX, another Arm HPC-focused design.

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.

-NTT sonority, Inc. (President: Hiroshi Sakai), a member of the NTT Group, one of the world's largest technology and business solutions companies, has entered the consumer electronics market via the development of an entirely new type of earphone using a unique technology called the "Personalized Sound Zone" (PSZ). The company has announced plans to commercially release the world's first open-ear PSZ technology developed by NTT Corporation (NTT) that locks audio into a small, individualized space. Crowdfunding for the wireless model nwm MBE001 on-ear speakers equipped with PSZ technology will begin on March 27, 2023, through Indiegogo. NTT sonority's audio brand nwm will continue to enhance its products with PSZ at their core, maximizing consumer safety and allowing users to experience the comfort of being connected through sound without having to worry about sound leakage.

NTT sonority's New Wave Maker (nwm) audio brand was created in November 2022 with the goal of creating an optimal audio experience. The company aims to expand its audio solutions to address future ways of working and living by creating not just a sense of immersion, but the comfort of being connected.

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2022. The Company posted KRW 70.46 trillion in consolidated revenue and KRW 4.31 trillion in operating profit in the quarter ended December 31, 2022. For the full year, it reported 302.23 trillion in annual revenue, a record high and KRW 43.38 trillion in operating profit.

The business environment deteriorated significantly in the fourth quarter due to weak demand amid a global economic slowdown. Earnings at the Memory Business decreased sharply as prices fell and customers continued to adjust inventory. The System LSI Business also saw a decline in earnings as sales of key products were weighed down by inventory adjustments in the industry. The Foundry Business posted a new record for quarterly revenue while profit increased year-on-year on the back of advanced node capacity expansion as well as customer base and application area diversification.

Samsung Electronics today announced production readiness of a high-performance PCIe 4.0 NVMe SSD, the PM9C1a. Integrated with a new controller based on Samsung's cutting-edge 5-nanometer (nm) process and the company's seventh-generation V-NAND technology, the PM9C1a will provide elevated computing and gaming performance in PCs and laptops.

"Our new PM9C1a SSD will deliver a robust combination of superior performance, greater power efficiency and increased security, which are the qualities that matter most to PC users," said Yong Ho Song, Executive Vice President of Memory Solution Product & Development at Samsung Electronics. "We are committed to creating storage that satisfies the diverse and changing market requirements as we continue to advance innovation in the PC SSD space."

CES 2023 ended today after an incredible week of product launches, major company announcements and innovation that will help to solve global challenges. CES shattered expected attendance drawing over 115,000 industry professionals - marking the largest audited global tech event since early 2020. With over 3200 exhibitors, including 1000 startups, CES 2023 showcased the next era of innovation from transportation and mobility to digital health, sustainability, Web3, metaverse and beyond.

For the first time, CES had a theme focused on Human Security for All. CES partnered with the United Nations Trust Fund for Human Security and the World Academy of Art and Science on the Human Security for All (HS4A) global campaign to foster food security, access to health care, personal income, environmental protection, personal safety, community security and political freedom. The products unveiled at CES 2023 tackle global issues such as access to clean water, food security, smart cities infrastructure, sustainable energy solutions, personal security and more. CES also featured the latest in accessibility tech, with innovation helping those in the disability community.

Global market intelligence firm TrendForce states that Chinese memory manufacturer YMTC is now at risk of exiting the market for 3D NAND Flash products by 2024 following its formal placement on the Entity List of the US Commerce Department on December 15. From this point forward, the Commerce Department will be reviewing and approving individual transactions related to the exportation, re-exportation, and sales of equipment, technologies, and other related goods from the US to YMTC. With acquisitions of equipment parts and technical support from its US partners becoming very difficult and prolonged, YMTC is going to be severely constrained from raising its bit output. Hence, its foothold on the market for 3D NAND Flash products is expected to weaken as time goes by.

TrendForce points out that without the support of the key equipment providers, YMTC is now facing a huge technical obstacle in the development of its latest 3D NAND Flash technology known as Xtacking 3.0. In particular, raising yield rate for the 128L and 232L processes is going to be extremely challenging for the Chinese memory manufacturer. Taking account of this latest escalation in the US-China trade dispute, TrendForce has further corrected down its projections on YMTC's supply bit growth rate and the total NAND Flash supply bit growth rate for next year. YMTC supply bits were initially forecasted to grow by 60% YoY for 2023. However, there was a massive downward correction that put its growth rate at just 18%. Now, YMTC is forecasted to post a YoY decline of 7%, which is a complete reversal from the earlier projections.

Global market intelligence firm TrendForce reports that the revenue generation momentum of the global IC design industry slowed down in 3Q22. The main factors behind this development were the Russia-Ukraine military conflict, the recent COVID-19 lockdowns in China, the ongoing inflation, and clients undergoing inventory corrections. The total revenue of the global top 10 IC design houses came to US$37.38 billion for 3Q22, showing a QoQ decline of 5.3%. Qualcomm remained first place in the ranking of the global top 10 IC design houses by revenue for 3Q22. Broadcom returned to second place by overtaking NVIDIA and AMD, who slipped to third and fourth respectively due to weakening demand for PCs and cryptocurrency mining machines.

Regarding US-based IC design houses that were in the top 10 group for 3Q22, Qualcomm recorded a QoQ increase for the sales of smartphone SoCs and 5G modem chips. It also made gains in the automotive electronics market by expanding its collaborations with partners in the automotive industry. As a result, Qualcomm's 3Q22 revenue figures for mobile and automotive offerings reflected QoQ increases of 6.8% and 22.0% respectively. The revenue growth of these two major product categories offset the marginal decline in the revenue for RF front-end chips. Qualcomm's IC design revenue as a whole climbed up by 5.6% QoQ to US$9.90 billion for 3Q22. The company sat firmly at the top of the ranking.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over 50 different part numbers, are onboard the Artemis 1 launch that blasted off on November 16. Intersil-brand rad-hard ICs are part of the battery management systems, RS-25 engine control electronics and the launch abort system on the Space Launch System that propelled the mission into space, the most powerful rocket ever built. On the Orion Capsule that will circle the moon, Renesas provided critical components for controller boards, the main flight computer, the docking camera system, the power distribution system and display and panel electronics. The Intersil-brand ICs perform multiple functions, including power management and precision signal processing.

Artemis is the ambitious NASA program that will take humankind back to the moon for the first time in more than 50 years. Artemis 1 is sending the test-mannequin populated Orion capsule to orbit the moon and deploy cubesats and other space experiments on a 42-day mission to test all the critical systems. Artemis 2 (2024) will have a crew that will orbit the moon paving the way for Artemis 3 (2025), which will land the first woman and the first person of color on the moon. The plan is for Artemis to continue to build a space station in lunar orbit and a base on the lunar South Pole. This infrastructure will allow for the awe-inspiring goal of a crewed mission to Mars in the 2040s.

Semiconductor manufacturers worldwide are estimated to increase 200 mm fab capacity 20% from 2021 through 2025, adding 13 new 200 mm lines as the industry reaches a record high of more than 7 million wafers per month (wpm), SEMI announced today in its 200 mm Fab Outlook to 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.

Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200 mm fabs to meet growing demand.The SEMI 200 mm Fab Outlook to 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% from 2021 to 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.

LG Electronics (LG) is unveiling its latest premium monitors at IFA 2022 in Berlin, Germany, including the superb, new UltraGear OLED gaming monitor (model 45GR95QE). LG's first curved OLED display with a 240Hz refresh rate, the 45-inch model is designed for immersive gaming experiences, offering the visual performance, speed and features serious gamers demand.

Visitors to LG's booth at IFA 2022 can explore a wide range of cutting-edge LG monitor products, including the new UltraGear and the UltraFine Display Ergo AI (model 32UQ890), which delivers a truly customizable setup for superior user comfort at home or at the office.

The Video Electronics Standards Association (VESA) today introduced the ClearMR Compliance Test Specification (ClearMR), an industry standard and logo program that provides a new quality metric for grading motion blur in digital displays. ClearMR is applicable to both LCD and emissive display products, including display panels, TVs, monitors, and computers with embedded displays, such as all-in-ones, laptops, notebooks and tablets. The new metric Clear Motion Ratio (CMR), as defined in the ClearMR standard, provides a clear numerical value based on the ratio of clear pixels to blurry pixels, which enables consumers to easily compare the amount of motion blur between VESA Certified ClearMR displays. CMR replaces Motion Picture Response Time (MPRT) and other methods of blur characterization since these other metrics do not accurately reflect the true nature of blur.

When designing integrated circuits, engineers aim to produce an efficient design that is easier to manufacture. If they manage to keep the circuit size down, the economics of manufacturing that circuit is also going down. NVIDIA has posted on its technical blog a technique where the company uses an artificial intelligence model called PrefixRL. Using deep reinforcement learning, NVIDIA uses the PrefixRL model to outperform traditional EDA (Electronics Design Automation) tools from major vendors such as Cadence, Synopsys, or Siemens/Mentor. EDA vendors usually implement their in-house AI solution to silicon placement and routing (PnR); however, NVIDIA's PrefixRL solution seems to be doing wonders in the company's workflow.

Creating a deep reinforcement learning model that aims to keep the latency the same as the EDA PnR attempt while achieving a smaller die area is the goal of PrefixRL. According to the technical blog, the latest Hopper H100 GPU architecture uses 13,000 instances of arithmetic circuits that the PrefixRL AI model designed. NVIDIA produced a model that outputs a 25% smaller circuit than comparable EDA output. This is all while achieving similar or better latency. Below, you can compare a 64-bit adder design made by PrefixRL and the same design made by an industry-leading EDA tool.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today introduced the 200MP ISOCELL HP3, the image sensor with the industry's smallest 0.56-micrometer (μm)-pixels. "Samsung has continuously led the image sensor market trend through its technology leadership in high resolution sensors with the smallest pixels," said JoonSeo Yim, executive vice president of sensor business team at Samsung Electronics. "With our latest and upgraded 0.56μm 200MP ISOCELL HP3, Samsung will push on to deliver epic resolutions beyond professional levels for smartphone camera users."

Since its first 108MP image sensor roll-out in 2019, Samsung has been leading the trend of next-generation, ultra-high-resolution camera development. Through the steady launch of new image sensors and advancements in performance, the company is once again forging ahead with the 0.56μm 200MP ISOCELL HP3. The ISOCELL HP3, with a 12 percent smaller pixel size than the predecessor's 0.64μm, packs 200 million pixels in a 1/1.4" optical format, which is the diameter of the area that is captured through the camera lens. This means that the ISOCELL HP3 can enable an approximately 20 percent reduction in camera module surface area, allowing smartphone manufacturers to keep their premium devices slim.

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

Vedanta, one of India's leading multinational groups, and Hon Hai Technology Group ("Foxconn"), world's largest electronics manufacturing company, today announced signing an MOU to form a joint venture company that will manufacture semiconductors in India. This first-of-its-kind joint venture between the two companies will support Indian Prime Minister Narendra Modi's vision to create an ecosystem for semiconductor manufacturing in India.

According to the MOU signed between the two companies, Vedanta will hold the majority of the equity in the JV, while Foxconn will be the minority shareholder. Vedanta Chairman Anil Agarwal will be the Chairman of the joint venture company. The targeted project plans to invest for manufacturing semiconductors. It will provide a significant boost to domestic manufacturing of electronics in India. Discussions are currently ongoing with a few State Governments to finalize the location of the plant. The collaboration between Vedanta and Foxconn follows the India Government's recent policy announcement for Electronics Manufacturing & PLI scheme for incentivizing organizations to contribute towards development of this sector. This will be the first joint venture in the electronics manufacturing space after the announcement of the policy.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") today announced that it will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture. Construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with the production start of Phase 1 scheduled for within fiscal 2024. When Phase 1 reaches full capacity, Toshiba's power semiconductor production capacity will be 2.5 times that of fiscal 2021.

Power devices are essential components for managing and reducing power consumption in every kind of electronic equipment, and for achieving a carbon neutral society. Current demand is expanding on vehicle electrification and the automation of industrial equipment, with very strong demand for low-voltage MOSFETs (metal oxide semiconductor field effect transistors) and IGBTs (insulated-gate bipolar transistors) and other devices. To date, Toshiba has met this demand growth by increasing production capacity on 200-milimeter lines, and expediting the start of production on 300-milimeter production lines from the first half of fiscal 2023 to the second half of fiscal 2022. Decisions on the new fab's overall capacity and equipment investment, the start of production, production capacity and production plan will reflect market trends.

If you thought that your 144 Hz monitor sounds rather fancy, you would have to think again after seeing this. Beijing Oriental Electronics Group Co., Ltd or BOE shortly, has announced that the company has managed to design and manufacture a 27-inch full HD display with a refresh rate of 500 Hz. No, this is not a typo, and the company made a display with such a high refresh rate. This technology marvel features an 8-lane eDP connection paired with a 1 ms response time and an actual 8-bit color gamut. While this refresh rate may not suit every AAA game title, players of CS: GO, and DOTA 2 are likely targets. Along with this 500 Hz monitor, BOE also announced a 110-inch 8K 120 Hz panel. You can read more about it from the company statement below..

BOE (Machine Translation from Chinese)With years of technology accumulation, BOE has made important breakthroughs in the field of oxide semiconductor display technology, overcoming industry problems such as copper (Cu) easy to diffuse, easy to oxidize, and easy to drill and engrave, and is the first in the industry to achieve mass production of copper interconnect stack structures., and the integration of high refresh rate, high resolution, low power consumption oxide display technology, breaking the foreign monopoly, and continue to launch low power consumption, ultra-narrow bezel, 500Hz+ gaming display, super-sized 8K Oxide 120Hz, A series of high-end technologies and products such as frequency conversion refresh rate display. At the same time, great breakthroughs have been made in the research and development of high mobility 30+ cm 2 / Vsoxide technology, which has laid a technical foundation for the subsequent performance improvement of high-end products.

Worldwide semiconductor revenue increased 25.1% in 2021 to total $583.5 billion, crossing the $500 billion threshold for the first time, according to preliminary results by Gartner, Inc.

"As the global economy bounced back in 2021, shortages appeared throughout the semiconductor supply chain, particularly in the automotive industry," said Andrew Norwood, research vice president at Gartner. "The resulting combination of strong demand as well as logistics and raw material price increases drove semiconductors' average selling price higher (ASP), contributing to overall revenue growth in 2021.