Lian-Li Industrial Co. Ltd announces the CB-01 CPU Water Block. Manufactured by Lian Li in partnership with cooling experts from Overclockers, UK, a world-record overclocking team, this is Lian Li's first water block ever. With their passion for quality materials, the CB-01 is made to the same exacting standards as Lian Li's outstanding cases. The cold plate has a heart of solid copper in a nickel coating and a final layer of tin-cobalt for extra cooling, durability, and corrosion resistance. The top is a translucent acrylic block that visibly guides the cooling waters through the microchannels. The simple yet sturdy mounting fit s virtually all modern and past motherboard sockets securely. For a bit of flare, there are holes pre-drilled for 5mm LED lights.

The CB-01 uses a standard G1/4" thread so most DIY water cooling components will easily fit the inlet and outlet ports. The inlet is deliberately offset against the outlet to allow the coolest water to enter the block in direct contact with the middle of the hottest CPU core. It then flows across the other cores and vents on the opposite side. The microchannels have an area of 32.2mm by 27.3mm but because they are contoured with precision grooves, they provide a greater overall surface area. While not the largest, these dimensions were deliberately chosen to strike a balance between high restriction and high flow for the best cooling for its size. Lian Li used their precision manufacturing to ensure the microchannels are as thin as possible for maximum performance.

Thermal Solutions specialist GELID Solutions unveils the latest top performance CPU cooler for Intel and AMD CPU. The Antarctica CPU cooler is a product of GELID Solutions GAMER product line.

The Antarctica comes with a 3D optimized heatsink that offers best-in-class thermal performance. The engineers of GELID Solutions especially designed a set of 5 power heat pipes, aluminum fins with improved profiling and an additional smaller heatsink with a copper core. These elements provide exceptional heat transfer from the CPU to the heatsink. Both heatsinks were created using precise software simulation and calculation during the development stage to ensure efficient air flow distribution at the lowest fan speed possible. The result, the Antarctica fully supports heat transfer of TDP 220W being paired with even very low-speed, virtually noiseless fans.

DeepCool has just added a new CPU cooler to its product portfolio, a model known as IceEdge 400 E (Elite Edition) that supports Intel LGA1156/LGA1155/LGA1150/LGA775 and AMD FM2/FM1/AM3+/AM3/AM2+/AM2/940/939/754 processors with a TDP of up to 130 W.

Pictured below, DeepCool's creation measures 100 x 86 x 125.5 mm, it weighs 475 grams and features an aluminum heatsink, four direct touch copper heatpipes, and a 92 mm Hydro Bearing fan that operates at 2200 RPM and has a sound output of 26.3 dBA. The IceEdge 400 E's price tag was not announced.

AMD reportedly updated its consumer products roadmap for 2014 thru 2015 to account for changes in the industry. The company is expected to unveil its next-generation "Volcanic Islands" GPU family by late-September, 2013. In the first quarter of 2014, the company is expected to unveil its 4th generation entry-level APUs, codenamed "Kabini." Built in ST3 socket for notebooks, and FS1B for desktops, this product family will include dual- and quad-core parts, with TDPs under 25W. Among the quad-core parts are the A4-5350 and A4-5150, and among the dual-core ones is the E1-2650.

"Kabini" will enter mass-production in February 2014, and will be formally announced in the following month. Kabini's early-2014 launch, delayed from late-2013, will have a cascading effect on its successor's launch. "Beema," its successor, will now launch in either late-2014, or early-2015. "Beema" will be based on the same socket types as "Kabini," but will incorporate more HSA technologies.

Antec unveiled a pair of new all-in-one CPU coolers in the Kühler H2O series, the Kühler H2O 1250 and Kühler H2O 650 (pictured in that order). The two build over their Series 4 predecessors with more powerful pumps, and new high-airflow fans that focus airflow through the radiator. The fan's motor doubles up as the pump's, and so the air and coolant flow are in perfect proportion. The H2O 650 features a 120 x 120 size radiator with a single fan, while the H2O 1250 doubles the dissipation area with a larger 240 x 120 radiator, that uses two of those fans. The two ship with support for the latest CPU socket types, including LGA115x, LGA1366, LGA2011, AM3+/AM3, and FM2/FM1.

Thermal Solutions specialist GELID Solutions reveals the Rev. 2 GX-7 CPU cooler of its GAMER product line. Engineers at GELID Solutions have upgraded the award-winning GX-7 to the Rev. 2 GX-7 by adding the Slim 12 PL Blue fan and the multi award-winning GC-Extreme thermal compound. Contrary to traditional heat pipe arrangement the Rev. 2 GX-7 offers a special array of heat pipes to take full advantage of all 7 heat pipes heat transfer capacity. Further V-shaped aluminum fins were used in the center of the heat sink to allow airflow to reach the heat sink more evenly. Openings inside of the heat sink and near the heat pipes let fresh-air flow in from the top and the bottom to the zones where normally poorly ventilated and eliminate the creation of hotspots. The unique heat sink shape supports dual fans.

Evercool announced the HPR 9225EA entry-level tower-type CPU cooler. It uses a stack of 43 aluminium fins, to which heat is conveyed by two 6 mm-thick copper heat pipes, which make direct contact with the CPU at the base. The stack is ventilated by a 92 mm fan that spins at speeds up to 2,200 RPM, pushing 35.6 CFM of air, with 26.3 dBA noise output. Measuring 97 x 73 x 118 mm (WxDxH), the cooler weighs about 400 g. It supports most modern CPU socket types, with the exception of LGA2011. Among the socket types supported are LGA115x, LGA775, AM3+/AM3/AM2+, and FM2/FM1. The company did not give out pricing information.

Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer today showcases a powerful, yet highly affordable CPU cooler, the Hyper 212X. With the Hyper 212X, high air cooling performance is available to builders with all budget levels.

Building upon the wildly popular Hyper 212 and Hyper 212 EVO, Hyper 212X improves a classic design. It includes the proven effective, patented Quad Continuous Direct Contact (CDC) heatpipe layout. Then, it steps forward by further improving the aluminum fin array with a new Tunnel Effect layout that not only improves the exchange of heat, but reduces overall noise.

Phanteks launches PH-TC12DX, a U-Type dual tower heat-sink with four 6mm heat-pipes allows for optimal airflow and cooling. PH-TC12DX's 6mm heat-pipes are linearly aligned and developed to have the least amount of air and thermal resistance. Incorporating P.A.T.S and C.P.S.C Technologies, PH-TC12DX delivers better heat dissipation and heat transfers. PH-TC12DX includes dual PH-F120HP PWM Premium fans to allow for higher performance and/or silent operation.

Scythe released the Apsalus entry-level liquid CPU Cooler (model: APSALUS3-120). Based on an Asetek platform, the pre-assembled (maintenance-free), closed-loop cooler uses an exposed copper base with pump assembly, joined the the 1U 120 mm radiator that packs the reservoir, which is ventilated by a 120 mm Scythe-made fan. The base measures 72.3 x 72.3 × 27.3 mm, the radiator 120 x 150 x 27 mm (excluding the fan), and the coolant pipes are about 326 mm long. The cooler supports all modern CPU socket types, including LGA2011, LGA115x, LGA1366, FM2/FM1, and AM3+/AM3/AM2+/AM2. It is priced around 6,980¥ ($84).

Antec introduced V4 series design updates for its Kuhler H2O 620 and H2O 920 closed-loop CPU coolers. The new coolers are outfitted with a higher-pressure pump, and split-flow copper fin design in the radiators. The company claims the two innovations work to drop temperatures down a further 2-4°C, over temperatures previous versions achieve. Lastly, the coolers are labeled with guaranteed support for current and upcoming CPU socket types, including LGA2011, LGA115x, LGA775, FM2/FM1, and AM3+/AM3/AM2+. Prices remain unchanged.

Sapphire officially launched the Vapor-X CPU cooler it talked about at trade shows earlier this year. It uses a vapor-chamber plate to draw heat from the CPU, and convey it to four 7 mm-thick nickel-plated copper heat pipes, which then pass through a dense aluminum fin stack, that's ventilated by two 120 mm PWM controlled fans (replaceable) in push-pull configuration. Spinning at speeds ranging between 495 and 2,200 RPM, the fans push 77 CFM of air, each. Measuring 135 x 110.4 x 163.5 mm, the heatsink weighs about 925 g. Nearly every modern client CPU socket type is supported, including Intel sockets LGA2011, LGA115x, LGA775, and AMD sockets AM3+/AM3/AM2+/AM2, and FM2/FM1. Expect a sub-$80 price.

ASRock will soon be adding a new budget board to its portfolio, the A55 Pro model which is powered by AMD's A55 chipset and supports AMD FM1 processors. Seen below, this ATX board has a 4+1 power design, two DDR3-1866 memory slots, six SATA 3.0 Gbps ports, and two PCIe x16 and three PCIe x1 slots.

The A55 Pro includes 5.1-channel onboard audio, Gigabit Ethernet, UEFI BIOS, six USB 2.0 ports, plus D-Sub and DVI outputs and comes with support for multiple ASRock features like Instant Boot, Instant Flash, APP Charger, XFast USB, XFast LAN and XFast RAM. The board's price tag has not been announced.

AMD implemented a new round of price cuts for seventeen of its socket FM1 A-series APUs, FM1 and AM3 Athlon II series CPUs, which has been in the works since mid-October. The cuts cover dual-, triple-, and quad-core Athlon II X2, X3, and X4 series processors; and A4, A6, and A8 series APUs. Popular APU models such as the A8-3870K, A8-3850, A6-3670K, and Athlon II X4 651 see price-cuts ranging anywhere between 3.7 to 17.4 percent. Dual-core Athlon II X2 265 got the biggest price-cut, nearly a third down by 30 percent. Prices of the dual-core A4-5300 socket FM2 was also cut significantly. The complete list of price-cuts is tabled below.

Korean enthusiast PC components major Zalman announced a trio of closed-loop liquid CPU coolers, the LQ310, LQ315, and LQ320; which are designed to handle maximum thermal loads (Qmax) of 300W, 330W, and 340W, respectively. The USP for all three is an extremely dense copper micro-fin structures inside the main block, where heat is dissipated to the coolant. The three feature what is essentially the same block and pump, and differ with the size of the radiator.

The Radiator component of the LQ310 measures 153 x 120 x 25 mm, that of the LQ315 is slightly thicker, at 35 mm, and LQ320 at 51 mm. A Zalman-made 120 mm fan, with 900 to 2,000 RPM speed range, long life bearing, and 4-pin PWM control, is standard issue for all three models. All modern CPU socket types are supported by the three, including LGA2011, LGA115x, AM3+/AM3, and FM2/FM1. The LQ310, LQ315, and LQ320, are priced at US $85, $100, and $120, respectively.

Noctua today presented its new NH-L9i and NH-L9a low profile CPU coolers for Intel and AMD. At a super-low profile of only 37mm, the NH-L9 coolers are ideal for extremely slim cases and with footprints tailored to the respective socket keep-out zones, they provide full compatibility with tall RAM modules and VGA cards on mini-ITX mainboards. Topped off with the new NF-A9x14 PWM premium fan, the NH-L9 coolers fuse everything users have come to expect from Noctua's larger coolers into a super-compact package for slim HTPC systems.

"The response on our first low profile cooler, the NH-L12, has been overwhelming", says Mag. Roland Mossig, Noctua CEO. "However, users asked for even smaller, lower height models that also provide better compatibility for extra slim, ITX based HTPCs. We're thrilled that we can now meet this demand with the new NH-L9 coolers."

Following the announcement of its second-generation A-series desktop APUs earlier this month, AMD is set to reduce prices of its older A-Series desktop APUs in the socket FM1 package, according to a DigiTimes report. Prices of the entry-level A4-3300 dual-core APU, for example, are expected to go down from US $46 to $30; and A4-3400 from $48 to $35. AMD also decided to cut price of its "Trinity" A4-5300 dual-core socket FM2 APU from $53 to $30, making it an attractive lure to the new platform, stepping up competitiveness against Intel Celeron. This information comes from sources among Taiwan-based motherboard makers, there's no word on when the new pricing could take effect.

Taiwan-based Biostar Microtech has this week released a new motherboard supporting AMD's FM1 APUs (A8, A6, A4 and E2 Series). Dubbed A55MLV, the board is powered by the AMD A55 chipset, has a micro ATX for factor, and features two DDR3-1866 memory slots, four SATA 3.0 Gbps ports, plus one PCI-Express x16 and one PCI slot.

The A55MLV also has 10/100 Ethernet, 5.1-channel audio, and a D-Sub output, and is selling for 40 Euro.

EK-Supremacy Elite, the premium bundle containing the best CPU water block on the market and the best thermal interface on the market - the EK-TIM Indigo Xtreme - is now finally shipping. Please note that due to high demand this product may be shown as out of stock at the time of purchase. These water blocks are therefore manufactured on daily basis to ensure adequate supply and daily re-stock.

EK-Supremacy Elite is the premium bundle containing the best CPU water block on the market - the EK-Supremacy - Full Nickel - and the best thermal interface on the market - the EK-TIM Indigo Xtreme. EK-Supremacy is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in perfect performance every time. EK-Supremacy is truly the best product for performance seeking enthusiasts.

It has been known since Computex that AMD plans to synchronize launch of its second-generation "Trinity" desktop APUs and second-generation "Vishera" desktop CPUs, in late-Q3 or early-Q4, 2012. In likely preparation for that, and to step up price-performance of its current lineup, AMD cut prices of its desktop CPUs and APUs across the board. These include price-cuts for Phenom II AM3 series, FX-series AM3+, and A-series FM1 CPUs and APUs. Some of the prices as down by as much as 22.9%. The Phenom II series chips are the ones with the biggest price-cuts. Find a list of chips with old and new pricing, and differences, compiled by CPU World, below.

To provide the best user experience on the AMD platform, ASUS has refreshed a variety of motherboards, including mainstream channel models, dedicated products from ROG and the TUF Series, plus FM1 socket-compatible and power-efficient APU-based models. Each product offers a variety of new ASUS exclusive technologies such as digital power control, Remote GO!, and Network iControl, alongside innovative Fast Boot, ASUS Boot Setting, and DirectKey, all specifically leveraging upcoming Windows 8 capabilities. Both new and existing features have been tailored and tested to comply with the Windows 8 architecture for total stability and maximized utility, while all motherboards have gone through a full series of compatibility assurance tests in getting ready for the move to Windows 8.

Akasa also unveiled the third entry into its Venom series of CPU coolers, the Venom Medusa. This launch comes exactly an year after that of the Venom Voodoo. In the picture below, the Venom Medusa is shown between the original Venom, and Venom Voodoo. The Venom Medusa is a large aluminum fin dual-tower heatsink, with two symmetrical aluminum fin stacks. It is designed keeping in mind the thermal loads of the new LGA2011 processors.

Its design consists of a large base from which eight nickel-plated copper heat pipes pass, making direct contact with the CPU, and passing through the two aluminum fin stacks at ends. The Venom Medusa ships with two fans, a Viper 120 mm fan pushes fresh air through the first aluminum fin stack, while a larger 140 mm fan conveys air from the first stack to the second. There is provision for a third 120 mm fan, which pulls air from the second stack, for exhaust. The Venom Medusa supports nearly every modern CPU socket type, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3, and FM2/FM1.

GELID Solutions showed off its newest Gamer series Black Edition CPU Cooler (doesn't carry a GX## model number). The cooler's design consists of a dark aluminum fin dual-tower design à la NH-D14, Corator DS, etc., and uses no less than seven heat pipes (3x 8 mm-thick and 4x 6 mm-thick) to transport heat from the base to the aluminum fin stacks. In the space between the two fin-stacks, a standard-size 120 mm (25 mm-thick) fan pulls air through the first stack, and pushes it through the second one. Pushing in fresh-air through the first stack is care of a slim 120 mm (15 mm-thick) fan. The cooler will be designed to be compatible with all modern CPU socket types, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3/AM2+/AM2, and FM2/FM1.

Cooling specialist Alpenföhn presents their newest addition to the Matterhorn line of performance coolers. Dubbed the Matterhorn Pure, it focuses on delivering the best possible cooling at the best possible price. Even with its untreated surface, the Matterhorn Pure impresses with the same high quality which Alpenföhn is known for.

Weighing in at a solid 660 grams without a fan, the cooler manages to impress with plenty of heat dissipation area. But Alpenföhn has ensured, that the material used has been employed properly utilizing the same design as the Matterhorn cooler, but leaving out the Nickel plating to allow the cooler to be offered at the best price point possible. The Pure still offers six heatpipes which make direct contact with the heat spreader of the CPU and thus manages to impress with great performance as well.

First unveiled this January, Reeven's extreme-cooling pot (model: RECC-01) launched in various markets. In Japan, it is being marketed by Scythe. Measuring 70 x 70 x 160 mm (WxDxH), and weighing 900 g, the RECC-01 is a liquid nitrogen or dry-ice evaporator. Aluminum makes up most of its body, while nickel-plated copper makes up its base. Its base dissipation surface has 18 circular pits. An AEROFLEX polymer insulation sleeve is included. Also included are a retention module supporting Intel sockets LGA2011, LGA1155/LGA1156, LGA1366 and LGA775; and AMD sockets FM1/AM3+/AM3/AM2+/AM2; and a thermal probe port. It is priced at 19,980 JPY (US $242).