BIOSTAR, a leading manufacturer of motherboards, graphics cards, and IPC solutions, is pleased to introduce the MT-N97 industrial computer. The BIOSTAR MT-N97 industrial computer is a compact, fanless powerhouse designed to meet the high demands of modern industrial applications. Tailor-made for system integrators, AIOT development, automation, edge computing, human-machine interfaces (HMI), and digital signage, the MT-N97 combines robust performance with unwavering stability, providing a reliable foundation for critical operations across various sectors.

Equipped with advanced specs that make it an ideal choice for high-performance, industrial-grade applications, the MT-N97 draws power from an Intel Alder Lake N SOC Processor (Intel N97, 4core, up to 3.6 GHz, TDP 12 W). It combines efficient performance with low power consumption, enhancing reliability and cost-effectiveness for continuous operation. The MT-N97's fanless design ensures quiet, noiseless performance, making it suitable for environments where minimal disruption is critical.

Shuttle is expanding its successful XPC slim product line to include four new Mini-PC Barebones: DS50U, DS50U3, DS50U5 and DS50U7. These models embrace modern technology and offer impressive performance while taking up minimal space. In a compact 1.3-liter format and with a thermally optimized, fanless chassis, the new devices are perfect for use in noise-sensitive environments.

Each model in the range has a soldered processor and is optimized specifically to suit different requirements:

• DS50U - The entry-level model: Equipped with an Intel Celeron processor of the 12th generation (Celeron 7305) and up to 64 GB of DDR5 RAM.
• DS50U3 - The sprinter: With an Intel Core i3 processor of the 13th generation (Core i3-1315U) and support for up to 96 GB of DDR5 RAM.
• DS50U5 - The powerful model: Powered by an Intel Core i5 processor of the 13th generation (Core i5-1334U), also designed for up to 96 GB of DDR5 RAM.
• DS50U7 - The record holder: The most powerful model in this range with an Intel Core i7 processor of the 13th generation (Core i7-1355U) and up to 96 GB of DDR5 RAM.

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.

MSI is thrilled to introduce the MS-CF17, a powerful 3.5" Single Board Computer (SBC) tailored for a wide range of industrial applications. Powered by Intel 13th Gen Raptor Lake-P processors, the MS-CF17 is ideal for use in industrial automation, edge computing, digital signage, and transportation systems. The MS-CF17 is designed to excel in harsh environments, offering fanless operation and a wide temperature range (-40°C to 70°C). This makes it perfect for settings where reliability and performance are crucial, such as in factory automation or outdoor digital signage installations. The board supports up to 32 GB of DDR5 memory and features built-in Intel Iris Xe graphics engine, making it suitable for graphics-intensive tasks like advanced imaging systems and AI-driven analytics.

Connectivity options are abundant, with four 2.5G LAN ports, four HDMI ports supporting quadruple independent displays, M.2 M key PCIe Gen 4 for storage and M.2 B/E key slots for expansions, allowing for seamless integration into complex systems. This flexibility makes the MS-CF17 a go-to solution for applications requiring high-speed data processing, multi-display setups, and real-time analytics. Additionally, the onboard TPM 2.0 provides enhanced security, crucial for applications where data protection is paramount.

Leading IPC provider AAEON today announced the release of two new Panel PCs: the ACP-2106, which features a 10" WXGA screen, and the ACP-2076, equipped with a 7" WSVGA Projected Capacitive Multi-Touch screen. Compared to its previous Panel PC offerings, both the ACP-2106 and ACP-2076 offer substantial improvements in processing power, with a choice of either the Intel Processor N50 or Intel Processor N97 CPU. Moreover, both new additions to the range support up to 32 GB of DDR5, compared to the 8 GB of DDR3L offered by the previous generation. With these improvements, the ACP-2106 and ACP-2076 are clearly designed for use in more advanced and taxing industrial and commercial applications, with retail and industrial automation thought to be primary target markets.

The ACP-2076 grants users a 7" display with 1024 x 600 resolution, while the ACP-2106's 10" screen offers a slightly higher resolution of 1280 x 800. Both PCs are also equipped with an HDMI 1.4b port, making them suitable for applications that require dual-display capabilities, such as smart kiosks. Both models also provide wide viewing angles and high brightness levels, with the ACP-2076 achieving 320 cd/m² and the ACP-2106 reaching 300 cd/m², ensuring consistent visibility in a variety of environments.

We are excited to introduce the MS-CF13 Mini-ITX motherboard, a groundbreaking solution designed to meet the demands of modern applications with its fanless, low-profile, and ultra low-power features. Powered by the Intel Alder Lake-N SoC series, the MS-CF13 offers exceptional performance while maintaining energy efficiency, making it an ideal choice for a variety of industries.

Key Features:

• Powered by Intel Alder Lake-N Processor: The MS-CF13 is equipped with Intel Alder Lake-N PC Client & Embedded Series SoC, delivering reliable and efficient performance for diverse applications.
• High-Speed Memory: Featuring a DDR5 4800 MHz SODIMM slot, the motherboard supports up to 16 GB of memory, ensuring robust data handling capabilities.
• Triple Independent Displays: Supports DP, HDMI/DP, and LVDS/eDP, making it perfect for applications that require multiple high-resolution screens.
• Enhanced Network Connectivity: Includes 2 2.5 GbE LAN ports with RJ-45, providing high-speed network connections for data-intensive tasks.

AAEON, a leading provider of industrial PC solutions, has introduced two new models to its comprehensive Fanless Embedded Box PC portfolio: the BOXER-6645U-RPL and the BOXER-6406U-ADN. The concurrent launch of these two products underscores AAEON's dedication to delivering high-quality industrial computing systems that cater to diverse application requirements, while leveraging the full spectrum of Intel processing technology.

The BOXER-6645U-RPL is a high-performance embedded PC with cross-generation CPU compatibility, as indicated by its support for 12th, 13th, and 14th Generation Intel Core socket-type processors, up to 65 W. Consequently, AAEON anticipates that the BOXER-6645U-RPL will serve as an optimal solution for customers seeking robust and easily deployable hardware capable of managing highly demanding workloads.

Vecow has launched its TGS-1000 series of mini PCs, featuring stackable expansion options for networking, wireless mobility, and additional capabilities. The Vecow TGS-1000 Series is an ultra-compact, fanless, stackable embedded computer lineup that includes the TGS-1000 and TGS-1500 models, powered by Intel Core Ultra Meteor Lake processors with integrated CPU, GPU, and NPU. This series supports up to 96 GB of DDR5 memory. Optimized for edge AI applications, it delivers up to a 14% boost in CPU performance and enhanced graphics capabilities.

The TGS-1000 Series can drive up to five independent displays through two HDMI and three DisplayPort (DP) ports. It features a variety of I/O connections, including up to five USB 3.0 ports (four Type-A and one Type-C) and a 2.5GbE LAN port with TSN support. Its modular design allows for flexible expansion with options for USB, isolated DIO, COM, LAN, or 4G/LTE, making it suitable for AI, smart retail, office communication, and gaming. The TGS-1500 model adds support for MXM graphics cards up to RTX 5000 Ada.

MSI, a global leader in AI and advanced computing solutions, proudly announces the launch of the MS-C906, a compact-size Box PC powered by the Intel 13th Gen Raptor Lake-P U Series Processor. Designed for ultra-low-power fanless operation, the MS-C906 is ideal for edge AI applications, offering unparalleled performance and reliability.

Key Features:

• High Performance: Supports up to 32 GB of DDR5 5200 MHz RAM and features quadruple independent HDMI displays, perfect for versatile visual output in various industrial and commercial environments.
• Robust Connectivity: Equipped with four Intel 2.5GbE LAN ports, ensuring robust network connectivity. M.2 and SATA interfaces provide ample storage options.

Elitegroup Computer Systems (ECS) is pleased to announce its participation in the COMPUTEX 2024 show in Taipei, Taiwan, from June 4 to 7, 2024. ECS will showcase a wide range of motherboards designed for light gaming, commercial, and vertical markets, alongside the comprehensive LIVA mini-PC and fanless box PC, as well as intelligent EV charging solutions.

COMPUTEX 2024 visitors will find ECS in Nangang Hall 1, on the fourth floor, in booth M0604, from June 4-7, 2024. Visitors can see live demos of products at the ECS booth.

Shuttle, a leading developer of Mini-PC solutions, today announces the launch of the DL30N. With its advanced technical specifications and robust design, this new fanless Mini-PC is aimed at professional users in a wide range of applications. Equipped with an Intel processor N100 and compatible with up to 16 GB of DDR5 SO-DIMM memory, the DL30N provides a solid foundation for applications that require high data processing speeds. Its two 2.5 Gbit/s network ports improve network performance even in complex network environments. With eight USB 3.2 Gen 1 ports and two COM ports, this machine offers exceptional connectivity for a wide range of applications.

Tom Seiffert, Head of Marketing & PR Europe at Shuttle, explains: "With the DL30N, we are specifically addressing the needs of companies looking for a reliable, powerful and noiseless solution. This PC is particularly suitable for use in areas such as digital signage, kiosk systems or even as a compact office PC."

MeLE, designers of mini PCs, and industrial PCs, unveiled the Fanless Stick PC PCG02 Pro. Measuring 146 mm x 61 mm x 20 mm (LxWxH), this thing is about the size of two smartphones duct-taped together, but weighing as much as one (since there's no battery inside). Under the hood is an Intel N100 "Alder Lake-N" processor, which features one "Gracemont" E-core cluster for a 4-core/4-thread CPU, and an Intel Xe LP-based iGPU with 24 execution units. The N100 in the MeLE PCG02 Pro is wired to 8 GB or 16 GB of LPDDR4X-4266 memory. Storage is in the form of 128 GB or 256 GB of eMMC. The device comes with Windows 11 Home single language pre-installed.

The Fanless Stick PC PCG02 Pro comes with an impressive set of connectivity for its size. Networking options include Wi-Fi 5 ac + Bluetooth 5.1, and a 1 GbE wired Ethernet. Display outputs include two HDMI 2.1, which can power a pair of 4K Ultra HD displays at 60 Hz, each. USB connectivity includes two USB 3.2 Gen 1 (5 Gbps) type-A ports; and a USB 3.2 Gen 2 (10 Gbps) type-C. There is a second type-C port used for power input through any USB PD 3.0 source that can deliver 25 W. A power adapter is included. Depending on the memory- and storage size opted for, the Fanless Stick PC PCG02 Pro is priced between USD $270 to $290. It can power a range of applications between home-entertainment (it's completely fanless), through digital signage, or even most office applications.

ECS Industrial Computer Co., Ltd., also known as ECSIPC, proudly unveils its latest generation of mini PCs for quad-display industrial applications, the LIVA Z5 series, which includes the LIVA Z5 Plus, LIVA Z5E Plus, and LIVA Z5F Plus. Committed to providing industry-specific value solutions, ECSIPC focuses on developing niche products and solutions for vertical industry applications. ECSIPC has achieved success in various application areas, including educational electronic whiteboards in Europe and the US, airport real-time flight systems in India, image projection for Japan's Shinkansen bullet trains, and electronic menu and POS systems for KFC in South America, while also exploring applications in vending machines and digital signage.

The newly launched LIVA Z5 series is powered by Intel 13th and 14th generation Core processors, delivering significant performance improvements with up to 10 cores capable of efficiently handling various demanding tasks. The series has Wi-Fi 6E speeds up to 9.6 Gbps for enhanced data transmission efficiency, allowing seamless playback of high-quality audiovisual content. Additionally, the multi-storage design accommodates PCIe Gen 4 M.2 NVMe SSDs and a 2.5-inch SSD or HDD, offering greater storage flexibility. The series ensures high-speed data processing in industrial environments with two 2.5G Base-T (2.5G) ports. At the same time, support for vPro and physical TPM significantly enhances the value of industrial applications.

Introducing the X Silent Edge PSU from Cooler Master, available in 850 W and 1100 W. These fanless power supplies offer a pleasing noise-free experience. Featuring advanced heat pipe technology, a modular thermal structure and Infineon IC chips, the X Silent Edge guarantees top-tier performance and reliability.

Why Choose the X Silent Edge PSU
The X Silent Edge PSU is not just a power supply; it's a commitment to silent operation, efficiency and cutting-edge technology. Whether you're a gamer, content creator, or PC enthusiast, these PSUs cater to your need for quiet and reliable power delivery.

The SG10 is an ambitious product designed to push the boundaries of fanless technology and create a gaming case capable of cooling high-performance CPUs and GPUs without the use of fans. This project collaboration between Streacom and Calyos is also aimed at showcasing the application of loop heat pipe technology in PC cooling and represents the first step in creating a viable mainstream high-performance solid-state alternative to water cooling solutions.

The spiritual successor to the SG10 began life as a Kickstarter project launched by Calyos as the NSG S0, and whilst having extensive expertise in cooling, the additional challenges of consumer product manufacturing proved to be a stumbling block. A search ensued to find a partner with suitable experience to get the project back on track, and with experience in both case manufacturing and fanless cooling, Streacom was the natural fit. As can be understood just by glancing at the image, the SG10 represents a complete redesign of the NSG S0. Not a single asset or component was carried over from the original case. This includes the Evaporator that pumps the coolant around the loop and the Condenser that radiates the heat, both core components that make this performance possible. Everything has been entirely re-engineered and improved far beyond the original specification and performance.

Bloodhound, by Simply NUC, is your all-in-one computing solution for IoT and Edge needs. With its Intel Celeron N5105 CPU, support for up to 32 GB of RAM, and offering up to 8 TB of storage in a rugged, fanless, IP53-rated design, Bloodhound excels in demanding environments, from warehouses to outdoor installations, and more.

Bloodhound comes out of the box with three 2.5 GbE LAN ports, giving you the flexibility you need to connect multiple IP devices, provide additional networking capabilities, or to cut down on overall cabling by utilizing the built-in PoE+ on the primary LAN port to power your device. Easily integrate your Bloodhound device into hard to reach places thanks to its slim form factor and the included VESA mount, but keep it accessible by connecting an external power source and status LEDs with the front panel header, allowing you access to your Bloodhound device when mounted out of view. Bloodhound can serve a variety of rugged deployments such as an edge firewall, an edge server for IP cameras, or an IoT gateway.

SAPPHIRE Technology, in cooperation with Thinlabs, presents a unique computing solution that utilizes 802.3bt PoE++ (Power-over-Ethernet) technology - the Thinlabs PoE NUC. It allows for up to four ThinLabs HD displays to be fully powered over a single Ethernet cable. Utilizing this technology brings many advantages like eliminating the need for electrical outlets or simplifying power backups. At the heart of the Thinlabs PoE NUC lies a motherboard developed by SAPPHIRE, featuring the AMD Ryzen Embedded V2000 series processor. This AMD Ryzen processor, with efficient "Zen 2" x86 CPU and Radeon Graphics cores offers versatility, low power and high performance. The AMD Ryzen flagship model, V2718, features an 8-core / 16-thread CPU with 7 integrated Radeon Graphics Compute Units.

Advantages of Power-over-Ethernet
The Thinlabs NUC solutions is equipped with the advanced 802.3bt PoE++ (PoE++ Type 4) technology. This innovation enables seamless supply of up to 90 W of power through a standard Cat 6 Ethernet cable. This simplifies deployment significantly, eliminating the need for a certified electrician to install an electrical outlet wherever the PC and monitors are required. Instead, a single Ethernet cable up to 100 m in length can be used to provide data and power to the complete system. Such an approach also greatly reduces installation cost and cable clutter.

Aetina launches its new fanless edge AI systems powered by NVIDIA Jetson Orin system-on-modules (SoMs), including the NVIDIA Jetson AGX Orin, Orin NX, and Orin Nano. These embedded box PCs are designed in a compact enclosure with a heat sink for efficient cooling. The heat sink reduces maintenance efforts for system owners after deployment. The new fanless systems have an operating temperature range of -25°C to +55°C, making them suitable for AI-powered application development across different verticals.

NVIDIA Jetson Orin NX and Orin Nano-Based Fanless Systems
AIE-CN31/41, AIE-CO21/31, AIE-PN32/42, and AIE-PO22/32 are Aetina's latest fanless system models built with an NVIDIA Jetson Orin NX or Orin Nano SoM. Featuring necessary M.2 expansion slots and I/O ports in a small-sized form factor, these systems enable easy system integration for space-limited applications. With low power consumption, the fanless system models can efficiently handle most AI inference tasks, making them ideal for AI projects that involve mass device deployment in different locations.

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

SolidRun has announced the world's first rugged system design that combines 8-core AMD Ryzen 7040 series processors with multiple Hailo-8 AI accelerators to create its Bedrock R7000 Edge AI for artificial intelligence (AI) applications. This new member in SolidRun's Bedrock family of fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

The new system integrates with the AMD Ryzen 7840HS processor, a state-of-the-art 4 nm APU with 8C/16T Zen 4 CPU and integrated RDNA 3 Radeon 780M GPU. The 20 native PCIe Gen 4 lanes and up to three Hailo-8 AI accelerators can be fully utilized together with NVMe Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays. The CPU and all devices are passively cooled by the innovative fanless cooling system of the Bedrock R7000 in an industrial temperature range of -40°C to 85°C.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

Details of ASUS' upcoming Prime N100I-D D4 Mini-ITX motherboard has made an appearance in official pictures posted over at Fanlesstech, although the board was apparently shown at Computex. The interesting part here is that it's under ASUS' Prime branding, which suggests that this will be a retail product, rather than something that would only be available to OEM partners. The Intel Processor N100 is a quad core 3.4 GHz chip based on Intel's Alder Lake-N and it has a 6 W TDP, which means it can be passively cooled.

Although the SoC supports DDR4 and DDR5 memory, at least for this specific SKU, ASUS went with DDR4 support in the shape of a single SO-DIMM slot which accepts up to 3200 MHz memory. The board also sports a single PCIe 3.0 x2 M.2 slot, an M.2 slot for an optional WiFi module, a PCIe 3.0 x1 slot and a single SATA connector and a USB 3.0 header. The odd thing here is that the SoC supports a total of nine PCIe lanes, but ASUS only appears to have made use of four of them. Around the back is a pair of 10 Gbps USB Type-A ports, a pair of 5 Gbps USB Type-A ports and two USB 2.0 ports, a PS/2 port, a serial port, a D-Sub VGA connector, a DisplayPort and an HDMI port of unknown version—although the SoC supports DP 1.4 and HDMI 2.1—a Gigabit Ethernet jack and three audio jacks.

Seasonic had a lot to show at Computex 2023, including its full range of power supply units from the PRIME, VERTEX, and FOCUS series, that are now fully compliant with ATX 3.0 and PCIe Gen 5 specifications. In addition, Seasonic also had its new MagFlow ARGB fans on display, and a wide range of high efficiency industrial PSUs.

Seasonic's PRIME, VERTEX, and FOCUS series were front and center at the Computex showcase, and those high power PSUs with Gold, Platinum, and Titanium efficiency ratings will be equipped with 12VHPWR connectors, meet the latest graphics card requirements, and feature both modular and recognizable stamped cable design. The star of the show were obviously the PRIME PX-1600, PRIME Fanless TX-700, and the FOCUS SPX-750, which is a compact SFX PSU with modular design.

Akasa introduced what is essentially the 2nd generation of its compact Turing fanless NUC case. The new Turing AC Pro, as its name suggests, is designed for the Intel NUC 13 Pro "Arena Canyon," and retains its distinctive cuboidal shape, and a volume of 2.8 liters. What's new is that the block that draws heat from the SoC now features a pair of 6 mm-thick copper heatpipes that spread heat across the extruded aluminium panels that make up the body of the case, and which double up as a heatsink. The introduction of these heatpipes increase the cooling capacity of the case to 40 W (up from 35 W). The case also includes a custom M.2 SSD heatsink.

The Akasa Turing AC Pro measures 95 mm x 260 mm x 113.5 mm (WxDxH), and supports NUC motherboards in the 4x4 inch UCFF form-factor. The front-panel I/O holes includes openings for two USB 3.x type-A ports, and a 4-pole headset jack. The rear I/O cutouts include DC-in, two HDMI, two USB type-A, two USB type-C, and an Ethernet. Akasa includes optional power bricks. For the Core i5 and Core i7 models of NUC 13 Pro, it offers a 120 W brick, and for the Core i3 models, there's a 90 W one, both operate at 19 V DC. The company didn't reveal pricing or availability information yet.

Converting the ingenuity of the UP Squared Pro 7000 board to its edge system range, AAEON's UP Squared Pro 7000 Edge is the first mini PC to harness the power of Intel Core i3 Processor N-series, Atom Processor X Series, and Intel Processor N-series processors in a fanless chassis.

The first fanless mini PC to utilize the processor platforms, the UP Squared Pro 7000 Edge provides developers with the same performance boost as its board counterpart, but with a more convenient route to market. The device's heatsink offers effective heat dissipation without the obvious drawbacks of a fan-based cooling system, opening the door to deployment in more settings, such as smart manufacturing and healthcare.