Intel is expected to announce their desktop Alder Lake processors later this month on October 28th and it would appear that laptop processors could enter production as early as November. These revelations come from a leaked roadmap published by Wccftech that lists the Alder Lake-P and Alder Lake-M processor families for launch in Q4 2021 and Q1 2022 respectively. The production window for Alder Lake-P opens November 8th and closes March 13th while for Alder Lake-M that period is from January 17th to April 17th.

The roadmap lists Alder Lake-P processors as featuring a TDP between 12 W to 45 W and Alder Lake-M covering 7 W to 15 W. The two platforms will both feature up to 96 Xe graphics Execution units along with Thunderbolt 4 and WiFi 6E connectivity. Alder Lake-P will include PCIe 5.0 and DDR5 support with no mention of DDR4 compatibility while Alder Lake-M will get PCIe 4.0 and LPDDR4X/LPDDR5. The mobile lineup is divided into 3 groups of which the flagship H55 was not mentioned in the roadmap indicating a post Q1 2022 release.

Power Quotient International (PQI) has just released its all-new H552V USB 3.0 2.5" portable hard drive! The drive features sharp and refined curves that create a stylish sports car-like appearance, a dual curved back case that lends it a stunning beauty, and a precision engraving polishing technique and ornate buffing that manifests a high quality combination glossy/matte black finish. The device's smooth surface texture, which is both aesthetically pleasing and comfortable to the touch, subtly exudes a reserved sense of extravagance. The PQI H552V boasts stylish race car-like curves and also features a USB 3.0 transfer interface crafted like a hawk-eyed double headlight. The bright LED light at the center of the headlights clearly displays transfer status to help avoid interrupting data transfers-and thereby losing one's important data-as a result of accidentally removing the device at the wrong time.

Elitegroup Computer Systems (ECS) is delighted to introduce the latest Intel based mini-ITX motherboard - ECS H67H2-I motherboard, designing to support the 2nd generation Intel Core processors and redefining home theater PC of the new era.

ECS has been very experienced and professional at Research & Development of small form factors motherboards, and we have envisioned that there will be a growing trend for HTPC. At both CeBIT & Computex exhibitions in 2010, ECS H55H-I was the first HTPC platform of mini-ITX form factor; it definitely caught visitors' attention among all similar categories. ECS H55H-I motherboard has successfully fulfilled product differentiation from the origins and ECS H67H2-I motherboard definitely will break the record in 2011. ECS H67H2-I motherboard continues carrying the advantages of space-saving, power-efficiency and surely brings much more vivid 3D visual experience as it supports amazing GPU O.C capability along with features of blu-ray HD playback and 3D gaming experience.

ADATA Technology, the worldwide leading manufacturer in high-performance DRAM modules and NAND Flash application products, today introduced its new XPG Gaming Series DDR3-1333G low voltage memory, designed for gaming enthusiasts who adopt Intel X58, P55, H55 and H57 motherboards, and for HTPC applications. The XPG Gaming Series DDR3-1333G low voltage memory offers cooler operation and lower power consumption with only 1.35V and CL9-9-9-24 timing for demanding environments, enabling eco-friendly personal computers to perform at high speeds and great stability.

"Environmental sustainability is an important principle to us at ADATA, therefore we developed XPG Gaming Series DDR3-1333G low voltage memory, since energy efficiency equates to reduced CO2 emission." said Alex Wu, Project Manager of ADATA Product Management Division. "By utilizing XPG Gaming Series DDR3-1333G low voltage memory, gaming enthusiasts can help to minimize their carbon footprint, saving money on electricity costs, and achieve the right balance of gaming system performance and stability."

Shuttle Inc., a leading developer and manufacturer of multi-form-factor solutions such as the world-famous XPC Mini-PC Barebones, today announces the launch of its new XPC Barebone SH55J2. Now, for the first time, a single Mini-PC supports all Intel Core variants for socket 1156.

From today, the SH55J2 brings you a Mini-PC platform which utilizes all the features of the new Intel Core series - whether it is the integrated HD graphics chip, the turbo boost function or two and four CPU cores. The energy-efficient processor generation is ideally suited for Mini-PCs.

As the demand has increased for PC components for gaming market, including high speed and reliable DRAM module, A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG Gaming Series DDR3-2000G and XPG Gaming Series DDR3-2000G v2.0 DRAM module. Designed for favorite gaming and daily computing groups on Intel X58, P55, and H55 platform, the new XPG Gaming Series DDR3-2000G DRAM module is promised to deliver CL9-9-9-24 timing with 1.65V voltage.

"A-DATA is the leader in the reliable and high performance DRAM module," said Richard Shen, manager of A-DATA product management department. "Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can rely on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences."

Intel introduced two new dual-core processors, the high-end Core i5 680, and the value-segment Pentium Dual-Core E5500. The former is an LGA1156 chip that runs on Intel P55, H55, H57, Q55, Q57 chipsets, while the latter is an LGA775 chip that works on most recent LGA775 motherboards. The Core i5 680 uses the 32 nm based Clarkdale core. At 3.60 GHz (27 x 133 MHz) with a Turbo Boost speed of 3.86 GHz, the i5 680 is expected to be the fastest dual-core processor ever made. Its embedded Intel HD Graphics controller is clocked at 733 MHz. It has L2 caches of 256 KB per core, and a shared L3 cache of 4 MB. It supports two channels of DDR3 memory. With HyperThreading enabled, the chip gives the OS four logical CPUs to deal with. It has a TDP of 73W.

The Pentium Dual-Core E5500 is based on the 45 nm Wolfdale-2M core, it has a clock speed of 2.80 GHz (14 x 200 MHz), and FSB speed of 800 MHz. It has a shared L2 cache of 2 MB, and TDP of 65W. While the Core i5 680 is priced at US $294, the E5500 goes for $75. All prices are per-piece in 1000 unit tray quantities.

Gigabyte is readying a new motherboard in the mini-ITX form-factor which is bound to surprise some with its feature-set. The GA-H55N-USB3 is a socket LGA1156 motherboard based on the Intel H55 chipset, supporting the entire range of LGA1156 processors with a powerful 4+2 phase VRM. The socket is wired to two DDR3 DIMM slots for dual-channel memory, which is powered by its own 2-phase circuit. Gigabyte was able to accommodate five SATA channels by the chipset, making space for one eSATA, and four internal SATA 3 Gb/s ports with RAID support.

Its lone expansion slot is a full-bandwidth PCI-Express 2.0 x16, while being based on the H55 chipset, it also supports Intel Flexible Display Interface for processors with embedded graphics. On its connectivity front it doesn't make many compromises either, with 8+2 channel HD audio with optical SPDIF connector, a two-port USB 3.0 controller giving out two USB SuperSpeed ports, gigabit Ethernet, Keyboard/Mouse combo PS/2, four USB 2.0 ports on the rear-panel + four by internal headers, and display connectivity which includes DVI, D-Sub, and HDMI. The GA-H55N-USB3 is expected to be out in April.

A-DATA Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG Gaming Series DDR3-1600G 8GB dual channel kit. Designed for gaming enthusiast who adopts the Intel P55 and H55 motherboards, the XPG Gaming Series DDR3-1600G 8GB dual channel kit offers CL9-9-9-24 timing at a voltage of 1.65V, and high-capacity to optimize the PC performance for ultimate gaming experiences.

"The ultimate gaming experiences are relying on proper choice of PC hardware and overall performance. Therefore, we introduced XPG Gaming Series DDR3-1600G as 8GB dual channel kit." said Action Chen, Deputy Project Manager of A-DATA XPG Department. "Gaming enthusiasts are able now to enjoy the extreme capacity and high speed by using XPG Gaming Series DDR3-1600G 8GB dual channel kit with 64 bit OS and satisfy their insatiable thirst for ultimate gaming experiences."

ASRock has updated the BIOS of its H55M Pro socket LGA1156 motherboard to include a "Turbo 100" feature. The feature is designed to run with the entry-level Pentium Dual-Core G6950 processor, which overclocks it from 2.80 GHz to 4.20 GHz, with a turbo ratio of 100%. This, the company claims, provides a significant graphics performance boost (tabled below). The new BIOS can be downloaded from ASRock Forums' Intel section.

Followed by Intel recent 32nm "Clarkdale" Core i5 / i3 processor launch with built-in GPU engine, it is now a brand new page and competition for all-in-one PC. BIOSTAR, a professional manufacturer of motherboards after its top-line H55 motherboards "TH55XE" being released, today we see another main stream board "TH55B HD" in the market remains high quality component design, outstanding over clocking capabilities and new colorful slots. And of course, it also offers more competitive prices.

"TH55B HD" - a member of BIOSTAR famous "T-Series" with Micro ATX form factor design, black color PCB, and supporting latest Intel 32nm "Clarkdale" Core i5 / i3 processor.

Shuttle, an industry leading designer and manufacturer of high-performance small form factor (SFF) PC solutions and creator of the XPC, today released details and images for the Shuttle models that will be showcased at the 2010 International CES, the world's largest tradeshow for consumer technology, from January 7-10, 2010.

Shuttle will be unveiling its forthcoming XPC models slated for release in the first half of the year, from the new J Series and re-designed All-In-One PC product lines. These models include the latest technology and new features from Intel, including the next-generation Intel Atom platform and the all new Intel Core i3, Intel Core i5, and Intel Core i7 processors.

EVGA introduced its lineup of three motherboards based on the new Intel H55 Express and H57 Express chipsets. These motherboards feature LGA-1156 sockets to support all current LGA-1156 Core i3, Core i5, and Core i7 processors. With the Intel Flexible Display Interface support, the boards let you make use of the integrated GPUs on some dual-core Intel Core i3, Core i5, and Pentium processors. Models include EVGA H57 (123-CD-E637-KR), EVGA H55 (123-CD-E635-KR), and EVGA H55V (111-CD-E630-TR), with the H55V being a micro-ATX model.

The EVGA H55 and EVGA H57 offer a little more than the chipset's feature-set, with Firewire, and additional storage controllers for IDE and two additional SATA 3 Gb/s ports. The two feature nearly identical board layouts with 5+1 phase CPU VRM, DVI and D-Sub for display connectivity, 8-channel audio, and a number of USB 2.0 ports. The EVGA H55 has one set of internal USB headers less, and does away with the PCI-Express x1 slots between the PCI-E 2.0 x16 and PCI-E x16 (x4) slots.

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel H55 and Intel H57 chipset and leveraging the success of the GIGABYTE Ultra Durable 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6 PC management tools, Dynamic Energy Saver 2 power saving utilities, DualBIOS and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.

"GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices," commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. "Featuring next generation storage capabilities including USB 3.0 and high performance digital DisplayPort connectivity, as well as GIGABYTE's own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system."

World-renowned mainboard and graphics card manufacturer, MSI, today officially released H57/H55 Intel chipset products that offer outstanding performance, effective heat dissipation and remarkable power efficiency and stability. After installation of the 32nm Intel Core i5 and Core i3 processors with graphics cores integrated, ultra-strong display performance and outstanding multi-display capability complement MSI's exclusive OC Genie one-second overclocking technology. This enhances 3D performance by up to 45%, allowing smooth BD movie playback, and seize the advantage while gaming.

MSI H57/H55 Series mainboards with built-in industry leading OC Genie auto overclocking technology: Just press the OC Genie button on the mainboard and within one second; enjoy auto overclocking and an optimized processor. Memory module and chipset setting values give overall 3D performance a boost of up to 45%. Whether users want to watch a high bit-rate HD movie or go online for some head-to-head gaming, both can be enjoyed with image performance that is smoother and lag-free.

Elitegroup Computer Systems (ECS), a leading motherboard, graphics card, barebone system and notebook manufacturer, today announced the launch of the ECS H57/H55 motherboard family with a lot of options of brand new technologies and unique features to meet the next generation of HTPC.

ASUS today announces the launch of a new motherboard series based on the Intel H57 and H55 chipsets. The ASUS P7H57D/P7H55 Series supports the new Intel Core i7, Core i5, Core i3, and Pentium processors with feature laden ATX and micro-ATX models to provide the best value and performance on the new LGA1156 platform. Featuring exclusive GPU Boost technology, the series delivers a rich visual experience and smooth video performance with Intel's latest HD capable integrated graphics capable processors. Built with Xtreme Design features, the P7H57D/P7H55 Series delivers optimized performance while being very energy-efficient. The ATX based P7H57D-V EVO also supports next-generation USB 3.0 and SATA 6 Gb/s technology for faster data throughput and better storage performance.

EVGA seems to be ready with two of its first motherboards based on the Intel H55 Express and H57 Express chipsets, supporting processors in the LGA-1156 package, along with support for Intel Flexible Display Interface to make use of the iGPU embedded in some dual-core Pentium, Core i3, and Core i5 processors. The two look nearly similar - infact seem to have the same PCB layout. The LGA-1156 socket is wired to four DDR3 DIMM slots for dual-channel memory support. There are two PCI-Express slots (x16, x4), and three PCI slots. The EVGA H57 model further packs two PCI-Express x1 slots.

The H55/H57 chipset provides six SATA 3 Gb/s ports, all of which are assigned as internal ports. A JMicron-made storage controller provides additional two SATA 3 Gb/s ports, along with an IDE connector to support two devices. Display connectivity on both models includes DVI and D-Sub. Other features include 8-channel audio, gigabit Ethernet, Firewire, and a number of USB 2.0 ports. The H55 model has two internal ports less, along with other internal features that the chipset lacks, such as Remote PC Assist, and Rapid Storage Technology. More details will be out soon.

Intel today gave a go ahead for the media to publish reviews of its brand new dual-core processors under the Core i5 6xx and Core i5 6x1 series. The processors are based on the new "Clarkdale" processor die, and make use of the company's 32 nm next generation HKMG manufacturing process. Unlike conventional processor packages based on the Nehalem/Westmere architecture, the new processors move the northbridge component of the system onto the processor package, only that it is based on a separate 45 nm die within the package. The 32 nm processor die houses two processor cores along with up to 4 MB of L3 cache, while it is wired to a larger iGPU die which houses the dual-channel DDR3 memory controller, a graphics core, PCI-Express root complex, along with other components traditionally found on northbridge chips.

The first three models in the new Core i5 series are the 3.20 GHz Core i5 650, 3.33 GHz Core i5 660 and 661 (latter has a faster iGPU), and 3.46 GHz Core i5 670. These processors have the LGA-1156 package and are compatible with existing P55 Express chipset (albeit without the iGPU feature), along with the company's new H55 Express and H57 Express chipsets that support the Flexible Display Interface that provides connectivity to the processors' iGPUs. The new processors feature HyperThreading Technology, with which it provides the operating system with four logical CPUs (threads) to deal with, TurboBoost technology which powers down a core and overclocks the other when the task load is low. Pricing and availability will surface when the processors are formally announced, a little later this month. Meanwhile, motherboard manufacturers are ready with boatloads of new motherboard models based on Intel's two new chipsets. A compilation of links to major reviews on the internet can be found in the day's reviews list on the homepage.

After giving its socket LGA-1156 quad-core processors a flying start, Intel is poised to release not just a couple of more processors in Q1-2010, but as many as 17 new models on January 7 alone, reports suggest. Among these are chips based on the company's new 32 nm manufacturing technology, which gives the manufacturer headroom to up features and performance, while maintaining low thermal and energy footprints.

This is when the company completes its triad of new generation Core family processors, with the Core i3 series of entry-level thru lower-mainstream processors. This triad starts with Core i3 as an entry-point for "smart performance", with Core i5 in the middle delivering "smart performance with Turbo Boost Technology", and Core i7 at the top, delivering "the ultimate in smart performance".

Gigabyte is ready with a trio of motherboards based on the value desktop chipset for the LGA-1156 platform, the Intel H55 Express. The three offer essential features of the chipset, including support for Flexible Display Interface, which provides connectivity for Intel processors with embedded graphics controllers. The trio includes two micro-ATX models: GA-H55M-S2H and GA-H55M-UD2H, and the ATX GA-H55-UD3H.

The GA-H55M-S2H is entry-level, 7-phase CPU VRM, two DDR3 DIMM slots wired to it for dual-channel memory, a PCI-Express 2.0 x16 slot, PCI-Express x16 (electrical x4), and two PCI slots. All six SATA 3 Gbps ports are assigned as internal ports, with the rear-panel consisting of an 8-channel audio cluster with optical SPDIF output, eight USB 2.0 ports, a keyboard/mouse combo PS/2 port, gigabit Ethernet, and display connectivity including DVI, D-Sub, and HDMI. Solid-state capacitors are limited to the vital VRM areas, with the rest of the board making use of standard electrolytic capacitors.

The third motherboard vendor in the league to be ready with products based on the Intel H5x Express chipset is ASRock, whose first wave consists of one ATX, and two micro-ATX form-factor motherboards, based on the H55 Express chipset. The H55 Express chipset is known to bring along the Flexible Display Interface, which handles the connectivity of the embedded graphics processors Intel's upcoming Core i3 and Core i5 "Clarkdale" processors feature, completing Intel's portfolio of processors based on the Nehalem/Westmere architectures across all segments. H55 Express is a toned-down version of the H57 Express chipset, it lacks support for technologies such as Remote PC Assist, Rapid Storage, and has slightly lesser number of USB 2.0 ports and lesser PCI-Express lanes in its local hub.

The two micro-ATX motherboards from ASRock are the H55M Pro and H55M. These boards are nearly same, in having 4+1 phase CPU VRM, display connectivity that includes DVI, D-Sub, and HDMI, expansion slots which include a PCI-Express 2.0 x16, a PCI-Express x16 (electrical x4), and one each of PCI-Express x1 and PCI. Both feature high-grade DuraCap solid-state capacitors, 8-channel audio, gigabit Ethernet, and eSATA. The two differ with the H55M Pro being slightly broader to accommodate four DDR3 DIMM slots, while the H55M has two, the H55M Pro has five out of six SATA 3 Gbps ports from its PCH assigned as internal ports, with one eSATA, and features FireWire, while the H55M has four internal SATA 3 Gbps ports, two ports are assigned as eSATA, and FireWire is absent.

Intel's upcoming "Clarkdale" is special for two reasons: it is the first 32 nm based processor from Intel, and that it's the first processor that comes with a graphics processor built in, something AMD conceptualized a long time ago. Under the hood (read: integrated heat-spreader), Clarkdale is a busy package, that holds a CPU complex die (that houses the main processing cores, cache, a dual-channel DDR3 integrated memory controller, and a Quickpath interconnect controller, that connects the die to its neighbor, a northbridge-iGraphics die that houses most northbridge components including a PCI-Express 2.0 root complex, the star-attraction IGP and a DMI connection to the "platform controller hub (PCH)".

Now faced with delays, Intel's upcoming Ibex-Peak platform, a next-generation mainstream implementation of the Nehalem architecture, is an interesting mix of technologies, where Intel seeks to minimise the platform and energy footprints while delivering value and performance through a clever bit of rearrangement of system components. HKEPC has learned that Intel's 5-Series mainstream chipsets consists of five models: P57, Q57, H57, P55, and H55. The P57 and P55 are built for the consumer PC with discrete graphics. The H57 and H55 chipsets are built for processors with integrated graphics, with support for the Intel FDI. The Q57 is built for the business / enterprise-client PC, it supports a host of exclusive Intel technologies that make the machine easier to manage.