ADATA Technology, the worldwide leading manufacturer in high-performance DRAM modules and NAND Flash application products, today introduced its new XPG Gaming Series DDR3-1333G low voltage memory, designed for gaming enthusiasts who adopt Intel X58, P55, H55 and H57 motherboards, and for HTPC applications. The XPG Gaming Series DDR3-1333G low voltage memory offers cooler operation and lower power consumption with only 1.35V and CL9-9-9-24 timing for demanding environments, enabling eco-friendly personal computers to perform at high speeds and great stability.

"Environmental sustainability is an important principle to us at ADATA, therefore we developed XPG Gaming Series DDR3-1333G low voltage memory, since energy efficiency equates to reduced CO2 emission." said Alex Wu, Project Manager of ADATA Product Management Division. "By utilizing XPG Gaming Series DDR3-1333G low voltage memory, gaming enthusiasts can help to minimize their carbon footprint, saving money on electricity costs, and achieve the right balance of gaming system performance and stability."

The creation and consumption of multimedia have become mainstream trends among users. As a result, the PC world continues to evolve pushing the boundaries to offer users a better experience. The new Acer Aspire X5950 and X3950 excel at handling even the most demanding home computing and entertainment needs. Great for sharing your photos and videos, mixing music or doing multimedia editing, these desktops feature first-rate applications, components and performance in a cool design taking up just a third of the space of standard PCs.

Harnessing the power of the Intel Core i7, i5 and i3, a family of processors capable of delivering maximum processing power in response to the most demanding tasks such as editing multimedia files, or playing fast-paced games, these desktops can speed through intensive computing applications matching the performance according to requirements, thus ensuring maximised entertainment and productivity. Allowing much faster multitasking the Aspire X5950 and X3950 help you be more efficient and get more done in less time. On top of it, you get a reduction of power consumption while taking advantage of great performance.

Intel introduced two new dual-core processors, the high-end Core i5 680, and the value-segment Pentium Dual-Core E5500. The former is an LGA1156 chip that runs on Intel P55, H55, H57, Q55, Q57 chipsets, while the latter is an LGA775 chip that works on most recent LGA775 motherboards. The Core i5 680 uses the 32 nm based Clarkdale core. At 3.60 GHz (27 x 133 MHz) with a Turbo Boost speed of 3.86 GHz, the i5 680 is expected to be the fastest dual-core processor ever made. Its embedded Intel HD Graphics controller is clocked at 733 MHz. It has L2 caches of 256 KB per core, and a shared L3 cache of 4 MB. It supports two channels of DDR3 memory. With HyperThreading enabled, the chip gives the OS four logical CPUs to deal with. It has a TDP of 73W.

The Pentium Dual-Core E5500 is based on the 45 nm Wolfdale-2M core, it has a clock speed of 2.80 GHz (14 x 200 MHz), and FSB speed of 800 MHz. It has a shared L2 cache of 2 MB, and TDP of 65W. While the Core i5 680 is priced at US $294, the E5500 goes for $75. All prices are per-piece in 1000 unit tray quantities.

EVGA introduced its lineup of three motherboards based on the new Intel H55 Express and H57 Express chipsets. These motherboards feature LGA-1156 sockets to support all current LGA-1156 Core i3, Core i5, and Core i7 processors. With the Intel Flexible Display Interface support, the boards let you make use of the integrated GPUs on some dual-core Intel Core i3, Core i5, and Pentium processors. Models include EVGA H57 (123-CD-E637-KR), EVGA H55 (123-CD-E635-KR), and EVGA H55V (111-CD-E630-TR), with the H55V being a micro-ATX model.

The EVGA H55 and EVGA H57 offer a little more than the chipset's feature-set, with Firewire, and additional storage controllers for IDE and two additional SATA 3 Gb/s ports. The two feature nearly identical board layouts with 5+1 phase CPU VRM, DVI and D-Sub for display connectivity, 8-channel audio, and a number of USB 2.0 ports. The EVGA H55 has one set of internal USB headers less, and does away with the PCI-Express x1 slots between the PCI-E 2.0 x16 and PCI-E x16 (x4) slots.

GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce their latest generation H55/H57 series motherboards, based on the Intel H55 and Intel H57 chipset and leveraging the success of the GIGABYTE Ultra Durable 3 design featuring 2x copper PCB and delivering a host of cutting-edge features including innovative Smart6 PC management tools, Dynamic Energy Saver 2 power saving utilities, DualBIOS and support for Energy Using Products Directive (EuP), for a powerful, yet power efficient multimedia platform.

"GIGABYTE once again leads the motherboard industry and sets the standard for delivering high speed data transfer and richer video playback capabilities for HD multimedia home entertainment devices," commented Tim Handley, Deputy Director of Motherboard Marketing at GIGABYTE Technology Co. Ltd. "Featuring next generation storage capabilities including USB 3.0 and high performance digital DisplayPort connectivity, as well as GIGABYTE's own unique 3x USB Power Boost, the GIGABYTE GA-H57M-USB3 and GA-H55M-USB3 provide a compelling solution for users wanting the ultimate multimedia system."

World-renowned mainboard and graphics card manufacturer, MSI, today officially released H57/H55 Intel chipset products that offer outstanding performance, effective heat dissipation and remarkable power efficiency and stability. After installation of the 32nm Intel Core i5 and Core i3 processors with graphics cores integrated, ultra-strong display performance and outstanding multi-display capability complement MSI's exclusive OC Genie one-second overclocking technology. This enhances 3D performance by up to 45%, allowing smooth BD movie playback, and seize the advantage while gaming.

MSI H57/H55 Series mainboards with built-in industry leading OC Genie auto overclocking technology: Just press the OC Genie button on the mainboard and within one second; enjoy auto overclocking and an optimized processor. Memory module and chipset setting values give overall 3D performance a boost of up to 45%. Whether users want to watch a high bit-rate HD movie or go online for some head-to-head gaming, both can be enjoyed with image performance that is smoother and lag-free.

Elitegroup Computer Systems (ECS), a leading motherboard, graphics card, barebone system and notebook manufacturer, today announced the launch of the ECS H57/H55 motherboard family with a lot of options of brand new technologies and unique features to meet the next generation of HTPC.

ASUS today announces the launch of a new motherboard series based on the Intel H57 and H55 chipsets. The ASUS P7H57D/P7H55 Series supports the new Intel Core i7, Core i5, Core i3, and Pentium processors with feature laden ATX and micro-ATX models to provide the best value and performance on the new LGA1156 platform. Featuring exclusive GPU Boost technology, the series delivers a rich visual experience and smooth video performance with Intel's latest HD capable integrated graphics capable processors. Built with Xtreme Design features, the P7H57D/P7H55 Series delivers optimized performance while being very energy-efficient. The ATX based P7H57D-V EVO also supports next-generation USB 3.0 and SATA 6 Gb/s technology for faster data throughput and better storage performance.

EVGA seems to be ready with two of its first motherboards based on the Intel H55 Express and H57 Express chipsets, supporting processors in the LGA-1156 package, along with support for Intel Flexible Display Interface to make use of the iGPU embedded in some dual-core Pentium, Core i3, and Core i5 processors. The two look nearly similar - infact seem to have the same PCB layout. The LGA-1156 socket is wired to four DDR3 DIMM slots for dual-channel memory support. There are two PCI-Express slots (x16, x4), and three PCI slots. The EVGA H57 model further packs two PCI-Express x1 slots.

The H55/H57 chipset provides six SATA 3 Gb/s ports, all of which are assigned as internal ports. A JMicron-made storage controller provides additional two SATA 3 Gb/s ports, along with an IDE connector to support two devices. Display connectivity on both models includes DVI and D-Sub. Other features include 8-channel audio, gigabit Ethernet, Firewire, and a number of USB 2.0 ports. The H55 model has two internal ports less, along with other internal features that the chipset lacks, such as Remote PC Assist, and Rapid Storage Technology. More details will be out soon.

Intel today gave a go ahead for the media to publish reviews of its brand new dual-core processors under the Core i5 6xx and Core i5 6x1 series. The processors are based on the new "Clarkdale" processor die, and make use of the company's 32 nm next generation HKMG manufacturing process. Unlike conventional processor packages based on the Nehalem/Westmere architecture, the new processors move the northbridge component of the system onto the processor package, only that it is based on a separate 45 nm die within the package. The 32 nm processor die houses two processor cores along with up to 4 MB of L3 cache, while it is wired to a larger iGPU die which houses the dual-channel DDR3 memory controller, a graphics core, PCI-Express root complex, along with other components traditionally found on northbridge chips.

The first three models in the new Core i5 series are the 3.20 GHz Core i5 650, 3.33 GHz Core i5 660 and 661 (latter has a faster iGPU), and 3.46 GHz Core i5 670. These processors have the LGA-1156 package and are compatible with existing P55 Express chipset (albeit without the iGPU feature), along with the company's new H55 Express and H57 Express chipsets that support the Flexible Display Interface that provides connectivity to the processors' iGPUs. The new processors feature HyperThreading Technology, with which it provides the operating system with four logical CPUs (threads) to deal with, TurboBoost technology which powers down a core and overclocks the other when the task load is low. Pricing and availability will surface when the processors are formally announced, a little later this month. Meanwhile, motherboard manufacturers are ready with boatloads of new motherboard models based on Intel's two new chipsets. A compilation of links to major reviews on the internet can be found in the day's reviews list on the homepage.

After giving its socket LGA-1156 quad-core processors a flying start, Intel is poised to release not just a couple of more processors in Q1-2010, but as many as 17 new models on January 7 alone, reports suggest. Among these are chips based on the company's new 32 nm manufacturing technology, which gives the manufacturer headroom to up features and performance, while maintaining low thermal and energy footprints.

This is when the company completes its triad of new generation Core family processors, with the Core i3 series of entry-level thru lower-mainstream processors. This triad starts with Core i3 as an entry-point for "smart performance", with Core i5 in the middle delivering "smart performance with Turbo Boost Technology", and Core i7 at the top, delivering "the ultimate in smart performance".

Following a recent expose of three of Gigabyte's upcoming motherboards based on the Intel H55 Express chipset supporting socket LGA-1156 processors, one of its first models based on the Intel H57 Express chipset surfaced, with the GA-H57M-USB3. This micro-ATX motherboard builds on the slightly expanded feature-set of the H57 PCH, which includes Intel Rapid Storage, Remote PC Assist, and a higher number of USB 2.0 ports and PCI-Express x1 lanes. It uses complete Ultra Durable 3 construction, which includes full solid-state capacitor design, 2 oz copper PCB, low RDS (on) MOSFET, and ferrite-core chokes. The processor is powered by an 8-phase VRM, it is wired to four DDR3 DIMM slots supporting dual-channel memory.

Expansion slots include PCI-Express 2.0 x16, PCI-E x16 (x4), and two PCI slots. Five out of six SATA 3 Gbps ports from the PCH are assigned as internal ports, while an additional Gigabyte GSATA2 controller provides two SATA 3 Gbps ports and an IDE connector. An additional NEC controller provides two USB 3.0 ports. The rear-panel consists of 8-channel audio with optical SPDIF (supporting Dolby Home Theater), gigabit Ethernet, two USB 3.0 ports (color-coded blue), four USB 2.0, FireWire, eSATA, keyboard/mouse combo port, and display connectivity which includes DVI, D-Sub, DisplayPort, and HDMI. The GA-H57M-USB3 is another of those boards slated for Q1 2010, when Intel releases new processors with embedded graphics along with the H55/H57 chipsets.

Over a month ahead of its launch, the first wave of Intel's 32 nm based Core i3 and Core i5 series dual-core processors have been listed on German online store HPM-Computer. The pricing and specifications disclosed by these listing confirm the information that surfaced as early as in July, this year. The series starts with Core i3 500 series processors whose clock speeds range between 2.93 to 3.06 GHz, and continue with Core i5 600 series dual-core processors ranged between 3.20 GHz and 3.43 GHz. While both series feature HyperThreading Technology to give the operating system four logical processors (threads) to work with, the Core i3 processors lack the Turbo Boost feature which the Core i5 chips have.

According to the new listing in which the chips are priced in Euros, the 2.93 GHz Core i3 530 processor is priced at 103.90 EUR, and 3.06 GHz Core i3 540 at 120.90 EUR. The Core i5 600 series lineup includes the 3.20 GHz Core i5 650 priced at 160.90 EUR, 3.33 GHz Core i5 660 and 661 priced at 175.90 EUR, and lead by the 3.43 GHz Core i5 670 priced at a premium 252.90 EUR point. All prices include a 19% applicable tax. The IGP clock speed (750 MHz vs. 900 MHz), differentiates Core i5 660 from 661. It is likely that the price of one of those seems to have entered incorrectly. With these processors, Intel may also introduce the Intel H57 Express chipset, and motherboards by various vendors will soon follow. These processors, however, have the same LGA-1156 socket the "Lynnfield" quad-core processors have, which are currently in the market. They may run on existing P55 Express based motherboards too, according to a recent report.

Come Q1 2010, and Intel will be expanding its socket LGA-1156 platform with dual-core processors, and processors with on-die graphics. Along with these, Intel will be releasing the H57 Express chipset which supports the Flexible Display technology which handles the connectivity for the processors' on-die graphics. Motherboard vendors seem to be ready well ahead, and the second such company with a product on display is MSI, with its H57M-ED65. This motherboard is based on the micro-ATX form-factor, and builds on the chipset's features, while also appearing to be enthusiast-friendly.

The CPU is powered by a lavish 10-phase VRM with elaborate heatsinks over the DrMOS chips. It completely does away with PCI, and features only PCI-Express slots. There are are two PCI-Express x16 slots (electrical x16, x4), and two PCI-Expres x1 slots. Apart from the six SATA 3 Gb/s ports the chipset provides, an additional storage controller provides two more SATA 3 Gb/s ports, and an IDE connector. The board makes full use of the Flexible Display technology, providing DVI, D-Sub, HDMI, and DisplayPort as display connectivity options. A number of USB ports, PS/2, gigabit Ethernet, 8-channel audio with optical SPDIF, eSATA, and FireWire make for the rest of the rear-panel. Its enthusiast-friendliness is further vindicated by the presence of the OC Genie feature, on the fly base clock controls, and power/reset buttons onboard. Expect this to feature in the company's first wave of H57 motherboards.

Following Intel's launch of the new socket LGA-1156 platform with quad-core Intel Core i5, Core i7 "Lynnfield", and the P55 Express chipset to drive the platform, Intel is preparing to drop another chalk in Q1 2010, with dual-core socket LGA-1156 processors that use the Core i3 and Core i5 brand identifiers. A feature unique to these processors is the integration of a graphics controller into the processor package. On the platform side, core-logic must support the Intel Flexible Display technology, which handles connectivity for that graphics controller. The chipset which will drive this would be Intel's upcoming H57 Express chipset, codenamed "Eagle Lake".

Motherboards based on the H57 chipset typically feature display connectors such as DVI, D-Sub, or HDMI. While intended to cover the mainstream segment, H57 can also be used to drive high-grade motherboards, as is shown by ASUS with its newest motherboard based on the chipset - the P7PH57D-V EVO. The ATX motherboard resembles the P7P55D Deluxe in many design aspects. It supports all the high-end features its cousin does, including support for SATA 6 Gb/s and USB 3.0 along with full-bandwidth PCI-Express 2.0 interfaces for the controllers.

At the IDF 2009 event, Intel showed of the fruition of the platform component rearrangement socket LGA-1156 strives for, by relocating the northbridge to the processor package. On display was the company's newest mini-ITX socket LGA-1156 motherboard that is full-featured, complete with Intel Flexible Display Interface support. Based on the Intel H57 chipset, the motherboard supports Intel Core i3, Core i5, and Core i7 processors based on the socket. Its two DDR3 DIMM slots provide dual-channel memory interface.

The sole expansion slot is a PCI-Express 2.0 x16, which can be used for any PCI-Express addon card. Located at the north of the board, the H57 chipset provides four SATA 3 Gbps ports, and requires a small heatsink to stay comfortable. The rear panel sums up the rest of the feature-set, it includes display output via DVI and HDMI, Ethernet, six USB ports, eSATA, and 8-channel audio with optical SPDIF. In the second picture below, it's placed to the left of a mini-ITX G45 motherboard by Intel.

Intel's upcoming "Clarkdale" is special for two reasons: it is the first 32 nm based processor from Intel, and that it's the first processor that comes with a graphics processor built in, something AMD conceptualized a long time ago. Under the hood (read: integrated heat-spreader), Clarkdale is a busy package, that holds a CPU complex die (that houses the main processing cores, cache, a dual-channel DDR3 integrated memory controller, and a Quickpath interconnect controller, that connects the die to its neighbor, a northbridge-iGraphics die that houses most northbridge components including a PCI-Express 2.0 root complex, the star-attraction IGP and a DMI connection to the "platform controller hub (PCH)".

Most motherboard vendors chose Computex as the ideal platform to showcase their upcoming products for the upcoming Intel LGA-1156 processors. The Intel booth was decked up wall-to-wall with Intel 5-series motherboards, some of which, made it to cameras for their unusual designs. Take for instance, the Shuttle SP55H7. This board uses a custom form-factor to fit into the company's bare-bones systems. The socket is slanted, and surrounded with an unusual mount-hole arrangement for the cooler, which again, could be of Shuttle's own design. This is, perhaps to make the most out of the available PCB area.

A more popular motherboard vendor, MSI showcased the first M-ATX motherboard for the platform we have seen so far, the H57-ED65. Based on the Intel H57 chipset. The socket is powered by an 8-phase DrMOS power circuit. MSI takes care of the basics for this platform, providing a PCI-E 2.0 x16, one PCI, and two PCI-E x1 slots. The dual-channel DDR3 memory slots neighbour one NVRAM slot. Apart from the six SATA II ports the H57 provides, a second controller drives the IDE connector, and perhaps, one or more eSATA ports. The rest of the 'wall' can be viewed here. By the looks of it, Intel made sure a full-fledged lineup of motherboards are available to the consumers when it kicks off the series of LGA-1156 processors, and there is every indication that the new platform won't have much trouble replacing the current LGA-775 series.

Now faced with delays, Intel's upcoming Ibex-Peak platform, a next-generation mainstream implementation of the Nehalem architecture, is an interesting mix of technologies, where Intel seeks to minimise the platform and energy footprints while delivering value and performance through a clever bit of rearrangement of system components. HKEPC has learned that Intel's 5-Series mainstream chipsets consists of five models: P57, Q57, H57, P55, and H55. The P57 and P55 are built for the consumer PC with discrete graphics. The H57 and H55 chipsets are built for processors with integrated graphics, with support for the Intel FDI. The Q57 is built for the business / enterprise-client PC, it supports a host of exclusive Intel technologies that make the machine easier to manage.