Huawei's new server CPU based on the HiSilicon Taishan V120 core has shown impressive single-threaded performance that matches AMD's Zen 3 architecture in a leaked Geekbench 6 benchmark. The Taishan V120 is likely being manufactured on SMIC's 7 nm process node. The Geekbench 6 result posted on social media does not identify the exact Huawei server CPU model, but speculation points to it being the upcoming Kunpeng 930 chip. In the benchmark, the Taishan V120 CPU operating at 2.9 GHz scored 1527 in the single-core test. This positions it nearly equal to AMD's EPYC 7413 server CPU based on the Zen 3 architecture, which boosts up to 3.6 GHz and which scored 1538 points. It also matches the single-threaded performance of Intel's Coffee Lake-based Xeon E-2136 from 2018, even though that Intel chip can reach 4.5 GHz boost speeds, scoring 1553 points.

The Taishan V120 core first appeared in Huawei's Kirin 9000 smartphone SoC in 2020. Using the core in server CPUs would allow Huawei to achieve competitive single-threaded performance to rival AMD's last-generation EPYC Milan and Intel's older Skylake server chips. Multi-threaded benchmarks will be required to gauge the Kunpeng 930's overall performance fully when it launches. Huawei continues innovating its ARM-based server CPU designs even while facing restrictions on manufacturing and selling chips internationally due to its inclusion on the US Entity List in 2019. The impressive single-threaded results versus leading x86 competitors demonstrate Huawei's resilience and self-reliance in developing homegrown data center technology through its HiSilicon division. More details on the Kunpeng 930 server chip will likely surface later this year, along with server configurations from Chinese OEMs.

According to the latest teardown from TechInsights, China's biggest technology maker, Huawei, has been shipping laptops with technology supposedly sanctioned by the United States. As the teardown shows, TechInisights has discovered that Huawei's Kirin 9006C processor is manufactured on TSMC's 5 nm semiconductor technology. Originally, the United States have imposed sanctions on Huawei back in 2020, when the government cut off Huawei's access from TSMC's advanced facilities and forbade the use of the latest nodes by Huawei's HiSilicon chip design arm. Today's findings show signs of contradiction, as the Qingyun L540 notebook that launched in December 2023 employs a Kirin 9006C chipset manufactured on a TSMC 5 nm node.

TechInsight's findings indicate that Kirin 9006C assembly and packaging occurred around the third quarter of 2020, whereas the 2020 Huawei sanctions started in the second quarter. Of course, the implication of the sanctions likely prohibited any new orders and didn't prevent Huawei from possibly stockpiling millions of chip orders in its warehouse before they took place. The Chinese giant probably made orders beforehand and is using the technology only now, with the Qingyun L540 laptop being one of the first Kirin 9006C appearances. Some online retailers also point out that the laptop complies with the latest security practices required for the government, which means that they have been in the works since the chip began the early stages of design, way before 2020. We don't know the stockpile quantity, but SMIC's domestic efforts seem insufficient to supply the Chinese market alone. The news that Huawei is still using TSMC chips made SMIC's share go for a 2% free fall on the Hong Kong stock exchange.

Huawei's subsidiary HiSilicon has made significant strides in the independent R&D of AI chips, launching the next-gen Ascend 910B. These chips are utilized not only in Huawei's public cloud infrastructure but also sold to other Chinese companies. This year, Baidu ordered over a thousand Ascend 910B chips from Huawei to build approximately 200 AI servers. Additionally, in August, Chinese company iFlytek, in partnership with Huawei, released the "Gemini Star Program," a hardware and software integrated device for exclusive enterprise LLMs, equipped with the Ascend 910B AI acceleration chip, according to TrendForce's research.

TrendForce conjectures that the next-generation Ascend 910B chip is likely manufactured using SMIC's N+2 process. However, the production faces two potential risks. Firstly, as Huawei recently focused on expanding its smartphone business, the N+2 process capacity at SMIC is almost entirely allocated to Huawei's smartphone products, potentially limiting future capacity for AI chips. Secondly, SMIC remains on the Entity List, possibly restricting access to advanced process equipment.

The Chinese semiconductor industry is advancing, and interestingly, it is growing rapidly under sanctions, even with the blacklisting of companies by the US government. China's semiconductor industry is mainly represented by companies like Semiconductor Manufacturing International Corp (SMIC) and Huawei Technologies, who are leading the investment and progress in both chip manufacturing and chip design. According to the latest interview with Bloomberg, former TSMC Vice President Burn J. Lin said that the US government and its sanctions can not stop the advancement of Chinese semiconductor companies. Currently, Lin notes that SMIC and Huawei can use older machinery to produce more advanced chips.

Even so, SMIC could progress to 5 nm technology using existing equipment, particularly with scanners and other machinery from ASML. Development under sanctions would also force China to experiment with new materials and other chip packaging techniques that yield higher performance targets. SMIC has already developed a 7 nm semiconductor manufacturing node, which Huawei used for its latest Mate 60 Pro smartphone, based on Huawei's custom HiSilicon Kirin 9000S chip. Similarly, the transition is expected to happen to the 5 nm node as well, and it is only a matter of time before we see other nodes appear. "It is just not possible for the US to completely prevent China from improving its chip technology," noted Burn J. Lin.

The global smartphone applications processor (AP) market grew 23 percent to $30.8 billion in 2021, according to Strategy Analytics' Handset Component Technologies (HCT) service report. According to this Strategy Analytics' Handset Component Technologies (HCT) research report, " Smartphone Apps Processor Market Share Tracker Q4 2021: Qualcomm Increases Revenue Share Lead", Qualcomm, MediaTek, Apple, Samsung LSI and Unisoc grabbed the top-five revenue share ranking spots in the smartphone applications processor (AP) market in 2021.

Sravan Kundojjala, author of the report and Director of Handset Component Technologies service at Strategy Analytics, commented, "For the first time on an annual basis, MediaTek overtook Qualcomm in units and established over 75 million unit-lead in smartphone APs 2021. MediaTek capitalized on Qualcomm's defocus on mid and low tier 4G LTE APs and gained volume share. Despite the loss of unit share crown, Qualcomm exited 2021 with over 43% higher revenue than MediaTek, thanks to an increased mix of higher-priced premium and high-tier APs. Both companies performed well in the 5G AP segment and posted a 13-year high in their AP average selling prices (ASPs)."

Worldwide semiconductor revenue increased 25.1% in 2021 to total $583.5 billion, crossing the $500 billion threshold for the first time, according to preliminary results by Gartner, Inc.

"As the global economy bounced back in 2021, shortages appeared throughout the semiconductor supply chain, particularly in the automotive industry," said Andrew Norwood, research vice president at Gartner. "The resulting combination of strong demand as well as logistics and raw material price increases drove semiconductors' average selling price higher (ASP), contributing to overall revenue growth in 2021.

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

IC Insights' November Update to the 2020 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in 2020. This research bulletin covers the expected top-15 2020 semiconductor suppliers (Figure 1).

The November Update also includes a detailed five-year forecast through 2024 of the IC market by product type (including dollar volume, unit shipments, and average selling price) and a forecast of the major semiconductor industry capital spenders for 2020. A five-year outlook for total semiconductor industry capital spending is also provided.

IC Insights recently released its September Update to the 2020 McClean Report that presented the second of a two-part analysis on the global IC foundry industry and included a look at the pure-play foundry market by region.

China was responsible for essentially all of the total pure-play foundry market increase in 2018. In 2019, the U.S./China trade war slowed China's economic growth but its foundry marketshare still increased by two percentage points to 21%. Moreover, despite the Covid-19 shutdown of China's economy earlier this year, China's share of the pure-play foundry market is forecast to be 22% in 2020, 17 percentage points greater than it registered in 2010 (Figure 1).

With its own 7 nm-class silicon fabrication node nowhere in sight for its processors, at least not until 2022-23, Intel is seeking out third-party semiconductor foundries to support its ambitious discrete GPU and scalar compute processor lineup under the Xe brand. A Taiwanese newspaper article interpreted by Chiakokhua provides a fascinating insight to the the new precious resource in the high-technology industry - allocation.

TSMC is one of these foundries, and will give Intel access to a refined 7 nm-class node, either the N7P or N7+, for some of its Xe scalar compute processors. The company could also seek out nodelets such as the N6. Trouble is, Intel will be locking horns with the likes of AMD for precious foundry allocation. NVIDIA too has secured a certain allocation of TSMC 7 nm for some of its upcoming "Ampere" GPUs. Sources tell China Times that TSMC will commence mass-production of Intel silicon as early as 2021, on either N7P, N7+, or N6. Business from Intel is timely for TSMC as it is losing orders from HiSilicon (Huawei) in wake of the prevailing geopolitical climate.

TSMC, one of the largest semiconductor manufacturing foundries, has officially confirmed that it will stop all orders from Chinese company Huawei Technologies. The Taiwanese silicon manufacturer has decided to comply with US regulations and will officially stop processing orders for Huawei on September 14th of this year. Precisely, the company was receiving orders from HiSilicon, a subsidiary of Huawei Technologies that focuses on creating custom silicon. Under the new regulation by the US, all non-US companies must apply for a license to ship any American-made technology to Huawei. Being that many American companies like KLA Corporation, Lam Research, and Applied Materials ship their tools to many manufacturing facilities, it would be quite difficult for Huawei to manufacture its silicon anywhere. That is why Huawei has already placed orders over at Chinese SMIC foundry.

Semiconductor Manufacturing International Corporation (SMIC), the state-backed Mainland Chinese semiconductor foundry, announced that it commenced mass-production of 14 nm FinFET SoCs for Huawei's HiSilicon subsidiary, a mere one month since Huawei shifting chip orders from TSMC to it. The company is manufacturing Kirin 710A is a revision of the original Kirin 710 SoC from 2018, built on SMIC's 14 nm node. The 4G-era SoC is capable of powering mid-range smartphones for Huawei's Honor brand, and uses an Arm big.LITTLE setup of Cortex A53 and Cortex A57 cores. This represents a major milestone not just for SMIC, but also Huawei, which has seen the company's isolation from cutting-edge overseas fabs such as TSMC. Much of Huawei's fate is riding on the success of SMIC's next-generation N+1 node, which purportedly offers a 57 percent energy-efficiency gain over 14 nm FinFET, rivaling sub-10 nm nodes such as 7 nm; enabling Huawei to build 5G-era SoCs.

TSMC is working hard to bring a new 5 nm (N5 and N5+) despite all the hiccups the company may have had due to the COVID-19 pandemic happening. However, it seems like nothing can stop TSMC, and plenty of companies have already reserved some capacity for their chips. With mass production supposed to start in Q3 of this year, 5 nm node should become one of the major nodes over time for TSMC, with predictions that it will account for 10% of all capacity for 2020. Thanks to the report of ChinaTimes, we have a list of new clients for the TSMC 5 nm node, with some very interesting names like Intel appearing on the list.

Apple and Huawei/HiSilicon will be the biggest customers for the node this year with A14 and Kirin 1000 chips being made for N5 node, with Apple ordering the A15 chips and Huawei readying the Kirin 1100 5G chip for the next generation N5+. From there, AMD will join the 5 nm party for Zen 4 processors and RDNA 3 graphics cards. NVIDIA has also reserved some capacity for its Hopper architecture, which is expected to be a consumer-oriented option, unlike Ampere. And perhaps the most interesting entry to the list is Intel Xe graphics cards. The list shows that Intel might use the N5 process form TSMC so it can ensure the best possible performance for its future cards, in case it has some issues manufacturing its own nodes, just like it did with 10 nm.

HiSilicon, a subsidiary company of Huawei, has officially entered the top 10 list of the semiconductor suppliers in the first quarter of 2020. This is a very important milestone for HiSilicon, as this shows just how big demand there is for its chips. Starting from smartphone chips going inside Huawei phones, server processors, and telecommunication equipment, HiSilicon has been busy pumping out designs at a very high rate. And now, thanks to the report of IC Insights, we have information that HiSilicon has become one of the biggest players in the industry.

Ranked at number 10 spot, HiSilicon is the first company from China that has entered this list. At the number nine spot is NVIDIA, which is also a new entry to the list. Thanks to the growth of 37% for the quarter, NVIDIA can hold number nine spot. In total, the top 10 of the semiconductor suppliers have climbed 16% on year in the first quarter of 2020, which is a very impressive result, counting in the current pandemic in the world.

Huawei's subsidiary, HiSilicon, which designs the processors used in Huawei's smartphones and telecommunications equipment, has reportedly moved its silicon orders from Taiwan Semiconductor Manufacturing Company (TSMC) to Semiconductor Manufacturing International Corporation (SMIC), according to DigiTimes. Why Huawei decided to do is move all of the 14 nm orders from Taiwanese foundry to China's largest silicon manufacturing fab, is to give itself peace of mind if the plan of the US Government goes through to stop TSMC from supplying Huawei. At least for the mid-tier chips built using 14 nm node, Huawei would gain some peace as a Chinese fab is a safer choice given the current political situation.

When it comes to the high-end SoCs built on 7 nm, and 5 nm in the future, it is is still uncertain how will Huawei behave in this situation, meaning that if US cuts off TSMC's supply to Huawei, they will be forced to use SMIC's 7 nm-class N+1 node instead of anything from TSMC. Another option would be Samsung, but it is a question will Huawei put itself in risk to be dependant on another foreign company. The lack of 14 nm orders from Huawei will not be reflecting much on TSMC, because whenever someone decides to cut orders, another company takes up the manufacturing capactiy. For example, when Huawei cut its 5 nm orders, Apple absorbed by ordering more capacity. When Huawei also cut 7 nm orders, AMD and other big customers decided to order more, making the situation feel like there is a real fight for TSMC's capacity.

The U.S. government announced advanced measures that make it harder for foreign companies, such as Taiwan's TSMC, to supply chips to Chinese telecom hardware giant Huawei. Foreign companies that use American chipmaking equipment, are required to obtain a license from the U.S. before supplying certain chips to Huawei. Sources comment that the new rule was tailor-made to curb TSMC fabricating smartphone SoCs for Huawei's HiSilicon subsidiary.

Mainland Chinese semiconductor companies are still behind Samsung and TSMC in 7 nm-class fab technologies, forcing HiSilicon to source from the latter. 7 nm fabrication is a key requirement for SoCs and modem chips capable of 5G. The high data transceiving rates of 5G requires a certain amount of compute power that can fit into smartphone-level power-envelopes only with the help of 7 nm, at least for premium smartphone form-factors. Same applies to 5G infrastructure equipment. This is hence perceived as a means for the U.S. to clamp brakes on Huawei's plans of playing a big role in 5G tech rollouts around the world, buying western 5G tech suppliers such as Nokia time to catch up. Huawei has been a flashpoint for a bitter political spat between the U.S. and China, with the Chinese press even threatening that the matter could hamper medical supplies to the U.S. to fight the COVID-19 pandemic.

AMD in the second half of 2020 could outpace Apple as the biggest foundry customer of TSMC for its 7 nm silicon fabrication nodes (DUV and EUV combined). There are two key factors contributing to this: AMD significantly increasing its orders for the year; and Apple transitioning to TSMC's 5 nm node for its A14 SoC, freeing up some 7 nm allocation, which AMD grabbed. AMD is currently tapping into 7 nm DUV for its "Zen 2" chiplet, "Navi 10," and "Navi 14" GPU dies. The company could continue to order 7 nm DUV until these products reach EOL; while also introducing the new "Renoir" APU die on the process. The foundry's new 7 nm+ (EUV) node will be utilized for "Zen 3" chiplets and "Navi 2#" GPU dies in 2020.

Currently, the top-5 customers for TSMC 7 nm are Apple, HiSilicon, Qualcomm, AMD, and MediaTek. Barring AMD, the others in the top-5 build mobile SoCs or 4G/5G modem chips on the node. AMD is expected to top the list as it scales up orders with TSMC. In the first half of 2020, TSMC's monthly output for 7 nm is expected to grow to 110,000 wafers per month (wpm). Apple's migration to 5 nm in 2H-2020, coupled with capacity-addition could take TSMC's 7 nm output to 140,000 wpm. AMD has reportedly booked the entire capacity-addition for 30,000 wpm, taking its allocation up to 21% in 2H-2020. Qualcomm is switching to Samsung for its next-generation SoCs and modems designed for 7 nm EUV. NVIDIA, too, is expected to built its next-gen 7 nm EUV GPUs on Samsung instead of TSMC. These moves by big players could free up significant foundry allocation at TSMC for AMD's volumes to grow in 2020.

AMD's "Zen 4" CPU microarchitecture is on track for a 2021 launch as its principal foundry partner, TSMC, is optimistic about early yields of its 5 nm silicon fabrication node. TSMC supports the 5 nm product roadmaps of not just AMD, but also Apple and HiSilicon. "Zen 4" is particularly important for AMD, as it will release its next enterprise platform, codenamed "Genoa," along with the new SP5 socket. The new socket will present AMD with the opportunity to significantly change the processor's I/O, such as support for a new memory standard, a new PCIe generation, more memory channels, more PCIe lanes, etc. As early as 2019, the foundry is seeing yields of over 50 percent for the 5 nm node (possibly risk production designed to test the node), which is very encouraging for its customers.

AMD's roadmap for 2020 sees the introduction of "Zen 3" on the 7 nm EUV process (dubbed 7 nm+). AMD recently commented that the performance uplift of "Zen 3" versus "Zen 2" will be "right in line with what you would expect from an entirely new architecture." The 7 nm EUV node provides a significant 20 percent increase in transistor-density compared to the current 7 nm DUV node "Zen 2" chiplets and the company's "Navi" family of GPUs are built on. "Zen 3" could see the company do away with the CCX (quad-core CPU complex), and make chiplets monolithic blocks of CPU cores without sub-divisions. For the client-segment, 5 is a recurring number in 2021. It will see the introduction of the 5th generation Ryzen processors (5000-series), built on the 5 nm process, supporting DDR5 memory, PCI-Express gen 5, and the new AM5 client-segment CPU socket.

As the trade war between the US and China continues to unfold, we are seeing major US companies ban or stop providing service to China's technology giant Huawei. Now, it looks like the trade war has crossed the ocean and reached the UK. This time, UK based ARM Holdings, the provider of mobile chip IP for nearly all smartphones and tablets, has revoked the license it has given Huawei.

According to the BBC, ARM Holdings employees were instructed to suspend all interactions with Huawei, and to send a note informing Huawei that "due to an unfortunate situation, they were not allowed to provide support, deliver technology (whether software, code, or other updates), engage in technical discussions, or otherwise discuss technical matters with Huawei, HiSilicon or any of the other named entities." The news came from an internal ARM document the BBC has obtained.

TSMC is giving final touches to set its flagship 7 nanometer EUV (extreme ultraviolet lithography) silicon fabrication node at its highest state of readiness for business, called mass-production. At this state, the node can mass-produce products for TSMC's customers. TSMC had taped out its first 7 nm EUV chips in October 2018. The company will also begin risk-production of the more advanced 5 nm node in April, staying on schedule. Mass production of 5 nm chips could commence in the first half of 2020.

The 7 nm EUV node augments TSMC's 7 nm DUV (deep ultraviolet lithography) node that's been already active since April 2018, and producing chips for AMD, Apple, HiSilicon, and Xilinx. At the turn of the year, 7 nm DUV made up 9 percent of TSMC's shipments. With the new node going online, 7 nm (DUV + EUV) could make up 25 percent of TSMC's output by the end of 2019.

DigiTimes, citing a Chinese-language Commercial Times report, cites TSMC's 7 nm foundry capacity as likely being underutilized in 2019. After TSMC announced it expected cutting-edge 7 nm designs to correspond to around 20% of the company's revenues in 2019, the company will likely have to review those projections, as lower demand from smartphone chip manufacturers will likely leave TSMC with less actual output than that which it can churn out.

Due to a cutback in orders placed by Apple, HiSilicon and Qualcomm, concerns regarding TSMC's ability to be the sole 7 nm chip fabrication tech for the industry can likely be laid to rest. That the smartphone market is reaching saturation is a well-known quantity - it's becoming harder and harder to cram new technologies that justify the yearly smartphone upgrade that most companies vie for - and one of the reasons for the launch of various brand-specific smartphone subscription services. The difference isn't scandalous - TSMC will still be making use of 80-90% of its total 7nm process capacity during the first half of 2019, the report quoted industry sources as saying.