A group of leading technology companies today announced the Gen-Z Consortium, an industry alliance working to create and commercialize a new scalable computing interconnect and protocol. This flexible, high-performance memory semantic fabric provides a peer-to-peer interconnect that easily accesses large volumes of data while lowering costs and avoiding today's bottlenecks. The alliance members include AMD, ARM, Cavium Inc., Cray, Dell EMC, Hewlett Packard Enterprise (HPE), Huawei, IBM, IDT, Lenovo, Mellanox Technologies, Micron, Microsemi, Red Hat, Samsung, Seagate, SK hynix, Western Digital Corporation, and Xilinx.

Modern computer systems have been built around the assumption that storage is slow, persistent and reliable, while data in memory is fast but volatile. As new storage class memory technologies emerge that drive the convergence of storage and memory attributes, the programmatic and architectural assumptions that have worked in the past are no longer optimal. The challenges associated with explosive data growth, real-time application demands, the emergence of low latency storage class memory, and demand for rack scale resource pools require a new approach to data access.

Integrated Device Technology, Inc., the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced the introduction of the industry's first low-power DDR3 memory buffer capable of operating with transfer speeds up to 1866 megatransfers per second (MT/s).

The new device affirms IDT's leadership in memory interface solutions by advancing the top data transfer rates of DDR3 load-reduced dual-inline memory modules (LRDIMMs) and allowing system makers to benefit from increased memory capacity at higher speeds. IDT's memory buffer is a critical component for advanced memory subsystems in servers, workstations, and storage applications.

Galaxy introduced a new GeForce GT 610 graphics card with its MDT multi-display connectivity, ideal for PCs with multiple high-resolution monitors for productivity. Just don't expect to game on it. The single-slot, full-height graphics card uses a fan-heatsink to cool the GPU and 1 GB of DDR3 memory. The GPU is wired to two IDT VMM1402 multi-display chips, which give out two DMS59 ports. Cables are included that convert each DMS59 to two DVI-I single-link, which supports digital resolutions of up to 1920 x 1200 pixels. The GPU is clocked at 810 MHz, CUDA cores at 1620 MHz, and memory at 1.00 GHz. Based on the 40 nm GF119 silicon, the GeForce GT 610 packs 48 CUDA cores, and a 64-bit wide memory interface. Pricing information was not released.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced the industry's first NVM Express (NVMe) enterprise non-volatile DRAM (NV-DRAM) controller with native support for PCIe Gen 3. The new NVMe NV-DRAM controller expands upon IDT's previously announced NVMe flash controller family to provide standards-based, high-density, high-performance PCIe-attached NV-DRAM solutions built around a combination of DRAM and NAND flash devices.

The IDT 89HF08P08AG3 NV-DRAM controller supports up to 32 GB of DDR3 SDRAM and 8 channels of NAND flash, with a PCIe x8 Gen 3 host interface. The controller is designed to fully comply with the NVMe standard - a standard that defines an optimized register interface, command set, and feature set for PCIe-based solid-state drives (SSDs). IDT's new PCIe NV-DRAM controller enables unparalleled read and write random performance with extremely low latency and high endurance, making it ideal for storage-intensive enterprise-class applications. The programmable controller provides OEMs the flexibility to quickly develop and deploy NV-DRAM solutions that use standard NVM Express drivers.

Integrated Device Technology, Inc., the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that Intel has selected IDT to develop an integrated transmitter and receiver chipset for Intel's wireless charging technology based on resonance technology. Wireless charging ICs by IDT will provide industry-leading size and cost reduction, while simplifying product development and integration. Intel, along with IDT, aims to deliver validated reference designs that are targeted for deployment in Ultrabooks, all-in-one (AiO) PCs, smartphones, and standalone chargers.

"Our extensive experience in developing the innovative and highly integrated IDTP9030 transmitter and multi-mode IDTP9020 receiver has given IDT a proven leadership position in the wireless power market," said Arman Naghavi, vice president and general manager of the Analog and Power Division at IDT. "We welcome the advancements in resonance technology and will support its continued success by delivering the most integrated and full-featured ICs in the world. IDT is excited to collaborate with Intel and looks forward to playing a key role in the proliferation of wireless power technology, resulting in benefits for IDT customers and shareholders."

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that it will be presenting on the NVM Express (NVMe) specification as well as exhibiting its latest enterprise flash controller products in booth #707 at the Flash Memory Summit, held in Santa Clara, CA on August 21-23.

Peter Onufryk, director of engineering in the Enterprise Computing Division at IDT, will present "How the Streamlined Architecture of NVM Express Enables High Performance PCIe SSDs." The presentation will provide an overview of NVM Express along with a detailed outline of the specification's performance features.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions today announced the expiration of the "go-shop" period pursuant to the terms of the previously announced merger agreement with PLX Technology, Inc. ("PLX"), dated April 30, 2012, which contemplates the exchange offer for all outstanding shares of PLX common stock, followed by a second step merger.

Pursuant to the "go-shop" provisions of the merger agreement, PLX and its representatives were permitted to actively solicit alternative acquisition proposals for a period of 30 calendar days, which expired at 11:59 p.m. California time on May 30, 2012, and to continue negotiations with certain qualifying "excluded parties" for up to an additional 15 days thereafter. On May 31, 2012, PLX confirmed that it did not receive any superior acquisition proposals during the "go shop" period and that no qualifying "excluded party" would be permitted to engage in any subsequent negotiations.

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, and PLX Technology, Inc., today announced that they have signed a definitive agreement pursuant to which IDT will acquire PLX. Under the terms of the agreement, unanimously approved by the boards of directors of both companies, IDT will acquire all of the outstanding shares of PLX common stock pursuant to an exchange offer, followed by a second step merger. In the acquisition, PLX stockholders will receive $3.50 in cash and 0.525 shares of IDT common stock for each PLX common share outstanding. Based on IDT's closing stock price on April 27, 2012, the transaction is valued at approximately $7.00 per PLX share and results in a total transaction value of approximately $330 million.

"The proposed acquisition of PLX Technology represents an exciting expansion of IDT's core serial switching and interface business," said Ted Tewksbury, president and CEO at IDT. "Our two companies have complementary product sets, technologies and customer bases, and we share a focus on delivering the highest-performance system-level interconnect solutions for data centers and other applications. IDT and its shareholders will benefit from the top-line contribution of our enhanced product portfolio as well as the increased profitability provided through the added scale and expanded operating margin. This transaction is aligned with our long-term strategy of expanding our core businesses through organic growth and acquisitions."

Integrated Device Technology, Inc. (IDT), the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced a new family of precision temperature sensors targeted at ultra-low-power solid state drive applications. This new family of devices minimizes power consumption and optimizes bill-of-materials (BOM) costs while maintaining compatibility with existing standards for high-volume memory modules.

The IDT TS3000GB0A0 is a low-power, high-accuracy temperature sensor for enterprise server and storage applications. It supports a 1.8 V power supply for reduced power consumption and compatibility with the existing supply voltage for SSD memory modules, eliminating the need for additional voltage regulators.

Here are the first pictures of Galaxy's GeForce GTX 550 Ti Display4 graphics card, designed exclusively for Asian markets. As its name might suggest, it is a GeForce GTX 550 Ti based graphics card designed to support up to four displays. The card uses an IDT VMM 1403 display output logic chip that lets it effectively make use of the total resolution the GPU supports. The redesigned display logic supports a total resolution of 5760 x 1080. Spread across four displays, you get 1440 x 1080 per display, or spread it across three displays to get 1920 x 1080 per display. Apart from four DVI connectors, its output logic makes room for a mini-HDMI connector.

The GeForce GTX 550 Ti is aided by 1 GB of GDDR5 memory across a 192-bit wide memory interface. It is powered by a 3+1 phase VRM controlled by Galaxy's in-house G-Engine chip. The GTX 550 Ti packs 192 CUDA cores, and clock speeds of 950 MHz core, 1900 MHz CUDA cores, and 1025 MHz (4.10 GHz effective) GDDR5 memory. Galaxy also used its in-house "Glaciator" cooler, which makes use of a heat-pipe fed heatsink ventilated by a large central fan. This can can be partially detached to help clean it, and the portion of the heatsink directly underneath it. Galaxy's GTX 550 Ti Display4 is priced at RMB 999 (converts to US $157).

Galaxy has been working its way around NVIDIA's 4 TMDS/2 display limitation for a while now. In April, the first pictures of two cards emerged, that used multi-monitor controllers made by IDT to multiply the number of displays a single-GPU card can handle. Here's the fruition. Galaxy displayed the GeForce 210 MDT X4 and GeForce GTX 560 Ti MDT X5, the former can drive four displays, and the latter five. Galaxy is using the IDT VMM1400, a chipset commonly found on multi-monitor hub devices. It allows the graphics card MDT graphics cards to give out multiple full-HD (1920 x 1080) display heads. The GeForce 210 MDT X4 gives out four DVI connectors, while the 560 Ti MDT X5 provides four mini HDMI and one each of DisplayPort and DVI.

Multi-display has huge benefits for productivity, gamers are only beginning to see them, but are restricted to higher-end graphics cards to get playable frame-rates. Prior to consumer multi-display ready graphics cards after ATI/AMD Eyefinity and NVIDIA 3DVision Surround, multi-display (>2 displays per graphics card) was restricted to the professional graphics market, where GPU vendors made a killing selling expensive graphics cards that handled over 2 display heads with just about enough graphics processing power to handle Windows Aero UI. One of NVIDIA's biggest AIC partners, Galaxy, took it upon itself to make GeForce-based multi-display graphics cards that make multi-display a lot more affordable. Currently, affordable multi-display graphics card market is dominated by AMD Radeon, where even the entry-level $50-something HD 6450 can handle 3 displays, while the $90-something HD 6670 handles 4.

Galaxy designed two new such GeForce-based graphics cards, the first is an entry-level card based on GeForce 210, which is single-slot, full-height, and silent. It uses two IDT VMM1402 chips to handle up to four full-HD (1920 x 1080) displays using four DVI connectors. The card has two DMS-59 connectors, there are two cables provided, which convert each DMS-59 to two DVI connectors.

IDT (Integrated Device Technology,) a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience and Micron Technology, Inc., one of the world's leading providers of advanced semiconductor solutions, today announced they have entered into an alliance to develop PCI Express Solid-State Drive (SSD) technologies for the server, storage and embedded markets.

As part of this alliance, IDT and Micron will co-develop enterprise flash controllers with a PCIe host interface optimized for Micron's flash devices and future generation RealSSD solid-state drives. Combining Micron's extensive experience in flash design and SSD development with IDT's proficiency in PCIe solutions and memory interface products will enable devices to achieve lower latency, greater performance and new levels of storage integration.