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Intel Announces Intent to Take Mobileye Public

With the full support of Intel's board of directors, Intel today announced its intention to take Mobileye public in the United States in mid-2022 via an initial public offering (IPO) of newly issued Mobileye stock. The move will unlock the value of Mobileye for Intel shareholders by creating a separate publicly traded company and will build on Mobileye's successful track record and serve its expanded market.

Intel will remain the majority owner of Mobileye, and the two companies will continue as strategic partners, collaborating on projects as they pursue the growth of computing in the automotive sector. The share of semiconductors is expected to be 20% of a premium vehicle's total bill-of-materials (BOM) by 20301. The Mobileye executive team will remain, with Prof. Amnon Shashua continuing as the company's CEO. Recently acquired Moovit as well as Intel teams working on lidar and radar development and other Mobileye projects will be aligned as part of Mobileye.

Intel Reports Third-Quarter 2021 Financial Results

Intel Corporation today reported third-quarter 2021 financial results. "Q3 shone an even greater spotlight on the global demand for semiconductors, where Intel has the unique breadth and scale to lead. Our focus on execution continued as we started delivering on our IDM 2.0 commitments. We broke ground on new fabs, shared our accelerated path to regain process performance leadership, and unveiled our most dramatic architectural innovations in a decade. We also announced major customer wins across every part of our business," said Pat Gelsinger, Intel CEO. "We are still in the early stages of our journey, but I see the enormous opportunity ahead, and I couldn't be prouder of the progress we are making towards that opportunity."

In the third quarter, the company generated $9.9 billion in cash from operations and paid dividends of $1.4 billion. Intel CFO George Davis announced plans to retire from Intel in May 2022. He will continue to serve in his current role while Intel conducts a search for a new CFO and until his successor is appointed. Third-quarter revenue was led by strong recovery in the Enterprise portion of DCG and in IOTG, which saw higher demand amid recovery from the economic impacts of COVID-19. The Client Computing Group (CCG) was down due to lower notebook volumes due to industry-wide component shortages, and on lower adjacent revenue, partially offset by higher average selling prices (ASPs) and strength in desktop.

Intel Wins US Government Project to Develop Leading-Edge Foundry Ecosystem

The U.S. Department of Defense, through the NSTXL consortium-based S2MARTS OTA, has awarded Intel an agreement to provide commercial foundry services in the first phase of its multi-phase Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. The RAMP-C program was created to facilitate the use of a U.S.-based commercial semiconductor foundry ecosystem to fabricate the assured leading-edge custom and integrated circuits and commercial products required for critical Department of Defense systems. Intel Foundry Services, Intel's dedicated foundry business launched this year, will lead the work.

"One of the most profound lessons of the past year is the strategic importance of semiconductors, and the value to the United States of having a strong domestic semiconductor industry. Intel is the sole American company both designing and manufacturing logic semiconductors at the leading edge of technology. When we launched Intel Foundry Services earlier this year, we were excited to have the opportunity to make our capabilities available to a wider range of partners, including in the U.S. government, and it is great to see that potential being fulfilled through programs like RAMP-C." -Pat Gelsinger, Intel CEO.

TSMC Looking to Build a Fab in Germany

TSMC, as part of its strategy to build cutting-edge semiconductor foundries in the US and EU, is looking to build a ground-up fab in Germany. The company's chairman, Mark Liu, made an announcement to this effect in the company's annual general meeting (AGM), addressing shareholders, held on July 26. This move is still in its "early stages," according to a DigiTimes report, with the company prospecting a suitable site across the country. The size and scale of TSMC's investment remains under the wraps.

TSMC's expedition to Germany aligns with an ambitious plan by the European Commission to make the EU a net-exporter of semiconductors and electronics by 2030. TSMC will have Intel Foundry Services for company in Germany, as an acquisition of Global Foundries would put Intel in control of its real-estate in Dresden. Intel is still prospecting the EU for a suitable place to invest €20 billion, besides ongoing investments in states such as the Republic of Ireland.

Intel Accelerates Packaging and Process Innovations

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

Intel to Enter Third-Party Foundry Business, Set Up $20 Billion Fabs in Arizona

Intel will formally enter the third-party semiconductor foundry business under the Intel Foundry Services (IFS) brand, announced CEO Pat Gelsinger, on Tuesday. This entity would operate under a business model not unlike that of TSMC, with its latest foundry technologies available to third-party customers, besides Intel. The company hopes to become a major foundry service provider to U.S. and E.U. customers, particularly enterprise and government contractors that need secure semiconductor manufacturing on U.S. soil.

To this effect, Gelsinger announced that the company will invest $20 billion in the state of Arizona, to set up two semiconductor foundries. Intel could have an edge over other foundry companies as its foundry service portfolio includes Intel technologies as IP blocks. IFS will be led by semiconductor industry veteran Dr. Randhir Thakur, who will report directly to Pat Gelsinger. The $20 billion investment in Arizona, according to Intel, will generate over 3,000 high-skilled jobs, over 3,000 construction jobs, and approximately 15,000 local long-term jobs.
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