Citing issues with the 22 nm manufacturing process, Intel postponed the release of its 22 nm "Ivy Bridge" Core processor family by as much as 10 weeks. There still seems to exist some confusion surrounding this launch, which SweClockers sought to clear with its latest article containing important dates related to the launch.

• 8 April, 2012: This was supposed to be the day "everything" (all CPU models slated for April, compatible motherboards) launched. Instead on this day, motherboard vendors will launch their products based on Intel Z77, Z75, H77, and B75 chipsets. System builders (you) will have to use existing "Sandy Bridge" processors, which are very much compatible with those motherboards. You will not be able to buy "Ivy Bridge" processors from anywhere on this day.
• 29 April, 2012: This is when Intel will launch quad-core Core i5, Core i7 "Ivy Bridge". On this day, the media will be able to post reviews of the new processor platform. It's not clear if you'll be able to buy these chips on this day, either. Perhaps you might.

Continued

In mid-February, it was reported that Intel was delaying availability of its upcoming "Ivy Bridge" Core processor family, at least to Notebook ODMs, to June, in a bid to help digestion of inventories of current-generation "Sandy Bridge" Core processors. Intel confirmed this delay. The company expects its next-generation chips to go on sale eight to 10 weeks later than initially planned, according to Sean Maloney, executive vice-president of Intel and chairman of Intel China. Maloney told Financial Times that sales of machines (notebooks, pre-built desktops) have been pushed back from April to June. "I think maybe it's June now," he said. More interestingly, Maloney shifted the blame for this delay from inventory-adjustments to the 22 nm fab process.

Regardless of whether you'll be able to get an "Ivy Bridge" Core processor till the second week of April, motherboards that are compatible with it out of the box, based on Intel's Z77 chipset (successor to Z68), will start selling in early-April. Sources told OCWorkbench that most motherboard vendors have in fact begun shipping orders to their distributors, while some are waiting for the green light. Motherboards based on the Z77 chipset feature LGA1155 CPU socket, are compatible with today's "Sandy Bridge" Core i3, Core i5, and Core i7 processors; and tomorrow's "Ivy Bridge" ones, out of the box. The new chipset offers features such as some native USB 3.0 ports, and support for certain Ivy Bridge-exclusive features, beyond which they're functionally identical to 6-series. Enthusiasts might not find the need to upgrade their motherboards to use Ivy Bridge, if their current motherboards have BIOS updates that let them support the new processors.

Intel was reportedly planning to limit mass-shipments of its third-generation Core processors (codenamed: "Ivy Bridge") to notebook ODMs, to help in digestion of swelling inventories of current-generation "Sandy Bridge" Core processors. Only a few models (those targeting Ultrabooks and mainstream notebooks) are expected to face delays till June, performance desktop retail processors will most likely not be affected, their launch is on-course for April.

To make up for the delay, Intel will might lower prices of its Ivy Bridge chips by as much as $70 a piece. The lower prices would ease transition between the two generations of processors without causing a price-shock to ODMs, when they then have to transfer to the end-users. Intel already attractive pricing for its Sandy Bridge CPUs to help clear inventories. The result of all this would be Ivy Bridge-powered notebooks being not much more expensive than current-generation Sandy Bridge-powered ones, on launch.

Hiroshige Goto, contributor for PC Watch that is known for detailed schematics of dies estimated the layout of Ivy Bridge silicon. Ivy Bridge is Intel's brand new multi-core processor silicon built on its new 22 nanometer silicon fabrication process. The four core silicon, which four configurations can be carved, will be built into packages that are pin-compatible with today's Sandy Bridge processors. The die area of Ivy Bridge is 160 mm², it has a total transistor count of 1.48 billion, compared to the Sandy Bridge silicon, which has 1.16 billion transistors crammed into a die 216 mm² in area, built on the 32 nm process.

Ivy Bridge has essentially the same layout as Sandy Bridge. The central portion of the die has four x86-64 cores with 256 KB dedicated L2 cache each, and a shared 8 MB L3 cache, while either sides of the central portion has the system agent and the graphics core. All components are bound by a ring-bus, that transports tagged data between the four CPU cores, the graphics core, the L3 cache, and the system agent, which has interfaces for the dual-channel DDR3 integrated memory controller, the PCI-Express controller, and the DMI chipset bus.

An Expreview community member ran benchmarks comparing the performance of the Intel HD 4000 graphics embedded into its upcoming 22 nm "Ivy Bridge" Core i5-3570K, comparing it to the integrated graphics of Core i5-2500K, and discrete graphics NVIDIA GeForce GT 240. These tests are endorsed by the site. The suite of benchmarks included games that aren't quite known to be very taxing on graphics hardware by today's standards, yet are extremely popular; games such as StarCraft II, Left4Dead 2, DiRT 3, Street Fighter IV. Some of the slightly more graphics-intensive benchmarks included Far Cry 2 and 3DMark Vantage. All benchmarks were run at 1280 x 720 resolution.

The Intel HD 4000 graphics core beats the HD 3000 hands down, with performance leads as high as 122% in a particular test. The chip produces more than playable frame-rates with Left4Dead 2 and Street Fighter IV, both well above 50 FPS, even DiRT 3 and Far Cry 2 run strictly OK, over 30 FPS. StarCraft II is where it produced under 30 FPS, so the chip might get bogged down in intense battles. A mainstream discrete GeForce or Radeon is a must. On average, the graphics core embedded into the Core i5-3570K was found to be 67.25% faster than the one on the Core i5-2500K.

Chinese motherboard manufacturer that specializes in high cost-performance motherboard, ONDA, is working on a micro-ATX motherboard based on the Z77 chipset. Its pictures made it to the press. The board mostly sticks to the chipset's feature set, except using an additional PCIe-PCI bridge that gives out two legacy PCI slots. As a Z77-based motherboard, it should support both overclocking and Smart Response SSD caching. The LGA1155 socket, which supports today's Sandy Bridge and tomorrow's Ivy Bridge processors, is powered by a simple 4+1 phase VRM. It is wired to four DDR3 DIMM slots, supporting dual-channel DDR3 memory.

All of the chipset's SATA ports are wired internally, including two SATA 6 Gb/s and four SATA 3 Gb/s. The board provides four USB 3.0 ports, two on the rear panel, two via header, all four are wired to the PCH. Apart from the two legacy PCI slots, we have one PCI-Express 3.0 x16 and one PCIe 2.0 x1. Display outputs include DVI, D-Sub, and HDMI. 6-channel HD audio and gigabit Ethernet make for the rest of the connectivity.

In what could come as a disappointment to some, Intel has reportedly put off mass-shipments of its third-generation Core processors (codenamed "Ivy Bridge") to June. The company, however, will go ahead with its April launch schedule, and will issue small shipments of these chips. This information comes from sources among notebook manufacturers.

This delay, however, doesn't appear to be linked to Intel's ability to ship the new 22 nm chips. Sources say that most notebooks vendors are having a very hard time digesting inventories of current-generation "Sandy Bridge" Core processors, and so the delay is merely to help them ship the last of their notebooks running current-generation chips, and to minimize the impact of the onset of new chips. Notebook vendors are currently seeing lukewarm demand.

AMD's Radeon HD 7800 series performance GPUs that target cost-benefit sweet-spots will be launched in the first half of March. The launch will include Radeon HD 7870 and Radeon HD 7850. The two SKUs are based on a new 28 nm ASIC codenamed "Pitcairn". Little is known about its specifications at this point, from reliable sources at least.

In April, AMD's rival NVIDIA will get its GeForce Kepler family of GPUs, all guns blazing. In April alone, NVIDIA is expected to launch a high-end part, the GeForce GTX 690, a performance part, the GeForce GTX 660, and mainstream part GeForce GTX 640. The three will be based on three new ASICs built on the 28 nm process, the GK110, GK104, and GK106, respectively.

April will be the most interesting month for PC enthusiasts as Intel will launch its third-generation Core processor family, codename "Ivy Bridge". Little is known about AMD's high-end Radeon HD 7990 "New Zealand".

Details of desktop Core i7 and Core i5 "Ivy Bridge" processors in the LGA1155 package have been detailed at lengths, in the past. Core i3 parts based on the same 22 nm Ivy Bridge silicon, however, were relatively known. Tables listing out updated information about the lineup points out that Intel has as many as five Core i3 "Ivy Bridge" desktop processors in the works, all dual-core, and among which two are low-power parts.

The table also suggests that these Core i3 chips will have reduced features, importantly, the lack of PCI-Express 3.0 bus. When connected to these chips, PCI-E 3.0 add-on cards (such as graphics cards) will function in PCI-Express 2.0 mode. Further, these chips will lack support for AES-NI (accelerates encryption), VT-d (enhanced virtualization), and TXT (security). Certain models in the lineup have faster integrated graphics, denoted by a "5" in the end of the model number. These chips also lack Turbo Boost for the x86 cores, but feature HyperThreading.

A little earlier this month, it was reported that major notebook vendors are planning price-cuts of their current-generation Ultrabooks, to clear inventories and pave the way for next-generation Ivy Bridge-based ones that stick to a more well-defined specification; the price-cuts previously mentioned were in the range of 20-25%. The range is looking more like 20-30% according to the latest DigiTimes report.

Major notebook vendors seem to be in a hurry to make the market digest inventories of current-generation Ultrabooks that are based on anything from ULV "Sandy Bridge" Core processors, to low-power Celeron and Pentium chips, some even AMD Brazos. In addition to Ultrabooks, conventional notebooks based on Sandy Bridge Core processors, and client desktops also stand to face price-cuts.

BIOSTAR, the world's famous manufacturer of mainboards, graphics cards, industrial computing systems and computer peripherals, proudly announces the BIOSTAR TZ77XE4 motherboards within the CeBIT 2012. The most frequent word combination in description of the new flagship lineup will be "for the first time" because the TZ77XE4 boards house a great deal of innovative technologies not found even in premium desktop solutions.

The TZ77XE4 boards are based on the latest Intel Z77 chipset, which for the first time incorporates tri-gate transistors manufactured using the 22-nm fab process which, for the first time, delivers a native support for the high-speed USB 3.0 interface and fast SSD caching with the Intel Smart Response Technology (SRT). Fully compatible with the second-generation Intel Core CPUs (Sandy Bridge), the new boards for the first time support the third generation Intel Core CPUs codenamed Ivy Bridge, also manufactured with the 3D-transistors using the 22-nm fab process and designed for the popular LGA 1155 socket.

Some time in 2013, Intel will launch its new processor architecture, codenamed "Haswell", which will go on to succeed "Ivy Bridge". More than an year away from its market entry, Haswell has already been exhaustively documented, but not many got into the details about its embedded graphics processor. That is, until now. A new internal slide sourced by DonanimHaber details the integrated GPU (iGPU), it appears like Intel has solid plans for home users.

To begin with, Haswell's iGPU will be DirectX 11.1 compliant, which means it will take advantage of API optimizations that improve performance, for typical desktop usage scenarios. Apart from support for a new DirectCompute architecture, it will also support OpenCL 1.2, which speeds up certain GPGPU-optimized applications. More importantly, the iGPU will be designed around a new stereoscopic 3D standard called Auto-Stereoscopic 3D (AS3D), which will take the likes of Blu-ray 3D acceleration, stereo 3D photos, etc., to the masses. Currently, it takes at least an entry-level GeForce or Radeon GPU to for acceptable performance with stereo 3D.

Once Company of The Year by Forbes, NVIDIA is now having a hard time convincing 111-year old investment firm Sterne Agee that it is as much of a company to look out for. The firm downgraded NVIDIA from its coveted "Catalyst Driven Idea List," claiming that NVIDIA lacks the kind of innovation looking into the foreseeable future, to remain in that list. Says Sterne Agee:

"We had put NVDA on our Catalyst Driven Idea list on January 3 ahead of anticipated catalysts at CES and Mobile World Congress (MWC). While there were some catalysts at CES with the quad-core Tegra 3 integrating Touch on its Ninja 5th core, CES also saw a Win8 Tablet prototype running an NVDA Tegra. While we believe there could be more catalysts with MWC February 27, we believe NVDA shares are fairly valued here. MWC catalysts could include Tegra 3 handsets with Icera baseband and some 7-10 tablets running Android Ice Cream Sandwich.

Sterne Agee's commentary continues.

As Intel's tick-tock CPU development Juggernaut rolls on, things seem very much on track, looking into the near future. Intel will launch its new "Ivy Bridge" 3rd Generation Core processor family in early-April 2012, which is a miniaturization of what is essentially the "Sandy Bridge" to the new 22 nm process, with IPC and instruction-set improvements, along with a faster graphics controller. The new process will also up clock speeds and overclocking headroom for chips that support it. What's more interesting, though, is that the architecture that succeeds Ivy Bridge, codenamed "Haswell", will be less than an year away in April...well almost.

A roadmap slide sourced by DonanimHaber pins the launch of Haswell to March-June, 2013. Haswell is a brand new CPU architecture that will succeed Ivy Bridge. According to the conventional idea of Intel's tick-tock CPU development strategy, it will be built on the 22 nm fab process, which will have gained some maturity by then. Intel follows a "tick-tock" product development model. Every year, Intel's product lineup sees either of the two. A "tock" brings in a new x86 architecture, a "tick" miniaturizes it to a newer silicon fabrication process. Earlier reports indicated that Haswell Core processors will be based on a newer socket, the LGA1150, and hence it will not be compatible with LGA1155 platforms.

Although the current generation of "Ultrabooks" don't really conform to a rigid specification apart from being really slim, unlike the next-generation Ivy Bridge-based ones which will have to conform to a specification laid down by Intel, the name "Ultrabooks" (short for ultra-portable/slim notebooks) has stuck. With Intel's newest processing platform just a couple of months away, notebooks manufacturers are reportedly lowering prices of current-generation Ultrabooks.

The move to lower prices of Ultrabooks is simply to clear inventories and pave the way for the next-generation. The prices will be cut significantly. Acer's Ultrabook S3 already saw its price drop to US $799 from $999; while HP's Ultrabooks will see prices cut by as much as 25 percent. Price of Lenovo's Ultrabook will go down by up to 21 percent. In short, every $999-ish Ultrabook will see its price go down to $749-799.

Here are the first pictures of MSI's Z77A-GD55 motherboard. The GD55 is a notch below the GD65 in terms of its feature-set, and will likely hold a cost-benefit sweetspot. The motherboard is designed to support today's "Sandy Bridge", and tomorrow's "Ivy Bridge" Core processors in the LGA1155 package, and is based on Intel's Z77 "Panther Point" chipset. The CPU is powered by a lighter 9-phase VRM compared to the 12-phase VRM on the GD65. It retains the expansion slot layout of its elder brother, consisting of two PCI-Express 3.0 x16 (x16/NC or x8/x8), four PCIe x1, and one PCIe 2.0 x4 (physical x16).

The Z77A-GD55 has two fewer SATA 6 Gb/s ports compared to the GD65, all its internal ports are wired to the PCH. That's two SATA 6 Gb/s and four SATA 3 Gb/s. There are no eSATA ports. Further, there are no third-party USB 3.0 controllers, either. All four of the USB 3.0 ports (two on the rear panel, two via front-panel header) are wired to the PCH. Display connectivity includes DVI, D-Sub, and HDMI. 8-channel HD audio with optical and coaxial SPDIF outputs, and gigabit Ethernet make for the rest of its connectivity.

In a footnote of a slide detailing AMD's Trinity A6 APU for Ultrathin notebooks at the company's Financial Analyst Day event, the new chip's 3DMark performance was revealed. The company was talking about the 17W ULV (ultra-low voltage) variant of the "Trinity" APU in the slide, that's designed for compact notebooks. The 3DMark Vantage performance of the APU was measured to be 2,355 points, in the same test, an Intel Core i5-2537M ULV 17W "Sandy Bridge" processor scored 1,158 points. The AMD chip, hence, emerged with a 103% graphics performance lead.

The slide notes that with an assumed performance increase of 30% by the upcoming "Ivy Bridge" architecture, its 3DMark performance is projected to be 1,505 points. The 17W Trinity chip would still end up with a 56% performance lead. Moving on, AMD even revealed the performance of the high-performance A10 "Trinity" APU with 25W TDP, designed for slightly thicker notebooks. This chip scored 3,600 points in 3DMark, which would effectively make it 136% faster than Ivy Bridge at graphics.

Still not officially announced by Dell, the Alienware-branded M18x R2 gaming laptop is rumored to come with some fresh and powerful graphics options from both NVIDIA and AMD. The Santa Clara team (NVIDIA) is said to be supplying two cards for the M18x R2 - the GeForce GTX 660M and GTX 675M (the latter will be available in a SLI configuration), while the Sunnyvale squad (AMD) will deliver the Radeon HD 7970M, in a CrossFireX setup.

Beside the GPU goodies mentioned, the M18x R2 (18.4-inch) laptop is expected to feature an Intel Ivy Bridge CPU, black and red color choices, an optional Wireless HD card, and more. Stay tuned (and save up?).

The Ivy Bridge LGA1155 processors inbound for April are mom and pop PC chips in front of the monstrosities Intel has planned for the enterprise (and possibly high-end desktop/HEDT) markets, based on the architecture. An 10-core Ivy Bridge-EP engineering sample, made it to the right hands in Taiwan (wrong hands for Intel), that wasted no time in putting them through some tests.

The 10-core Ivy Bridge-EP/EX chip (LGA2011, 2P-capable) features 10 next-generation cores clocked at 2.80 GHz, with 256 KB L2 cache per core, 30 MB shared L3 cache, and HyperThreading technology that enables 20 logical CPUs. This chip crunched WPrime 1024M in 158.5 seconds, and scores 41.78X relative speed in Fritz chess when just 8 of its 20 threads are put to use. You can also find some pretty screen shots of CPU-Z with its long processor selection list and Windows 8 task manager.

According to dell-lab.posterous.com (a site known for accurate tips on future Dell products), a trio of updated Alienware laptops are currently in plan, the M14x R2 (14-inch), M17x R4 (17.3-inch) and M18x R2 (18.4-inch).

There's not much info on the M18x R2 except for the fact that it will be available in both red and black, while the M14x R2 is said to come with the same colors and have 1 GB and 2 GB graphics options.

The M17x R4 is claimed to feature at least three new GPU choices, including the yet-unannounced AMD Radeon HD 7970M, Nvidia GeForce GTX 660M and GTX 675M. All three laptops should also adopt Intel's upcoming 22 nm processors (Ivy Bridge). No word on when they'll be released.

While its processor-integrated graphics solutions may not be a match for those from NVIDIA and AMD in terms of client applications such as gaming, Intel thinks it has a shot at the entry-level workstation graphics segment, dominated by the likes of NVIDIA Quadro FX 580 and AMD FirePro V3800 series. Workstation GPUs differ from consumer ones as they are accompanied by more API features, are certified by professional 3D modelling software, and are designed to minimize rendering errors since these renders go on to take shape as millions of dollars worth skyscrapers, for example.

Intel thinks that after the performance success of SNA, it has achieved an acceptable level of performance with its integrated graphics design to take it professional. It is doing so by creating workstation-variants of the "Sandy Bridge" and future "Ivy Bridge" silicons in the Xeon E3-1200 series, and giving their integrated graphics increased functionality. The result is a variant of Intel's HD graphics 3000 series, called Intel HD Graphics P3000 series (P denoting professional). Intel is applying for certification by 3D modeling software developers (it's important, because engineers look for these certifications before picking their hardware). The status of its certification with various vendors is detailed in the first slide below.

Making silicon chips is not easy, requiring hugely expensive fabs, with massive clean-room environments and at every process shrink, the complexity and difficulty of making the things goes up significantly. It looks like TSMC and GlobalFoundries are both having serious yield problems with their 28 nm process nodes, according to Mike Bryant, technology analyst at Future Horizons and this is causing a rash of non-working wafers - to the point of having nothing working with some chip designs submitted for production. It seems that the root cause of these problems are to do with the pressures of bringing products to market, rather than an inherent problem with the technology; it just takes time that they haven't got to iron out the kinks and they're getting stuck: "Foundries have come under pressure to release cell libraries too early - which end up with designs that don't work," Bryant said. In an effort to try and be seen to treat every customer equally, TSMC is attempting to launch ten 28 nm designs from seven companies, but it's not working out too well: "At 45-nm, only NVIDIA was affected. At 28-nm any problems for TSMC will be problems for many customers" said Bryant.

While many might think that "Ultrabook" is a generic term for a new performance ultra-portable notebook form-factor, it is a registered trademark of Intel, which governs the specifications of what qualifies to be an Ultrabook. Intel will launch a well-defined Ultrabook platform based on its third-generation Core processor family, codenamed "Ivy Bridge", later this year. Meanwhile, AMD is finalizing a performance ultra-portable specification of its own, powered by its next-generation "Trinity" accelerated processing units (APUs), which it will call "Ultrathin".

Ultrathin will be designed to offer competitive CPU performance to Ultrabook, and superior GPU performance to it, at target prices 10-20 percent lower than Ultrabook. In 2012, while Intel bagged about 75 design wins for its Ultrabook platform, AMD claims to have already won 20. AMD's Ultrathin platform will have advantages over Intel's Ultrabook with regards to platform and component costs. The average AMD Ultrathin with $100~$200 cheaper than the average Intel Ultrabook. Some notebook vendors are concerned that a competitive platform to Intel Ultrabook could result in a price-war between the two platforms, and end up reducing the prices of the now profitable-looking performance ultraportable segment.

ZOTAC also displayed an upcoming socket LGA1155 motherboard based on Intel Z77 chipset, in the mini-ITX form-factor, which is geared for overclocking, that's right, overclocking. ZOTAC has, in the past, designed a similar motherboard based on the Z68 chipset. This mini-ITX board draws power from 24-pin ATX and 8-pin EPS connectors, it supports upcoming "Ivy Bridge" Unlocked LGA1155 Core processors out of the box.

The LGA1155 socket (LOTES Black, powder-coated to prevent shrinking when subjected to subzero cooling), is powered by an 8-phase VRM circuitry, complete with a feature-rich controller, Pulse-made inductors, and driverMOSFETs (DrMOS), and High-C capacitors. The DrMOS chips are cooled by a high-density heatsink that shares some of its heat with the heatsink over the Z77 PCH, over a heat pipe.