As a follow-up to our older article on how December-January will play out for AMD's next-generation APU lineup, we have news that the company will unveil, or at least tease its next-generation desktop APU, codename "Kaveri," on November 11, 2013. It's when the company will host its APU'13 event, modeled along the lines of GPU'13, held in Hawaii this September, where it unveiled its Radeon R9 200 and R7 200 GPU families. On its backdrop, the company will also hold its 2013 AMD Developer Summit, which brings together developers making software that take advantage of both CPU and OpenCL-accelerated GPUs. APU'13 will be held in San Jose, USA, and like GPU'13, will be live-streamed to the web. In addition to new APUs, the company is expected to make some big announcements with its HSA (heterogeneous system architecture) initiative that brought some big names in the industry on board.The agenda for APU'13 follows.

A leaked AMD slide detailed key dates in the product launch cycle for the company's next-generation desktop APU, codenamed "Kaveri." The chip will be officially announced on December 5, 2013. This is when AMD will post press-releases about the chip, but lack of market availability will make it more of a soft-launch. The chips should begin to ship to OEM vendors by late-December, 2013. It won't be until mid-February, 2014, that you'll be able to buy one of these chips in the retail channel. Built in the new socket FM2+ package, supporting the company's new A88X chipset, "Kaveri" will feature CPU cores based on the next-generation "Steamroller" micro-architecture, which offers an incremental (conservatively, around 10 percent) performance upgrade over "Piledriver;" a new GPU based on the Graphics CoreNext micro-architecture, TrueAudio technology, support for faster DDR3 memory standards, and PCI-Express gen 3.0 bus interface.

MSI is pleased to announce the new A88X-G43 motherboard featuring the new AMD A88X chipset and FM2+ socket for all current FM2 Trinity and Richland APUs and AMD's upcoming 4th generation APUs for FM2+ codenamed Kaveri. AMD APUs are known for their excellent gaming and multi-media experience and support a wide range of display solutions. The MSI A88X-G43 has support for 3+1 screen Eyefinity and thanks to the HDMI 1.4 connector; it supports 4K resolutions (3840x2160) which provides much crisper images and life-like images on the biggest monitors currently available.

Striving to provide consumers with the highest quality and most stable products, MSI utilizes its new Military Class 4 components for the all new MSI FM2+ series. These key components have all been certified to seven MIL-STD-810G tests to ensure stable operation under the harshest conditions.

ASRock unveiled its first socket FM2+ motherboards, ready for the upcoming A-Series "Kaveri" APUs, and backwards-compatible with A-Series "Richland" and "Trinity" ones. Among the most notable of ASRock's FM2+ products are the FM2A88X-Extreme6+ and the FM2A88M-Extreme4+. The former is a feature-rich ATX form-factor offering, while the latter isn't too far behind with its feature-set, albeit in the micro-ATX form-factor. The FM2A88X-Extreme6+ features a 10-phase VRM to power the APU socket, which is wired to four DDR3 DIMM slots, and two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). A third PCI-Express x16 is electrical gen 2.0 x4, and wired to the A88X FCH. Two each of PCI-Express 2.0 x1, and legacy PCI make for the rest of the expansion.

Storage connectivity on the FM2A88X-Extreme6+ includes seven SATA 6 Gb/s ports, and one eSATA 6 Gb/s. Display connectivity includes dual-link DVI, DisplayPort 1.2, and possibly HDMI 2.0. 8-channel HD audio with optical SPDIF output, gigabit Ethernet, and six USB 3.0 ports. Moving on, the FM2A88M-Extreme4+ features a simpler 6-phase VRM for the APU socket, which is wired to four DDR3 DIMM slots, and a single PCI-Express 3.0 x16. The other long slot is electrical gen 2.0 x4. One each of PCI-Express 2.0 x1 and legacy PCI make for the rest of its expansion. Display connectivity includes dual-link DVI, D-Sub, and HDMI (2.0?). Four USB 3.0 ports, 8-channel HD audio, and gigabit Ethernet make for the rest of it.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced its new FM2+ motherboard lineup supporting the forthcoming 'Keveri' AMD APUs with support for existing socket FM2 Trinity and Richland APUs.

GIGABYTE A88X motherboards feature a number of features and technologies and also include the first AMD G1-Killer gaming motherboard, the G1.Sniper A88X which includes GIGABYTE AMP-Up Audio, a range of advanced audio technologies that are designed to give audio enthusiasts and PC gamers more control over their motherboard audio than ever before. GIGABYTE A88X series motherboards also offer unique GIGABYTE features, including UEFI DualBIOS, Digital Power delivery, as well Triple Display support.

AMD confirmed that its next-generation socket FM2+ APUs, codenamed "Kaveri," will begin shipping in Q4-2013, and will be available "very early" in Q1-2014, in the retail (desktop component) channel. Mobile variants of the chip will be available a little later in the same quarter. AMD also described the stuff that "Kaveri" APUs will be made of - four x86-64 cores based on the "Steamroller" micro-architecture, major heterogeneous computing enhancements, a newer integrated graphics processor based on the and "Graphics CoreNext" micro-architecture.

ASUS today announced the new A88XM-A and A55BM-A/USB3 motherboards, the first from any manufacturer to support new Socket FM2+ APUs (Accelerated Processing Units) from AMD. The A88XM-A with AMD A88X chipset and A55BM-A/USB3 with A55 chipset are both Micro-ATX motherboards for existing AMD 'Richland' and 'Trinity' FM2 APUs, and are hardware-ready for upcoming AMD 'Kaveri' FM2+ APUs that support DirectX 11.1 and PCI Express 3.0 natively. ASUS is committed to supporting the latest in PC technology. The new FM2+ motherboards offer customers the very latest in motherboard design, with the added flexibility of both backward and forward compatibility with AMD APUs.

Even though AMD's next-generation Kaveri APU, based on the Steamroller x86 CPU, GCN (Graphics Core Next) GPU, and HUMA memory architecture might not arrive until late in 1H of 2014, its successor is already named and being worked on by AMD. Carizo, successor to Kaveri, will arrive sometime in 2015, we are betting before the end of 1H 2015, and will feature further improvements in AMD's big APU push.

While nothing is confirmed, Carizo most probably packs AMD's next-in-line Excavator CPU core and perhaps an improved GCN based GPU core. Memory architecture will undoubtedly feature further improvements, in line with AMD's big push for heterogeneous computing and unified memory.

AMD's next generation Kaveri APUs might be delayed until early 1H 2014. The Steamroller architecture based APU is officially slated for Q4 2013, but a new report says that Kaveri based APUs are yet to achieve the mass production levels required for a full-scale launch. Of course, AMD could still launch the APUs in limited supply, with the supply eventually improving over the months, but that doesn't ever go well with consumers.

"AMD originally expected to start supplying its Heterogeneous System Architecture (HAS) Kaveri APUs in the second half of 2013, but according to the company's latest plans, the CPU maker will only provide two A10 and one A8 APU pilot production samples to its clients in December 2013, indicating that Kaveri APU-based PC products may have difficulties showing up in the retail channel before April 2014, the sources said."

Hardware news site WCCF Tech spotted an interesting entry listed in the Bionic research database. The ES (Engineering Sample) chip could be a part of AMD's next-generation APU series featuring the new and improved Steamroller core. While we don't expect performance to increase by leaps and bounds, but Steamroller builds on the Bulldozer architecture and has a target to offer as much as a 30% improvement in performance over the original core.

The ES code 2M186092H4467_23/18/12/05_1304 tells us even more. According to earlier observations (here and here), the four numbers in the middle part tell a bit about clock speeds. If the first one is not 00 (no turbo, see Kabini ES), it indicates a turbo clock of 2.3GHz. The "18? stands for 1.8GHz nominal frequency. I'm not so sure about the "12?. It could stand for 1.2Ghz North Bridge clock. Finally the "05? indicates a 500MHz GPU clock. The right part "1304? is the GPU code, which - thanks to earlier revelations - can be identified as AMD1304.1 = "KV SPECTRE MOBILE 35W (1304)".

A 2.3 GHz Turbo core is pretty low, which can be attributed to the early state of the Engineering Sample. Hopefully clock speeds hit further north of just 1.8 GHz CPU and 500 MHz graphics, especially for the 35W part. The next-generation chips will be manufactured on the new bulk 28nm manufacturing process at Global Foundries.

FinalWire announced AIDA64 v2.85, the popular system diagnostic and benchmarking suite is updated with 64-bit benchmarks optimized for AMD's "Richland" APUs, improved support for "Kaveri," "Kabini," and "Temash" APUs; and Intel "Haswell" and "Valleyview" CPUs; early support for AMD "Beema" APU, Intel "Avoton" SoC, "Crystalwell," "Ivy Bridge-E," and "Haswell-E" CPU, "Haswell-ULT" SoC; preliminary support for DDR4 and GDDR5 system memory types; and GPU support for AMD Radeon HD 8000 series and NVIDIA GeForce GTX Titan.DOWNLOAD: FinalWire AIDA64 v2.85 Installer (EXE), Archive (ZIP)

AMD (NYSE: AMD), a leading provider of technology that enables visually-rich experiences for today's consumers, provided an early look at its new 2013 accelerated processing units (APUs) and announced a new OEM relationship with VIZIO. At an International Consumer Electronics Show (CES) event, AMD demonstrated working silicon of its first true system on chip (SoC) APUs, codenamed "Temash" and "Kabini," which will be the industry's first quad-core x86 SoCs. Both APUs are scheduled to ship in the first half of 2013. Demonstrations included a range of leading-edge applications and games on a "Kabini"-based ultrathin notebook and a "Temash"-based performance tablet and hybrid notebook.

AMD also introduced the new APU codenamed "Richland" which is currently shipping to OEMs and delivers visual performance increases ranging from more than 20 percent to up to 40 percent over the previous generation of AMD A-Series APUs1. "Richland" is expected to come bundled with new software for consumers such as gesture- and facial-recognition to dramatically expand and enhance consumers' user experiences. The follow-on to "Richland" will be the 28nm APU codenamed "Kaveri" with revolutionary heterogeneous system architecture (HSA) features which is expected to begin shipping to customers in the second half of 2013.

Even as Intel neither confirms nor denies reports of it abandoning socketed client desktop processors in favor of BGA packages that permanently bind chips to motherboards, AMD has come forward and asserted that it won't abandon socketed client processors, and will continue to support the DIY PC enthusiast market, reinforced with the fact that BClk multiplier-unlocked processors from the company start for as low as US $129.99. In a statement to the TechReport, AMD's Chris Hook said:

AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the "Kaveri" APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.

As the company that introduced new types of BGA packages in ultrathin platforms several years ago, and today offers BGA-packaged processors for everything from ultrathin notebooks to all-in-one desktops, to embedded applications and tablets, we certainly understand Intel's enthusiasm for the approach. But for the desktop market, and the enthusiasts with whom AMD has built its brand, we understand what matters to them and how we can continue to bring better value and a better experience.

A leaked company roadmap slide revealed that AMD's third-generation performance APU, codenamed "Kaveri," will be built on the 28 nm silicon fabrication process. The chips will be built by Global Foundries. Kaveri combines AMD's next-generation CPU architecture codenamed "Steamroller" with Graphics CoreNext GPU architecture.

In addition to Kaveri, AMD will introduce a major update to its low-power APU lineup with "Kabini." A true successor to "Brazos," Kabini features x86-64 cores built on the energy-optimized "Jaguar" architecture (which succeeds "Bobcat," on which Brazos APUs are built). It is also mentioned that Kabini will be a true system-on-chip (SoC), with integration of the FCH chipset into the APU silicon. Such an integration could increase die size and complexity, but could also minimize the board footprint of the platform, making it possible to use the SoC in thin tablets, and COMs.

Today at its annual Financial Analyst Day, AMD has presented an updated roadmap detailing the hardware it plans to bring to the table during 2012 and 2013. For this year, the Sunnyvale-based company is preparing a processor quarter which includes the Trinity, Brazos 2.0 and Hondo APUs (accelerated processing units) and the Vishera CPU.

Set to be the main weapon in AMD's x86 arsenal, the Trinity APU (aka the 2nd gen A Series) is made on 32 nm process technology, and features DirectX 11 graphics, two/four Piledriver cores (Piledrive is said to deliver 25% better performance than the Stars cores found in Llano APUs), and a TDP that can go as low as 17 W on mobile parts. Trinity is expected to debut in Q2 and already has close to 100 design wins (more than Llano had before its release).