A few details have been let out on Intel's next socket, LGA 1700, which will be the one to accept next-gen Alder Lake CPUs. Apparently, Intel's LGA 1700 - which replaces the current LGA 1200 socket) will feature a lower height (by a full [1] millimeter, helping to further reduce socket load) as well as new mounting holes positions for cooling solutions. This would effectively render existing cooling solutions incompatible with Intel's next-gen CPUs - it will be up to your cooling solution provider to offer a new cooler bracket that's compatible with the new LGA 1700 socket. If the manufacturer doesn't, it's likely you'll have to get a newer cooling solution that actually ships with the required adapter.

It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.