Monday, May 24th 2021
Intel LGA Socket 1700: Lower Height, New Hole Pattern Render Existing Cooling Solutions Incompatible
A few details have been let out on Intel's next socket, LGA 1700, which will be the one to accept next-gen Alder Lake CPUs. Apparently, Intel's LGA 1700 - which replaces the current LGA 1200 socket) will feature a lower height (by a full [1] millimeter, helping to further reduce socket load) as well as new mounting holes positions for cooling solutions. This would effectively render existing cooling solutions incompatible with Intel's next-gen CPUs - it will be up to your cooling solution provider to offer a new cooler bracket that's compatible with the new LGA 1700 socket. If the manufacturer doesn't, it's likely you'll have to get a newer cooling solution that actually ships with the required adapter.
It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.
Sources:
Igor's Lab, via Videocardz
It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.
49 Comments on Intel LGA Socket 1700: Lower Height, New Hole Pattern Render Existing Cooling Solutions Incompatible
(necessary equalizing sorry)
On a more serious note, with the cpu being bigger this was to be expected, I just hope some cooler companies like Noctua can make a adapter for users.
"Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LAG 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler."
That....im not sure about though....
With recent history in mind, will these new ones be heaters as well?
Oh no!Intel: "Power draw is our passion!"
Not only can their CPUs draw 300W, but their coolers can too.
Also intel is changing the cooling mount b/c existing coolers can't handle how much those things gon be hot, unlike AMD who's recent releases have not been know for increasing the temps and power draw significantly.
LGA-115x lasted longer than five years.
Due to the way they designed their coolers a new mounting kit is all they have to make.
And i believe all high end Noctua coolers have a 45x45mm coldplate as well, so that's not a concern either.
To me, that looks like the CPU sits in a bucket-like deep recess. Won't that cause massive clearance problems for heatpipes and waterblocks?
If that's the socket keep-out-zone then it would make more sense, but that's a hella weird way to show it.
(bonus image)
Becoming???