CPU-Z's Q1 2025 validation data indicates a new trend in CPU core count preferences among PC users. Eight-core processors now account for 24.7% of all validations, a significant increase of 32.6% compared to previous data. In contrast, six-core processors have declined to 22.5% of validations, down by 6.9%. The higher core count of eight-core CPUs aligns with the increasing demand for multithreaded performance in various computing environments, from professional workstations to high-end gaming systems. Market share figures also reveal adjustments in consumer preferences regarding CPU manufacturers. Intel retains a majority of presence with 56.3% of the market. However, AMD's share has risen notably at 43.7%, representing a 16.6% increase from the previous year.

The shift in market shares suggests that users are increasingly drawn to AMD's offerings, which include competitive eight-core processors. A key contributor to the trend toward eight-core CPUs is the rising popularity of specific models. The Ryzen 7 9800X3D, for example, has significantly impacted this new statistic, becoming the most popular CPU according to the CPU-Z validations. This indicates that users are interested in eight-core offerings with 3D V-Cache technology for increased gaming performance. The shift away from six-core configurations, which now represent a smaller portion of the validation data, shows that eight cores are now a sweet spot for many gamers. For multitasking and gaming, it seems like a perfect choice.

RiVAI Technologies, a Shenzhen-based semiconductor firm founded in 2018, unveiled this first fully domestic high-performance RISC-V server processor designed for compute-intensive applications. The Lingyu CPU features 32 general-purpose computing cores working alongside eight specialized intelligent computing cores (LPUs) in a heterogeneous "one-core, dual architecture" design. It aims for performance comparable to current x86 server processors, with the chip implementing optimized data pathways and enhanced pipelining mechanisms to maintain high clock frequencies under computational load. The architecture specifically targets maximum throughput for parallel processing workloads typical in data center environments. The chip aims to serve HPC clusters, all-flash storage arrays, and AI large language model inference operations.

Since its inception, RiVAI has accumulated 37 RISC-V-related patents and established partnerships with over 50 industry collaborators, including academic research relationships. Professor David Patterson, a RISC-V architecture pioneer, provides technical guidance to the company's development efforts. The processor's dual-architecture approach enables dynamic workload distribution between conventional processing tasks and specialized computational operations, potentially improving performance-per-watt metrics compared to traditional single-architecture designs. The Lingyu launch significantly advances China's semiconductor self-sufficiency strategy, potentially accelerating RISC-V ecosystem development while providing Chinese data centers with domestically engineered high-performance computing solutions, ultimately bypassing x86 and Arm solutions.

A small number of AMD Ryzen 7 9800X3D CPUs have had trouble starting up on some ASRock AM5 motherboards. The issue was first noticed in February 2025, and both AMD and ASRock immediately looked into the problem. The investigation found that the older BIOS versions on specific ASRock boards had memory compatibility problems. When a Ryzen 7 9800X3D was used, the computer could not complete its normal boot process, known as POST. ASRock quickly released a beta BIOS update to fix the memory issue, and after testing, a final version of the update was made available as of now. Users who update their BIOS should now see the problem disappear. In one case, a report suggested that a Ryzen 7 9800X3D had been damaged. However, further checks showed no burn marks on the motherboard. The issue was simply due to some debris, and after careful cleaning, the motherboard started normally and passed further tests.

AMD pointed out that many reasons can cause a computer to not start up properly, and a POST failure does not always mean the CPU is broken. They advise users to update their BIOS to the newest version available for their motherboard model. If the problem continues even after updating, users should reach out to customer support for help. In a few cases, if the problem cannot be fixed on the spot, the CPU might need to be replaced. This quick fix shows that AMD and ASRock work well together to solve problems. Even though only a few systems were affected, the issue was taken seriously and fixed fast. With the latest BIOS update, users can now expect their systems to boot without trouble, ensuring that the Ryzen 7 9800X3D offers good performance for everyday tasks and gaming.

Mark Gurman—Bloomberg's resident soothsayer of Apple inside track info—has disclosed predictive outlooks for next-generation M5 chip-based MacBooks. Early last month, we experienced the launch of the Northern Californian company's M4 MacBook Air series—starting at $999; also available in a refreshing metallic blue finish. The latest iteration of Apple's signature "extra slim" notebook family arrived with decent performance figures. As per usual, press and community attention has turned to a potential successor. Gurman's (March 30) Power On newsletter posited that engineers are already working on M5-powered super slim sequels—he believes that these offerings will arrive early next year, potentially reusing the current generation's 15-inch and 13-inch fanless chassis designs.

In a mid-February predictive report, Gurman theorized that Apple was planning a major overhaul of the MacBook Pro design. A radical reimagining of the long-running notebook series—that reportedly utilizes M6 chipsets and OLED panels—is a distant prospect; perhaps later on in 2026. The Cupertino-headquartered megacorp is expected to stick with its traditional release cadence, so 2025's "M5" refresh of MacBook Pro models could trickle out by October. Insiders believe that Apple will reuse existing MacBook Pro shells—the last major redesign occurred back in 2021. According to early February reportage, mass production of the much-rumored M5 chip started at some point earlier in the year. Industry moles posit that a 3 nm (N3P) node process was on the order books, chez TSMC foundries.

Intel's freshly concluded Vision 2025 "Products Update and GTM" showcase included a segment dedicated to forthcoming Core Ultra 300 "Panther Lake" client processors. Industry watchdogs have grabbed a select few screenshots from Team Blue's broadcast from Las Vegas, Nevada—one backdropped slide confirms that Intel's next-generation mobile CPU series will launch in 2026. This information mirrors the company's Chinese office presenting of an AI PC roadmap—coverage of last month's event highlighted a scheduled first quarter 2026 "volume" arrival of "Core Ultra Next-gen Panther Lake (18A)."

Going back to early March, Intel leadership refuted online rumors of "Panther Lake" mobile CPUs being delayed into 2026, due to alleged problems encountered during the development of the Foundry service's 18A process node. An interviewed executive repeatedly insisted that his firm's brand-new series was on track for release within the second half of 2025. Fast-forward to the end of last week; Lip-Bu Tan expressed a similar outlook in a letter addressed to investors. The newly-established boss stated: "we will further enhance our (leadership) position in the second half of this year with the launch of Panther Lake, our lead product on Intel 18A, followed by Nova Lake in 2026." Industry insiders propose that the Core Ultra 300 series will become available in a very limited capacity come October, via an Early Enablement Program (EEP). Returning to this week—Jim Johnson, senior vice president of the firm's Client Computing Group, informed a watchful audience about the merits of his group's design: "I'm personally excited about Panther Lake because it combines the power efficiency of Lunar Lake, the performance of Arrow Lake, and is built to scale 18A and is on track for production later this year...Our client roadmap is the most innovative we've ever had, and we are far from done."

Yesterday, at Intel Vision 2025, IBM announced the availability of Intel Gaudi 3 AI accelerators on IBM Cloud. This offering delivers Intel Gaudi 3 in a public cloud environment for production workloads. Through this collaboration, IBM Cloud aims to help clients more cost-effectively scale and deploy enterprise AI. Intel Gaudi 3 AI accelerators on IBM Cloud are currently available in Frankfurt (eu-de) and Washington, D.C. (us-east) IBM Cloud regions, with future availability for the Dallas (us-south) IBM Cloud region in Q2 2025.

IBM's AI in Action 2024 report found that 67% of surveyed leaders reported revenue increases of 25% or more due to including AI in business operations. Although AI is demonstrating promising revenue increases, enterprises are also balancing the costs associated with the infrastructure needed to drive performance. By leveraging Intel's Gaudi 3 on IBM Cloud, the two companies are aiming to help clients more cost effectively test, innovate and deploy generative AI solutions. "By bringing Intel Gaudi 3 AI accelerators to IBM Cloud, we're enabling businesses to help scale generative AI workloads with optimized performance for inferencing and fine-tuning. This collaboration underscores our shared commitment to making AI more accessible and cost-effective for enterprises worldwide," said Saurabh Kulkarni, Vice President, Datacenter AI Strategy and Product Management, Intel.

When Microsoft first introduced the Copilot+ program alongside its renewed push for Windows-on-Arm laptops, the AI-powered assistant features were mostly limited to Snapdragon X-powered devices. In addition to the inclusion of these features on Intel and AMD systems, Microsoft is also announcing Voice Access, a new accessibility feature that will first launch on Qualcomm Snapdragon systems and make their way to Intel- and AMD-powered systems. These new updates come by way of the March 27 Preview update titled KB505365. However, there is still no mention of an AMD and Intel launch for the much maligned Recall feature that Microsoft was testing late last year and recalled due to privacy concerns.

According to the latest Windows Experience Blog post, users of AMD- and Intel-powered PCs will now be able to access features, like Live Captions, Cocreator, Restyle Image, and Image Creator more broadly across the line-up of Copilot+ PCs with Intel Core Ultra 200V and AMD Ryzen AI 300 CPUs. Live Captions is officially pitched as an accessibility feature, meanwhile Restyle Image and Image Creator are AI-powered image editing and generation features, and Cocreator lies somewhere in between as a text-to-image tool that is meant to augment drawing in Paint. Cocreator will be rolling out as of the announcement, and Restyle Image and Image Creator will be available in the Photos app on Intel and AMD systems. As for Voice Access, Microsoft claims that it will allow users to be more flexible with their language when using speech to navigate their PCs, as opposed to "learning complex steps, commands and syntax that voice access previously required" for voice navigation on PC. Voice Access will initially be limited to Snapdragon X PCs, but it will roll out to AMD and Intel Copilot+ PCs later this year.

Successors to AMD's current-generation lineup of Ryzen 8000G desktop APUs are reportedly in the pipeline—according to the latest HXL/9550pro predictive declaration, finalized units could arrive at retail later this year. They propose that an "AMD AM5 New APU" family could arrive alongside an unannounced MSI Unify-X enthusiast-grade motherboard design, within the final quarter of 2025. Press interpretations of this inside track information point to possible upcoming "Ryzen 9000G" processors, utilizing Team Red's Zen 5 and RDNA 3.5 technologies. This potent combination already exists, albeit in mobile form—namely within Team Red's stable of Ryzen AI "Strix Halo, Strix Point," and "Krackan Point" APUs.

Industry experts opine that AMD will most likely deploy high-end "Strix Point" silicon to desktop, or more fancifully: "Gorgon Point." The latter codename turned up via leaks last week. Around early 2024, we witnessed Team Red's transfer of "Phoenix"—from original mobile formats—to their AM5 desktop platform. TechPowerUp's W1zzard evaluated the Ryzen 5 8500G "Phoenix 2" APU last summer; this plucky budget-friendly model sports Zen 4 and Zen 4c cores. Theoretically a flagship "Ryzen 9000G" SKU could emerge with twelve processor cores (4x "Zen 5" + 8x "Zen 5c"), a Radeon 890M iGPU, and an XDNA 2 NPU.

In a letter addressed to stockholders, Intel's new CEO—Lip-Bu Tan—roadmapped the importance of a couple of major upcoming product launches. Starting off, Team Blue's new chief detailed a fresh approach, with the casting off of old strategies: "achieving the results I know Intel is capable of starts by refocusing on our customers. This has been priority number one since my first day on the job. I am listening carefully to their feedback so that we continue driving the changes needed to delight our customers and strengthen our competitive position. Plain and simple, the time for talk is over. We must turn our words into action and deliver on our commitments. I have been pleased to see the leadership team has already started driving the culture change needed to make this happen. As CEO, I will continue to drive this transformation so that we move faster, work smarter and make it easier for customers to win with Intel."

Tan's mentioning of Core Ultra "Panther Lake" processors arriving within the second half of this year aligns with prior official statements. Insiders posited that Panther Lake-H (PTL-H) mobile CPUs were delayed into 2026 due to issues with the Foundry's 18A process node, but an Intel executive dismissed these claims a few weeks ago. Interestingly, the firm's Chinese office outlined an "early 2026 volume launch" of "Panther Lake (18A)" chips during a mid-March AI PC press event. A presentation slide indicated that an Early Enablement Program (EEP) is expected to start in October; Team Blue's loose terminology likely classes the sending off of samples—to OEMs, for approval—as a "real" product launch.

The next generation of the award-winning all-in-one coolers is here. The Liquid Freezer III Pro features optimized premium fans and takes ARCTIC's CPU water cooling to a new level of performance. It starts with the Liquid Freezer III Pro 360, which is also available in A-RGB and A-RGB (White) versions. The launch also marks the introduction of the next major promotion. Further variants in 240, 280 and 420 mm will be introduced in Q2 2025.

The Liquid Freezer III Pro offers PC enthusiasts and gamers an impressive performance upgrade. The new Pro fans set new standards at both high and low speeds. Compared to the previous model, the performance has been increased once again - for even more effective cooling with minimal noise.

The AMD Ryzen 5 9600 launched recently as a slightly more affordable variant of the popular Ryzen 5 9600X. Despite launching over a month ago, the 9600 still appears rather difficult to track down in retail stores. However, a recent PassMark benchmark has provided some insights as to the performance of the non-X variant of AMD's six-core Zen 5 budget CPU. Unsurprisingly, the Ryzen 5 9600X and the Ryzen 5 9600 are neck-and-neck, with the 9600X scraping past its non-X counterpart by a mere 2.2% in the CPU benchmark.

According to the PassMark result, the Ryzen 5 9600 scored 29,369, compared to the Ryzen 5 9600X's 30,016, while single-core scores were 4581 for the 9600X and 4433 points for the 9600, representing a 3.2% disparity between the two CPUs. The result is not surprising, since the only real difference between the 9600 and the 9600X is 200 MHz boost clock. All other specifications, including TDP, core count, cache amount and base clock speed, are identical. Both CPUs are also unlocked for overclocking, and both feature AMD Precision Boost 2. While the Ryzen 5 9600 isn't available just yet, it will seemingly be a good option for those who want to stretch their budget to the absolute maximum, since recent reports indicate that it will be around $20 cheaper than the Ryzen 5 9600X, coming in at around the $250-260 mark.

The status of Intel "Meteor Lake-S" (MTL-S) desktop processors was the subject of much speculation throughout 2023—by September of that year, Team Blue leadership projected an upcoming launch in 2024. Technically, Meteor Lake was deployed to "sort-of desktops" platforms—albeit in mini-PCs that utilized Core Ultra mobile chips. Industry moles insisted that Intel was still actively engaged in production of MTL-S samples in late 2023. According to a recent ITHome report, those insider tales turned out to be legitimate. On Monday (March 24), the online publication revealed the existence of a mysterious "Q46W" engineering sample—courtesy of Kyoka (a trusted source). A CPU-Z diagnostic revealed the unannounced CPU's turboboost capability reaching 4.5 GHz, while base frequency sat at the 2.8 GHz mark.

According to ITHome's investigative piece, Team Blue: "tested a very special desktop processor: it uses the Meteor Lake architecture, has 6 performance cores and 8 energy efficiency cores (6P+8E), but the performance cores (P-cores) do not support Hyper-Threading. The production date of the product in hand is the 51st week of 2023, which is obviously later than the time when Meteor Lake-S was reported to be cancelled for external sales. From this situation, 'Q46W' may be a development test processor for FCLGA1851 platform or the 800 series chipset. Kyoka believes that the processor should be in the ES2 stage." A Xianyu seller—tbNick_3u8k4—is reportedly offloading a surprising quantity of "Intel Confidential Q46W" processors, allegedly manufactured back in early 2024. Photos show tray-mounted units available for sale on Taobao's second hand market platform. tbNick_3u8k4 mentions that this particular batch of Q46W chips "requires a special motherboard to light up," suggesting that readily available Intel 800 Series chipset-based models are not fit for purpose.

We are aware of a number of cases where some AMD CPUs have boot issues with specific BIOS versions, and case with ASRock motherboard involving damaged CPU. We are taking these incidents seriously and have reached out to many of the affected users to gather information. We have obtained some of the motherboards for thorough inspection.

• A retrieved motherboard was in a system where the CPU showed burn damage. When inspecting this motherboard, we found that the motherboard does not have obvious damage nor burn marks around the VRM area. Measurements of the motherboard are also within spec. After cleaning and removing debris from the CPU socket, without further repair, the motherboard can boot up successfully with original onboard BIOS. It also passed long-term stress tests.
• With some BIOS versions, we have noticed some systems are not being able to boot with random 9000-series CPUs. BIOS 3.20 fixes this issue by improving memory compatibility.

Compal is preparing "Adapt X" modular laptop design, which appears scheduled for actual market release according to its listing in the 2025 IF Design Awards catalog. The currently conceptual design features two display variants—14-inch and 16-inch models—that integrate with a specialized HUB system, enabling expanded I/O capabilities and modular AI units, most likely a dedicated NPU module for offloading smaller AI tasks from the CPU/GPU. The modular architecture utilizes USB connectivity between expansion components, with current renders showcasing speaker modules, I/O expansion options, and a primary keyboard unit presumably housing the CPU. Unlike Framework's granular approach, which allows for the choice of individual ports, Compal has opted for a more component-based system. The company claims that components can be used independently or combined, offering multiple usage modes at lower costs and reduced upgrade frequency.

Earlier this month, the company revealed a Hybrid AIO desktop that transforms between desktop, laptop, and tablet configurations and the "Infinite Laptop" featuring an expandable display stretching 14 inches to 18 inches through horizontal extension mechanisms. Compal's direct market entry would be a welcome addition as a significant ODM (Original Design Manufacturer) that typically produces hardware for other brands rather than selling under its own label. The modular laptop segment remains niche but potentially lucrative, with Compal likely targeting consumers already looking at Framework solutions. No official announcements regarding specifications, pricing, or release dates have been made by Compal, with the Adapt X currently only visible through IF Design Award documentation. We could see more prototypes being presented in the coming months, and the coming Computex show is the right time for Compal to showcase its concept. Nonetheless, we are looking for more details about it.

AMD's Ryzen 9 9950X3D processor with 16 cores, 32 threads, and 3D V-Cache is an exceptional content creation and gaming workload machine. However, MSI's proprietary BIOS features reportedly enable substantial performance headroom beyond stock settings. MSI's latest internal testing confirms that specific firmware configurations can deliver up to 14.5% performance improvements in demanding titles like Monster Hunter Wilds. The performance uplift hinges on firmware update, with MSI recommending the installation of chipset driver v7.01.08.129 or higher, which includes the critical AMD Application Compatibility Database driver. Users who update to BIOS versions featuring AGESA 1.2.0.3 or newer may encounter an "Unknown Device" in Device Manager, which can be resolved by installing the AMD Application Compatibility Database driver included in the latest chipset package. When paired with AGESA 1.2.0.3+ BIOS implementations, this configuration yields measurable framerate improvements of approximately 10% in Metro Exodus and 8% in Far Cry 6 at 1080p resolution compared to legacy firmware.

MSI's BIOS feature suite provides several optimization pathways. Memory Try It! delivers pre-configured memory timing profiles, while High-Efficiency Mode optimizes graduated memory bandwidth across four performance tiers. The X3D Gaming Mode modifies core and SMT configurations and provides additional gaming-specific enhancements, though potentially at the expense of multi-threaded application performance. Benchmark data from MSI demonstrates that implementing DDR5-8000 CL38 Memory Try It! profiles alongside "Tighter" High-Efficiency Mode settings and X3D Gaming Mode activation delivers a 14.5% performance uplift in Monster Hunter Wilds compared to baseline DDR5-4800 configurations, and approximately 8% over XMP DDR5-7200 settings. Titles like Shadow of the Tomb Raider and Far Cry 6 both recorded approximately 6% performance gains under similar test conditions. MSI cautions that memory overclocking implementations may impact system stability, while X3D Gaming Mode's thread management modifications could reduce performance in heavily multi-threaded workloads. Performance benefits will necessarily vary based on GPU capabilities and system configuration.

At its annual Amplify Conference, HP Inc. today announced new products and services designed to shape the future of work, empowering people and businesses to create and manage their own way of working. The company unveiled more than 80 PCs, AI-powered print tools for SMBs, and Workforce Experience Platform enhancements all built to drive company growth and professional fulfillment.

"HP is translating AI into meaningful experiences that drive growth and fulfillment," said Enrique Lores, President and CEO at HP Inc. "We are shaping the future of work with game-changing AI innovations that seamlessly adapt to how people want to work."

AYANEO debuted its Android gaming pad at GDC 2025 in San Francisco on March 17, establishing itself as the world's first device manufacturer to integrate Qualcomm's new Snapdragon G3 Gen 3 gaming platform. The AYANEO Gaming Pad features significant performance upgrades, with CPU and GPU improvements of 30% and 28% over previous generation hardware. The device centers around an 8.3-inch 1440p LCD optimized for gaming with a 120 Hz refresh rate and 3:2 aspect ratio. AYANEO has implemented an active cooling system with a blower-type fan to maintain thermal stability during extended gaming sessions. The hardware architecture includes a CNC all-metal frame, and a transparent glass back cover in what the company calls its "Explorer Edition" design aesthetic.

Other specs, such as the camera, exceed typical gaming tablet specifications, with a 5 MP front-facing camera for streaming complemented by a 50 MP primary rear camera and a 13 MP 120-degree ultra-wide lens. The Gaming Pad incorporates a six-axis gyroscope for motion controls and quad-chamber speakers for spatial audio output. Connectivity advances include implementing Wi-Fi 7. The Gaming Pad supports peripheral ecosystem expansion through compatible controllers, keyboards, and mice, enhancing its versatility across gaming contexts. While AYANEO is the first to market with the Snapdragon G3 Gen 3 Platform, OneXPlayer has simultaneously announced its ONEXSUGAR SUGAR 1 with the same chipset. AYANEO has not yet disclosed pricing, availability, or complete technical specifications, with additional product details expected in upcoming announcements.

A mysterious HiSilicon Kirin X90 processor was included in a Chinese state report; the official assessment document seems to cover the topics of native CPU reliability and security. Jukanlosreve—a keen watcher of semiconductor industry inside tracks—highlighted the unannounced technology on social media. They alerted TP Huang (aka tphuang) to this discovery, possibly in reaction to the latter's reporting of a wholly Huawei-designed AI laptop. Last week, we heard about a speculated portable enterprise PC series powered by Kunpeng-920 mobile processors. HiSilicon is a Chinese fabless semiconductor firm, operating under Huawei ownership—normally, their Kirin processors are designated as smartphone-based solutions. Industry watchdogs believe that company leadership is paving the way for a new generation of personal and server processors—their current Kunpeng-900 series debuted back in 2019, so natural successors are very likely in the development pipeline. Early last year, insiders proposed that Huawei had prioritized its Ascend 910B AI accelerator chip—despite these rumors, Kirin-related leaks continued to trickle out.

According to industry moles, HiSilicon tends to spread its custom Arm-based Taishan core design across modern Kirin and Kunpeng processor families. Based on Jukanlosreve's initial detective work, Tom's Hardware proposed a plausible outlook for the (leaked) chip's future. Their report theorized: "Huawei's server and PC divisions have been relatively quiet, as evidenced by the lack of new Kunpeng SoC designs. The new Kirin X90, despite its name, could be a possible successor, considering that Huawei is reportedly launching a new 'AI PC' with HarmonyOS next month. It's likely to be fabricated using SMIC's 7 nm process featuring Taishan V120 cores based on either the Armv8 or Armv9 architectures, which are not subject to the US trade ban." Instead of using an old hat Kunpeng-920 SoC, Huawei's forthcoming next-gen "Qingyun" AI laptop could be equipped with a Kirin X90 APU—Tom's Hardware foresees an Apple MacBook-esque "integration of custom hardware and software" with the Chinese tech firm's fully in-house developed model.

TrendForce reveals that the combined revenue of the world's top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase. The booming AI industry has fueled growth across the semiconductor sector, with NVIDIA leading the charge, posting an astonishing 125% revenue growth, widening its lead over competitors, and solidifying its dominance in the IC industry.

Looking ahead to 2025, advancements in semiconductor manufacturing will further enhance AI computing power, with LLMs continuing to emerge. Open-source models like DeepSeek could lower AI adoption costs, accelerating AI penetration from servers to personal devices. This shift positions edge AI devices as the next major growth driver for the semiconductor industry.

The oft-rumored status of Intel's refreshed generation of Arrow Lake processors (ARL-R) was the topic of much debate in 2023. By September 2024, certain industry watchdogs believed that the endeavor had ended. Early last month, Golden Pig Upgrade proposed that Team Blue leadership had resurrected the troubled project—at least with "ARL-S Refresh" desktop CPUs. Earlier today, the noted leaker of inside information returned to the topic of Arrow Lake Refresh. According to industry moles, the launch of refreshed desktop processors (on LGA 1851) is confirmed.

An extended timeline was disclosed in Golden Pig Upgrade's latest musing: "Arrow Lake HX Refresh is confirmed to return. Don't criticize the interface for only one generation. AI PCs are getting bigger and stronger." Given that ARL-HX-equipped high-end notebooks and mini PCs—with Core Ultra 7 200 series APUs—are relatively new arrivals, a mild update later on in the year could be considered pointless. Intel has committed themselves to a launch of Panther Lake mobile processors (PTL-H) in the second half of 2025. As disclosed by past leaks, the "beefing up" of onboard NPUs—to Lunar Lake-esque standards—is a reported goal; at least with Arrow Lake-S.

Today marks the launch of ASUS Vivobook S14/S16 (S3407QA/S3607QA), a pair of Copilot+ PCs engineered to be the ideal companions for everyday life.

Featuring the latest high-performance Snapdragon X processor with up to 45 TOPS NPU, these ultra-slim, lightweight laptops deliver powerful AI capabilities, extended battery life, and next-level connectivity. For work, study, or play, Vivobook S14/S16 provide an immersive entertainment experience with stunning 16:10 FHD OLED or 2.5K 144 Hz IPS displays, along with Snapdragon Sound and Dolby Atmos audio. Designed for style and durability, these devices ensure effortless AI computing with premium metallic chassis, military-grade resilience, and advanced security features for total peace of mind.

TRYX, a leading innovator in PC cooling solutions and the PC chassis market, is excited to announce the launch of the new PANORAMA SE.

Building on the success of the TRYX flagship CPU liquid cooler, the PANORAMA, TRYX has been striving to bring its innovative AMOLED curved screen to an even broader audience. Introducing the all-new PANORAMA SE series, equipped with the newly launched ASETEK Adela cooling solution, engineered for reliable and stable performance. Now, PC DIY enthusiasts on a budget can enjoy the flagship PANORAMA experience, complete with a stunning 6.5-inch, 2K, 60 Hz AMOLED display.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the HAF 5 Pro, a fully built gaming system designed to deliver robust performance and seamless gameplay. Powered by an Intel Core i7-12700F processor and NVIDIA GeForce RTX 4060 Ti, the HAF 5 Pro leverages Cooler Master's expertise in high airflow cases, efficient cooling, and premium power delivery—paired with the enhanced gaming features of Windows 11.

"We've taken our hallmark high-airflow concept and built a system that's both powerful and visually striking," said Jimmy Sha, CEO of Cooler Master. "Our customers know and trust the HAF lineup for cooling prowess, so outfitting it with top-tier components, a dedicated VGA fan, and Windows 11's advanced gaming capabilities was a natural progression to offer an all-in-one experience."

MSI IPC, a global leader in industrial computing solutions, proudly unveils the MS-CF05, V2.0, a high-performance ATX motherboard engineered for industrial automation, edge computing, and embedded applications. Designed to support 14th, 13th, and 12th Gen Intel Core, Pentium, and Celeron processors, the MS-CF05, V2.0 delivers exceptional computing power, scalability, and I/O flexibility, including a PCI slot for legacy support, making it ideal for modern industrial needs.

Last Friday, AMD confirmed finalized price points for its upcoming Ryzen 9 9950X3D ($699) and 9900X3D ($599) gaming processors—both launching on March 12. Media outlets are very likely finalizing their evaluations of review silicon; official embargoes are due for lifting tomorrow (March 11). By Team Red decree, a drip feed of pre-launch information was restricted to teasers, a loose March launch window, and an unveiling of basic specifications (at CES 2025). A trickle of mid-January to early March leaks have painted an incomplete picture of performance expectations for the 3D V-Cache-equipped 16 and 12-core parts. A fresh NDA-busting disclosure has arrived online, courtesy of an alleged Ryzen 9 9950X3D sample's set of benchmark scores.

A pre-release candidate posted single and multi-thread ratings of 4739 and 69,701 (respectively), upon completion of PassMark tests. Based on this information, a comparison chart was assembled—pitching the Ryzen 9 9950X3D against its direct predecessor (7950X3D), a Zen 5 relative (9950X), and competition from Intel (Core Ultra 9 285K). AMD's brand-new 16-core flagship managed to outpace the previous-gen Ryzen 9 7950X3D by ~14% in single thread stakes, and roughly 11% in multithreaded scenarios. Test system build details and settings were not mentioned with this leak—we expect to absorb a more complete picture tomorrow, upon publication of widespread reviews. The sampled Ryzen 9 9950X3D CPU surpassed its 9950X sibling by ~5% with its multi-thread result, both processors are just about equal in terms of single-core performance. The Intel Core Ultra 9 285K CPU posted the highest single-core result within the comparison—5078 points—exceeding the 9950X3D's tally by about 7%. The latter pulls ahead by ~3% in terms of recorded multi-thread performance. Keep an eye on TechPowerUp's review section; where W1zzard will be delivering his verdict(s) imminently.