AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

NVIDIA is taking the wraps off a new compact generative AI supercomputer, offering increased performance at a lower price with a software upgrade. The new NVIDIA Jetson Orin Nano Super Developer Kit, which fits in the palm of a hand, provides everyone from commercial AI developers to hobbyists and students, gains in generative AI capabilities and performance. And the price is now $249, down from $499.

Available today, it delivers as much as a 1.7x leap in generative AI inference performance, a 70% increase in performance to 67 INT8 TOPS, and a 50% increase in memory bandwidth to 102 GB/s compared with its predecessor. Whether creating LLM chatbots based on retrieval-augmented generation, building a visual AI agent, or deploying AI-based robots, the Jetson Orin Nano Super is an ideal solution to fetch.

In Win Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, had introduced its new AR36 (360 mm) AIO liquid cooler featuring an "infinity Mirror" design, compatible with both AMD and Intel platforms.

Infinity Mirror Block
The ARGB-infused CPU block features an infinity mirror design on the front, showcasing radiant light reflections that create an infinite, vibrant, and colorful glow from every angle. Inside, high-density microchannel fins in the copper baseplate efficiently draw heat away from even the hottest processors, minimizing the temperature delta to unlock maximum headroom for sustained thermal boost clock speeds. The pump is equipped with a three-phase, six-pole motor, ensuring consistently high performance with reduced noise during operation.

Minisforum is an easily recognizable brand that is well-regarded for its lineup of mini PCs. The MS-A1 is one such mid-range offering that boasts an AM5 socket, and the product is now available to configure with the 16-core Ryzen 9 9950X with a 100 W TDP, which happens to be an absolute monstrosity of a desktop CPU with hefty cooling requirements.

The system was already available with a Ryzen 7 8700G, which was most likely performant enough for most people. The MS-A1 does not feature dedicated graphics, which is why the Ryzen 7 8700G was a great choice thanks to its relatively potent iGPU. However, it is no surprise that there are many workloads that demand raw CPU power over anything else, and the MS-A1 with the Ryzen 9 9950X will be an excellent option for such demanding scenarios. That said, since the system does not feature discrete graphics, the Radeon 610M iGPU found in the 9950X will simply not be able to keep up with any GPU-intensive workloads.

Fujitsu has previewed its next-generation Monaka processor, a 144-core powerhouse for data center. Satoshi Matsuoka of the RIKEN Center for Computational Science showcased the mechanical sample on social media platform X. The Monaka processor is developed in collaboration with Broadcom and employs an innovative 3.5D eXtreme Dimension System-in-Package architecture featuring four 36-core chiplets manufactured using TSMC's N2 process. These chiplets are stacked face-to-face with SRAM tiles through hybrid copper bonding, utilizing TSMC's N5 process for the cache layer. A distinguishing feature of the Monaka design is its approach to memory architecture. Rather than incorporating HBM, Fujitsu has opted for pure cache dies below compute logic in combination with DDR5 DRAM compatibility, potentially leveraging advanced modules like MR-DIMM and MCR-DIMM.

The processor's I/O die supports cutting-edge interfaces, including DDR5 memory, PCIe 6.0, and CXL 3.0 for seamless integration with modern data center infrastructure. Security in the design is taken care of with the implementation of Armv9-A's Confidential Computing Architecture for enhanced workload isolation. Fujitsu has set ambitious goals for the Monaka processor. The company aims to achieve twice the energy efficiency of current x86 processors by 2027 while maintaining air cooling capabilities. The processor aims to do AI and HPC with the Arm SVE 2 support, which enables vector lengths up to 2048 bits. Scheduled for release during Fujitsu's fiscal year 2027 (April 2026 to March 2027), the Monaka processor is shaping up as a competitor to AMD's EPYC and Intel's Xeon processors.

Taiko Audio, a Dutch high-end audio manufacturer, has unveiled what might be the most over-engineered music server ever created—the Extreme Server. With a starting price of €28,000 (US$29,600), this meticulously crafted device embodies either the pinnacle of audio engineering or the epitome of audiophile excess. The Extreme's most distinctive feature is its unique dual-processor architecture, using two Intel Xeon Scalable 10-core CPUs. This unusual configuration isn't just for show—Taiko claims it solves a specific audiophile dilemma: the impact of Roon's music management interface on sound quality. By dedicating two processors to Roon and Windows 10 Enterprise LTSC 2019 interface, they've made Roon's processing "virtually inaudible", addressing a concern most music listeners probably never knew existed.

Perhaps the most striking technical achievement is the server's cooling system, or rather, its complete absence of conventional cooling. Taiko designed a custom 240 W passive cooling solution with absolutely no fans or moving parts. The company machined the CPU interface to a mind-boggling precision of 5 microns (0.005 mm) and opted for solid copper heat sinks instead of aluminium, claiming this will extend component life by 4 to 12 years. The attention to detail extends to the memory configuration, where Taiko takes an unconventional approach. The server uses twelve 4 GB custom-made industrial memory modules, each factory pre-selected with components matched to within 1% tolerance. According to Taiko, this reduces the refresh rate burst current by almost 50% and allows for lower operating temperatures. The PSU that powers the PC is a custom 400 W linear power supply, an in-house development designed specifically for the Extreme's unique needs. It combines premium Mundorf and Duelund capacitors for sonic neutrality, Lundahl chokes selected by ear, and extensive vibrational damping using Panzerholz (a compressed wood composite) for durability, low temperature operation, longevity, and exceptional sound quality.

About a month ago, we reported about the AMD Ryzen 7 9800X3D "Zen 5" processor with 3D V-Cache that is flying off the shelves, with scalpers trying to make a profit from buying the retail inventory. The processor continues to face widespread availability issues more than a month after its launch, though the company assures consumers that relief is on the horizon. "We are working diligently to get as much supply to market as possible, with more processors being shipped every week," an AMD spokesperson told Tom's Hardware. "We expect availability to get better as shipments ramp throughout the quarter." The CPU is not only hard to find but also proves to be one of the most sought-after processors on Amazon.

The supply shortage has created opportunities for scalpers, who are listing the processor at prices reaching $1,000—more than double its retail price. Even established retailers like Walmart have listed the chip at inflated prices, approaching $800. Adding to consumers' challenges, some third-party sellers have posted fraudulent listings, making it crucial for buyers to verify seller credibility. While major retailers like Amazon, Newegg, Best Buy, and B&H Photo maintain the official $479 price point when in stock, securing a unit at this price has proven challenging for most consumers. As the holiday season is here, AMD's promised production ramp-up is much needed, as gamers have been planning their upgrade months in advance and are in dire need of pushing the performance of their systems up another notch.

It's been public knowledge for a while now that Lenovo is planning an imminent successor to its Legion Go handheld that has proven rather popular among handheld gamers. Previous leaks and rumors indicated that the Legion Go S 8ARP1, as it will apparently be named, will be a more affordable version of the current Legion Go. Now, thanks to Roland Quandt, Windows Central, and WinFuture, more details about the upcoming Legion Go S have leaked, including images of the device, supposed specifications, and a potential price.

According to the leaks, the new affordable handheld gaming PC will feature some substantial hardware changes, including a slightly smaller eight-inch display, this time with a much lower 1920 × 1200p resolution and a slightly lower 120 Hz refresh rate. Gone, too, are the Nintendo Switch-style detachable controllers, with the Legion Go S instead featuring a white unibody design. What's more interesting than the leaked images of the Legion Go S or the hardware changes—detachable controllers or not, the Legion Go is still intended to be used as a handheld—is the new AMD APU that will seemingly power the Go S. The as-yet unannounced AMD Ryzen Z2G looks like it will be an odd core configuration featuring an AMD Radeon 680M iGPU and Zen 3+ cores. Ultimately, the APU seems like it will put the Legion Go S somewhere between the current-generation Legion Go and devices featuring the AMD Ryzen Z1 (non-extreme), which is a good place to be if Lenovo hopes to compete with the likes of the Steam Deck OLED, which will seemingly cost around the same as the Legion Go S, depending on which region you are in.

The Standard Performance Evaluation Corporation (SPEC), the trusted global leader in computing benchmarks, today announced the availability of the SPECworkstation 4.0 benchmark, a major update to SPEC's comprehensive tool designed to measure all key aspects of workstation performance. This significant upgrade from version 3.1 incorporates cutting-edge features to keep pace with the latest workstation hardware and the evolving demands of professional applications, including the increasing reliance on data analytics, AI and machine learning (ML).

The new SPECworkstation 4.0 benchmark provides a robust, real-world measure of CPU, graphics, accelerator, and disk performance, ensuring professionals have the data they need to make informed decisions about their hardware investments. The benchmark caters to the diverse needs of engineers, scientists, and developers who rely on workstation hardware for daily tasks. It includes real-world applications like Blender, Handbrake, LLVM and more, providing a comprehensive performance measure across seven different industry verticals, each focusing on specific use cases and subsystems critical to workstation users. SPECworkstation 4.0 benchmark marks a significant milestone for measuring workstation AI performance, providing an unbiased, real-world, application-driven tool for measuring how workstations handle AI/ML workloads.

Steam's monthly hardware and software surveys provide a decent picture of what hardware and software gamers rely on to play their favorite games—at least those on Valve's game platform. Since the launch of Windows 11, it has been a somewhat reliable way to track the adoption of the new Windows version, and, as the official cut-off for Windows 10 support draws near, one would expect Windows 11 to pick up steam, especially among gamers, where Windows is the dominant OS. The results of the November Steam Survey are in, and while not much has changed on the hardware front, it seems like Microsoft is indeed wearing gamers down when it comes to Windows 11 adoption. Despite seeing a decent uptick in Windows 11 installations, the overall Windows market share dropped, even if almost imperceptibly, while Linux and macOS both saw a slight uptick in adoption among Steam gamers. As expected, Windows remained the dominant platform for gamers, but Windows 11, specifically, saw growth of 4.18%, while Windows 10 lost 4.15%, which is almost an exact 1:1 match, indicating that gamers are largely staying on Windows when they finally decide to move on from Windows 10. Overall, Windows lost 0.05% market share, compared to Linux, which gained 0.03% and macOS, which grew by 0.02%.

Valve's SteamOS Holo was the most popular Linux version in the survey, but it, too, slid by 0.28%. Of course, the hardware split for Linux is representative of the software side of things, which is to say: It's mostly just Steam Decks. As expected, most of the video cards and CPUs in the Linux results were AMD GPUs, with well over 36% of the sampled Linux gamers using AMD GPUs, even disregarding the obvious bias introduced by the AMD-powered Steam Deck hardware. The most popular NVIDIA GPU on Linux systems running Steam is currently the GeForce RTX 3060, at a mere 1.46% of the market share. Meanwhile, on Windows side, 5.03% of gamers are using the GTX 3060, with the next most popular GPU being the NVIDIA GeForce RTX 4060 Laptop GPU, at 4.92%.

A significant fix has been submitted to the Linux kernel 6.13-rc1 that addresses prolonged boot times affecting older AMD processors, specifically targeting "Zen 1" and "Zen 2" architectures. The issue, which has been present for approximately 18 months, could cause boot delays ranging from several seconds to multiple minutes in extreme cases. The problem was discovered by a Nokia engineer who reported inconsistent boot delays across multiple AMD EPYC servers. The most severe instances showed the initial unpacking process taking several minutes longer than expected, though not all boots were affected. Investigation revealed that the root cause stemmed from a kernel modification implemented in June 2023, specifically related to CPU microcode update handling.

The technical issue was identified as a missing step in the boot process: Zen 1 and Zen 2 processors require the patch buffer mapping to be flushed from the Translation Lookaside Buffer (TLB) after applying CPU microcode updates during startup. The fix, submitted as part of the "x86/urgent" material ahead of the Linux 6.13-rc1 release, implements the necessary TLB flush for affected AMD Ryzen and EPYC systems. This addition eliminates what developers described as "unnecessary and unnatural delays" in the boot process. While the solution will be included in the upcoming Linux 6.13 kernel release, plans are in place to back-port the fix to stable kernel versions to help cover most Linux users on older Zen architectures.

HWiNFO has been updated to version v8.16, which brings several new improvements and fixes, as well as adds enhanced support for next-generation AMD CPUs and APUs, as well as next-generation Intel GPUs. While it does not specify any models, it is clear that it gets support for AMD's upcoming Kraken Point and Strix Halo APUs, as well as Intel's upcoming Battlemage GPUs.

In addition, the new HWiNFO v8.16 also improves support for Intel Lunar Lake, adds reporting of number of NPU tiles, adds support for Cybenetics Powenetics PMD (Power Measurements Device), enhances sensor monitoring on MSI's Z890, B860, and H810 series motherboards, enhances reporting of CUDIMM CKD parameters, NGU clock, and drive letter, and improves reporting of V/F curve settings, among other things. You can check out the full release notes below.

For over half a century, general-purpose processors have been built on the Tomasulo algorithm, developed by IBM engineer Robert Tomasulo in 1967. It's a $500B industry built on specialized CPU, GPU and other chips for different computing tasks. Hardware startup Ubitium has shattered this paradigm with a breakthrough universal processor that handles all computing workloads on a single, efficient chip - unlocking simpler, smarter, and more cost-effective devices across industries - while revolutionizing a 57-year-old industry standard.

Alongside this, Ubitium is announcing a $3.7 million in seed funding round, co-led by Runa Capital, Inflection, and KBC Focus Fund. The investment will be used to develop the first prototypes and prepare initial development kits for customers, with the first chips planned for 2026.

Thermaltake, a leading PC DIY brand for premium hardware solutions, launches The Tower 250 Mini Tower Chassis, the latest Mini-ITX case in The Tower Series, featuring incredible hardware compatibility, an iconic vertical body design with an octagonal prism shape, and LCD customization. Available in Black, Snow, Matcha Green and Hydrangea Blue finishes, The Tower 250 is built for optimized cooling performance and enhanced capabilities.

Compatible with a wide range of hardware gadgets, The Tower 250 can house a 360 mm high-end GPU, a 360 mm AIO radiator and a standard ATX or SFX power supply up to 200 mm, along with eight 120 mm or five 140 mm fans. Additionally, this Mini-ITX case excels in thermal efficiency with two CT120 fans pre-installed on the top of the case, and room for a 360 mm/280 mm all-in-one CPU cooler on the right. Behind the motherboard tray, two 2.5" SSDs or one 3.5" HDD can be installed, offering maximum storage support.

Microsoft has announced its new Azure HBv5 virtual machines, featuring unique custom hardware made by AMD. CEO Satya Nadella made the announcement during Microsoft Ignite, introducing a custom-designed AMD processor solution that achieves remarkable performance metrics. The new HBv5 virtual machines deliver an extraordinary 6.9 TB/s of memory bandwidth, utilizing four specialized AMD processors equipped with HBM3 technology. This represents an eightfold improvement over existing cloud alternatives and a staggering 20-fold increase compared to previous Azure HBv3 configurations. Each HBv5 virtual machine boasts impressive specifications, including up to 352 AMD EPYC "Zen4" CPU cores capable of reaching 4 GHz peak frequencies. The system provides users with 400-450 GB of HBM3 RAM and features doubled Infinity Fabric bandwidth compared to any previous AMD EPYC server platform. Given that each VM had four CPUs, this yields 88 Zen 4 cores per CPU socket, with 9 GB of memory per core.

The architecture includes 800 Gb/s of NVIDIA Quantum-2 InfiniBand connectivity and 14 TB of local NVMe SSD storage. The development marks a strategic shift in addressing memory performance limitations, which Microsoft identifies as a critical bottleneck in HPC applications. This custom design particularly benefits sectors requiring intensive computational resources, including automotive design, aerospace simulation, weather modeling, and energy research. While the CPU appears custom-designed for Microsoft's needs, it bears similarities to previously rumored AMD processors, suggesting a possible connection to the speculated MI300C chip architecture. The system's design choices, including disabled SMT and single-tenant configuration, clearly focus on optimizing performance for specific HPC workloads. If readers can recall, Intel also made customized Xeons for AWS and their needs, which is normal in the hyperscaler space, given they drive most of the revenue.

The supercomputer Fugaku, jointly developed by RIKEN and Fujitsu, has successfully retained the top spot for 10 consecutive terms in two major high-performance computer rankings, HPCG and Graph500 BFS (Breadth-First Search), and has also taken sixth place for the TOP500 and fourth place for the HPL-MxP rankings. The HPCG is a performance ranking for computing methods often used for real-world applications, and the Graph500 ranks systems based on graph analytic performance, an important element in data-intensive workloads. The results of the rankings were announced on November 19 at SC24, which is currently being held at Georgia World Congress Center in Atlanta, Georgia, USA.

The top ranking on Graph500 was won by a collaboration involving RIKEN, Institute of Science Tokyo, Fixstars Corporation, Nippon Telegraph and Telephone Corporation, and Fujitsu. It earned a score of 204.068 TeraTEPS with Fugaku's 152,064 nodes, an improvement of 38.038 TeraTEPS in performance from the previous measurement. This is the first time that a score of over 200 TeraTEPS has been recorded on the Graph500 benchmark.

MSI previously gave us a teaser of what to expect from its upcoming Claw 8 AI+ gaming handheld with Intel's Lunar Lake Core Ultra CPUs, calling it "the most advanced 8-inch gaming handheld in the market," but a recent CES listing has divulged more details about the upcoming challenger to the likes of the Lenovo Legion Go. For starters, the upgraded battery capacity has been revealed, along with an estimated battery life and performance figures. Supposedly, more information will be revealed about the Claw 8 AI+ at CES 2025, which starts on January 7, 2025.

According to the CES page, the new MSI Claw 8 AI+ will have an 8-inch display and an 82 WHr battery, which will supposedly be able to deliver "4+ hours of gameplay for AAA titles." However, these manufacturer claims are generally to be taken with healthy helpings of salt, especially in when it comes to claims as nebulous as "AAA titles" without any proposed quality settings, specific games, or frame rates. Regarding the display, it wouldn't be surprising to see MSI use the same display as the one found in the Lenovo Legion Go, since there is a somewhat limited selection of 8-inch displays for handheld gaming devices. The MSI Claw 8 AI+ will also use Intel's 2nd-generation ARC iGPUs in conjunction with AI-enhanced graphics, which should provide a healthy uptick in both performance and efficiency, with the CES listing touting 48 TOPS of compute power.

Dell Technologies (NYSE: DELL) continues to make enterprise AI adoption easier with the Dell AI Factory, expanding the world's broadest AI solutions portfolio.Powerful new infrastructure, solutions and services accelerate, simplify and streamline AI workloads and data management.

"Getting AI up and running across a company can be a real challenge," said Arthur Lewis, president, Infrastructure Solutions Group, Dell Technologies. "We're making it easier for our customers with new AI infrastructure, solutions and services that simplify AI deployments, paving the way for smarter, faster ways to work and a more adaptable future."

AMD has claimed the top ten spots in Amazon's best-selling and most wished-for category with its Ryzen processors. The success of AMD's CPUs can be attributed to the competitive pricing, top-tier performance, and overall features provided by Team Red. In its best-sellers category, Amazon lists the following CPUs: AMD Ryzen 7 5700X, Ryzen 5 5600X, Ryzen 7 7800X3D, Ryzen 5 7600X, Ryzen 7 9800X3D, Ryzen 9 5900X, Ryzen 7 5700X3D, Ryzen 7 7700X, Ryzen 7 5800X, Ryzen 5 7600, and Ryzen 5 5500. The first Intel CPU to appear in the list, at the time of writing, is the Intel Core i5-13600KF CPU, sitting in the spot number 12 in the best-selling department.

Another interesting list to look at is the most wished-for, where Amazon shoppers put CPUs on their wishlist and wait for a purchase. The number one most wished-for CPU is the AMD Ryzen 7 9800X3D with 3D V-Cache. The eight spots are occupied by: AMD Ryzen 7 7800X3D, Ryzen 7 5700X3D, Ryzen 9 5900X, Ryzen 7 5800X, Ryzen 7 7700X, Ryzen 5 7600X, Ryzen 9 9900X, and Ryzen 5 5600X. Intel Core i9-14900K CPU currently occupies the number ten spot. This truly shows the enthusiasm of Amazon shoppers towards AMD's CPU offerings and the company's current mindshare. With an increasing market share, AMD is challenging Intel in the CPU department, providing great competition to tech enthusiasts.

Expanding the system's computing capability with an additional accelerator like a GPU is common. However, expanding the system's memory capacity with room for more DIMM is something new. Thanks to ServeTheHome, we see that at the OCP Summit 2024, Lenovo showcased its ThinkSystem SR860 V3 server, leveraging CXL technology and Astera Labs Leo memory controllers to accommodate a staggering 16 TB of DDR5 memory across 128 DIMM slots. Traditional four-socket servers face limitations due to the memory channels supported by Intel Xeon processors. With each CPU supporting up to 16 DDR5 DIMMs, a four-socket configuration maxes out at 64 DIMMs, equating to 8 TB when using 128 GB RDIMMs. Lenovo's new approach expands this ceiling significantly by incorporating an additional 64 DIMM slots through CXL memory expansion.

The ThinkSystem SR860 V3 integrates Astera Labs Leo controllers to enable the CXL-connected DIMMs. These controllers manage up to four DDR5 DIMMs each, resulting in a layered memory design. The chassis base houses four Xeon processors, each linked to 16 directly connected DIMMs, while the upper section—called the "memory forest"—houses the additional CXL-enabled DIMMs. Beyond memory capabilities, the server supports up to four double-width GPUs, making it also a solution for high-performance computing and AI workloads. This design caters to scale-up applications requiring vast memory resources, such as large-scale database management, and allows the resources to stay in memory instead of waiting on storage. CXL-based memory architectures are expected to become more common next year. Future developments may see even larger systems with shared memory pools, enabling dynamic allocation across multiple servers. For more pictures and video walkthrough, check out ServeTheHome's post.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

Today at its inaugural IBM Quantum Developer Conference, IBM announced quantum hardware and software advancements to execute complex algorithms on IBM quantum computers with record levels of scale, speed, and accuracy.

IBM Quantum Heron, the company's most performant quantum processor to-date and available in IBM's global quantum data centers, can now leverage Qiskit to accurately run certain classes of quantum circuits with up to 5,000 two-qubit gate operations. Users can now use these capabilities to expand explorations in how quantum computers can tackle scientific problems across materials, chemistry, life sciences, high-energy physics, and more.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the Hyper 411 Nano, the company's latest iteration of their esteemed Hyper series of CPU air coolers. The Hyper 411 Nano brings a selection of all-new, cutting-edge features to the table, adding on to the already excellent performance of the Hyper series.

Features

• Direct contact technology: Four heat pipes directly connect to the cooling mechanism to ensure efficient, rapid heat transfer.
• All-black aesthetic: A novel all-black look gives the Hyper 411 Nano a modern, sleek feel.
• AMD and Intel compatibility: Specially designed mounting ensures compatibility with all the latest AMD and Intel CPUs.
• Easy fan installation: Included clips makes installing the fan easy.