Intel's Core Ultra 3 205 processor's spec sheet appeared online for a short period of time—members of the Team Blue subreddit discovered an official product page (now removed) and other related details. In part, the discussion focused on the alleged lower-end "Arrow Lake-S" (ARL-S) desktop CPU being "reserved for OEMs." Previously, this SKU's existence was leaked out at various points back in 2024. VideoCardz has kindly preserved the latest set of information, prior to its removal from Intel's official web presence—showing a potential new addition to the Core Ultra 200S (Series 2) lineup.

The Core Ultra 3 205 model appears to slot into a segment previously occupied by (now retired) budget-oriented Pentium and Celeron products—based on the specification sheet listing of a 57 W TDP (aligning with past ratings). The Maximum Turbo Power limit is 76 W. Team Blue has inadvertently revealed that this is an eight-core processor, comprised of four Lion Cove P-Cores and four Skymont E-Cores—so 8 (4P + 4E). The performance-oriented cores can (Max Turbo) boost up to 4.9 GHz, while the efficiency-focused units are capable of reaching up to 4.4 GHz. The on-board AI Boost NPU is rated for a peak rating of 13 TOPS (Int8). The Core Ultra 3 205's GPU seems to only utilize two out of the four available Arc Xe-LPG cores. The product page mentioned that the Core Ultra 3 205 is due for launch in Q1 2025, although the "Market Status = Launched" segment adds to the confusion surrounding this now de-listed SKU.

Samsung Electronics Co., Ltd. today announced the Galaxy S25 Ultra, Galaxy S25+, and Galaxy S25, setting a new standard towards a true AI companion with our most natural and context-aware mobile experiences ever created. Introducing multimodal AI agents, the Galaxy S25 series is the first step in Samsung's vision to change the way users interact with their phone—and with their world. A first-of-its-kind customized Snapdragon 8 Elite Mobile Platform for Galaxy chipset delivers greater on-device processing power for Galaxy AI plus superior camera range and control with Galaxy's next-gen ProVisual Engine.

"The greatest innovations are a reflection of their users, which is why we evolved Galaxy AI to help everyone interact with their devices more naturally and effortlessly while trusting that their privacy is secured," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "Galaxy S25 series opens the door to an AI-integrated OS that fundamentally shifts how we use technology and how we live our lives."

Cadence today announced that MediaTek has adopted the AI-driven Cadence Virtuoso Studio and Spectre X Simulator on the NVIDIA accelerated computing platform for its 2 nm development. As design size and complexity continue to escalate, advanced-node technology development has become increasingly challenging for SoC providers. To meet the aggressive performance and turnaround time (TAT) requirements for its 2 nm high-speed analog IP, MediaTek is leveraging Cadence's proven custom/analog design solutions, enhanced by AI, to achieve a 30% productivity gain.

"As MediaTek continues to push technology boundaries for 2 nm development, we need a trusted design solution with strong AI-powered tools to achieve our goals," said Ching San Wu, corporate vice president at MediaTek. "Closely collaborating with Cadence, we have adopted the Cadence Virtuoso Studio and Spectre X Simulator, which deliver the performance and accuracy necessary to achieve our tight design turnaround time requirements. Cadence's comprehensive automation features enhance our throughput and efficiency, enabling our designers to be 30% more productive."

Shipping manifests at NBD.ltd have revealed the presence of Intel's "Nova Lake" test chips, providing insight into the development timeline of the company's 2026 processor platform. The discovery comes as Intel prepares for the launch of its "Panther Lake" CPUs on the 18A process node in late 2025. Nova Lake is positioned to replace both Panther Lake for mobile devices and "Arrow Lake" for desktop systems. The manufacturing process remains unconfirmed, with Intel potentially using either its in-house 14A node or TSMC's 2 nm technology. Following recent practices, Intel may split production between its own facilities and TSMC for different components. Rumored specifications show that Nova Lake will use Coyote Cove performance cores and Arctic Wolf efficiency cores.

Unlike Lunar Lake, it will not incorporate on-package memory, maintaining a more conventional design approach. The test chip's appearance suggests Intel is adhering to its development schedule. This timing aligns with the company's plans for Panther Lake's mass production in the second half of 2025, a structured transition between generations. Documents point to "Razor Lake" as Nova Lake's eventual successor, though detailed specifications are not yet available. Panther Lake, the immediate predecessor to Nova Lake, will focus primarily on mobile computing, with desktop variants limited to Mini PC implementations. This approach mirrors the Meteor Lake generation, which saw limited desktop release through the "PS" series for Edge platforms. The Nova Lake platform is expected to support DDR5 memory and may introduce PCIe Gen 6.0 compatibility, with final specifications unconfirmed.

Thermal Grizzly's Duronaut thermal paste stands out due to its combination of exceptional long-term stability and excellent thermal conductivity. Its outstanding performance in heat transfer is further enhanced by the ability to apply Duronaut in an extremely thin layer. This is made possible by its unique composition of aluminium microparticles and zinc oxide nanoparticles, optimized for particle shapes and sizes. These features ensure excellent adhesion of the paste to the surface. The powders are mixed into a specially developed silicone oil, resulting in extraordinary long-term stability.

For optimal application, the high-end thermal paste comes with the new TG Spatula Pro. The redesigned spatula allows for more pressure to be applied to the surface during application, enabling the paste to be spread more efficiently in a thinner layer. Duronaut is available in 2-gram and 6-gram packaging options.

Alphacool presents the Apex 1, the first CPU water cooler in the Apex series. It combines maximum cooling performance, exceptional design, and a high-quality selection of materials. The Apex 1 integrates the proven cross-slot technology with the new 3D-Jetplate 2.0, ensuring optimal cooling performance for both AMD and Intel processors of the latest generation. A pre-chamber in front of the 3D-Jetplate 2.0 smooths the incoming water flow and evenly distributes it across the Jetplate and the copper base's cooling fins. Both the copper base and the brass connector part are precisely CNC-machined to guarantee top-notch manufacturing quality.

Alphacool offers two versions of the cooler. The AMD AM5 version features an offset cooler base, which does not sit centrally on the CPU. Instead, it is positioned to direct the water injection right above the CPU hotspot. The Intel version has a centrally positioned cooler base that covers the entire CPU. Both versions ensure outstanding cooling performance. The cooler's design is made to fully cover the CPU socket and mounting holes. This does not affect the installation, which remains incredibly simple. Additionally, the coolers come equipped with aRGB lighting, positioned both on the top and on the side towards the RAM, perfectly complementing the design.

ASUS today announced the ExpertBook B3 series, an all-new lineup of AI-powered laptops that offers extensive customization to empower daily business needs. Equipped with up to the latest Intel Core Ultra 7 processor (Series 2) with Intel vPro, Intel AI Boost NPU and Intel Arc graphics, ExpertBook B3 delivers solid performance to tackle a wide range of tasks seamlessly. These new laptops also feature powerful AI tools such as ASUS AI ExpertMeet], Microsoft Copilot and AI noise-canceling technology, delivering unmatched productivity experiences.

With a build that's as lightweight as 1.4 kg, a 180° lay-flat hinge, military-grade durability, comprehensive connectivity, and advanced security features, the latest ExpertBook B3-series AI PCs ensure flexibility and efficiency on the go. In addition, with long battery life, exceptional visuals and audio, and an eco-friendly design, ExpertBook B3 series supports streamlined workflows - keeping employees productive, wherever they work.

Intel product change notification documents—published on January 6—have revealed the planned "End of Life" (EOL) phasing out of 12th Generation "Alder Lake" mobile processor models. Tom's Hardware has pored over the listed products/SKUs and concluded that the vast majority of Team Blue's mobile-oriented Alder Lake selection are destined for retirement. Team Blue's HX series is being kept alive for a little while longer. Two documents show differing "discontinuance timelines" for their respective inventories—including lower-end Celeron and Pentium Gold SKUs, as well as familiar higher-up Core i3, i5, i7, and i9 families. U, P, H and HK-affixed models are lined up for the chopping block.

Intel's 13th Generation "Raptor Lake" mobile processor selection—comprised of Core 100 (series 1) and Core 200 (series 2)—offers similar silicon makeup. Many equivalent alternatives to older generation "Alder Lake" chips reside here—Tom's Hardware presented a key example: "i5-1235U, which is designated for thin and lightweight laptops. OEMs can instead opt for the i5-1335U, the Core 5 120U, or the Core 5 220U, as they're just better bins of the 1235U on the same FCBGA1744 socket." A significant number of Alder Lake mobile SKUs will be available to OEMs for ordering up until 26 April, with final shipments heading out on 25 October. The rest have been assigned a July 25 order cut-off date, with final shipments scheduled on 26 January 2026.

The list of mini PCs available on the market has grown quite a bit in the past few weeks, with a bunch of such systems getting unveiled at CES 2025. Now, Gigabyte clearly does not wish to be left out of the party either, and has unveiled its Brix Extreme mini PC powered by a last-gen, but decently powerful AMD "Hawk Point" APU and a plethora of connectivity options in a compact package.

The system, as mentioned, boasts the 28-watt Ryzen 7 8840U PRO APU, which sports 8 Zen 4 cores and 16 threads. Performance should be identical to its non-PRO counterpart, which should put it roughly in the same class as the Intel Core Ultra 256V "Lunar Lake" CPU. The APU is paired with up to 64 GB of DDR5-5600 memory. Dual M.2 2280 slots take care of storage requirements, both of which are user-accessible.

Qualcomm is becoming serious about its server CPU ambitions. Today, we have learned that Sailesh Kottapalli, Intel's former chief architect for Xeon server processors, has joined Qualcomm as Senior Vice President after 28 years at Intel. Kottapalli, who announced his departure on LinkedIn Monday, previously led the development of multiple Xeon and Itanium processors at Intel. Qualcomm's data center team is currently working on reference platforms based on their Snapdragon technology. The company already sells AI accelerator chips under the Qualcomm Cloud AI brand, supported by major providers including AWS, HPE, and Lenovo.

This marks Qualcomm's second attempt at entering the server CPU market, following an unsuccessful Centriq effort that ended in 2018. The company is now leveraging technology from its $1.4 billion Nuvia acquisition in 2021, though this has led to ongoing legal disputes with Arm over licensing terms. While Qualcomm hasn't officially detailed Kottapalli's role, the company confirmed in legal filings its intentions to continue developing data center CPUs, as originally planned by Nuvia.

Courtesy of serial leaker @momomo_us, who dug up the product pages for Intel's two new retail boxed CPU coolers, we now know what they'll look like ahead of them shipping. The two coolers are known as the Laminar RH2 and Laminar RM2, with the RH2 being the higher-end model of the two. The RH2 has a copper heat column that attaches to aluminium fins and it's decorated with an aRGB LED ring, as well as a white Intel LED logo. It stands 71 mm tall from the base of the heatsink to the top of the fan and is overall 103 x 103 mm and it weighs in at 450 grams. It's rated for CPUs up to 65 W TDP and the fan operates between 1000 and 3000 rpm and supports variable speed via PWM control. It will output 23 dBA at 1600 RPM with the CPU at 40 degrees C, according to the specs. It appears to come with some kind of back plate and it's screwed in place. It will only ship with the Intel Core Ultra 9 Processor 285 for now.

The much more basic RM2 cooler is designed for 65 W TDP CPUs and it measures 100 x 100 mm, but it only stands 47 mm tall. Here only the base of the cooler is made out of copper, the fins are once again made from aluminium and this results in a lower weight of 340 grams. The fan speed range is 600 to 3250 rpm and we're looking at a PWM controlled fan here too. The downside is that the fan has to run at 2400 rpm to produce the same 40 degrees at the inlet with a 65 W CPU underneath it, which results in a noise level of 30 dBA, which is a lot louder than the RH2. Unlike the RH2, the RM2 uses standard Intel socket push-pins for mounting. The RM2 will ship with the Intel Core Ultra 5 Processor 225, 225F, 235, 265 and 265F CPUs, but according to the product page, it will also ship with some Core Ultra 7 desktop chips. Both coolers come with a three-year warranty. Design wise, both of the new coolers are a lot less flashy compared to the previous generation of Intel CPU coolers.

Today's gamers are not just players; we are the innovators and leaders of tomorrow's workforce. As someone who recognizes the incredible potential within our gaming community, I'm committed to supporting your journey both in and out of the game. In our latest announcements focusing on the future of play and work, we've shared exciting updates across various fronts, including some major innovations in gaming. I'm thrilled to introduce even more gear designed to enhance your gaming experience. From the powerful OMEN 16 Laptop and the compact OMEN 16L Desktop to our stunning new OMEN displays and precise HyperX mice, I can't wait to dive into the details and show you how these products will elevate your play and keep you ahead of the curve. We're not just creating innovations; we're shaping the future of play.

Power and Performance for All: The OMEN 16 Laptop and OMEN 16L Desktop
At HP, your feedback is our guiding star. You told us you want smooth, immersive gameplay on machines that stay cool and quiet; we created the third-generation OMEN 16 to be our coolest and quietest version yet. The OMEN 16 elevates your gaming experience with cutting-edge technology and thoughtful design, keeping performance at its peak. Let's dive into the technical specifics.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

ASUS today announced its latest all-in-one (AIO) liquid CPU cooler, the ROG Ryuo IV SLC 360 ARGB, at CES 2025. This new addition expands the comprehensive ASUS AIO cooler lineup, catering to the diverse needs of gamers, creators, and PC enthusiasts. These advanced solutions offer exceptional thermal performance, streamlined installation, and customizable aesthetics, ensuring optimal cooling for all types of builds. Fully compatible with the latest AMD and Intel 800 series motherboards, ASUS AIO coolers deliver unmatched performance and style.

From the premium ROG Ryuo IV SLC 360 ARGB for pristine BTF setups to the professional-grade ProArt LC 420 for demanding workstations, ASUS offers unparalleled versatility. The ASUS AIO cooler, when paired with a compatible ASUS motherboard, unlocks the full potential of the system, enabling seamless synchronization of RGB lighting, precise fan speed adjustments, and real-time monitoring of CPU statistics through the Armory Crate software.

Expanding its AI PC leadership, Qualcomm Technologies, Inc. announced the Snapdragon X Platform, the 4th platform to join the Snapdragon X Series compute portfolio, designed to deliver performance, multi-day battery life, and Copilot+ PC experiences for even more users globally.

Redefining the PC Category for Mainstream Devices at $600
Utilizing the power of an 8-core Qualcomm Oryon CPU, Snapdragon X is delivering essential performance to the next-generation of PCs. This platform delivers up to 163% faster performance at ISO-power than our competitors who also require 168% more power at ISO-performance, the Snapdragon X processor balances performance and built-in intelligence with a 45 TOPS NPU that runs Copilot+ PC experiences more efficiently. With an integrated power efficient GPU, Snapdragon X supports dynamic graphics ideal for creating presentations, web browsing, or streaming content. Snapdragon X is an ideal solution for students, freelance workers, and budget-conscious consumers who need a reliable and powerful laptop that can keep up with their busy lives. Devices powered by Snapdragon X are expected to be available from leading OEMs including Acer, ASUS, Dell Technologies, HP and Lenovo in early 2025 enabling Copilot+ PCs in the $600 range.

The mobile cavalry has landed with the introduction of Area-51 laptops. These 18-inch and 16-inch laptops have an acute focus on power, performance and innovative engineering in a new otherworldly design language. Like its desktop counterpart, Area-51 laptops are an expression of maximum performance that cater to gamers seeking the preeminent gaming experience.

Armed to the nines with next-gen high-performance technology and enveloped in our brand-new industrial design, Area-51 symbolizes the next act for Alienware.

• Elite Performance: Area-51 unleashes 280 W of power on next-gen NVIDIA graphics and a next-gen Intel Ultra CPU - this is the upper limit of performance on any gaming laptop, period.
• Robust Thermals: A new intricate thermal architecture enables Area-51 to move up to 35% more air through the system while being 15% quieter.
• Sophisticated Design: Area-51 laptop design exudes a mysterious identity that invokes curiosity while elevating comfort and functionality.

Today at CES 2025, future business leaders will be wowed by new and powerful AI PCs and solutions from HP Inc. that empower them to collaborate and lead like never before.

Working with Purpose to Drive Impact
As the work landscape evolves, so do expectations for technology. That's why HP meticulously designed its latest lineup of commercial next-gen AI PCs to give professionals the right tools for their unique work experiences. With HP's newest EliteBooks, fast presentation creation, personalized emails, and a built-in recording studio are possible with just a simple click of a button, alongside built-in security and intelligence thanks to Wolf Security.

Intel has ceased production of its basic RS1 Laminar CPU cooler, marking the end of its most affordable cooling solution. The RS1, which debuted alongside Intel's 12th-generation processors in 2021, represented a modest upgrade from earlier stock coolers. Its aluminium construction and 47 mm profile, coupled with a redesigned five-blade fan, delivered adequate cooling for 65-watt processors despite its lightweight 260-gram build. The decision to discontinue the RS1 appears largely driven by its limited application scope. The cooler shipped exclusively with two dual-core processors: the Pentium Gold G7400 and Celeron G6900. With both chips operating at a modest 46 W TPD, the basic cooling capacity of the RS1 proved sufficient but ultimately too specialized for broader market demands.

Moving forward, Intel will rely on its RM1 cooler as the primary replacement. The RM1 shares similar dimensions with the RS1 but incorporates a copper base plate for enhanced thermal transfer and features an LED accent light. Intel recently launched the Intel Processor 300, essentially a rebranded Pentium G7400, shipped with the RM1 cooler, suggesting the company had already begun phasing out the RS1. The RM1 now serves as Intel's standard cooling solution across most of its locked CPU lineup, from Core i3 through Core i7 processors in the 12th through 14th generations. This standardization will help the company cut costs, focusing on products with broader compatibility and market appeal. For users and system builders, the change should have minimal impact, as the RM1 offers superior cooling capabilities compared to its discontinued predecessor.

Recent sales data (nicely complied by VideoCardz) from one of the largest German retailers, Mindfactory, has revealed that the AMD Ryzen 7 9800X3D processor has achieved higher unit sales than all Ryzen 9000 processors combined. Despite its later market entry, the eight-core 9800X3D CPU has reached 8,650 units sold, surpassing the combined sales of the earlier-released standard Ryzen 9000 processors. For comparison, the entire non-X3D Ryzen 9000 lineup, including the Ryzen 9 9950X, 9900X, Ryzen 7 9700X, and Ryzen 5 9600X, has accumulated fewer total sales through the same retailer. The flagship Ryzen 9 9950X alone accounts for just 780 units, while the Ryzen 9 9900X and Ryzen 5 9600X have moved 810 and 890 units, respectively, while the second-best selling 9000 series SKU was Ryzen 7 9700X with 2,510 units sold. However, the 9800X3D's market performance still falls significantly short of its predecessor. The previous generation Ryzen 7 7800X3D maintains a massive lead with 78,420 units sold through the same retailer.

AMD is preparing to expand its X3D lineup with several new models. The six-core Ryzen 5 9600X3D is scheduled for release, along with 12-core Ryzen 9 9900X3D and 16-core Ryzen 9 9950X3D variants expected later this month. Based on previous generation sales patterns, where higher-core models saw lower adoption rates, these upcoming high-end processors may face similar market dynamics. Of course, these sales figures are only a part of the story as Mindfactory is only a single retailer across a diverse set of sellers, so the complete market picture is unknown to anyone but AMD. PC upgrade cycles are a common bottleneck in new CPU sales, especially as consumers don't tend to upgrade their PCs every year with new CPUs and platforms. We have to wait and see how the market adapts to new X3D SKUs, and if the Zen 5 X3D CPUs can reach the previous generation fame among consumers.

Intel has officially announced its presence at CES 2025, teasing what appears to be a significant focus on AI capabilities in its upcoming processor lineup. The tech giant shared a preview image featuring their tagline "AI Inside for a New Era." The announcement suggests that the company will be showcasing new developments in AI processing capabilities integrated directly into their consumer processors. Intel's upcoming lineup is expected to feature the mobile-focused "Arrow Lake" Core Ultra 200H/HX processors alongside the Arrow Lake-based Core Ultra 200S series designed for desktop systems with 35 W and 65 W power configurations. The company is also supposedly introducing new mid-range and workstation-class 800-series processors for desktop platforms.

The "AI Inside" messaging indicates that Intel is positioning itself to compete more aggressively in the AI computing space, particularly as PCs increasingly handle AI workloads locally. While specific details about the presentation remain under wraps, we can anticipate announcements regarding new Arrow Lake configurations, enhanced AI capabilities, and possibly new partnerships or software ecosystems designed to leverage these features. The keynote could also shed light on Intel's strategy for maintaining competitiveness in an increasingly AI-focused computing landscape. Michelle Johnston Holthaus, interim co-CEO, and Jack Weast, an Intel Fellow and VP of Intel Automotive, will deliver the live keynote. Intel's agenda also shows next-generation AI silicon so we can get information on accelerators like Falcon Shores.

AMD's upcoming Ryzen AI Kraken Point APUs appear to be affordable APUs for next-generation thin-and-light laptops and potentially even some gaming handhelds. Murmurings of these new APUs have been going around for quite some time, but a PassMark benchmark was just posted, giving us a pretty comprehensive look at the hardware configuration for the upcoming Ryzen AI 7 350. While the CPU configuration in the PassMark result confirms the 4+4 configuration we reported on previously, it seems as though the iGPU portion of the new Ryzen AI 7 is getting something of a downgrade compared to previous generations.

While all previous mobile Ryzen 7 and Ryzen 9 APUs have featured the Radeon -80M or -90M series iGPUs, the Ryzen AI 7 350 steps down to the AMD Radeon 860M. Although not much is known about the new iGPU, it uses the same nomenclature as the Radeon iGPUs found in previous Ryzen 5 APUs, suggesting it is the less performant of the new 800 series iGPUs. This would be the first time, at least since the introduction of the Ryzen branding, that a Ryzen 7 CPU will use a cut-down iGPU. This, along with the 4+4 (Zen 5 and Zen 5c) heterogenous architecture, suggests that this Ryzen 7 APU will prioritize battery life and thermal performance, likely in response to Qualcomm's recent offerings. Comparing the 760M to the single 860M benchmark on PassMark reveals similar performance, with the 860M actually falling behind the average 760M by an average of 9.1%. Take this with a grain of salt, though, since there is only one benchmark result on PassMark for the 860M.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

Ever since AMD introduced Strix Point, enthusiasts like ourselves have been eagerly awaiting details regarding the high-end Strix Halo APUs with integrated graphics that are rumored to be powerful enough for the system to not require discrete graphics at all. Leaks regarding the upcoming performance mobile APU lineup have been trickling out steadily, and a fresh new Geekbench leak reveals the CPU performance of the Ryzen AI+ Max 395 APU, which boasts a 16-core configuration consisting entirely of Zen 5 cores, unlike Strix Point which features a mix of Zen 5 and the smaller Zen 5c cores. And oh dear, are the numbers ever so lucrative.The APU managed to rake in 2,849 points in the single-core department, and a whopping 20,708 points in multicore. As Videocardz correctly notes, this result is far ahead of AMD's current top-end mobile offering, the Ryzen 9 7945HX3D, which manages around 16,900 points in the multicore test. In single-core, however, the Ryzen 9 7945HX3D does edge ahead, with around 2,900 points. That said, the ROG Flow Z13 laptop that the APU was housed in is most likely still in the testing phase, so it is entirely possible that the final product will sport even better performance. That being said, the Apple M4 Max SoC, however, remains in a league of its own with 3,800 points in single-core and a shocking 25,000 points in multicore. With CES 2025 just around the corner, it's only a matter of weeks before the Ryzen AI Max+ lineup finally sees the light of day and reaches our hands.

NVIDIA is taking the wraps off a new compact generative AI supercomputer, offering increased performance at a lower price with a software upgrade. The new NVIDIA Jetson Orin Nano Super Developer Kit, which fits in the palm of a hand, provides everyone from commercial AI developers to hobbyists and students, gains in generative AI capabilities and performance. And the price is now $249, down from $499.

Available today, it delivers as much as a 1.7x leap in generative AI inference performance, a 70% increase in performance to 67 INT8 TOPS, and a 50% increase in memory bandwidth to 102 GB/s compared with its predecessor. Whether creating LLM chatbots based on retrieval-augmented generation, building a visual AI agent, or deploying AI-based robots, the Jetson Orin Nano Super is an ideal solution to fetch.

In Win Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, had introduced its new AR36 (360 mm) AIO liquid cooler featuring an "infinity Mirror" design, compatible with both AMD and Intel platforms.

Infinity Mirror Block
The ARGB-infused CPU block features an infinity mirror design on the front, showcasing radiant light reflections that create an infinite, vibrant, and colorful glow from every angle. Inside, high-density microchannel fins in the copper baseplate efficiently draw heat away from even the hottest processors, minimizing the temperature delta to unlock maximum headroom for sustained thermal boost clock speeds. The pump is equipped with a three-phase, six-pole motor, ensuring consistently high performance with reduced noise during operation.