Earlier today, three of Intel's South Korean authorized distributors announced the introduction of Raptor Lake-R-based "Value Pack Genuine" buying options—Danawa's news section stated that the involved companies are: PC Direct, Coit, and Intec & Company. The newly revealed "reasonably priced" packages will contain 14th Generation Core i5-14600KF or i5-14400F processors. A photo preview (see below) showcases very plain blue retail boxes (with no logo), adorned with information-carrying stickers. The freshly unveiled "Value Pack (genuine product)" designs are region exclusive (for the moment); seemingly slotting somewhere in-between Intel's traditional "Boxed" retail and barebones "Tray" processor offerings.

According to the Danawa report, one of the local distributors stated: "this is a very meaningful moment as it is the first time that an official Intel value pack has been released in Korea. We are pleased to offer a more reasonable price while maintaining the same warranty period and standards as existing genuine products. We hope that this release will allow more consumers to upgrade their PCs without burden." Western news sites have highlighted the Core i5 14600KF Value Pack's cheapest available price point (identified via the Danawa comparison engine); KRW 284,540 (~$199 USD). The traditional "Boxed" retail equivalent goes for KRW 295,700 (~$207 USD), while the barebones "Tray" (OEM-oriented) package is priced at KRW 261,200 (~$183 USD). Tom's Hardware checked out the new offering's Batch # and Serial # codes: "on Intel's warranty information page, (it) said that the ATPO (Batch #) we listed indicated that it was a tray processor...We'd like to believe the numbers on the image were just placeholders that belong to a tray processor, or that Intel RMAs in South Korea are all handled by its distributors." Danawa's news piece repeatedly claims that the two new options offer lower pricing compared to "existing genuine box products," but come with the "same genuine warranty" terms.

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

Intel today showcased how Intel Xeon 6 processors with Efficient-cores (E-cores) have dramatically accelerated time-to-market adoption for the company's solutions in collaboration with the ecosystem. Since product introduction in June 2024, 5G core solution partners have independently validated a 3.2x performance improvement, a 3.8x performance per watt increase and, in collaboration with the Intel Infrastructure Power Manager launched at MWC 2024, a 60% reduction in run-time power consumption.

"As 5G core networks continue to build out using Intel Xeon processors, which are deployed in the vast majority of 5G networks worldwide, infrastructure efficiency, power savings and uncompromised performance are essential criteria for communication service providers (CoSPs). Intel is pleased to announce that our 5G core solution partners have accelerated the adoption of Intel Xeon 6 with E-cores and are immediately passing along these benefits to their customers. In addition, with Intel Infrastructure Power Manager, our partners have a run-time software solution that is showing tremendous progress in reducing server power in CoSP environments on existing and new infrastructure." -Alex Quach, Intel vice president and general manager of Wireline and Core Network Division

LG Electronics USA (LG) today announced pricing and pre-order availability of its 2025 AI-enabled LG gram lineup, the company's first on-device AI-laptops powered by Intel Core Ultra Series 2 CPUs. Introduced at CES 2025, the new lineup includes the LG gram Pro Z90TP ($1999 to $2399), LG gram Pro Copilot+PC Z90TS ($1849 to $2399), LG gram Pro 2-in-1 T90TP ($1999 to $2399) and LG gram Copilot+PC Z90TL ($1999 to $2399). Leveraging LG's gram AI technology, and cloud AI capabilities powered by GPT-4o, these laptops deliver impressive hybrid AI performance while preserving the LG gram's iconic slim and lightweight design.

Throughout the duration of the pre-order period (Feb. 24, 2025 to March 23, 2025), customers will receive an LG gram +view IPS portable monitor (349.99 value) at no additional cost and $200 savings on select models. All standard terms of purchase apply.

Intel has updated its 18A node website with the message, "Intel 18A is now ready for customer projects with the tape outs beginning in the first half of 2025: contact us for more information." The contact hyperlink includes an email where future customers can direct their questions to Intel. Designed as a turnaround node for Intel, 18A carries industry-leading features like SRAM density scaling comparable with TSMC's N2, 15% better performance per watt, and 30% better chip density vs. the Intel 3 process node used in Intel Xeon 6, as well as PowerVia backside-power delivery to increase transistor density.

Other features like RibbonFET are the first to replace FinFET transistors, making gate leakage a tighter control. Interestingly, Intel's first products to use the 18A node are client CPUs "Panther Lake" and "Clearwater Forest" Xeon CPUs for data centers. External Intel Foundry customers using the 18A node include Amazon's AWS, Microsoft for its internal silicon for Azure, and Broadcom exploring 18A-based designs. The process of gaining customers for advanced manufacturing is complex, as many existing Samsung/TSMC customers are not risking their capacity and contracts with established advanced silicon makers. However, if Intel's first few customers prove successful, many others could flock over to Intel's fabs as geopolitical tensions are questioning whether the current models of the semiconductor supply chain are feasible in the future. If US companies and startups decide to move with Intel for their chip manufacturing, Intel could experience a complete recovery.

We have noticed an uptick of AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D-related leaks in mid-to-late February; suggesting an imminent launch. Officially, a Q1 release window was set by Team Red leadership during their CES 2025 presentation, and further disclosures pointed to a loose March window. Earlier today, Golden Pig Upgrade disclosed NDA-busting information—the veteran leaker believes that AMD will be lifting global Ryzen 9 9950X3D CPU review embargoes on March 11. VideoCardz jumped on this unofficial announcement, and reached out to industry insiders. The anonymous contacts reported back; they allege that a March 12 retail release is on the cards.

It is believed that the 16-core and 12-core X3D-equipped "Granite Ridge" Ryzen 9 desktop chips will roll out on the same day (March 12). Coincidentally, Golden Pig Upgrade reckons that Intel's Core Ultra 200HX "Arrow Lake" mobile processor series will launch alongside Team Red's high-end gaming duo. The latter two are touted to attract the majority of press attention on day one. As pointed out by VideoCardz, the release of Radeon RX 9070 GPUs is—speculatively—scheduled a week in advance of AMD's expansion of its Ryzen 9000X3D lineup. Early last week, price points were leaked—courtesy of accidental Newegg listings: $699.99 for the Ryzen 9 9950X3D, and $599.99 for the 12-core Ryzen 9 9900X3D.

Navigating AMD's various modern processor model naming schemes is tricky business, and another layer of complexity has been added this week; with newly revealed "Strix Point" and "Krackan Point" CPUs. Three previously unannounced SKUs have appeared on AMD's Chinese website: Ryzen AI 9 H 365, Ryzen AI 7 H 350, and Ryzen AI 5 H 340. At first glance, these models codes seem to be familiar—after a double take, we see a small difference in nomenclature. The addition of a middle-placed/detached "H" has press outlets and hardware enthusiasts scratching their collective heads. After discovering Team Red's Ryzen AI 9 H 365 APU listing, Lonely City Hardware posted a humorous observation on social media: "for the Chinese market. No one can remember the full name."

Frustratingly, Western search engines (at the time of writing) just point you to the non-H equivalents. The "H" designation denotes Chinese market exclusivity; TechPowerUp has covered previous-generation examples in the recent past. When comparing technical details and specification sheets to Western equivalents, VideoCardz noted that there were no apparent differences—platform and packaging are the same (FP8). A cross-reference—of clock speeds, thermal ratings, and core architecture (Zen 5/Zen 5C)—points to spec parity across East and West variants.

Loongson Technology has announced its next-generation 3B6600 processor—according to recent Chinese press reports, early details were disclosed in "investor relations activity" documentation. Their eight-core design is still in development, with the fabless company (allegedly) setting some lofty performance goals. According to a MyDrivers report (citing Fast Technology), the 3B6600 processor's single-core and multi-core "high level" performance is touted to match that of Core i5 and i7 offerings from Intel's 12th and 13th Generation portfolios. In the past, Loongson has compared its older products to Western equivalents. Last year, their 3A6000 chip design was mentioned in the same sentence as "AMD Zen 4 and Intel Raptor Lake" processor families. Around November 2023, reports had it approximating Team Blue Core i3-10100 "Comet Lake" CPU performance.

The next-gen 3B6600 CPU is supposedly using its predecessor (3A6000) as a springboard; MyDrivers believes that the same in-house LoongArch ISA design (fabricated on 12 nm/14 nm) will be revisited. The publication highlighted a significant area of optimization: "single-core performance of 3B6600 is expected to be in the world's leading ranks...Loongson 3B6600 will continue to use mature technology, and the architecture core will be upgraded to the new LA864. The same frequency performance is greatly improved by about 30%, compared with the Loongson 3A6000's LA664 architecture." Loongson engineers are reportedly targeting a maximum turboboost frequency of 3.0 GHz, but under normal operation the 3B6600 chip is predicted to offer a main frequency of 2.5 GHz. The new design will integrate a new "LG200 GPGPU" graphics computing core—additionally, supported standards include: DDR5 memory, PCIe 4.0 bus, and HDMI 2.1.

AMD's Ryzen 9 9950X3D and Ryzen 9 9900X3D "Zen 5" processors are due for launch next month, but an exact date has not been announced. Currently, Team Red's 3D V-Cache-equipped Ryzen 9000 CPU series is composed of a single SKU: the popular eight-core Ryzen 7 9800X3D model. A new leak points to a possible imminent lineup expansion; the sixteen-core Ryzen 9 9950X3D and twelve-core Ryzen 9 9900X3D CPUs have finally popped up on Geekbench Browser. Both candidates seemed to be tested on the same PC platform; utilizing a GIGABYTE X670 AORUS ELITE AX motherboard and 32 GB (2 x 16 GB) of DDR5-4800 MT/s RAM. Notebookcheck

The Ryzen 9 9950X3D sample scored overall with 3363 (single-core) and 20,465 points (multi-core) in Geekbench 6.3. As expected, the Ryzen 9 9900X3D candidate's overall tallies came in slightly lower—it achieved 3274 (single-core) and 19,227 points (multi-core) overall. Press outlets were quick to compare these figures to prior generation outputs (refer to Wccftech's chart, below). On average, the incoming "Zen 5" parts surpass "Zen 4" equivalents by an average of 15%—in terms of single-core performance. Multi-core performance improvements are less significant; coming in at an average of 7%. The range-topping Ryzen 9 9950X3D CPU's multi-core performance score is "lower than expected," but closer-to-launch optimizations could rectify this matter. Geekbench results often do not reflect the true potential of tested silicon; gamers tend to dismiss or completely ignore these data points. Last month, an AMD executive revealed that the two upcoming X3D Granite Ridge desktop chips: "will provide similar overall gaming performance to the Ryzen 7 9800X3D." Speculative price points—of $699 (16-core) & $599 (12-core)—leaked online last week.

EK, the premium liquid cooling manufacturer, is proud to announce the latest generation of EK-Quantum Velocity³ CPU water blocks. Offering universal compatibility for both AMD AM5 and Intel LGA 1700 / 1851 sockets, the EK-Quantum Velocity³ features a fully customizable configuration that allows you to rotate, adjust, and reposition the internal components, heat spreader, and ports - ensuring high-performance liquid cooling that's perfectly optimized for your build.

Universal Intel & AMD Platform Compatibility
The EK-Quantum Velocity³ offers a new level of compatibility with design that allows you to interchange between Intel LGA 1700 / 1851 & AMD AM5 with a few simple adjustments. When choosing your platform, simply align the jet plate alignment based on the Intel or AMD socket, reposition the cold plate and attach the LGA or AM5 mounting bracket - it's that simple. This design ensures universal compatibility, offering high performance liquid-cooling that's future proofed should you wish to change platform when upgrading your PC.

The days of 32-bit software support in NVIDIA's drivers are coming to an end, and with that, so does the support for the once iconic PhysX real-time physics engine. According to NVIDIA's engineers on GeForce forums, the lack of PhysX support has been quietly acknowledged, as NVIDIA's latest GeForce RTX 50 series of GPUs are phasing out support for 32-bit CUDA software, slowly transitioning the gaming world to the 64-bit software entirely. While older NVIDIA GPUs from the Maxwell through Ada generations will maintain 32-bit CUDA support, this update breaks backward compatibility for physics acceleration in legacy PC games on new GPUs. Users running these titles on RTX 50 series cards may need to rely on CPU-based PhysX processing, which could result in suboptimal performance compared to previous GPU generations.

A Reddit user reported frame rates dropping below 60 FPS in Borderlands 2 while using basic game mechanics with a 9800X3D CPU and RTX 5090 GPU, all because 32-bit CUDA application support on Blackwell architecture is depreciated. When another user booted up a 64-bit PhysX application, Batman Arkham Knight, PhysX worked perfectly, as expected. It is just that a massive list of older games, which gamers would sometimes prefer to play, is now running a lot slower on the most powerful consumer GPU due to the phase-out of 32-bit CUDA app support.

AMD's "Strix Halo" APU, marketed as Ryzen AI Max+, has just been exposed in die-shot analysis. Confirming the processor's triple-die architecture, the package showcases a total silicon footprint of 441.72 mm² that integrates advanced CPU, GPU, and AI acceleration capabilities within a single package. The processor's architecture centers on two 67.07 mm² CPU CCDs, each housing eight Zen 5 cores with a dedicated 8 MB L2 cache. A substantial 307.58 mm² I/O complements these die that houses an RDNA 3.5-based integrated GPU featuring 40 CUs and AMD's XDNA 2 NPU. The memory subsystem demonstrates a 256-bit LPDDR5X interface capable of delivering 256 GB/s bandwidth, supported by 32 MB of strategically placed Last Level Cache to optimize data throughput.

The die shots reveal notable optimizations for mobile deployment, including shortened die-to-die interfaces that reduce the interconnect distance by 2 mm compared to desktop implementations. Some through-silicon via structures are present, which suggest potential compatibility with AMD's 3D V-Cache technology, though the company has not officially confirmed plans for such implementations. The I/O die integrates comprehensive connectivity options, including PCIe 4.0 x16 lanes and USB4 support, while also housing dedicated media engines with full AV1 codec support. Initial deployments of the Strix Halo APU will commence with the ASUS ROG Flow Z13 launch on February 25, marking the beginning of what AMD anticipates will be broad adoption across premium mobile computing platforms.

ASUS Republic of Gamers (ROG) announced that the 2025 ROG Flow Z13 is now available for pre-order. This versatile gaming 2-in-1 can feature up to AMD's newest AMD Ryzen AI Max+ 395 Processor with Radeon 8060S Graphics and a unified memory structure, allowing for incredible performance and power efficiency. A new stainless steel and copper vapor chamber, larger intake vents, and 2nd Gen Arc Flow Fans offer 70% more airflow for quiet and efficient cooling.

This 13-inch tablet boasts a stunning ROG Nebula Display, a 2.5K resolution 180 Hz touchscreen with 500 nits of peak brightness, and Corning Gorilla Glass 5 protection. The Flow Z13 now also features a larger 70Wh battery, a larger touchpad and keycaps, and a convenient Command Center button for quick access to vital system functions. With dual USB-C ports, both of which support USB4 and power delivery, as well as a dedicated HDMI 2.1 port, the Flow Z13 lets gamers leave their dongles at home.

AMD's openSIL project, aimed towards open CPU silicon initialization code, continues progressing despite a slight delay in its development timeline. The initiative, which will eventually replace the current AGESA system across AMD's client and server processors, received a new update. The company initially targeted the end of 2024 to release proof-of-concept code for Phoenix client SoCs and Turin server hardware. However, as we move through the first quarter of 2025, AMD has acknowledged a slight deviation from this schedule. In a recent statement, AMD representatives assured the developer community that work continues steadily on both Phoenix and Turin proof-of-concept releases.

"We are hard at work preparing the Phoenix and Turin POC's for public release," stated an AMD representative, emphasizing that these releases will serve as sample code previewing future production-worthy implementations. The company clarified that these initial releases are not intended for production environments. The delay has minimal impact on AMD's plan, as the primary goal remains focused on achieving full production readiness with the upcoming Zen 6 architecture. The openSIL project promises to enhance Coreboot support and provide developers with full access to low-level system components. Though limited to select reference motherboards, the proof-of-concept releases will serve as the first milestones in AMD's journey toward more open hardware solutions.

ASUS's Republic of Gamers China account on Weibo has teased the ROG Magic X mobile device that combines laptop/tablet form with a detachable keyboard. Inside, the device is powered by AMD Ryzen AI MAX+ SoC, which ASUS called a "three-in-one" chip, mainly due to its CPU, NPU, and iGPU combination. One possible SKU for ROG Magic X is AMD's top-end Ryzen AI MAX+ 395 processor. Carrying 16 "Zen 5" cores and 32 threads, the chip is designed for AI-enhanced laptops with 126 combined TOPS of AI processing power. The Ryzen AI MAX+ 395 features 64 MB of L3 cache and operates at a base clock of 3 GHz, with boost capabilities up to 5.1 GHz, depending on workload conditions. Manufactured on TSMC's 4 nm process node, the processor maintains a modest 55 W TDP, suitable for high-performance mobile systems. The chip includes support for ECC memory and PCIe Gen 5. It integrates the Radeon 8060S solution based on RDNA 3.5 architecture for graphics.

We are yet to see more details about the ROG Magic X, but with the arrival of AMD Ryzen AI MAX+, we assume this machine will result in a powerful gaming device for users on the go. More details are expected on February 25, when ASUS plans to showcase it. Pricing and availability are also expected to follow soon after.

Reports from Financial Times suggest Arm has plans to create its own CPU, set to hit the market in 2025 with Meta Platforms said to be one of the first customers. The chip is said to be a CPU for data center servers, with TSMC handling the manufacturing. However, when the Financial Times asked about this, SoftBank (the majority owner of Arm) and Meta stayed quiet, while Arm didn't give a statement. A Nikkei report from May 2024 suggested that a prototype AI processor chip would be completed by spring 2025 and available for sale by fall 2025, so the latest information from the Financial Times report feels like a confirmation of previous rumors.

Right now, Arm makes money by letting others use its instruction set and core designs to make their own chips. This new move could mean Arm will compete with its current customers. Sources in the industry say Arm is trying to win business from Qualcomm, with rumors that Arm has been bringing in executives from companies it works with to help develop this chip. While Qualcomm had talked in the past about giving Meta a data center CPU using Arm's design, it looks like Arm has won at least some of that deal. However, no technical or specification details are available currently for Arm's 1st in-house server CPU.

Synopsys, Inc. today announced the expansion of its industry-leading hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems using the latest AMD Versal Premium VP1902 adaptive SoC. The next generation HAPS-200 prototyping and ZeBu-200 emulation systems deliver improved runtime performance, better compile time and improved debug productivity. They are built on new Synopsys Emulation and Prototyping (EP-Ready) Hardware that optimizes customer return on investment by enabling emulation and prototyping use cases via reconfiguration and optimized software. ZeBu Server 5 is enhanced to deliver industry-leading scalability beyond 60 billion gates (BG) to address the escalating hardware and software complexity in SoC and multi-die designs. It continues to offer industry-best density to optimize data center space utilization.

"With the industry approaching 100s of billions of gates per chip and 100s of millions of lines of software code in SoC and multi-die solutions, verification of advanced designs poses never-before seen challenges," said Ravi Subramanian, chief product management officer, Synopsys. "Continuing our strong partnership with AMD, our new systems deliver the highest HAV performance while offering the ultimate flexibility between prototyping and emulation use. Industry leaders are adopting Synopsys EP-Ready Hardware platforms for silicon to system verification and validation."

Qualcomm has announced its latest mid-range offering, dubbed the Snapdragon 6 Gen 4. Compared to its predecessor, the Snapdragon 6 Gen 3, the improvements on the CPU side are rather modest, with Qualcomm claiming an 11% improvement. The CPU, now based on TSMC N4, packs four ARMv9-based Cortex-A720 P-cores, along with four Cortex-A520 E-cores, making it an 8-core system as tradition. On the GPU side, however, a substantial 29% improvement has been asserted, although the specifics remain under wraps as of this writing.

The chipset can be paired with up to 16 GB of LPDDR5-3200 memory, and displays up to FHD+ at 144 Hz are supported. INT4 support is also present the new NPU, which should allow for decent on-device AI capabilities. Gaming performance should also witness a decent jump, thanks to the aforementioned GPU improvement, paired with Game Super Resolution (upscaling) and Frame Motion Engine (frame generation, every other frame). For connectivity, Wi-Fi 6E, Bluetooth 5.4, and 5G (mm Wave, sub-6 GHz) are present. Up to 200 MP single-camera systems are supported, with Snapdragon's LLV (Low Light Vision) technology, Of course, being a budget segment SoC, it would be futile to expect high-end photography capabilities. As for videography, 4k30 and 1080p120 are supported, along with HLG and HDR10.

A new case of catastrophic CPU failure has emerged involving AMD's Ryzen 7 9800X3D processor, marking the latest in a series of reported incidents within the last few days involving high-performance GPUs and CPUs. The failure occurred during routine use when a system equipped with the 9800X3D and an ASRock Nova X870E motherboard suddenly shut down, resulting in visible thermal damage to both components. The incident is particularly noteworthy as the system operated under stock settings, with only AMD EXPO memory optimization enabled. The affected user, who has two decades of PC building experience, reported that the system had been operational for approximately 20 days before the failure, with no temperature anomalies recorded through HWMonitor during its operation.

The hardware was running the ASRock BIOS version 3.16. This case differs significantly from the previous AMD Ryzen 7 9800X3D failure, where user error during installation was identified as the primary cause, with the user force-installing the CPU in the socket. The timing of the failure—during a low-intensity workload of streaming video content—further complicates the investigation into root causes. While isolated cases of hardware failure are not uncommon in the PC component market, this case may be the first one caused entirely by the CPU/motherboard combination, not user error. The user also faces uncertainty regarding warranty coverage, as the CPU and motherboard were purchased separately from different retailers. We hope the warranty case goes well, and the user gets a replacement!

AI PC capabilities have evolved rapidly in the two years since AMD introduced the first x86 AI PC CPUs at CES 2023. New neural processing units have debuted, pushing available performance from a peak of 10 AI TOPS at the launch of the AMD Ryzen 7 7840U processor to peak 50+ TOPS on the latest AMD Ryzen AI Max PRO 300 Series processors. A wide range of software and hardware companies have announced various AI development plans or brought AI-infused products to market, while major operating system vendors like Microsoft are actively working to integrate AI into the operating system via its Copilot+ PC capabilities. AMD is on the forefront of those efforts and is working closely with Microsoft to deliver Copilot+ for Ryzen AI and Ryzen AI PRO PCs.

In the report "The Year of the AI PC is 2025," Forrester lays out its argument for why this year is likely to bring significant changes for AI PCs. Forrester defines the term "AI PC" to mean any system "embedded with an AI chip and algorithms specifically designed to improve the experience of AI workloads across the computer processing unit (CPU), graphics processing unit (GPU), and neural processing unit (NPU)." This includes AMD products, as well as competing products made by both x86 and non-x86 CPU manufacturers. 2025 represents a turning point for these efforts, both in terms of hardware and software, and this Forrester report is an excellent deep dive into why AI PCs represent the future for enterprise computing.

AMD's Ryzen 9000HX lineup of "Fire Range" Zen 5 mobile processors is due for release within a vague March to April window, with the upcoming 3D V-Cache-equipped Ryzen 9 9955HX3D SKU touted to become a top choice for manufacturers of ultra high-end gaming laptops. The latest version of CPU-Z is ready (in advance) with support for Team Red's incoming product line; CPUID's patch notes (published on February 8) have revealed previously unannounced models. AMD's official introduction of Ryzen 9000HX series CPUs included an opening salvo of Ryzen 9 9955HX3D (16-core), 9955HX (16-core) and 9850HX (12-core) models.

According to CPU-Z version 2.14, three additional "Fire Range" SKUs are seemingly on the way. Starting off with the Ryzen 9 9950HX3D—a (presumably) slightly less potent 3D V-Cache-sporting model—its nomenclature suggests that it will sit just below the series flagship. The 9950HX model is expected to slot just under the already announced 9955HX chip. The newly revealed 9845HX SKU could become the lowest 12-core offering within AMD's "Fire Range" product stack.

So far, this Friday (February 7) has been a bumper day for Intel CPU-related leaks. Golden Pig Upgrade and Jaykihn appear to be in competition with each other—they have uncovered all manner of speculative treasures across desktop and mobile segments. The latest revelation provides an early insight into unannounced feline-themed next-gen CPUs, courtesy of a Jaykihn social media post. Team Blue's Panther Lake processor family is slated for launch within the latter half of 2025—Intel officially stated that it would be their "lead product" on 18A. Older rumors had the "mobile-exclusive" Panther Lake processor family linked to a mixed configuration of new "Cougar Cove" P-cores and updated "Skymont" E-cores. According to today's leak, a variety of core configurations and feature sets are in the pipeline.

Jaykihn has listed three Panther Lake SKUs, and a "more mainstream" lower-end Wildcat Lake model. Common features include support for Thunderbolt 4 connectivity and LPDDR5X memory. Team Blue's rumored highest-end Panther Lake-H (PTL-H) processor appears to max out with a grand total of sixteen cores—consisting of 4 P-cores, 8 E-Cores, and 4 LP cores. The integrated graphics solution is (allegedly) a 12 core Xe3 "Celestial" GPU, with support for LPDDR5X memory—it is the only one on the list to completely jettison DDR5 compatibility. Insiders believe that the total platform (TOPS) rating is 180. As interpreted by VideoCardz, a 12-core "Panther Lake-U" (PTL-U) SKU is reportedly free of efficiency (E) units. The sole Wildcat Lake (WCL) model seems to sport a 2 P-core, 4-LP, and 2-Xe3 configuration.

Intel is reported to be eyeing a revival of its "Arrow Lake Refresh" desktop processor design—Golden Pig Upgrade disclosed this "strange" revelation via an updated Weibo blog post. Back in 2023, the Chinese hardware reviewer and leaker extraordinaire theorized that Team Blue's much-rumored shelving of "ARL-S/HX Refresh" came down to cost/benefit considerations relating to accommodating an upgraded NPU in the chip's tile-based design. Last September, reports suggested that Intel had put the final kibosh on a 14th Gen Core Ultra 8P+32E "Arrow Lake Refresh" processor series—leaked roadmaps had a launch window marked down for late 2025, going into 2026. Industry watchdogs have picked up on Golden Pig Upgrade's latest forecast—prompting further theorizing.

Intel has its mobile segment's future covered with Panther Lake (later in 2025) and Nova Lake (2026), but a notable gap exists in their desktop world. Nova Lake's desktop S-series is slated for launch at some point in 2026, so this year could be prime territory for a mild refresh of existing Arrow Lake-S processors—on the LGA1851 socket. Golden Pig Upgrade reckons that refreshes of ARL-S (desktop) and ARL-HX (high-end laptop) are back on Team Blue's upcoming product roadmap. Industry moles reckon that an updated NPU design—potentially similar to the one housed in Lunar Lake mobile chips—will be the only major upgrade lined up for the so-called "Core Ultra 300" processor series. Intel's current-gen flagship model—Core Ultra 9 285K—has NPU performance topping off at 13 TOPS. Refreshed Arrow Lake SKUs could be deployed with an improved NPU aspect, perhaps capable of hitting 48 TOPS.

Intel's data center business has experienced a lot of decline in recent years. Once the go-to choice for data center buildout, nowadays, Xeon processors have reached a 13-year low. According to SemiAnalysis analyst Sravan Kundojjala on X, the once mighty has fallen to a 13-year low number, less than 50% of its CPU sales in the peak observed in 2021. In a chart that is indexed to 2011 CPU volume, the analysis gathered from server volume and 10K fillings shows the decline that Intel has experienced in recent years. Following the 2021 peak, the volume of shipped CPUs has remained in free fall, reaching less than 50% of its once-dominant position. The main cause for this volume contraction is attributed to Intel's competitors gaining massive traction. AMD, with its EPYC CPUs, has been Intel's primary competitor, pushing the boundaries on CPU core count per socket and performance per watt, all at an attractive price point.

During a recent earnings call, Intel's interim c-CEO leadership admitted that Intel is still behind the competition with regard to performance, even with Granite Rapids and Clearwater Forest, which promised to be their advantage in the data center. "So I think it would not be unfathomable that I would put a data center product outside if that meant that I hit the right product, the right market window as well as the right performance for my customers," said Intel co-CEO Michelle Johnston Holthaus, adding that "Intel Foundry will need to earn my business every day, just as I need to earn the business of my customers." This confirms that the company is now dedicated to restoring its product leadership, even if its internal foundry is not doing okay. It will take some time before Intel CPU volume shipments recover, and with AMD executing well in data center, it is becoming a highly intense battle.

Apple's M4 SoC was released to overwhelmingly positive reviews, particularly regarding the commendable performance and efficiency benefits it brought to the table. The chip first appeared in the OLED iPad Pro lineup last May, arriving in the company's MacBook Pro lineup only much later, giving Intel's Lunar Lake and AMD's Strix Point a run for their money. Now, it appears that the company is cognizant of the heat brought by AMD's Strix Halo, and has already commenced mass production for the first SoC in the M5 family - the vanilla M5, according to Korean news outlet ET News.

Just like last time, the M5 SoC has been repeatedly rumored to first arrive in the next-generation iPad Pro, scheduled to enter production sometime in the second half of this year. The MacBook Pro will likely be next-in-line for the M5 treatment, followed the rest of the lineup as per tradition. Interestingly, although Apple decided against using TSMC's 2 nm process for this year's chips, the higher-tier variants, including the M5 Pro and M5 Max are expected to utilize TSMC's SoIC-mH technology, allowing for vertical stacking of chips that should ideally benefit thermals, and possibly even allow for better and larger GPUs thanks to the separation of the CPU and GPU portions. Consequently, yields will also improve, which will allow Apple to bring costs down.