Long-term reliability issues continue to plague Intel's 13th Gen and 14th Gen Core desktop processors based on the "Raptor Lake" microarchitecture, with users complaining that their processors have become unstable with heavy processing workloads, such as games. This includes the chips that have minor levels of performance tuning or overclocking. Intel had earlier isolated many of these stability issues to faulty CPU core frequency boosting algorithms, which it addressed through updates to the processor microcode that it got motherboard- and prebuilt manufacturers to distribute as UEFI firmware updates. The company has now come out with new findings of what could be causing these issues.

In a statement Intel posted on its website on Monday (22/07), the company said that it has been investigating the processors returned to it by users under warranty claims (which it has been replacing under the terms of its warranty). It has found that faulty processor microcode has been causing the processors to operate under excessive core voltages, leading to their structural degradation over time. "We have determined that elevated operating voltage is causing instability issues in some 13th/14th Gen desktop processors. Our analysis of returned processors confirms that the elevated operating voltage is stemming from a microcode algorithm resulting in incorrect voltage requests to the processor."

Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD to supply high-performance substrates for hyperscale data center compute applications. These substrates are made in SEMCO's key the technology hub in Busan and the newly built state of the art factory in Vietnam. Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW in 2028. SEMCO's substantial investment of 1.9 trillion KRW in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and the future technology needs.

SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.

Cornelis Networks, a leading independent provider of intelligent, high-performance networking solutions, today announced the appointment of Lisa Spelman as its new chief executive officer (CEO), effective August 15. Spelman joins Cornelis from Intel Corporation, where she held executive leadership roles for more than two decades, including leading the company's core data center business. Spelman will succeed Philip Murphy, who will assume the role of president and chief operating officer (COO).

"Cornelis is unique in having the products, roadmap, and talent to help customers address this issue. I look forward to joining the team to bring their innovations to even more organizations around the globe."

The much-anticipated revolution in AI-powered personal computing seems to be off to a slower start than expected. Qualcomm's Snapdragon X CPUs, touted as game-changers in the AI PC market, have struggled to gain significant traction since their launch. Recent data from PassMark, a popular benchmarking software, reveals that Snapdragon X CPUs account for a mere 0.3% of submissions in the past 30 days. This is a massive contrast to the 99.7% share held by traditional x86 processors from Intel and AMD, which raises questions about the immediate future of ARM-based PCs. The underwhelming adoption comes despite bold predictions from industry leaders. Qualcomm CEO Cristiano Amon had projected that ARM-based CPUs could capture up to 50% of the Windows PC market by 2029. Similarly, ARM's CEO anticipated a shift away from x86's long-standing dominance.

However, it turns out that these PCs are primarily bought for the battery life, not their AI capabilities. Of course, it's premature to declare Arm's Windows venture a failure. The AI PC market is still in its infancy, and upcoming mid-tier laptops featuring Snapdragon X Elite CPUs could boost adoption rates. A lot of time still needs to pass before the volume of these PCs reaches millions of units shipped by x86 makers. The true test will come with the launch of AMD's Ryzen AI 300 and Intel's Lunar Lake CPUs, providing a clearer picture of how ARM-based options compare in AI performance. As the AI PC landscape evolves, Qualcomm faces mounting pressure. NVIDIA's anticipated entry into the market and significant performance improvements in next-generation x86 processors from Intel and AMD pose a massive challenge. The coming months will be crucial in determining whether Snapdragon X CPUs can live up to their initial hype and carve out a significant place in the AI PC ecosystem.

Simply NUC, Inc., a leading custom computing company, proudly announced the launch of the Scorpion Canyon NUC 14 Performance device across their global websites, a revolutionary PC workstation designed to meet diverse computing needs. Featuring the latest Intel Core Ultra "Meteor Lake" CPUs, Intel Arc integrated graphics, and optional NVIDIA RTX 4060 or 4070 graphics, the NUC 14 Performance redefines computing in a compact form factor.

"Introducing the NUC 14 Performance is a significant milestone for us," said Aaron Rowsell, Founder & President of Simply NUC. "This product family ushers in advanced AI capabilities and top-tier graphics in computing power. With unmatched performance, AI-readiness, and a sleek tool-less design, the NUC 14 Performance sets a new standard for compact workstations."

Intel is preparing to launch its next generation of mobile CPUs with Core Ultra 200 series "Lunar Lake" leading the charge. However, as these processors are about to hit the market, leakers reveal Intel's plans for the next-generation Core Ultra 300 series "Panther Lake". According to rumors, Panther Lake will double the core count of Lunar Lake, which capped out at eight cores. There are several configurations of Panther Lake in the making based on the different combinations of performance (P) "Cougar Cove," efficiency (E) "Skymont," and low power (LP) cores. First is the PTL-U with 4P+0E+4LP cores with four Xe3 "Celestial" GPU cores. This configuration is delivered within a 15 W envelope. Next, we have the PTL-H variant with 4P+8E+4LP cores for a total of 16 cores, with four Xe3 GPU cores, inside a 25 W package. Last but not least, Intel will also make PTL-P SKUs with 4P+8E+4LP cores, with 12 Xe3 cores, to create a potentially decent gaming chip with 25 W of power.

Intel's Panther Lake CPU architecture uses an innovative design approach, utilizing a multi-tile configuration. The processor incorporates five distinct tiles, with three playing active roles in its functionality. The central compute operations are handled by one "Die 4" tile with CPU and NPU, while "Die 1" is dedicated to platform control (PCD). Graphics processing is managed by "Die 5", leveraging Intel's Xe3 technology. Interestingly, two of the five tiles serve a primarily structural purpose. These passive elements are strategically placed to achieve a balanced, rectangular form factor for the chip. This design philosophy echoes a similar strategy employed in Intel's Lunar Lake processors. Panther Lake is poised to offer greater versatility compared to its Lunar Lake counterpart. It's expected to cater to a wider range of market segments and use cases. One notable advancement is the potential for increased memory capacity compared to Lunar Lake, which capped out at 32 GB of LPDDR5X memory running at 8533 MT/s. We can expect to hear more potentially at Intel's upcoming Innovation event in September, while general availability of Panther Lake is expected in late 2025 or early 2026.

A new look? With the Core 1 Carbon, Alphacool now presents the very powerful CPU cooler in a carbon look. This cooler reliably dissipates the enormous waste heat of the latest desktop CPU generation with the help of the completely newly developed 3D jetplate.

With the Core 1 CPU cooler, Alphacool combines the best of old and new. Combined with the proven cross-slot technology, the new 3D jetplate ensures extremely even distribution of the coolant on the redesigned cooler base. Compared to the previous model, a 10 Kelvin lower temperature can be achieved. Milled from a high-quality brass block, the Core 1 has nickel-plated connections. By enlarging the nickel-plated radiator base made of pure copper, it is possible to completely cover even very large CPUs.

Samsung Electronics today announced its all-new Galaxy Z Fold6 and Galaxy Z Flip6, along with Galaxy Buds3 and Galaxy Buds3 Pro at Galaxy Unpacked in Paris.

Earlier this year, Samsung ushered in the era of mobile AI through the power of Galaxy AI. With the introduction of the new Galaxy Z series, Samsung is opening the next chapter of Galaxy AI by leveraging its most versatile and flexible form factor perfectly designed to enable a range of unique mobile experiences. Whether using Galaxy Z Fold's large screen, Galaxy Z Flip's FlexWindow or making the most of the iconic FlexMode, Galaxy Z Fold6 and Flip6 will provide more opportunities to maximize AI capabilities. Built on the foundation of Samsung's history of form factor innovation, Galaxy AI uses powerful, intelligent, and durable foldable experience to accelerate a new era of communication, productivity, and creativity.

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.

What appears to be the full details of all of Intel's upcoming 800-series chipsets have leaked and although we've already seen what the Z890 chipset will offer, no details of the other SKUs have leaked to date. Maybe the biggest news is that there won't be an H870 chipset this time around, according to the leaker @jaykihn0 over at X/Twitter. The full range appears to be Z890, B860 and H810 for consumers, W880 for workstations and Q870 for corporate desktops. That said, the Z890 and W880 are identical in terms of slots and ports, but whereas the W880 gains full ECC support and Intel vPro and remote management, it loses the CPU and bus overclocking features of the Z890. The Q870 loses four chipset PCIe 4.0 lanes, one 20 Gbps or two 10 Gbps USB 3.2 ports, but is otherwise similar to the Z890, minus all the overclocking features, but with Intel vPro and remote management.

The B860 ends up on the chopping block as always and loses not only 10 chipset PCIe lanes compared to the Z890 chipset, but also four lanes from the CPU and four lanes on the DMI interface to the chipset. On top of that bifurcation goes out the window toigether with PCIe RAID and the chipset is only capable of having two 20 Gbps or four 10 Gbps USB 3.2 ports, but at least memory overclocking is still on the table. Finally, the H810 chipset is as basic as it gets, with no extra CPU PCIe lanes beyond the 16 lanes for a graphics card, but they are at least PCIe 5.0 this time around. The chipset itself is only equipped with a mere eight PCIe 4.0 lanes and it gets zero 20 Gbps and two 10 Gbps USB 3.2 ports. Note that all platforms support one or two Thunderbolt 4 / USB4 ports, but it's unclear if this is native support or via an add-on chip. Also note that the USB ports are shared and the maximum count is that for the 5 Gbps ports in the details below, so the Z890 for example, doesn't have 25 USB 3.2 ports in total, but rather only 10. All in all, we'll see a migration to PCIe 5.0 for the x16 slot across the entire 800-series chipset range and from the B860 and up, all chipsets will have a dedicated PCIe 5.0 x4 interface that will most likely be used for an M.2 slot. Also, the PCIe lane count is the maximum, but due to Intel's HSIO layout, some resources will be shared with SATA and Ethernet, which means not all PCIe lanes will be accessible.

Researchers from the University of California, San Diego, have unveiled a significant security vulnerability affecting Intel Raptor Lake and Alder Lake processors. The newly discovered flaw, dubbed "Indirector," exposes weaknesses in the Indirect Branch Predictor (IBP) and Branch Target Buffer (BTB), potentially allowing attackers to execute precise Branch Target Injection (BTI) attacks. The published study provides a detailed look into the intricate structures of the IBP and BTB within recent Intel processors, showcasing Spectre-style attach. For the first time, researchers have mapped out the size, structure, and precise functions governing index and tag hashing in these critical components. Particularly concerning is the discovery of previously unknown gaps in Intel's hardware defenses, including IBPB, IBRS, and STIBP. These findings suggest that even the latest security measures may be insufficient to protect against sophisticated attacks.

The research team developed a tool called "iBranch Locator," which can efficiently identify and manipulate specific branches within the IBP. This tool enables highly precise BTI attacks, potentially compromising security across various scenarios, including cross-process and cross-privilege environments. One of the most alarming implications of this vulnerability is its ability to bypass Address Space Layout Randomization (ASLR), a crucial security feature in modern operating systems. By exploiting the IBP and BTB, attackers could potentially break ASLR protections, exposing systems to a wide range of security threats. Experts recommend several mitigation strategies, including more aggressive use of Intel's IBPB (Indirect Branch Prediction Barrier) feature. However, the performance impact of this solution—up to 50% in some cases—makes it impractical for frequent domain transitions, such as those in browsers and sandboxes. In a statement for Tom's Hardware, Intel noted the following: "Intel reviewed the report submitted by academic researchers and determined previous mitigation guidance provided for issues such as IBRS, eIBRS and BHI are effective against this new research and no new mitigations or guidance is required."

In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main models for introducing FOPLP packaging technology: Firstly, OSAT providers transitioning from traditional methods of consumer IC packaging to FOPLP. Secondly, foundries and OSAT providers packaging AI GPUs that are transitioning 2.5D packaging from wafer level to panel level. Thirdly, panel makers who are packaging consumer ICs.

0patch plans to combat Microsoft's ending Windows 10 support by offering unofficial security updates for the 2015 operating system. Microsoft is ending Windows 10 security updates on October 14, 2025, after which the OS will stop receiving patches for vulnerabilities. The Redmond giant will provide you with an option to update your Windows 10 build, however, with a hefty fee slapped. Extended Security Updates (ESU) pricing structure follows a tiered model that doubles each year. From October 2025 to October 2026, the cost is $61 per device. The following year, from October 2026 to October 2027, the price increases to $122 per device. In the final year, spanning October 2027 to October 2028, the cost rises to $244 per device. For users planning to maintain Windows 10 until October 2028, the total expense over the three-year period would amount to $427 per device.

However, 0patch, a company focused on providing unofficial security updates for Windows OSes, will provide Windows 10 users with free and paid security updates post-end of service. Their system focuses on delivering targeted "micropatches" for critical vulnerabilities that emerge after Microsoft's official support ends. These micropatches are designed to be extremely precise and minimal, often consisting of just a few CPU instructions. A key feature of 0patch's approach is its non-invasive nature. The patches are applied directly to running processes in the computer's memory, leaving the original Microsoft files untouched. This method allows for rapid deployment of security fixes without requiring system reboots or interrupting user activities. The patching process is designed to be seamless and virtually unnoticeable to users. For instance, a user working on a document wouldn't experience any disruption while a micropatch is being applied. This approach is particularly beneficial for servers, where continuous uptime is crucial, as patches can be implemented without any downtime.

As we're getting close to the launch of AMD's 9000-series Ryzen processors, local retailers have already started to put the new CPUs up for pre-order and this gives us a first glimpse into the pricing we can expect. The first company to do so in Europe is Slovenian retailer Funtech, which has put up all four SKUs on its site. For those not familiar with European pricing, Slovenia has a VAT or sales tax rate of 22 percent, which obviously makes the pricing higher than in the US and some other countries. As Funtech also sells AMD's current CPUs, we can also get an idea of how much more the new CPUs will cost, at least compared to what the online retailer sells the equivalent 7000-series models for.

Starting from the bottom, the Ryzen 5 9600X goes for €310 (US$332) and the shop has the Ryzen 7 7600X up for sale at €212. The Ryzen 7 9700X goes for €400 (US$429), whereas the Ryzen 7 7700X is sold for €305. The Ryzen 9 9900X is listed at €500 (US$536) with the Ryzen 9 7900X at €392. Finally the Ryzen 9 9950X is listed at €660 (US$707), compared to €510 for the Ryzen 9 7950X. This is in line with earlier leaked pricing from the Philippines and with the VAT removed, we end up close to proposed MSRP pricing by various leakers over the past couple of months, or even somewhat lower. If anything, it doesn't look like AMD is going to increase the MSRP over the 7000-series of Ryzen processors.

As Intel gears for the launch of Lunar Lake and Arrow Lake processors, the company appears to be preparing a new line of high-performance processors for gaming laptops. Recent developments suggest that the company is adapting its desktop-grade Arrow Lake-S chips for use in ultra-high-performance notebooks. The buzz began when X user @InstLatX64 spotted Intel testing a peculiar motherboard labeled "Arrow Lake Client Platform/ARL-S BGA SODIMM 2DPC." This discovery hints at the possibility of Intel packing up to 24 cores into laptop processors, eight more cores compared to the 16 cores expected in standard Arrow Lake-H mobile chips. By utilizing the full potential of Arrow Lake-S silicon in a mobile form factor, Intel aims to deliver desktop-class performance to high-end notebooks in a BGA laptop CPU.

The leaked chip would likely feature eight high-performance Lion Cove P-cores and 16 energy-efficient Skymont E-cores, along with an integrated Xe2 GPU. This configuration could provide the raw power needed for demanding games and professional applications in a portable package. However, implementing such powerful hardware in laptops presents challenges. The processors are expected to have a TDP of 45 W or 55 W, with actual power consumption potentially exceeding these figures to maintain high clock speeds. Success will depend not only on Intel's chip design but also on the cooling solutions and power delivery systems developed by laptop manufacturers. As of now, specific details about clock speeds and performance metrics remain under wraps. The test chip that surfaced showed a base frequency of 3.0 GHz, notably without AVX-512 support.

AMD's Zen 5 Ryzen 9000 "Granite Ridge" series desktop processors are expected to be released on July 31st. The Ryzen AI 300 "Strix Point" series notebooks will hit stores earlier, on July 15th. This information comes from product listings on various e-commerce sites, as reported by ITHome and Videocardz. Additionally, a BestBuy listing shows one ASUS laptop with a Ryzen AI 300 "Strix Point" CPU launching on July 15th, ahead of the desktop processor release.

ITHome also reported potential retail prices for the AMD Ryzen 9 series CPUs, at least for the Philippine market. Worldwide prices may be lower or higher depending on taxes in each region.

• Ryzen 9 9950X: $648
• Ryzen 9 9900X: $597
• Ryzen 7 9700X: $409
• Ryzen 5 9600X: $315

A Finnish company called Flow Computing is making some very bold claims when it comes to its new IP. The company has developed what it calls a Parallel Processing Unit or a PPU, which the company claims can boost the performance of any CPU by a hundred times its current performance. Furthermore, the company claims that its PPU can double the performance of any current code execution, with no need for any kind of optimisation for its PPU. The PPU can be integrated into new processors, but it can also be designed as a discrete chip that can be added to any current hardware and Flow Computing claims the performance benefits will be the same in both instances.

Flow Computing is a spinoff from the VTT Technical Research Centre of Finland and the company emerged from stealth mode last week with around €4 million in funding. Flow Computing doesn't intend to make its PPU by itself, but instead, the company wants to licence its tech to third parties, to give everyone an equal opportunity to take advantage of what's on offer. At this point in time, Flow Computing hasn't made any custom silicon, instead the company has validated its PPU using an FPGA tested against various Intel CPUs. As such, there are numbers to back up its claims and we've provided links below to a whitepaper and an FAQ for those that are interested in doing a deep dive into its claims. Flow Computing appears to have a few different implementations of its PPU, ranging from 16 to 256 cores, with the latter being for high-end computers, but the basic is said to be suitable for something as basic as a smartwatch. Time will tell if Flow Computing will be able to deliver on its claims and it'll be an interesting company to follow.

MSI, the leading brand in gaming products, is proud to announce the launch of the MAG Infinite E1. Equipped with processors up to 14th Gen Intel processor and NVIDIA GeForce RTX 40 Series graphics card, the MAG Infinite E1 is designed to be the ultimate gaming companion, delivering unmatched functionality. Built with the iconic MAG spirit of durability and robust construction, the MAG Infinite E1 showcases a design that conveys a stable and endurance, appealing to gamers seeking both power and reliability.

The MAG Infinite E1 is powered by up to an Intel Core i7 processor, offering significant performance enhancements over its predecessor. When combined with the NVIDIA RTX 40 Series graphics card, the MAG Infinite E1 not only leaps in performance but also in AI-enhanced graphics capabilities. Gamers can immerse themselves in lifelike virtual environments with advanced ray tracing and enjoy ultra-high frame rates with minimal latency. Furthermore, the MAG Infinite E1 is equipped with state-of-the-art transmission capabilities including DDR5 memory and M.2 PCI-e SSD slots, ensuring peak performance and making it the ideal choice for gamers who demand the very best.

At Computex last week, we got a first look at Gigabyte's new TRX50 AI TOP motherboard—where TOP stands for trillions of operations per second—designed for AMD's Threadripper and Threadripper Pro CPUs. Now the company has released the full specifications of the TRX50 AI TOP and the board is packed to the brim with features. The E-ATX board is home to four PCIe x16 slots, all of which can operate in PCIe 5.0, but one can be limited to PCIe 4.0, depending on your choice of CPU. There's also four NVMe M.2 slots, with CPU dependent functionality. Other features include eight DIMM slots, but these are again CPU dependent, two 10 Gbps Ethernet interfaces via a pair of Marvell AQtion AQC113C controllers, WiFi 7 via a Qualcomm QCNCM865 module and dual audio chips, one for the rear ports and one for the front panel audio.

As this is a 2024 model, USB4 is of course also part of the package, but only one of the two USB4 supports DP Alt-mode, due to there only being one DP input. The board also has an internal USB 3.2 Gen 2x2 (20 Gbps) header for a case mounted USB-C port, a further six rear 5 Gbps USB Type-A ports, plus a pair of internal headers for a further four 5 Gbps USB Type-A ports. The board also has four SATA ports, a 16+8+4 power phase design, a 14-layer PCB, a debug display and the now common easy release features for the M.2 drive heatsinks and the graphics card. The TRX50 AI TOP also sports what Gigabyte calls "UC BIOS" which has a "User-Centred intuitive UX with Quick Access function", but there's currently no details of how this differs from previous UEFI releases from Gigabyte. There was no word on pricing.

be quiet!, the German manufacturer for premium PC components, is proud to announce a new member to its family of high-end air coolers: Dark Rock 5. With its single-tower design, Dark Rock 5 offers outstanding cooling performance at low noise levels for builds that won't fit dual-tower designs like Dark Rock Pro 5 or Dark Rock Elite. Like its bigger brothers, Dark Rock 5 offers maximum compatibility with high-end consumer motherboards and RAM-modules. With its sleek black design, Dark Rock 5 knows how to impress: whether you use it for gaming, for workstations or as a reliable companion in your home office.
Better performance, easier installation

Dark Rock 5 improves on the high-performance benchmarks of its predecessor, Dark Rock 4, combining a proven and iconic design with cutting edge fan technology. Six high-performance heat pipes are connected to an asymmetrical heat sink with additional cut-outs for high RAM and VRM cooler compatibility, while a consumer-grade Silent Wings 4 120 mm PWM fan delivers perfect air pressure and virtually inaudible operation (29.8dB(A) at maximum fan speed). For those in search for the highest performance, a second fan can be installed optionally at the exhaust side. As with other Dark Rock models, special black coating with ceramic particles enable perfect heat transfer -- and an elegant look.

Alseye, the Chinese maker of AIO/air coolers and PC cases, had an interesting display at Computex 2024. The company's main showcase was the massive AIO cooler selection with some exciting pump/CPU block combo designs. A star of the show is the company's i360 360 mm AIO water cooler in white. It features a real-time information display of CPU and GPU temps on its CPU block, which resembles the look of a car's turbocharger. With a pump speed of 3200 RPM and fan speeds of 800-1800 RPM with FDB bearings, the i360 should be a quiet implementation. It also comes in an i240 240 mm radiator version with support for AMD and Intel platforms.

Noctua unveiled its new Ampere Altra family of CPU coolers for Ampere Altra and Altra Max Arm processors at the Computex 2024 show, as well as the upcoming NVIDIA GH200 Grace Hopper superchip cooler. In addition, it also showcased its new cooperation with Seasonic with PRIME TX-1600 Noctua Edition power supply and a rather unique Kaelo wine cooler.

In addition to the new and upcoming standard CPU coolers and fans, Noctua also unveiled the new Ampere Altra family of CPU coolers at the Computex 2024 show, aimed to be used with recently launched Ampere Altra and Altra Max Arm processors with up to 128 cores. The new Noctua Ampere Altra CPU coolers are based on the proven models for Intel Xeon and AMD Threadripper or EPYC platforms. The Noctua Ampere Altra family of CPU coolers use Noctua's SecuFirm2 mounting system for LGA4926 socket and come with pre-applied NT-H2 thermal paste. According to Noctua, these provide exceptional performance and whisper-quiet operation which are ideal for Arm based workstations in noise-sensitive environments. The Ampere Altra lineup should be already available over at Newegg. In addition, Nocuta has unveiled its new prototype of NVIDIA GH200 Grace Hopper superchip cooler, which integrates two custom NH-U12A heatsinks in order to cool both the Grace CPU and Hopper GPU. It supports up to 1,000 W of heat emissions, and aimed at noise-sensitive environments like local HPC applications and self-hosted open source LLMs. The NVIDIA GH200 cooler is expected in Q4 this year and offered to clients on pre-order basis.

In addition to the thermosiphon liquid cooler project, Noctua also brought several upcoming air CPU coolers and fans to the Computex 2024 show, including the new NH-D15 G2, the NF-A14x25 G2, as well as next-generation dual-tower 120 mm CPU cooler and next-generation 120 mm fan.

The new NH-D15 G2 is the upgraded version of the popular NH-D15, which now gets a new fin stacks with reduced fin pitch, leaving it with 20 percent more surface area, 8 heatpipes (instead of 6 on the NH-D15), new fans with both higher performance and acoustic optimization, and offset design for better PCI clearance. It will use Noctua's Torx based SecuFirm2+ mounting system with offset option for AM5, as well as come bundled with NT-H2 thermal paste, NA-TPG1 thermal paste guard for AM5, and NA-ISW1 shim-washers for improved contact on LGA1700 sockets. Noctua will launch three different versions, the standard version with medium base convexity, as well as two new versions LBC and HBC, with low base and high base convexity. The new NH-D15 G2 should launch later this month.

The subsidiary of MiTAC Holdings Corp, MiTAC Computing Technology and its server brand TYAN, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today's AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel Xeon 6 processor and 4th and 5th Gen Intel Xeon Scalable processors, these solutions deliver cutting-edge performance.

"For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel's latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership," said Rick Hwang, President of MiTAC Computing Technology Corporation.

In addition to new cases, a successor to the well-known Dark Rock CPU air cooler series, and new cases, be quiet! also brought new Light Wings LX series of fans and the new Light Loop AIO CPU liquid cooler to the Computex 2024 show. As expected, be quiet! is following the ARGB trend, but also taking it to a new level without compromising the performance, with both Light Wings LX fan series and the Light Loop AIO cooler.

As said, the Light Wings LX fan series obviously focuses on the lighting, but be quiet! was keen to note that the series will maintain reliable cooling and performance as well. In order to take the ARGB lighting to the next level, be quiet! is using both illuminated impeller and frosted fan blades, and integrates a total of 16 LEDs. These will still be available in black and white color options, 120 mm and 140 mm sizes, as well as PWM and PWM high-speed versions. The PWM version comes with seven fan blades and spins up to 1,600 RPM for the 120 mm and 1,200 RPM for the 140 mm version, while the PWM high-speed uses nine optimized fan blades and spins up to 2,100 RPM for the 120 mm and up to 1,800 RPM for the 140 mm version. Both also have low-starting RPM for quiet operation, use long-life rifle bearing, and have daisy-chain ability. be quiet! expects the new Light Wings LX fan series to launch in September, with price ranging from $19/$20 for both standard PWM and PWM high-speed single 120/140 mm Light Wings LX fan.