Monday, July 8th 2024
AMD Ryzen 9000X3D Series to Keep the Same 64 MB 3D V-Cache Capacity, Offer Overclocking
AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.
Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.
Sources:
Wccftech, via CompterBase.de
Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.
62 Comments on AMD Ryzen 9000X3D Series to Keep the Same 64 MB 3D V-Cache Capacity, Offer Overclocking
That, and not repeating anything similar to the vSOC whoops of the Ryzen 7000 generation.
What is it now? 1.1v?
That's 20% (give or take 4/5nm differences); enough to be note-worthy but not enough to fry anything. Probably ~170w TDP and that's conceivably IF you keep it within their temp limits (of perhaps 89c again?).
If I had to guess, enough to get to 5900mhz with a golden sample, but ain't no way they'll let you have 6ghz. /cynical realism
My 7950X3D vcache all cores around 5.3hz but my 7800X3D didn't break 4.9 same motherboard so if you can take a 9800X3D up 2-300mhz people will have less fomo
I wouldn't be so pessimistic. The 4nm is given +11% performance vs 5nm by TSMC (obviously with the same transistors) and Zen5 has a 16% increase in IPC (which means 16% lower frequencies for the same performance on Zen4). A Zen5 3D at @5GHz would already perform as well as a Zen4 3D at 4.3GHz, already running at 5.1GHz like Zen4 is all butter. In my opinion the expectation of at least +20% on Zen4 is the minimum of the minimum. What remains to be understood is how much more maximum MT frequency vs Zen4 and the silicon curve of the TSMC N4P. I have a 7950X... coupled with an AIO 360, CO -15 and 101MHz bus (I use MT, I don't play), I'm more than fine... about +1.5/2% vs def, but over 230W it's a nightmare... I got to 260W in manual OC... hung with the temp 95° (tamb 20°). The expectation for OC fun is that the 4nm TSMC can allow +100/200MHz at the same PPT with Zen4, that the silicon curve can perhaps allow 6GHz (psychological :) and therefore it makes sense to go custom vs AIO
Once dialed in and setup with process lasso it's fine though but I'd pay 100 more not to deal with that shite lol.
I find that mildly confusing, and wonder why that would be. Or maybe it's just a 'typo' ?
The issue is chiplet to IO die to chiplet latency.
My 5950X is always faster than my 5800X despite dual CCD so I figured assuming the same clocks a 7950X3D with dual ccd would just be more consistent.
If the issue is latency between the CPU chiplets as you posit, having 3D cache over both CPU chiplets should reduce latency to a level at the very least equal to that of single CCD X3D chips. It would also be interesting to see how the additional cache impacts energy efficiency.
The gains of two X3D caches are likely to be much more minimal in general but I for one would be willing to pay extra for it if it means they have a 16 core chip that's top of the chart in gaming and energy efficiency and has excellent MT.
Your assertion I wrote something "contradictory" implies a fundamental misunderstanding of the architecture, its drawbacks, and why X3D counters those drawbacks and therefore works well for games.
Two sets of 3DVCache increases latency between cores on different chiplets, not decreases it, lol.
Where exactly is your source for such info anyways? There are zero consumer processors with two sets of 3D cache.
If you want an all around CPU you go with the 7950X3D or the 14900K. Although the 7950X3D is slower than the 7800X3D in games due to that dual CCD compromise.
Your confusion comes from the fact that you assume X3D cache is the reason for efficiency increasing, from some inherent property, when the reality is that it's the voltage limitation that comes from the stacked cache forcing AMD to not release chips tuned way past their efficiency sweetspot to get within 10-20% of Intel single core performance.
Wishful thinking along with some active imagination is what causes people to long for the hypothetical performance/efficiency of a part that did not release to market (for a good reason).