Seagate is advancing in NVMe technology for large-capacity hard drives as the growing storage needs in AI systems and apps continue to rise. Old and current storage setups struggle to handle the huge datasets needed for machine learning, which now reach petabyte and even exabyte sizes. Today's storage options have many drawbacks for AI tasks. SSD-based systems offer the needed speed however it is not cost-effective for storing large AI training data. SAS/SATA hard drives are cheaper however, the interfaces rely on proprietary silicon, host bus adapters (HBAs), and controller architectures that struggle with the high-throughput, low-latency needs of AI's high data flow.

Seagate's "new idea" is to use NVMe technology in large-capacity hard drives. This creates a solution that keeps hard drives cost-effective and dense while boosting performance for AI apps. NVMe hard drives will not need HBAs, protocol bridges, and additional SAS infrastructure, allowing seamless scalability by integrating high-density hard drive storage with high-speed SSD caching in a unified NVMe architecture.

As expected, Nintendo has kept quiet about the upcoming Switch 2 hybrid console's feature set and internal makeup. The next-gen portable gaming system's debut presentation served as a mostly surface-level teaser. News outlets have relied heavily on leaks for "insider" reportage, going back to the early 2020s—starting off with kopite7kimi's discovery of a mysterious NVIDIA "T239" chipset. As reported last week, Famiboards—a Nintendo-centric online forum—has served as a somewhat reliable source of inside track information. Earlier in the year, one member started to share NDA-busting details about Switch 2's display technology: "I've heard that the screen supports 120 Hz and VRR, which should help a lot in handheld." Weeks later, SecretBoy elaborated on the benefits of this setup: "developers can optimize the handheld profiles of their games with VRR and 40 FPS in mind."

The GamingLeaksAndRumours subreddit views SecretBoy's leaks as being fairly accurate/legitimate: "(they) called out the GPU performance before the clock speeds were leaked; 10 days later back in January (3 TFLOPS docked, 1.4/1.5 TFLOPS handheld)." Earlier today, the tipster's latest musings were compiled into a Reddit summary—another set of quotes reads as follows (in condensed form): "I will reiterate that the screen is 120 Hz with HDR and VRR support. That's what I'm personally most excited for...No idea about the actual quality of the screen, but I think OLED was always going to be too expensive for this feature set, which they needed to get into the first iteration of the hardware so that developers could optimize their games around it (speculation)." Screen technology connoisseurs have expressed much disappointment about Nintendo's alleged selection of an "inferior" panel—many will point out that Valve was inspired by the Switch OLED model (2021); their Steam Deck handheld was famously upgraded/refreshed in 2023 with a fancier screen. Invited guests will get to experience Switch 2's "hugely revelatory" LCD tech at various Nintendo-hosted international preview events in April.

Nintendo seems to readying a speculated mid-2025 launch of the much-anticipated Nintendo Switch 2 hybrid games console, according to industry watchdogs. International preview events are scheduled to happen throughout April, so online theories have settled on potential May or June release windows. Members of Famiboards—a Nintendo discussion forum—have kept tabs on a wide variety of pre-launch information outlets, going back to 2021. Their latest tracking activities—with eyes firmly trained on shipping manifests—have produced compelling evidence of Switch 2 materials turning up on North American shores in the recent past. A Famiboards detective detailed their discoveries: "so, it finally happened. HVBG exported 383,000 units of the completed console set between January 17th and January 22nd. They were all shipped to the US, and all were of the USZ (US/Canada) region code. 41,598 units of the charging grip were also shipped to the US, confirming that HGU0620 is the charging grip with a product code of BEE-A-ESSKA, which matches the Switch 1 charging grip's HAC-A-ESSKA."

Nintendo's mid-January unveiling of Switch 2 served as a refreshing break from the norm; the Japanese gaming giant operates under very secretive conditions. Their early 2025 teaser showcased a device that seemed to recycle its predecessor's feature set, but the CGI trailer implied mouse-like functionality. Patent leaks have provided further insight into the design of Nintendo's next-gen Joy-Con. Last month, Shuntaro Furukawa—the company's president—disclosed that his team was taking "all possible measures" to provide sufficient stock for Switch 2's launch window. This week's insider investigation paints a promising picture, at least for potential North American buyers: "383k is a decent-sized shipment, but I wouldn't be surprised if the numbers increase. HVBG had received 1.2 million units of one-per-system parts like the SoC and screen as of December, and 1.7 million as of January, and we can expect 100% of those to end up in units shipped to the US. One thing we can learn from the shipments is that the console set is not a bundle."

Late last month, industry insiders posited that pleasing progress was being made with Samsung's cutting-edge 2 nm Gate-All-Around (GAA) node process. The rumored abandonment of an older 3 nm GAA-based project—in late 2024—has likely sent the South Korean foundry team into overdrive. A speculated Exynos 2500 flagship mobile processor was previously linked to said 3 nm node, but industry watchdogs believe that company engineers are experimenting with a 2 nm GAA manufacturing process. According to the latest insider report—from FN News SK—Samsung Foundry (SF) has assembled a special "task force (TF)." Allegedly, this elite team will be dedicated to getting a newer "Exynos 2600 chip" over the finish line—suggesting an abandonment of the older "2500" design, or a simple renaming.

Samsung's recent launch of Galaxy S25 series smartphones was reportedly viewed as a disappointing compromise—with all models being powered by Qualcomm's "first-of-its-kind customized Snapdragon 8 Elite Mobile Platform," instead of in-house devised chipsets. According to industry moles, one of the SF task force's main goals is a boosting of 2 nm GAA production yields up to "economically viable" levels (roughly 60-70%)—apparently last month's best result was ~30%. Mass production of prototype chipsets is tipped to start by May. Samsung's reported target of "stabilizing their Exynos 2600" SoC design will ensure that "Galaxy S26 series" devices will not become reliant on Qualcomm internals. Additionally, FN News proposes a bigger picture scenario: "the stabilization of 2 nm (SF2/GAA) products, is expected to speed up the acquisition of customers for Samsung Electronics' foundry division, which is thirsty for leading-edge process customers." A forthcoming rival next-gen mobile chip—Snapdragon 8 Elite Gen 2—is supposedly in the pipeline. The smartphone industry inside track reckons that Qualcomm has signed up with TSMC; with a 2 nm manufacturing process in mind.

According to Digital Chat Station—a repeat leaker of unannounced Qualcomm hardware—unnamed Android smartphone manufacturers are considering an eSIM-only operating model for future flagship devices. Starting with the iPhone 14 generation (2022), Apple has continued to deliver gadgets that are not reliant on "slotted-in" physical SIM cards. According to industry insiders, competitors could copy the market leader's homework—Digital Chat Station's latest Weibo blog post discusses the space-saving benefits of eSIM operation; being "conducive to lightweight and integrated design." Forthcoming top-tier slimline Android mobile devices are tipped to utilize Qualcomm's rumored second-generation "Snapdragon 8 Elite Gen 2" (SM8850) chipset.

Digital Chat Station reckons that: "SM8850 series phones at the end of the year are testing eSIM. Whether they can be implemented in China is still a question mark. Let's wait and see the iPhone 17 Air. In order to have an ultra-thin body, this phone directly cancels the physical SIM card slot. Either it will be a special phone for the domestic market, or it will get eSIM." The phasing out of physical SIM cards within the Chinese mobile market could be a tricky prospect for local OEMs, but reports suggest that "traditionally-dimensioned" flagship offerings will continue to support the familiar subscriber identity module standard. Physical SIM card purists often point out that the format still provides superior network support range.

Apple's recent unveiling of refreshed Mac Studio models—in "mismatched" M3 Ultra and M4 Max forms—was greeted with a lukewarm reception from press and public. The absence of an M4 Ultra option has disappointed many folks within the high-end Mac buying populace—rumors of a delayed development of Apple's "Mac Studio M4 Ultra model" emerged online last October. The M3 Ultra processor serves as a somewhat dissatisfying stopgap—prior to last week's official announcement, insiders were still actively questioning the existence of said chip. Last week, Apple representatives reportedly informed Ars Technica and Numerama about their "Ultra" tier not reaching "every chip generation." Follow-up articles have suggested that the M4 Max chip design does not feature an UltraFusion connector; thus cutting off a main path to potential M4 Ultra routes.

Based on previous-gen history, Mac-specialist news sites propose the upcoming M3 Ultra chipset being—in effect—the result of two M3 Max chips joined together via Apple's UltraFusion connection system. Further speculation points to the company's engineering department having to start with a blank canvas; involving a speculative monolithic die design. Noted Apple leaker—Mark Gurman—has disclosed additional theories via his paywalled Bloomberg "Power On" newsletter. As interpreted by MacRumors: "Apple is reluctant to develop an M4 Ultra chip from scratch due to production challenges, costs, and the relatively small sales volume of its desktop computers, like the Mac Studio. So, that seems to rule out the only other way in which Apple could have released an M4 Ultra chip." Several media outlets posit that Apple will skip a generation, and instead focus on getting UltraFusion connections working with next-gen "M5" processors. A refreshed Mac Pro lineup is reportedly on the cards; mid-January reports linked the next-gen workstation series to a very powerful "Hidra" chip design.

MiTAC Computing Technology Corp., a subsidiary of MiTAC Holdings Corp. and a global leader in server design and manufacturing, will showcase its latest AI and HPC innovations at Supercomputing Asia 2025, taking place from March 11 at Booth #B10. The event highlights MiTAC's commitment to delivering cutting-edge technology with the introduction of the G4520G6 AI server and the TN85-B8261 HPC server—both engineered to meet the growing demands of artificial intelligence, machine learning, and high-performance computing (HPC) applications.

G4520G6 AI Server: Performance, Scalability, and Efficiency Redefined
The G4520G6AI server redefines computing performance with an advanced architecture tailored for intensive workloads. Key features include:

• Exceptional Compute Power- Supports dual Intel Xeon 6 Processors with TDP up to 350 W, delivering high-performance multicore processing for AI-driven applications.
• Enhanced Memory Performance- Equipped with 32 DDR5 DIMM slots (16 per CPU) and 8 memory channels, supporting up to 8,192 GB DDR5 RDIMM/3DS RDIMM at 6400 MT/s for superior memory bandwidth.

Earlier in the week, online chatter pointed to a possible delay in the production of Panther Lake silicon. Well-known industry analyst—Ming-Chi Kuo—has kept tabs on the inner workings of several big semiconductor players. A previous insider tale revealed NVIDIA's allegedly revised "Blackwell" architecture roadmap. Kuo's latest insight focused on Intel and their 18A node process; rumored setbacks have reportedly pushed the launch of next-gen Panther Lake (PTL) mobile processors into 2026. Team Blue leadership has already reacted to the relatively fresh allegations—earlier in the week, John Pitzer sat down with Morgan Stanley Semiconductor Research's Joe Moore. During their conference fireside chat, Intel's Corporate Vice President of Investor Relations addressed recent internet whispers.

When asked about 18A being developed on schedule, Pitzer responded with: "yes, it is. I mean, I tend to wake up every morning trying to fish through rumors that are coming across on social media about Intel 18A. I want to be very clear. Panther Lake is on track to launch in the second half of this year. That launch date has not changed. We feel really good about the progress that we are making. In fact, if you look at where our yields are on Panther Lake today, they're actually slightly ahead at a similar point in time to Meteor Lake, if you look at the development process for Meteor Lake. I think a couple of weeks ago, there was a technical paper out that actually looked at our SRAM density on Intel 18A that compared well with TSMC's N2. Lots of different metrics you can compare technologies on. I think in general, we think about Intel 18A being an N3 type/N2 sort of comp with the external peers." Panther Lake is set to become the company's first product family that will utilize its own Foundry's 18A node process. Mid-way through February, we heard about the importance of PTL with Intel's portable gaming strategy.

The "Medusa" or "Medusa Point" codename started to appear online over the past couple of months. These mysterious AMD projects were linked to next-generation "Zen 6" Ryzen desktop and mobile processor families (respectively). Initially, insiders reckoned that Team Red had selected an RDNA 4-based graphics solution for integration their futuristic new-gen laptop APU design. Two days ago, Golden Pig Upgrade weighed in with a different theory—the veteran leaker believes that provisions have regressed on the "Medusa Point" iGPU front.

Previous reports have suggested that the "Medusa Point" processor's iGPU aspect will utilize up to 16 compute units (CU), based on a theorized count of eight workgroup processors (WGPs) from leaked imagery. The latest insider tip points to the utilization of a non-specific "RDNA 3.x" branch, instead of conjectured RDNA 4 graphics technology. Industry watchdogs hold the belief that AMD will be sticking with RDNA 3.5 for a while—as featured on their current-gen "Zen 5" mobile-oriented Strix Point, Strix Halo and Krackan Point chips. As pointed out by Notebookcheck, Team Red leadership disclosed that RDNA 4 is exclusive to discrete card families (for the time being). RDNA 3.5-equipped APUs have—so far—received a warm welcome; AMD engineers could be reserving development resources for a distant future project.

SoftBank Corp., ZutaCore and Hon Hai Technology Group ("Foxconn") today announced they implemented ZutaCore's two-phase DLC (Direct Liquid Cooling) technology in an AI server using NVIDIA accelerated computing, making it the world's first implementation of ZutaCore's two-phase DLC (Direct Liquid Cooling) technology using NVIDIA H200 GPUs. In addition, SoftBank designed and developed a rack-integrated solution that integrates each component of the server, including cooling equipment with two-phase DLC technology, on a rack scale, and conducted an operational demonstration and performance evaluation at its data center in February 2025. The demonstration results indicated the solution passed NVIDIA's temperature test (NVQual), thereby confirming the compatibility, stability and reliability of this rack-integrated solution. The solution also achieved pPUE (partial Power Usage Effectiveness) of 1.03 (actual measured value) per rack for cooling efficiency

With the spread and increased adoption of AI, demand for AI servers and other computing resources is expected to expand significantly, further increasing power consumption at data centers. At the same time, reducing power consumption from the perspective of reducing carbon dioxide (CO2) emissions has become a pressing issue worldwide, requiring data centers to become more efficient, consume less power, and introduce innovative heat removal solutions. Since May 2024, SoftBank has been collaborating with ZutaCore, a global leader in the development and business deployment of two-phase DLC technology, to develop solutions optimized for low power consumption at AI data centers.

International corporate entities have to deal with global time differences; causing uncountable logistical headaches. As evidenced by local reports; AMD and board partner representatives decided to debut their next-gen Radeon RX 9070 Series in front of a (mostly) Chinese audience. The much earlier than anticipated presentation took place well in advance of the "main event," with Jack Huynh and other Team Red big brass showcasing brand-new products to regional distributors and media outlets. VideoCardz believes that this "surprise" press mini-junket occurred—roughly—twelve hours ahead of the officially scheduled international "special broacast."

Baseline price points—VAT included—of 4999 RMB (~$686 USD) and 4499 RMB (~$617 USD) were announced, for the incoming Radeon RX 9070 XT and RX 9070 models (respectively). We now know that North American MSRPs (excluding tax) are $599 and $549 (respectively). AMD's presentation slides included more shots of their reference designs (MBA), in triple or dual-fan configurations. Earlier in the week, industry watchdogs proposed that the Radeon RX 9070 Series would launch with an all-custom card lineup; with no AMD-built options. Attendees noted several on-stage board partner company reps, including Jack Yu (ASUS China). ASRock, GIGABYTE, PowerColor, VASTARMOR, XFX and Yeston were the other participants; with demonstration hardware in their hands.

Samsung Display today revealed plans to exhibit its next-generation OLED technology, boasting an impressive maximum brightness of 5,000 nits, at the Mobile World Congress 2025 (MWC25) on March 3.

The ultra-high brightness OLED was developed based on the polarizer-less display, also known as on-cell film (OCF) technology, which Samsung Display was the first to commercialize. This innovation not only enhances outdoor visibility but also reduces power consumption, paving the way for significant design flexibility. OCF technology is being applied to a bar-type smartphone and a rollable laptop, following its success in foldable smartphones, and is being recognized by customers as a high-value display technology.

GSMA MWC Barcelona, runs from March 3 to 6, 2025 at the Fira Barcelona Gran Via in Barcelona, Spain. AMD is proud to participate in forward-thinking discussions and demos around AI, edge and cloud computing, the long-term revolutionary potential of moonshot technologies like quantum processing, and more. Check out the AMD hospitality suite in Hall 2 (Stand 2M61) and explore our demos and system design wins. Attendees are welcome to stop by informally or schedule a time slot with us.

As modern networks evolve, high-performance computing, energy efficiency, and AI acceleration are becoming just as critical as connectivity itself. AMD is at the forefront of this transformation, delivering solutions that power next-generation cloud, AI, and networking infrastructure. Our demos this year showcase AMD EPYC, AMD Instinct, and AMD Ryzen AI processors, as well as AMD Versal adaptive SoC and Zynq UltraScale+ RFSoC devices.

Framework has finally introduced its next-generation Framework Laptop 13, now powered by the extremely potent Ryzen AI 300 "Strix Point" APUs. The product is already available for pre-order on Framework's website, with prices starting from $899 for the Do-It-Yourself variant, and $1,099 for the fully assembled variant. From the outside, the design of the product has been left mostly unchanged, which may appear somewhat disappointing at first, although an unaltered design likely indicates compatibility of components between the two laptops, which is undoubtedly one of the primary selling points for the Framework Laptop.

As mentioned, the biggest upgrade that the new Framework Laptop brings to the table is the new selection of processors, with the Ryzen AI 9 HX 370 APU sitting at the highest-end. Unsurprisingly, the Strix Point APUs allow for excellent performance improvements to both CPU and GPU side of things. With 12 cores (4 Zen 5 + 8 Zen 5c) and 24 threads, the highest-end Ryzen AI 9 HX 370 APU performs admirably well in benchmarks as well as real-life workloads. The Radeon 890M iGPU is among the fastest available on the market, trading blows with the Arc 140T iGPU in synthetic benchmarks. Of course, the 50 TOPS NPU allows for CoPilot functionality, for those who care. The Windows variant ships with a dedicated CoPilot key as well, while the DIY variant does not.

The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is helping hyperscalers, and the leading optical module provider, overcome those challenges with new silicon photonics and next-gen BiCMOS technologies, scheduled to ramp up from the second half of 2025 for 800 Gb/s and 1.6 Tb/s optical modules.

At the heart of interconnections in a datacenter are thousands, or even hundreds of thousands, of optical transceivers. These devices convert optical into electrical signals and vice versa to allow data flow between graphics processing unit (GPU) computing resources, switches and storage. Inside these transceivers, ST's new, proprietary silicon photonics (SiPho) technology will bring customers the ability to integrate multiple complex components into one single chip, while ST's next-gen, proprietary BiCMOS technology brings ultra high-speed and low power optical connectivity, which are key to sustain the AI growth.

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Yesterday, the ASUS Chinese office announced a special event—on February 25—dedicated to launching a next-gen AMD APU-powered premium notebook model: "ROG Magic X (or Illusion X) is the first to be equipped with the Ryzen AI MAX+ three-in-one chip, which can efficiently coordinate multiple modes, provide combat power and computing power on demand, and can handle e-sports, creation and AI with one chip!" The manufacturer's Weibo post has generated plenty of buzz; industry insiders reckon that reviews could be published today (February 18)—HXL/9550pro informed VideoCardz with a not so cryptic message: "STX-Halo NDA: Feb 18th 2025."

Western press outlets point out that the ROG Magic X is a local variant of the familiar ROG Flow Z13 design; a 2025 refresh brings in AMD's much anticipated "Strix Halo" APU design. Team Red-authored marketing material and pre-release evaluation leaks have hinted about impressive integrated graphics solution performance; equalling or even exceeding that of previous-gen dGPUs. Well-known North American hardware review outlets have dropped hints (NDA permitting) about AMD's Ryzen Al Max+ 395 and Max 390 processors. Hardware Canucks could barely contain their excitement regarding the potent Zen 4 and RDNA 3.5 combo package; to the point of wish listing a potential direct successor: "Strix Halo is one of the most exciting things launched into the PC space in the last half decade. Full stop...AMD can't keep this as a one-off. If it's followed up with Zen 6 and RDNA 4 next year...watch out." Naturally, Team Red's cutting-edge mobile CPU technology is arriving in devices with high asking prices. The aforementioned ROG Flow Z13 2025 model—configured with top specs—is priced at $2699. Notebookcheck reckons that ASUS has tacked on an extra $500, since an announcement of initial pricing at CES 2025.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

NDA-busting renders of the much-anticipated and rumored Nintendo Switch 2 console appeared online late last year—reports suggested that a member of the Xiahongshu forum was involved in this dramatic leak. The source seemingly had access to a 3D CAD model—possibly procured from a manufacturing partner. Industry insiders believed that top Nintendo brass were incensed by the pre-Christmas 2024 leaks. Around mid-January, an official unveiling of the next-gen gaming handheld arrived online, courtesy of a relatively short teaser video. Early April public showcases are on the calendar; press outlets and regular punters will be participating in hands-on experiences (invite-only) at venues across North America, Europe, Asia and Australia. The flow of early 2025 Switch successor leaks have seemingly slowed down, but renewed activity on Reddit points to early samples emerging via black market outlets.

The aforementioned Xiahongshu forum member is reportedly considering a purchase of pre-release Switch 2 units—previous boasts have indicated that they already own one example. Screenshots of alleged interactions between the seller and potential client were uploaded to Chinese discussion boards, and then shared on the Nintendo Switch 2 Subreddit. The anonymous black market dealer reckons that stock will be available in the near future—claiming by "next week"—with an asking price of 290,000 RMB per package (~$39,780 USD). This steep demand—allegedly—grants early access to the core console tablet, Joy-Con controllers, and dock. Online community debates have produced several theories, regarding the leaker's motivations. Given their history of selling CAD models to accessory makers; this working relationship could develop into a—presumably more profitable—supply of actual working hardware.

David McAfee—AMD's corporate vice president and general manager of client channel business—has highlighted February 28 as a highly important date for next-gen graphics technology. The much-anticipated (and teased) Radeon RX 9000 series unveiling event has a confirmed time slot on that day: 8 AM EST. The overseer of Ryzen CPU and Radeon GPUs has warded off curious queries from journalists and members of the PC hardware for several weeks, since the conclusion of CES 2025. A confusing early January presentation did not include a segment dedicated to upcoming RDNA 4 products. Online conjecture pointed to Team Red delaying and restrategizing the launch of Radeon RX 9070 XT and RX 9070 models.

AMD enthusiasts will breathe a collective sigh of relief, after reading McAfee's announcement: "the wait is almost over. Join us on February 28 at 8 AM EST for the reveal of the next-gen AMD Radeon RX 9000 Series. Get ready to make it yours when it hits shelves in early March. RSVP by subscribing to the AMD YouTube channel." Insider sources reckon that retailers will have stock on shelves by the rumored March 6 launch day. Mid-to-late January leaks suggested a fairly comprehensive distribution of board partner custom cards across European retail channels. Alleged specifications and performance results have leaked out over the past month and a half—will AMD (and AIBs) have any surprises lined up for the February 28 event?

During yesterday's "Battlefield Labs" announcement, Electronic Arts revealed the full extent of its international multi-team development setup—dubbed "Battlefield Studios." According to their recent presentation, franchise originator—DICE (Stockholm)—is working alongside Ripple Effect (formerly DICE Los Angeles), Motive (Montreal) and Criterion (Guildford). EA's British studio is best known for its past work—most notably (going back nearly twenty-five years ago) the Burnout series and newer Need for Speed titles. The Surrey-based outfit appears to be completely devoted to working on the next Battlefield entry's single-player component—older press releases hinted about a new Need for Speed project. Around autumn 2023, Vince Zampella (Battlefield franchise overseer) announced that the majority of Criterion's team had shifted over to working on a next-gen Battlefield title, while a smaller "core group" would: "continue on what's next for Need for Speed."

Almost a year ago, Criterion and EA celebrated the Need for Speed franchise's thirtieth anniversary—a press release focused mainly on roadmapped content for Need for Speed Unbound (2022). The game was updated with a final chunk of post-release content last November. Eurogamer took it upon themselves to investigate Criterion's current internal formation, given that support duties have concluded on the NFS Unbound project. The online publication received a response from EA's top-most Battlefield developer. Zampella said in a statement to Eurogamer: "the Need for Speed team at Criterion are joining their colleagues working on Battlefield...As a company, it was important to us to take the last year to listen to our Need for Speed community and use their feedback to create content for Unbound...With an increased understanding of what our players want in a Need for Speed experience, we plan to bring the franchise back in new and interesting ways."

We build our TUF Gaming components for users who want an emphasis on substance, meaning you're paying for pure performance when you go TUF. That focus on function is where the TUF Gaming GeForce RTX 5090 and TUF Gaming GeForce RTX 5080 graphics cards excel, providing you with next-gen graphics capabilities as well as high-performance thermal solutions that'll hold up under 4K AAA gaming pressure. If you've been waiting to upgrade your rig and want to treat yourself to a premium power bump, now's the time to pull the trigger. You're in for a truly substantial generational leap with these high-end components featuring the power of NVIDIA's latest GPU architecture alongside the sophistication of our latest graphics card designs.

Next-gen tech for tomorrow's heavyweight games
The GeForce RTX 5090 and 5080 comprise the top of the power stack for NVIDIA's 50 Series GPUs, so when you invest in either a TUF Gaming GeForce RTX 5090 or 5080 graphics card, you're setting yourself up for years to come. The 50 Series is powered by NVIDIA's Blackwell architecture, meaning these GPUs feature 4th generation RT cores to give gamers the best ray tracing performance yet. They also pack neural shaders, which compress textures to cut down on memory usage and produce incredible real-time visuals. And NVIDIA has ensured its 50 Series is equipped for neural processing via a built-in AI management processor, so you'll get an optimal experience when harnessing the power of NVIDIA DLSS 4. Powered by 5th generation Tensor Cores, DLSS 4 uses a Multi Frame Generation solution to boost your framerate to new heights.

The HWiNFO development team are prepping for the upcoming release of an NVIDIA upper mid-range "Blackwell" GPU—their popular system diagnostics tool will be updated with support for GeForce RTX 5070 Ti (GB203-based) graphics card models. Team Green flagship and sub-flagship SKUs were sent to market this week—with mixed results—industry experts believe that stock shortages will be in effect for many months post-release. Volatile retail conditions could force potential buyers—of next-gen graphics technology—into considering options from lower down in NVIDIA's new product stack. The GeForce RTX 5070 Ti ($749 MSRP, with no Founders Edition) and GeForce RTX 5070 ($549 MSRP) GPUs could be tempting alternatives—as stopgaps or permanent fixtures. Press outlets believe that a February 20 product launch is pencilled in.

HWiNFO's incoming 8.21 build is being readied with support for GeForce RTX 5070 Ti graphics cards, but the GeForce RTX 5070 (non-Ti) GPU is notably absent from the suite's "upcoming changes" list. An investigative VideoCardz news piece points to HWiNFO being the first bit of software to publicly acknowledge (in advance) support for Team Green's 8,960 CUDA core-equipped model. As reported earlier this week, the GeForce RTX 5070 Ti is based on NVIDIA's GB203 GPU—also present on a larger sibling: "RTX 5080 maxes the silicon out, enabling all 84 SM, the RTX 5070 Ti is slightly cut down, with 70 out of 84 SM being enabled, resulting in 8,960 CUDA cores, 280 Tensor cores, 70 RT cores, 280 TMUs, and an unknown number of ROPs. The memory size is 16 GB, across the chip's full 256-bit GDDR7 memory interface... Its TGP is down to 300 W compared to the 360 W of the RTX 5080."

DeepSeek-R1 is an open model with state-of-the-art reasoning capabilities. Instead of offering direct responses, reasoning models like DeepSeek-R1 perform multiple inference passes over a query, conducting chain-of-thought, consensus and search methods to generate the best answer. Performing this sequence of inference passes—using reason to arrive at the best answer—is known as test-time scaling. DeepSeek-R1 is a perfect example of this scaling law, demonstrating why accelerated computing is critical for the demands of agentic AI inference.

As models are allowed to iteratively "think" through the problem, they create more output tokens and longer generation cycles, so model quality continues to scale. Significant test-time compute is critical to enable both real-time inference and higher-quality responses from reasoning models like DeepSeek-R1, requiring larger inference deployments. R1 delivers leading accuracy for tasks demanding logical inference, reasoning, math, coding and language understanding while also delivering high inference efficiency.