The late 2024 news cycle suggested that Samsung's semiconductor business was going through tough times. Alleged yield problems—affecting the 3 nm Gate-All-Around (GAA) process—were highlighted last November. Fast-forward to January 2025; the South Korean megacorp has launched its cutting-edge Galaxy S25 smartphone series. The entire lineup of newly unveiled flagship smartphones contains Qualcomm's Snapdragon 8 Elite mobile chipsets; the Southern Californian chip designer is reportedly pulling in a tidy sum from this partnership. Fresh reports from South Korean news outlets indicate that Samsung System LSI employees have received an "encouraging" email from their boss, regarding current production predicaments.

Businesskorea and Sedaily reports include quotes extracted from the (apparently) leaked internal memo. LSI division president, Park Yong-in, reportedly stated: "we are currently in a situation where we have to develop two flagship products at the same time." Both articles allege that Samsung's semiconductor teams are expected to "cultivate roots and withstand storms." Industry watchdogs believe that the aforementioned "flagship products" are the Exynos 2500 mobile chipset, and Samsung Electronic's next-gen Galaxy S26 smartphone family. Earlier this month, we heard whispers about the much-delayed in-house chip design being readied (with a 2 nm process) for a possible late 2025 launch, inside unannounced Galaxy Z Flip 7 and Fold 7 devices. Park disclosed anticipated incoming obstacles in 2025: "last year's business division profit was higher than expected, but this was a temporary phenomenon...Looking at the entire business division, there will be monthly surpluses and deficits." Last month, inside sources proposed the notion that foundry investments were slashed in half.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is helping hyperscalers, and the leading optical module provider, overcome those challenges with new silicon photonics and next-gen BiCMOS technologies, scheduled to ramp up from the second half of 2025 for 800 Gb/s and 1.6 Tb/s optical modules.

At the heart of interconnections in a datacenter are thousands, or even hundreds of thousands, of optical transceivers. These devices convert optical into electrical signals and vice versa to allow data flow between graphics processing unit (GPU) computing resources, switches and storage. Inside these transceivers, ST's new, proprietary silicon photonics (SiPho) technology will bring customers the ability to integrate multiple complex components into one single chip, while ST's next-gen, proprietary BiCMOS technology brings ultra high-speed and low power optical connectivity, which are key to sustain the AI growth.

Senao Networks Inc. (SNI), a global leader in AI computing and networking solutions, will be exhibiting at 2025 Mobile World Congress (MWC) in Barcelona. At the event, SNI will showcase its latest AI-driven innovations, including AI Servers, AI Cameras, AIPCs, Cloud Solutions, and Titanium Power Supply, reinforcing its vision of "AI Everywhere."

Senao Networks continues to advance AI computing with new products designed to enhance security, efficiency, and connectivity.

Yesterday, the ASUS Chinese office announced a special event—on February 25—dedicated to launching a next-gen AMD APU-powered premium notebook model: "ROG Magic X (or Illusion X) is the first to be equipped with the Ryzen AI MAX+ three-in-one chip, which can efficiently coordinate multiple modes, provide combat power and computing power on demand, and can handle e-sports, creation and AI with one chip!" The manufacturer's Weibo post has generated plenty of buzz; industry insiders reckon that reviews could be published today (February 18)—HXL/9550pro informed VideoCardz with a not so cryptic message: "STX-Halo NDA: Feb 18th 2025."

Western press outlets point out that the ROG Magic X is a local variant of the familiar ROG Flow Z13 design; a 2025 refresh brings in AMD's much anticipated "Strix Halo" APU design. Team Red-authored marketing material and pre-release evaluation leaks have hinted about impressive integrated graphics solution performance; equalling or even exceeding that of previous-gen dGPUs. Well-known North American hardware review outlets have dropped hints (NDA permitting) about AMD's Ryzen Al Max+ 395 and Max 390 processors. Hardware Canucks could barely contain their excitement regarding the potent Zen 4 and RDNA 3.5 combo package; to the point of wish listing a potential direct successor: "Strix Halo is one of the most exciting things launched into the PC space in the last half decade. Full stop...AMD can't keep this as a one-off. If it's followed up with Zen 6 and RDNA 4 next year...watch out." Naturally, Team Red's cutting-edge mobile CPU technology is arriving in devices with high asking prices. The aforementioned ROG Flow Z13 2025 model—configured with top specs—is priced at $2699. Notebookcheck reckons that ASUS has tacked on an extra $500, since an announcement of initial pricing at CES 2025.

One feature that gamers have loved about AMD Ryzen processors is the company's commitment to socket longevity. If you have a PC with an AMD Ryzen 7000 Series CPU and an AM5 motherboard, for example, you're able to upgrade to an AMD Ryzen 9000 Series CPU without stripping your PC down to the studs and replacing the motherboard. But perhaps you're starting from scratch with your first AM5 PC. In that case, you have several years' worth of AM5 motherboard options to consider, including the TUF Gaming B850-Plus WiFi from our B850 motherboard family.

For years, one of the most popular AM5 motherboards has been the TUF Gaming B650-Plus WiFi. This rock-solid, battle-proven board delivers on all fronts with its durable design, comprehensive cooling, and ruggedized aesthetic. Yet if you're building a new PC in 2025, we think you'll be happier in the long run with this board's successor, the TUF Gaming B850-Plus WiFi. Armed with key updates like a bolstered power solution, PCIe 5.0 x16 slot, Wi-Fi 7, and more and faster USB ports, this motherboard offers incredible value for your gaming rig.

NDA-busting renders of the much-anticipated and rumored Nintendo Switch 2 console appeared online late last year—reports suggested that a member of the Xiahongshu forum was involved in this dramatic leak. The source seemingly had access to a 3D CAD model—possibly procured from a manufacturing partner. Industry insiders believed that top Nintendo brass were incensed by the pre-Christmas 2024 leaks. Around mid-January, an official unveiling of the next-gen gaming handheld arrived online, courtesy of a relatively short teaser video. Early April public showcases are on the calendar; press outlets and regular punters will be participating in hands-on experiences (invite-only) at venues across North America, Europe, Asia and Australia. The flow of early 2025 Switch successor leaks have seemingly slowed down, but renewed activity on Reddit points to early samples emerging via black market outlets.

The aforementioned Xiahongshu forum member is reportedly considering a purchase of pre-release Switch 2 units—previous boasts have indicated that they already own one example. Screenshots of alleged interactions between the seller and potential client were uploaded to Chinese discussion boards, and then shared on the Nintendo Switch 2 Subreddit. The anonymous black market dealer reckons that stock will be available in the near future—claiming by "next week"—with an asking price of 290,000 RMB per package (~$39,780 USD). This steep demand—allegedly—grants early access to the core console tablet, Joy-Con controllers, and dock. Online community debates have produced several theories, regarding the leaker's motivations. Given their history of selling CAD models to accessory makers; this working relationship could develop into a—presumably more profitable—supply of actual working hardware.

David McAfee—AMD's corporate vice president and general manager of client channel business—has highlighted February 28 as a highly important date for next-gen graphics technology. The much-anticipated (and teased) Radeon RX 9000 series unveiling event has a confirmed time slot on that day: 8 AM EST. The overseer of Ryzen CPU and Radeon GPUs has warded off curious queries from journalists and members of the PC hardware for several weeks, since the conclusion of CES 2025. A confusing early January presentation did not include a segment dedicated to upcoming RDNA 4 products. Online conjecture pointed to Team Red delaying and restrategizing the launch of Radeon RX 9070 XT and RX 9070 models.

AMD enthusiasts will breathe a collective sigh of relief, after reading McAfee's announcement: "the wait is almost over. Join us on February 28 at 8 AM EST for the reveal of the next-gen AMD Radeon RX 9000 Series. Get ready to make it yours when it hits shelves in early March. RSVP by subscribing to the AMD YouTube channel." Insider sources reckon that retailers will have stock on shelves by the rumored March 6 launch day. Mid-to-late January leaks suggested a fairly comprehensive distribution of board partner custom cards across European retail channels. Alleged specifications and performance results have leaked out over the past month and a half—will AMD (and AIBs) have any surprises lined up for the February 28 event?

During yesterday's "Battlefield Labs" announcement, Electronic Arts revealed the full extent of its international multi-team development setup—dubbed "Battlefield Studios." According to their recent presentation, franchise originator—DICE (Stockholm)—is working alongside Ripple Effect (formerly DICE Los Angeles), Motive (Montreal) and Criterion (Guildford). EA's British studio is best known for its past work—most notably (going back nearly twenty-five years ago) the Burnout series and newer Need for Speed titles. The Surrey-based outfit appears to be completely devoted to working on the next Battlefield entry's single-player component—older press releases hinted about a new Need for Speed project. Around autumn 2023, Vince Zampella (Battlefield franchise overseer) announced that the majority of Criterion's team had shifted over to working on a next-gen Battlefield title, while a smaller "core group" would: "continue on what's next for Need for Speed."

Almost a year ago, Criterion and EA celebrated the Need for Speed franchise's thirtieth anniversary—a press release focused mainly on roadmapped content for Need for Speed Unbound (2022). The game was updated with a final chunk of post-release content last November. Eurogamer took it upon themselves to investigate Criterion's current internal formation, given that support duties have concluded on the NFS Unbound project. The online publication received a response from EA's top-most Battlefield developer. Zampella said in a statement to Eurogamer: "the Need for Speed team at Criterion are joining their colleagues working on Battlefield...As a company, it was important to us to take the last year to listen to our Need for Speed community and use their feedback to create content for Unbound...With an increased understanding of what our players want in a Need for Speed experience, we plan to bring the franchise back in new and interesting ways."

We build our TUF Gaming components for users who want an emphasis on substance, meaning you're paying for pure performance when you go TUF. That focus on function is where the TUF Gaming GeForce RTX 5090 and TUF Gaming GeForce RTX 5080 graphics cards excel, providing you with next-gen graphics capabilities as well as high-performance thermal solutions that'll hold up under 4K AAA gaming pressure. If you've been waiting to upgrade your rig and want to treat yourself to a premium power bump, now's the time to pull the trigger. You're in for a truly substantial generational leap with these high-end components featuring the power of NVIDIA's latest GPU architecture alongside the sophistication of our latest graphics card designs.

Next-gen tech for tomorrow's heavyweight games
The GeForce RTX 5090 and 5080 comprise the top of the power stack for NVIDIA's 50 Series GPUs, so when you invest in either a TUF Gaming GeForce RTX 5090 or 5080 graphics card, you're setting yourself up for years to come. The 50 Series is powered by NVIDIA's Blackwell architecture, meaning these GPUs feature 4th generation RT cores to give gamers the best ray tracing performance yet. They also pack neural shaders, which compress textures to cut down on memory usage and produce incredible real-time visuals. And NVIDIA has ensured its 50 Series is equipped for neural processing via a built-in AI management processor, so you'll get an optimal experience when harnessing the power of NVIDIA DLSS 4. Powered by 5th generation Tensor Cores, DLSS 4 uses a Multi Frame Generation solution to boost your framerate to new heights.

The HWiNFO development team are prepping for the upcoming release of an NVIDIA upper mid-range "Blackwell" GPU—their popular system diagnostics tool will be updated with support for GeForce RTX 5070 Ti (GB203-based) graphics card models. Team Green flagship and sub-flagship SKUs were sent to market this week—with mixed results—industry experts believe that stock shortages will be in effect for many months post-release. Volatile retail conditions could force potential buyers—of next-gen graphics technology—into considering options from lower down in NVIDIA's new product stack. The GeForce RTX 5070 Ti ($749 MSRP, with no Founders Edition) and GeForce RTX 5070 ($549 MSRP) GPUs could be tempting alternatives—as stopgaps or permanent fixtures. Press outlets believe that a February 20 product launch is pencilled in.

HWiNFO's incoming 8.21 build is being readied with support for GeForce RTX 5070 Ti graphics cards, but the GeForce RTX 5070 (non-Ti) GPU is notably absent from the suite's "upcoming changes" list. An investigative VideoCardz news piece points to HWiNFO being the first bit of software to publicly acknowledge (in advance) support for Team Green's 8,960 CUDA core-equipped model. As reported earlier this week, the GeForce RTX 5070 Ti is based on NVIDIA's GB203 GPU—also present on a larger sibling: "RTX 5080 maxes the silicon out, enabling all 84 SM, the RTX 5070 Ti is slightly cut down, with 70 out of 84 SM being enabled, resulting in 8,960 CUDA cores, 280 Tensor cores, 70 RT cores, 280 TMUs, and an unknown number of ROPs. The memory size is 16 GB, across the chip's full 256-bit GDDR7 memory interface... Its TGP is down to 300 W compared to the 360 W of the RTX 5080."

DeepSeek-R1 is an open model with state-of-the-art reasoning capabilities. Instead of offering direct responses, reasoning models like DeepSeek-R1 perform multiple inference passes over a query, conducting chain-of-thought, consensus and search methods to generate the best answer. Performing this sequence of inference passes—using reason to arrive at the best answer—is known as test-time scaling. DeepSeek-R1 is a perfect example of this scaling law, demonstrating why accelerated computing is critical for the demands of agentic AI inference.

As models are allowed to iteratively "think" through the problem, they create more output tokens and longer generation cycles, so model quality continues to scale. Significant test-time compute is critical to enable both real-time inference and higher-quality responses from reasoning models like DeepSeek-R1, requiring larger inference deployments. R1 delivers leading accuracy for tasks demanding logical inference, reasoning, math, coding and language understanding while also delivering high inference efficiency.

Intel's freshly uploaded fourth-quarter 2024 "CEO/CFO earnings call comments" document has revealed grand CPU-related plans for 2025 and beyond. One of Team Blue's interim leaders—Michelle Johnston Holthaus—believes that "Nova Lake" processors (a next-generation client family) will arrive in 2026, following a comprehensive rollout of "Panther Lake" CPU products. This official timeline matches previously leaked and rumored development schedules—most notably, in a shipping manifest that was discovered last week. In recent times, industry watchdogs have linked "Nova Lake" to Intel's own 14A node and a TSMC 2 nm process node. Additionally, tipsters pointed to an apparent selection of Coyote Cove performance cores and Arctic Wolf efficiency-oriented cores.

Following yesterday's official announcements, a leaker shared several insights—theorized core configurations and manufacturing details were posted on the Hardware subreddit. Community members were engaged in a debate over Intel's "killing of Falcon Shore," but a plucky contributor—going under the moniker "Exist50"—redirected conversation to all-things "Nova Lake." They believe that Intel has shifted all "compute dies to TSMC" for manufacturing, after a change in plans—initial designs had the "8+16 die" on TSMC's N2P, and the "4+8 die on Intel 18A." Exist50 seemed to have inside track knowledge of product ranges: "Nova Lake (NVL) has a unified HUB/SoC die across mobile and desktop. So yeah, the baseline there is 4+8+4. But there's at least one more die for mobile." The flagship desktop (NVL-S or NVL-SK) chip's configuration could feature as many as sixteen performance cores and thirty-two efficiency cores, due to tile reuse—2x (8P+16E). Exist50 advised Intel CPU enthusiasts to forgo current generation offerings. "Nova Lake" should be: "quite a jump from Arrow Lake (ARL) in terms of MT performance, to say the least. I think anyone who buys ARL will end up regretting it, big time!"

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Qualcomm's Snapdragon X2 processor family was outed last autumn—online sources revealed an Iceland-themed "Project Glymur" moniker, as well as the "SC8480XP" SKU codename. At the time, leakers suggested that Qualcomm engineers had started testing early samples around July/August—further speculation pointed to "Snapdragon X Elite Gen 2" chipsets being evaluated on desktop platforms.

Yesterday, Everest (aka Olrak29_) discovered another SKU—their social media post included an intriguing screenshot, extracted from a shipping manifest. The image's contents reveals the existence of an "Ultra Premium" model, with part number: X2-000-096. Qualcomm has publicly acknowledged that it is working on successors, for launch in 2025—its third generation of "Oryon" CPU cores are lined up for inclusion in the next-gen AI PC project. Second-gen "Oryon" cores are reserved for smartphone platforms. The leaked "Ultra Premium" chip could sit in a new product tier—possibly positioned above the already established high-end "Elite" range.

AMD Radeon engineers are spending newly allocated extra time on optimizing their upcoming FidelityFX Super Resolution 4 (FSR 4) technology—industry watchdogs believe that a finalized version will launch alongside the initial lineup of RDNA 4 graphics card, now scheduled for release in March. Recently, David McAfee—Vice President and General Manager of Ryzen and Radeon products—revealed that his colleagues were working hard on maximizing performance and enabling "more FSR 4 titles." Insiders have started theorizing about how the current landscape of FSR 3.1-compatible games will translate with next-gen "AI-driven" upscaling techniques—several outlets believe that a freshly patched PC version of The Last of Us Part I is paving the way for eventual "easy" updates.

Kepler_L2—an almost endless fountain of Team Red-related insider knowledge—picked up on a past weekend VideoCardz report, and proceeded to add some extra tidbits via social media interaction. They started off by claiming that Team Red's: "RDNA 4 driver replaces FSR 3.1 DLL with FSR 4." When queried about the implication of said development, Kepler believes that all FSR 3.1 game titles will become ready to support FSR 4 on day one. The upgrade process—possibly achieved through a driver-level DLL swap—is reportedly quite easy to implement. According to the insider: "yeah, it should just work."

Silicon Motion will expand its MonTitan lineup of SSD controllers—for datacenters and enterprise platforms—with the upcoming addition of a truly next-generation model. Wallace C. Kou (the company's founder and CEO) contributes to ChinaFlashMarket.com with a regular written column—his latest feature (posted on January 17) includes a short sentence dedicated to announcing his firm's new SM8466 design. This appears to be their first foray into PCIe 6.0-based interface territories—details are minimal (at this point in time), but the CEO divulged the very basics. Silicon Motion's engineering team is currently in the "development stage" with the SM8466 project—a: "4 nm PCIe Gen 6 SSD master chip."

It is not clear whether this next-gen PCIe 6.0 SSD controller will be heading to market anytime soon, but Kou's column mostly focused on current plans—likely signalling where priorities lie. Silicon Motion's "built-in PCIe Gen 5 SSD enterprise-level master chip" (SM8366) is in mass production—industry experts believe that the company's MonTitan PCIe 5.0 family has had a tough time keeping up with equivalent Phison products—in particular, the market leading PS5026-E26 (PCIe 5.0 x4) controller. The SM8366 could be potent enough to take the crown in higher-end enterprise segments, but the existence of a PCIe 6.0-based successor is bound to attract extra attention.

AMD has finally made an official announcement regarding the much anticipated launch of RDNA 4 graphics cards. The first wave of next-generation models—Radeon RX 9070 XT and 9070 (non-XT)—are lined up for a loose "around March" release, thus conforming to recent company statements that pointed to a first quarter (of 2025) rollout. The rumor mill had Team Red strategizing a launch for later this month—potentially beating NVIDIA to the next-gen GPU punch, but "price hurdles" and other factors have allegedly contributed to a revision of tactics.

Yesterday, David McAfee—Vice President and General Manager of Ryzen and Radeon products—ended speculation with a social media post: "Radeon 9000 series hardware and software are looking great, and we are planning to have a wide assortment of cards available globally. Can't wait for gamers to get their hands on the cards when they go on sale in March!" Hardcore PC hardware enthusiasts will likely be left confused by this fresh proclamation—a steady flow of January leaks have provided evidence of Navi 48 GPU-based products sitting in retail storage facilities, unboxing of certain partner models, and insiders playtesting early samples. Industry watchdogs posit that AMD's "aggressive pricing approach" has rubbed retailers the wrong way—the extra wiggle room could be spent on negotiating wholesale costs.

At CES 2025, Khadas captivated global audiences with groundbreaking product designs and innovative technologies, showcasing the immense potential of next-generation computing devices. As a technology brand dedicated to addressing diverse user needs, Khadas delivered an impressive display of cutting-edge solutions that seamlessly blend innovation with practicality.

Mind 2s: The Modular Mini PC Powered by Arrow Lake
Since the launch of its first Mind series, Khadas has earned widespread recognition for its exceptional craftsmanship and superior performance. To meet the demand for the latest technology, Khadas unveiled Mind 2s, modular mini PC powered by the Intel Arrow Lake platform. Featuring the Intel Core Ultra 7 255H processor, built on the all-new Arrow Lake-H architecture, the Mind 2s offers not only significant performance enhancements but also outstanding energy efficiency, improved integrated graphics, and superior AI processing capabilities.

MSI introduced its groundbreaking NVIDIA GeForce RTX 50 Series graphics card range earlier today—hot on the heels of NVIDIA's formal unveiling of its brand-new Blackwell architecture. TechPowerUp staffers on the ground at this year's CES managed to wade through MSI's enviable collection of custom cards showcased on the showroom floor—taking up-close photos and discussing the latest designs with company representatives. An entry-level family has debuted—in the form of INSPIRE—alongside a new high-end series dubbed "VANGUARD." In addition, TPU was treated to the usual suspects including top-of-the-range SUPRIM cards. MSI has also tinkered with its design aesthetic for the VENTUS GAMING product line.

We will start with the upper echelon—MSI's new GeForce RTX 5090 32G SUPRIM LIQUID SOC model. Well-heeled gaming enthusiasts will likely be handing over a hefty premium for this well appointed dual-slot card. Its stealthy "diamond-cut inspired" premium shroud houses a micro-fin copper base and MSI's patented water block array—ensuring that the GPU and VRAM are kept cool during the most demanding of gaming or professional sessions. The 360 mm aluminium radiator is coupled with the latest STORMFORCE fans in a triple unit configuration. It should be noted that the Ada Lovelace generation MSI RTX 4090 SUPRIM LIQUID model sported a dual-fan radiator setup. MSI reps did not divulge any details regarding extreme overclocking and boost figures for this top-tier Blackwell model, but we suspect that the extra fan will be doings its best to temper Team Green's "massive" GB202 die.

Expanding its AI PC leadership, Qualcomm Technologies, Inc. announced the Snapdragon X Platform, the 4th platform to join the Snapdragon X Series compute portfolio, designed to deliver performance, multi-day battery life, and Copilot+ PC experiences for even more users globally.

Redefining the PC Category for Mainstream Devices at $600
Utilizing the power of an 8-core Qualcomm Oryon CPU, Snapdragon X is delivering essential performance to the next-generation of PCs. This platform delivers up to 163% faster performance at ISO-power than our competitors who also require 168% more power at ISO-performance, the Snapdragon X processor balances performance and built-in intelligence with a 45 TOPS NPU that runs Copilot+ PC experiences more efficiently. With an integrated power efficient GPU, Snapdragon X supports dynamic graphics ideal for creating presentations, web browsing, or streaming content. Snapdragon X is an ideal solution for students, freelance workers, and budget-conscious consumers who need a reliable and powerful laptop that can keep up with their busy lives. Devices powered by Snapdragon X are expected to be available from leading OEMs including Acer, ASUS, Dell Technologies, HP and Lenovo in early 2025 enabling Copilot+ PCs in the $600 range.

MSI has unveiled its groundbreaking NVIDIA GeForce RTX 50 Series graphics cards, featuring cutting-edge designs including Suprim Liquid, Suprim, Vanguard, Gaming Trio, Ventus, and Inspire. Engineered with enhanced thermal solutions, the cards are crafted to meet the high-performance demands of next-gen GPUs, delivering advanced cooling and peak performance.

Powered by NVIDIA Blackwell, GeForce RTX 50 Series GPUs bring game-changing capabilities to gamers and creators. Equipped with a massive level of AI horsepower, the RTX 50 Series enables new experiences and next-level graphics fidelity. Multiply performance with NVIDIA DLSS 4, generate images at unprecedented speed, and unleash creativity with NVIDIA Studio. Plus, access NVIDIA NIM microservices - state-of-the-art AI models that let enthusiasts and developers build AI assistants, agents, and workflows with peak performance on NIM-ready systems.

By now, it's a surprise to almost nobody that NVIDIA plans to launch its next-generation RTX 5000-series "Blackwell" gaming graphics cards at the upcoming CES 2025 event in Las Vegas in early January. Previously, leaks and rumors gave us a full run-down of expected VRAM amounts and other specifications and features for the new GPUs, but these have yet to be confirmed by NVIDIA—for obvious reasons. Now, though, it looks as though iBuyPower has jumped the gun and prematurely revealed the new specifications for its updated line-up of pre-built gaming PCs with RTX 5000-series GPUs ahead of NVIDIA's official announcement. The offending product pages have since been removed, but they both give us confirmation of the previously leaked VRAM amounts and of the expected release cadence for RTX 5000, which will reportedly see the RTX 5070 Ti and RTX 5080 launch before the RTX 5090 flagship.

On iBuyPower's now-pulled pages, the NVIDIA GeForce RTX 5080 16 GB and GeForce RTX 5070 Ti 16 GB can be seen as the GPUs powering two different upcoming Y40 pre-built gaming PCs from the system integrator. The VRAM specifications here coincide with what we have previously seen from other leaked sources. Unfortunately, while an archived version of the page for the pre-built containing the RTX 5080 appears to show the design for an ASUS TUF Gaming RTX 5080 with a triple-fan cooler, it looks like iBuyPower is using the same renders for both the 5080 and 5070Ti versions of the pre-built PCs. What's also interesting is that iBuyPower looks to be pairing the next-gen GPUs with 7000-series AMD X3D CPUs, as opposed to the newly released AMD Ryzen 9000 X3D chips that have started making their way out into the market.

Himax Technologies, Inc. ("Himax" or "Company"), an industry leader in fabless display driver ICs and other semiconductors, today announced it will present its next-generation, proprietary ultra luminous 400K nit Color Sequential Front-lit LCoS Microdisplay solution at CES 2025, the largest consumer electronics show in Las Vegas, U.S.A. from January 7 - 10, 2025. The unparalleled brightness of the LCoS solution reaffirms Himax's market leadership in LCoS and its steadfast commitment to advancing AR applications, catering to the critical demands of leading tech innovators in AR technology.

Himax's proprietary Color Sequential Front-lit LCoS Microdisplay sets a new benchmark in brightness performance for microdisplays. With an industry-leading 400K nits of brightness and typical power consumption of just 300 milliwatts, this breakthrough ensures superior eye-level brightness even in high ambient light environments, making it a perfect fit for outdoor usability. The integration of 2D waveguides further enhances its ability to deliver clear, vibrant visuals, making it ideal for next-generation see-through goggles. In addition to its brightness, the microdisplay boasts a lightweight, ultra-compact form factor of less than 0.5 c.c., exceptional vibrant color performance, and low power consumption, all essential factors for all-day wearable devices. This makes the Color Sequential Front-lit LCoS Microdisplay a perfect solution for the evolving needs of AR goggle devices.

Intel has officially announced its presence at CES 2025, teasing what appears to be a significant focus on AI capabilities in its upcoming processor lineup. The tech giant shared a preview image featuring their tagline "AI Inside for a New Era." The announcement suggests that the company will be showcasing new developments in AI processing capabilities integrated directly into their consumer processors. Intel's upcoming lineup is expected to feature the mobile-focused "Arrow Lake" Core Ultra 200H/HX processors alongside the Arrow Lake-based Core Ultra 200S series designed for desktop systems with 35 W and 65 W power configurations. The company is also supposedly introducing new mid-range and workstation-class 800-series processors for desktop platforms.

The "AI Inside" messaging indicates that Intel is positioning itself to compete more aggressively in the AI computing space, particularly as PCs increasingly handle AI workloads locally. While specific details about the presentation remain under wraps, we can anticipate announcements regarding new Arrow Lake configurations, enhanced AI capabilities, and possibly new partnerships or software ecosystems designed to leverage these features. The keynote could also shed light on Intel's strategy for maintaining competitiveness in an increasingly AI-focused computing landscape. Michelle Johnston Holthaus, interim co-CEO, and Jack Weast, an Intel Fellow and VP of Intel Automotive, will deliver the live keynote. Intel's agenda also shows next-generation AI silicon so we can get information on accelerators like Falcon Shores.

The Apple M4 hardly needs any introduction - the latest desktop-class SoC from the Cupertino giant is remarkably fast, while being impressively efficient. Its recently unveiled Pro and Max variants are equally praiseworthy, although none of the 4th generation Apple Silicon goodness is available on the extremely popular MacBook Air as of right now. However, that is about to change soon according to a reliable recent report.

According to Bloomberg's Mark Gurman, the M4-powered MacBook Air has already entered production, and is scheduled to witness the light of day by the spring of next year, possibly even earlier. However, it is certainly worth noting that unlike the MacBook Pro, the MacBook Air does not feature active cooling, making its performance rather limited in demanding, sustained scenarios as compared to the MacBook Pro. Even then, the M4 is likely to be much snappier than its primary x86 rival, Intel's Lunar Lake, if the M4 iPad Pro's performance is anything to go by.