Everyone's favorite GPU-news leaker Kopite7kimi has updated his tweet from April 1 with more specific board part numbers, and suddenly the information contained there—which could have been misinterpreted as an April 1st joke—now all seems to add up with our own posting from last month about memory bus widths. The update seems to indicate the boards will now feature 21 Gbps memory, which is the same as what we saw on the recently made available RTX 3090 Ti cards, and Videocardz goes further to speculate the 3090 Ti could have been a dry run for the upcoming cards, including with a similar 600 W TDP rating to follow. Note also that the leaker is shying away from referring to these as the RTX 4080/4090 series, leaving room in case NVIDIA decides to jump in naming scheme for reasons including marketing and what the competition decides.

ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and can be found on the production floors of most semiconductor manufacturers and OSATs involved in Advanced Packaging worldwide.
Earlier this month, the company was recognized for its continuous innovation and contribution to heterogeneous integration technologies with a 3D InCites "Equipment Supplier of the Year" award.

ERS is now giving a first look at the next-generation ADM330, which has changed its previously matte metallic appearance to a clean, white surface matching most equipment found in a cleanroom. In addition, the machine is now fully compliant with the GEM300 SEMI standards, thus allowing seamless integration into automated fabs and Industry 4.0 architectures. Warpage adjustment performance has also been improved thanks to a unique thermal chuck design that enables a strong vacuum performance three times better than its predecessor. Lastly, the new ADM330 offers an implemented add-on software feature allowing stand-alone laser marking for improved wafer traceability.

After the data center-oriented Hopper architecture launch, NVIDIA is slowly preparing to transition the consumer section to new, gaming-focused designs codenamed Ada Lovelace. For starters, the source claims that NVIDIA is using the upcoming GeForce RTX 3090 Ti GPU as a test run for the next-generation Ada Lovelace AD102 GPU. Thanks to the authorities over at Igor's Lab, we have some additional information about the upcoming lineup. We have a sneak peek of a few features regarding the top-end GeForce RTX 4080 and RTX 4090 GPU SKUs. According to Igor's claims, NVIDIA is testing the PCIe Gen5 power connector and wants to see how it fares with the biggest GA102 SKU - GeForce RTX 3090 Ti.

Additionally, we find that the AD102 GPU is supposed to be pin-compatible with GA102. This means that the number of pins located on GA102 is the same as what we are going to see on AD102. There are 12 places for memory modules on the AD102 reference design board, resulting in up to 24 GB of GDDR6X memory. As much as 24 voltage converters surround the GPU, NVIDIA will likely implement uP9512 SKU. It can drive eight phases, resulting in three voltage converters per phase, ensuring proper power delivery. The total board power (TBP) is likely rated at up to 600 Watts, meaning that the GPU, memory, and power delivery combined output 600 Watts of heat. Igor notes that board partners will bundle 12+4 (12VHPWR) to four 8-pin (PCIe old) converters to enable PSU compatibility.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

The next-generation "Ada Lovelace" graphics architecture powering NVIDIA's GeForce RTX 40-series graphics cards, could see a significant increase in on-die cache memory, according to leaked source-code related to drivers or firmware, seen by XinoAssassin on Twitter. The source-code leak emanates from the recent large-scale cyber-attack on NVIDIA. When comparing source files related to Ampere and Ada architectures, XinoAssassin noticed lines that reference large cache slices.

From this, it was analyzed that the top-of-the-line AD102 silicon will have 96 MB of last-level cache on the silicon; the AD103 and AD104 chips have 64 MB; the AD106 has 48 MB, and the smallest AD107 has 32 MB. Compare this to the 6 MB on the GA102, puny 4 MB on the GA103 and GA104; 3 MB on the GA106, and 2 MB on the GA107. NVIDIA is known to make innovations in generational memory bandwidth increase and memory management, with each new architecture. The company could tap into even faster versions of GDDR6X memory it co-developed with Micron (GDDR6 with PAM4 signaling).

When Intel announced the company's first hybrid design, codenamed Alder Lake, we expected to see more of such design philosophies in future products. During Intel's 2022 investor meeting day, the company provided insights into future developments, and a successor to Alder Lake is no different. Codenamed "Raptor Lake," it features a novel Raptor Cove P-core design that is supposed to bring significant IPC uplift from the previous generation of processors. Using Intel 7 processor node, Raptor Lake brings a similar ecosystem of features to Alder Lake, however, with improved performance across the board.

Perhaps one of the most exciting things to note about Raptor Lake is the advancement in core count, specifically the increase in E-cores. Instead of eight P-cores and eight E-cores like Alder Lake, the Raptor Lake design will retain eight P-cores and double the E-core count to 16. It was a weird decision on Intel's end; however, it surely isn't anything terrible. The total number of cores now jumps to 24, and the total number of threads reaches 32. Additionally, Raptor Lake will bring some additional overclocking improvement features and retain socket compatibility with Alder Lake motherboards. That means that, at worst, you would need to perform a BIOS update to get your previous system ready for new hardware. We assume that Intel has been working with software vendors and its engineering team to optimize core utilization for this next-generation processor, even though they have more E-cores present. Below, we can see Intel's demonstration of Raptor Lake running Blender and Adobe Premiere and the CPU core utilization.

ADVA today announced that CSC - IT Center for Science, which operates the Finnish University and Research Network (FUNET) and the Swedish University Computer Network (SUNET), have conducted a world-first trial carrying data at 400Gbit/s over more than 10,000 km. Using both FUNET and SUNET, the demo harnessed the ADVA FSP 3000 TeraFlex CoreChannel to transmit services at unprecedented line speeds for a live ultra-long-haul network. The trial shows how data-intensive applications can be connected over inter-continental distances using existing links. This offers significant benefits to FUNET and SUNET customers in the R&E community who will be able to leverage high-throughput technologies and collaborate by sharing huge data sets over longer distances than ever before.

"Our multi-domain field trial with the ADVA FSP 3000 TeraFlex CoreChannel terminal evaluated flexibility and the terminal's capabilities to adapt to use cases where ultra-long-haul 400GbE services are needed. The results that were achieved - trans-oceanic reach over terrestrial systems - were far beyond our expectations and typical real-life service requirements," said Jani Myyry, senior network specialist at FUNET. "Nordic research and education networks are shifting towards a federated next-generation model where optical spectrum resources are shared within the region. We have already built multiple programmable cross-border interconnection links between the FUNET and SUNET ADVA open line systems to exchange spectrum transparently. The trial utilized these interconnection links and the FUNET and SUNET network footprint to create the extremely transparent optical routes used during the tests."

Intel's Alder Lake CPUs started the wave of hybrid designs spanning the consumer sector with high-performance P-cores and high-efficiency E-cores combined to make a mixed design work. And it seems like the replacement for it is already in progress, as the next-generation Intel "Raptor Lake" processors are continuing enablement in the Linux kernel. This next-generation Raptor Lake design will arrive towards the end of this year, and the software ecosystem is already preparing for its arrival. According to the report from Phoronix, audio support for Intel Raptor Lake processors has been added to the Linux kernel 5.18.

As the report points out, the enablement work is no different since days of Skylake, where adding new IDs to the driver gets the job done. However, what is interesting is that Raptor Lake is slowly getting the entire software ecosystem support functional. This shows with Linux kernel 5.17, where Raptor Lake-S Gen 12-based graphics card received initial software support. As the software matures, full support for Raptor Lake will come, especially as we enter the later months of 2022, when the next generation is supposed to arrive.

MAINGEAR—an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations—today announced that new NVIDIA GeForce RTX 3050 graphics cards are now available to configure within MAINGEAR's product line of award-winning custom gaming desktop PCs and workstations. Featuring support for real-time ray tracing effects and AI technologies, MAINGEAR PCs equipped with the NVIDIA GeForce RTX 3050 offer gamers next-generation ray-traced graphics and performance comparable to the latest consoles.

Powered by Ampere, the NVIDIA GeForce RTX 3050 features NVIDIA's 2nd gen Ray Tracing Cores and 3rd generation Tensor Cores. Combined with new streaming multiprocessors and high-speed G6 memory, the NVIDIA GeForce RTX 3050 can power the latest and greatest games. NVIDIA RTX on 30 Series GPUs deliver real-time ray tracing effects—including shadows, reflections, and Ambient Occlusion (AO). The groundbreaking NVIDIA DLSS (Deep Learning Super Sampling) 2.0 AI technology utilizes Tensor Core AI processors to boost frame rates while producing sharp, uncompromised visual fidelity comparable to high native resolutions.

Although physically away from the 2022 International CES, AMD is hosting a virtual press event to announce many new consumer products. The year's biggest tech-show allows AMD to talk about its latest, and next-generation architectures, the products it has in store for 2022, as well as introduce new technology. We expect the company to unveil "Zen 4" from a consumer perspective, its next-generation mobile processors, and much more. Stay tuned as we live-blog the event as it unfolds.15:01 UTC: Straight away we see some big new model names:15:02 UTC: CEO Dr Lisa Su takes centrestage.

EK, the premium liquid cooling gear manufacturer, and MSI, a world-leading gaming brand, have partnered up once again to launch the next-gen MSI CARBON motherboard and EK-Quantum monoblock combo. The brand new EK-Quantum MSI MPG Z690 CARBON EK X D-RGB is based on the latest Z690 chipset and supports Intel 12th gen Alder Lake CPUs, this motherboard offers unparalleled cooling for the CPU, VRM section, and the first slot m.2 SSD thanks to the purpose-designed monoblock.

MSI's world-class engineering team and EK's industry-leading thermal engineers worked together to improve the previous-gen solution and bring even more benefits to the newest Intel Alder Lake platform. The MPG Z690 Carbon EK X allows maximum performance without the noisy environment, providing you with countless hours of uninterrupted gameplay while monitoring the flow in your loop via the integrated flow indicator. And to make sure your first assembly goes without a hitch, an EK-Leak Tester was included in the package.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today kicked off the DDR5 era with the launch of DOMINATOR PLATINUM RGB DDR5 and VENGEANCE DDR5. Leveraging more than 25 years of experience crafting premium, high-performance memory, these new modules open the way to far higher frequencies, greater capacities, and faster performance. Launching initially at speeds of up to 5,200 MHz and capacities of up to 32 GB per module, DDR5 pushes the performance limit further than ever before alongside next-generation platforms, starting with 12th Generation Intel Core Processors and Z690 motherboards. With your choice between the iconic styling and stunning lighting of DOMINATOR PLATINUM RGB DDR5 or the compact, minimalist profile of VENGEANCE DDR5 in kits of 32 GB - 64 GB, CORSAIR has the options to equip your new cutting-edge PC with the unprecedented performance of DDR5.

As the performance and capabilities of modern CPUs continue to increase, your system needs upgraded memory to keep up and make the most of its potential. DDR5 ensures that today's high-end CPUs receive data as quickly as possible, and take system performance to the next level. While previous generations of DRAM were limited to less precise motherboard-based control for voltage regulation, DDR5 modules are the first equipped with onboard voltage regulation now conveniently controlled through CORSAIR iCUE software, resulting in more finely tuned and stable overclocking. iCUE also enables you to customize and save your own Intel XMP 3.0 profiles with ease, to tailor performance by app or task.

Since the end of 2020, TEAMGROUP has been at the forefront of next-generation DDR5 development, working closely with motherboard manufacturers to perform extensive validation testing. Whether it is the testing and research of DDR5's new PMIC architecture or XMP overclocking parameters, the company has achieved very fruitful results. Today TEAMGROUP is launching its brand new DELTA DDR5 Memory Series, the first DDR5 modules to be equipped with RGB lighting effect, providing gamers who enjoy visual flair with both next-level speed and eye-pleasing illumination.

The T-FORCE DELTA RGB DDR5 continues the design language of the DELTA DDR4 Series by maintaining the ultra-large spreader with wide-angled RGB edges and a minimalist geometrical surface. The overall look is further enhanced by its sleek stealth-fighter-inspired design. In addition, the color and flashing speed of each RGB LED used in DELTA RGB DDR5 can be independently controlled, offering more freedom to customize lighting effects than a typical RGB DDR4 memory. Currently samples have been sent to ASUS, GIGABYTE, MSI, ASROCK, BIOSTAR and other motherboard manufacturers for lighting tests. Players will be able to easily customize their own dazzling RGB effects through the manufacturers' lighting software.

AMD is slowly preparing to launch its next-generation of graphics cards based on the RDNA3 architecture, and it could bring some new connectivity options as well. Currently, the graphics cards we are using today use DisplayPort 1.4 connector for their DP output. However, the more advanced DisplayPort 2.0 could land in RDNA3 GPUs, bringing much-needed improvements to the video output system. What DP 2.0 brings to the table is an upgrade to an Ultra High Bit Rate individual lane speed of 20 GB/s, totaling 80 GB/s with four of those. The DP 2.0 capable system would be able to output a 10K uncompressed resolution at 60 Hz, or two 4K 144 Hz monitors at the same time. With compression, that would be extended much further. We have to wait and see what AMD does and if the next-generation RDNA3 brings this new DisplayPort standard to the masses.

Microsoft is today holding a virtual Windows Event to showcase what is next for Windows. As we have made reports earlier in the past few weeks, the Redmond giant has shown-off the next-generation Windows 11 operating system, which will make a major improvement compared to Windows 10 both internally and as far as looks are concerned. We were live-blogging all of that, and at exactly, 11 am Eastern Time. You can find the whole live blog below, and check out the new Windows 11 OS features.

14:43 UTC: The event is about to start...

AMD's Zen 4 based systems are still in development, however, the company is already distributing firmware to give the new core design proper support once it arrives. By doing this, software providers are already able to distribute software with support for Zen 4 architecture. One of those examples is HWiNFO, popular monitoring, and diagnostics tool. In the pre-release of its upcoming version 7.05, which you can already download, the tool lists "Enhanced early support of some Zen4-based systems". This means that the software would likely be capable of monitoring a few components of the Zen 4 system, as the temperature for example. While we are not sure what the "enhanced" really means, only time will tell, as we await the launch of AMD's next-generation systems. You can download the pre-release 7.05 version of HWiNFO here, and you can check out the changelog below.

Microsoft has revealed the date when support for Windows 10 is going to end - effectively confirming that their original vision of Windows 10 being "the last Windows OS ever" is now dead. The information comes from Microsoft's own update to Windows 10's support life cycle page, which the company has amended with the final resting date set for October 14th 2025 for both Home and Pro versions of the operating system. Previously, the support life cycle page listed end of support dates for various release versions of Windows 10 - not the entire OS.

Adding this to the announcement that Windows would get a new, "next-gen" update; the related teaser art which omits the shadow of the window crossbar, making the cast shadow look either basically unrealistic (some Raytracing seems to be needed by Microsoft's art personnel) or, infinitely more likely, the omitted shadow serves to approximate the cast shadows as much as possible to 11. No official announcement by Microsoft, but usually 1 + 1 = 2.

Samsung is preparing to deploy their latest innovations in NAND density with the next-generation V-NAND (7th gen). Samsung says it is preparing products that leverage both V-NAND's higher density (at 176 layers per chip versus up to 136 layers on 6th gen) with the throughput of both PCIe 4.0 and PCIe 5.0. This would of course mean higher density drives available, as well as a reduction in the overall $/GB equation. Due to Samsung's vertical integration (meaning that they are one of the few companies that can design and produce all SSD components in-house), the company is also developing next-gen NAND controllers that can leverage throughputs of 2,000 MT/s transfer rates and thus "optimized for multitasking huge workloads".

Samsung expects to be able to scale V-NAND well past the 1,000 layer mark - a far-cry from the claims made by SK Hynix, who have only talked about a theoretical 600-layer NAND configuration. While the 176-layer, 7-gen V-NAND is only now entering mass production and the final stages of product development, Samsung has already taped out the initial batches of their 8th-gen V-NAND, which feature "more than 200 layers". It's likely that Samsung's 1,000-layer claim actually looks towards the future in a timeframe of decade(s?) and isn't actually something to look forward to in the approximate future.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen4 7000s Prem. SSD with up to 7 GB/s read speed while optimizing passive thermal dissipation, which promises no throttling under long-lasting operation. Through the SSD Tool Box application, users can have an instant control on overall operation of SSD.

AORUS Gen4 7000s Prem. SSD adopts the PCIe 4.0 NVMe M.2 interface and it equips the latest Phison E18 selected 8-channel controller, which provides users with ultimate random access rate, as well as the high speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. With the read speed up to 7 GB/s and write speed up to 6.85 GB/s, AORUS Gen4 7000s Prem. SSD can power up content creators, gamers, and users eager for extreme performance.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC component manufacturers, is proud to announce the next-generation DDR5 RGB high-performance gaming memory, Polaris RGB, is ready for the upcoming DDR5 platform. The GeIL Polaris RGB Gaming Memory will be available in Q4, 2021, with capacities ranging from 16 GB (16 GB x1) up to 128 GB (32 GB x4).

It has been seven years since DDR4 launched into the market, and GeIL has put countless hours into developing the new DDR5 memory modules. And in doing so, GeIL has designed the Polaris RGB to provide RGB illuminated high-performance DDR5 gaming memory and has been working closely with motherboard makers to guarantee the best compatibility and reliability among the latest Intel and AMD motherboards.

According to Bloomberg, which first predicted the arrival of Apple custom processors in MacBooks, we have another piece of information regarding Apple's upcoming MacBook Pro lineup, set to arrive this summer. As you are aware, MacBook Pro right now comes in two different variants. The first is a smaller 13-inch design that is powered by Apple's M1 chip, while the second is a 16-inch design powered by an Intel Core processor. However, it seems like that will no longer be the case when the next-generation lineup arrives. Starting this summer, all of the MacBook Pro models will have Apple's custom silicon powering these devices, which bring Intel's presence to an end.

And the successor to the now-famous M1 chip seems to be very good. As per the report, Apple is upgrading the architecture and the total core count. There are two different chips, codenamed Jade C-Chop and Jade C-Die. Both are 10-core designs, equipped with two small and eight big cores. The difference between the two is the total number of graphics cores enabled. The smaller version will have 16 graphics cores, while the bigger one will have 32 graphics cores. On the SoC, there will be an updated Neural Engine, for better AI processing. These new processors will come with up to 64 GB of RAM in selected configurations as well. The report also notes the arrival of HDMI port, SD card slot, and MagSafe for charging.

Today, Lenovo in partnership with Intel has announced that Leibniz Supercomputing Centre (LRZ) is building a supercomputer powered by Intel's next-generation technologies. Specifically, the supercomputer will use Intel's Sapphire Rapids CPUs in combination with the highly-teased Ponte Vecchio GPUs to power the applications running at Leibniz Supercomputing Centre. Along with the various processors, the LRZ will also deploy Intel Optane persistent memory to process the huge amount of data the LRZ has and is producing. The integration of HPC and AI processing will be enabled by the expansion of LRZ's current supercomputer called SuperMUG-NG, which will receive an upgrade in 2022, which will feature both Sapphire Rapids and Ponte Vecchio.

Mr. Raja Koduri, Intel graphics guru, has on Twitter teased that this supercomputer installment will represent a combination of Sapphire Rapids, Ponte Vecchio, Optane, and One API all in one machine. The system will use over one petabyte of Distributed Asynchronous Object Storage (DAOS) based on the Optane technologies. Then, Mr. Koduri has teased some Ponte Vecchio eye candy, which is a GIF of tiles combining to form a GPU, which you can check out here. You can also see some pictures of Ponte Vecchio below.

Apple's M1 processors are a big success. When Apple introduced the M1 processors in the MacBook lineup, everyone was impressed by the processor performance and the power efficiency it offered. Just a few days ago, Apple updated its Mac lineup to feature these M1 processors and made it obvious that custom silicon is the way to go in the future. Today, we have information coming from Nikkei Asia, that Apple's next-generation M2 chip has entered mass production and that it could be on the way for as early as July when Apple will reportedly refresh its products. The M2 chip is made inside TSMC's facilities on a 5 nm+ N5P node. While there is no more information coming from the report about the SoC, we can expect it to be a good generational improvement.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced its launch of the industry's highest performing 24G SAS (SAS-4) SSD - the PM1653. Based on the latest SAS interface, the new drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is also the industry's first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities from 800 GB to 30.72 TB for advanced enterprise server systems.

"As the leading provider of SAS storage for a decade, Samsung has been offering the most advanced and reliable enterprise solutions in full support of the critical workloads of global server OEMs, governments and financial institutions. Samsung enterprise solutions are also accredited by the U.S. National Institute of Standards and Technology for the most powerful data security," said Kwangil Park, senior vice president of the Memory Product Planning Team at Samsung Electronics. "Like we have done with the PM1653, Samsung will continue to collaborate with our customers to accommodate the ever-growing demand of the enterprise server market for the most uncompromising offerings available."

As the global economy enters the post-pandemic era, technologies including 5G, WiFi6/6E, and HPC (high-performance computing) have been advancing rapidly, in turn bringing about a fundamental, structural change in the semiconductor industry as well, according to TrendForce's latest investigations. While the demand for certain devices such as notebook computers and TVs underwent a sharp uptick due to the onset of the stay-at-home economy, this demand will return to pre-pandemic levels once the pandemic has been brought under control as a result of the global vaccination drive. Nevertheless, the worldwide shift to next-gen telecommunication standards has brought about a replacement demand for telecom and networking devices, and this demand will continue to propel the semiconductor industry, resulting in high capacity utilization rates across the major foundries. As certain foundries continue to expand their production capacities this year, TrendForce expects total foundry revenue to reach a historical high of US$94.6 billion this year, an 11% growth YoY.