MSI is excited to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the AM5 platform. Powered by advanced 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unmatched performance, efficiency, and versatility for gamers and content creators. At launch, August 8th, AMD Ryzen 7 9700X, and Ryzen 5 9600X are available while the Ryzen 9 9950X and 9900X will launch on August 15th. These processors will feature up to 16 cores and 32 threads, with a theoretical maximum boost clock speed of 5.7 GHz, 64 MB of L3 cache, and a maximum TDP of 170 W.

AMD Ryzen 9000 Series will also support PCIe 5.0 for the GPU and M.2 while enhancing DDR5 memory speed. Notably, the AMD Ryzen 7 9700X offers approximately 12% better overall performance than the first-gen AMD 3D V-cache CPU. All these processors are compatible with the AM5 socket, and existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate by updating to the latest BIOS, available on MSI's product support page.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, IPC solutions, and storage devices, today is excited to announce a brand-new BIOS update for its AMD AM5 motherboards, designed to support AMD's latest Ryzen 9000 series processors, including Ryzen 9 9950X, Ryzen 9 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. Incorporating the latest AMD AGESA 1.2.0.0.a Patch A BIOS update on BIOSTAR official website, BIOSTAR AM5 series motherboards consisting of X870E, X670E, B650E, B650, A620, and A620A are now primed and ready to unleash the full potential of AMD's ZEN 5 processors with superior stability.

AMD's latest Ryzen 9000 series processors, built on the groundbreaking Zen 5 architecture, represent a significant leap forward in computing performance and efficiency. These processors offer up to 16 cores and 32 threads, with clock speeds reaching up to 5.7 GHz. Featuring enhanced IPC (Instructions Per Cycle) performance and advanced Ryzen AI capabilities, the Ryzen 9000 series is engineered to handle intensive gaming, content creation, and professional workloads with ease. The new architecture also introduces improved power efficiency, ensuring cooler operation and lower energy consumption. With these cutting-edge processors, users can experience unprecedented levels of speed, responsiveness, and overall computing power.

AMD is preparing to release its next generation of high-performance CPUs, the Ryzen 9000X3D series, and rumors are circulating about potential increases in stacked L3 cache. However, a recent report from Wccftech suggests that the upcoming models will maintain the same 64 MB of additional 3D V-cache as their predecessors. The X3D moniker represents AMD's 3D V-Cache technology, which vertically stacks an extra L3 cache on top of one CPU chiplet. This design has proven particularly effective in enhancing gaming performance, leading AMD to market these processors as the "ultimate gaming" solutions. According to the latest information, the potential Ryzen 9 9950X3D would feature 16 Zen 5 cores with a total of 128 (64+64) MB L3 cache, while a Ryzen 9 9900X3D would offer 12 cores with the same cache capacity. The Ryzen 7 9800X3D is expected to provide 96 (32+64) MB of total L3 cache.

Regarding L2, the CPUs feature one MB of L2 cache per core. Perhaps the most exciting development for overclockers is the reported inclusion of full overclocking support in the new X3D series. This marks a significant evolution from the limited options available in previous generations, potentially allowing enthusiasts to push these gaming-focused chips to new heights of performance. While the release date for the Ryzen 9000X3D series remains unconfirmed, industry speculation suggests a launch window as early as September or October. This timing would coincide with the release of new X870 (E) chipset motherboards. PC enthusiasts would potentially wait to match the next-gen CPU and motherboards, so this should be a significant upgrade cycle for many.

ASUS today announced the innovative concepts and upcoming designs that it will be demonstrating at its Computex 2024 booths, including AI PCs, prototype AMD and Intel motherboards, as well as fresh CPU coolers.

AI PC-ready hardware
With all the groundbreaking AI-powered apps and features available today, and many more on the horizon, PC enthusiasts the world over are searching for hardware that will let them run AI tools on their own AI PC in addition to using cloud-based subscriptions. At Computex 2024, ASUS is showing off the PC hardware that builders can leverage to explore the future of this revolution. An AI PC is an entire platform ready to unlock advanced AI features—in turn, revolutionizing the way that people build, customize, and use such a device.

While wandering through the Computex showrooms, our little spies spotted something interesting at the ASRock stand: an extensive lineup of motherboards built around the AMD X870 and X870E chipsets. The six models from the ASRock, Pro, Steel, Phantom Gaming, and the legendary Taichi families support the latest AMD Ryzen 9000, 8000, and 7000 series processors. We had the opportunity to see them live on display and rushed to present them one by one, complete with pictures and main specifications.Now we're going to look further in detail:

MSI is thrilled to announce the launch of the latest AMD Ryzen 9000 Series processors, set to debut on the new X870 chipsets. Powered by cutting-edge 4 nm CPU process technology, the Ryzen 9000 Series promises to revolutionize the computing landscape with unparalleled performance, efficiency, and versatility for gamers and content creators. At launch, there will be four new AMD Ryzen 9000 Series CPUs available: the Ryzen 9 9950X, 9900X, Ryzen 7 9700X, and Ryzen 5 9600X. They are compatible with the AM5 socket, existing AMD 600 Series motherboards and Ryzen 9000 Series processors can seamlessly integrate with each other by updating to the latest BIOS, readily available on MSI's product support page.

At this year's Computex 2024, visitors to the MSI booth will have the opportunity to witness two models firsthand, the MAG X870 TOMAHAWK WIFI and PRO X870-P WIFI. Additionally, a comprehensive lineup of features awaits users across the MPG and MEG series, ensuring a diverse range of options to suit every need. Here is a sneak-peak of features that you can expect to see on the upcoming MSI's X870 motherboards.

AMD is debuting its Ryzen 9000 series "Granite Ridge" desktop processors powered by the "Zen 5" microarchitecture later this year. These chips are compatible with existing AMD 600-series chipset motherboards with a simple UEFI firmware update, but the company is also taking the opportunity to launch the AMD 800-series chipset family alongside these chips. The lineup will be led by the AMD X870E, followed by the X870. These two chipsets should launch immediately alongside the new processors, but will later be joined by the AMD B850 and B840. There's no entry-level chipset planned, the AMD A620 will continue to hold the fort for AMD here. There is an interesting new mix of product differentiation, according to a leaked GIGABYTE slide scored by VideoCardz.

If you recall, the X670E and X670 were differentiated by a lack of Gen 5 PCI-Express x16 PEG slots on the X670, which instead was limited to Gen 4 on the PEG slot. The X670 still had Gen 5 NVMe slots attached to the CPU, and had practically the same I/O features as the X670E, including the same counts of downstream PCIe Gen 4 general purpose lanes. Both the X670E and X670 are 2-chip solutions, in that the second chip is a connected to the general purpose PCIe lanes of the first chip, which in turn is connected to the processor. Things are going to change with the 800-series. The top-spec X870E will be a 2-chip solution, with PCIe Gen 4 general purpose lane counts resembling the X670E; but the X870 is a single-chip solution that more closely resembles the B650E in I/O. The X870 (non-E) now gives you Gen 5 PCI-Express x16 PEG, just like the X870E and the B650E, and at least one Gen 5 x4 NVMe slot attached to the CPU, but has fewer downstream Gen 4 general purpose PCIe lanes than the X670. Both the X870E and X870 assure USB4 connectivity, and support CPU overclocking. Things get very interesting in the mid-range.

AMD's next-generation Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture, is rumored to launch in late-July, 2024, according to multiple sources in the ChipHell tech forums. The first four SKUs in the processor series will include one each of 16-core, 12-core, 8-core, and 6-core, spanning the Ryzen 9, Ryzen 7, and Ryzen 5 series, just like the company's Ryzen 7000 series debut. The company could unveil these processors in its 2024 Computex keynote address early next month, talking about their features and performance in broad strokes, while we get technical previews in the run-up to the late-July launch.

A late-July launch of the Ryzen 9000 series "Granite Ridge" processors should also mean that the various motherboard manufacturers will showcase their upcoming motherboards based on the AMD X870 desktop chipset at Computex. Ryzen 9000 series are built in the existing Socket AM5 package, and should be compatible with existing AMD 600-series chipset motherboards. In fact, most motherboard vendors have already released UEFI firmware updates that include Ryzen 9000 series processor compatibility. Those buying a Ryzen 9000 series processor with an AMD 600-series chipset motherboard can simply take advantage of the USB BIOS Flashback feature that's available on most motherboards, including the entry-level ones.

AMD is readying the new 800-series motherboard chipset to launch alongside its next-generation Ryzen 9000 series "Granite Ridge" desktop processors that implement the "Zen 5" microarchitecture. The chipset family will be led by the AMD X870E, a successor to the current X670E. Since AMD isn't changing the CPU socket, and this is very much the same Socket AM5, the 800-series chipset will support not just "Granite Ridge" at launch, but also the Ryzen 7000 series "Raphael," and Ryzen 8000 series "Hawk Point." Moore's Law is Dead goes into the details of what sets the X870E apart from the current X670E, and it all has to do with USB4.

Apparently, motherboard manufacturers will be mandated to include 40 Gbps USB4 connectivity with AMD X870E, which essentially makes the chipset a 3-chip solution—two Promontory 21 bridge chips, and a discrete ASMedia ASM4242 USB4 host controller; although it's possible that AMD's QVL will allow other brands of USB4 controllers as they become available. The Ryzen 9000 series "Granite Ridge" are chiplet based processors just like the Ryzen 7000 "Raphael," and while the 4 nm "Zen 5" CCDs are new, the 6 nm client I/O die (cIOD) is largely carried over from "Raphael," with a few updates to its memory controller. DDR5-6400 will be the new AMD-recommended "sweetspot" speed; although AMD might get its motherboard vendors to support DDR5-8000 EXPO profiles with an FCLK of 2400 MHz, and a divider.