ASUS today introduced the X870 MAX Gaming WiFi7 motherboard. This Socket AM5 motherboard comes in two color-based variants—its default black, and the white X870 MAX Gaming WiFi7 W, which features a white PCB, besides white/silver heatsinks. The X870 MAX Gaming is positioned below even the TUF Gaming X870 Plus, and separate from the company's Prime series. It is designed to lure gaming PC builders away from the likes of the GIGABYTE Gaming X and MSI Gaming Plus series. The board is built in the ATX form-factor and draws power from a combination of 24-pin ATX and two 8-pin EPS connectors. It features a 12+2+1 phase CPU VRM that uses 80 A-rated power stages.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and just the one M.2 Gen 5 x4 NVMe slot. The second CPU-attached NVMe interface is wired out as M.2 Gen 4 x4. The third M.2 slot is Gen 4 x4 and wired to the X870 FCH. The board also puts out four SATA 6 Gbps ports. Besides the main Gen 5 x16 PEG slot, the board has three other physical x16 slots, two of these are Gen 4 x1, and the last one Gen 3 x1. Display connectivity includes an HDMI, and a DisplayPort that's wired to the board's two 40 Gbps USB4 type-C ports. Other USB ports include a 10 Gbps USB 3.2 Gen 2; three 5 Gbps USB 3.1 Gen 1, and four USB 2.0, there is a 20 Gbps USB-C header, besides two additional 5 Gbps ports through a standard header.

Colorful Technology Company Limited, a leading brand in gaming PC components, gaming laptops, and Hi-fi audio products, is thrilled to announce the CVN X870 ARK FROZEN motherboard for the AMD Ryzen 9000 Series processors - COLORFUL's first AMD X870 motherboard. The CVN X870 ARK FROZEN adopts the CVN's signature military-inspired aesthetics.

The CVN X870 ARK FROZEN's design is inspired by aircraft carriers. The motherboard features large frost gray heatsinks and a titanium gray-colored PCB - COLORFUL's first AM5 motherboard to feature the color. Its bright orange accents evoke power and sophistication. The M.2 heatsinks sport lines similar to the runway of the aircraft carrier.

Colorful recently teased its new CVN motherboards series based on the AMD X870 chipset, and now the first model, CVN X870 ARK FROZEN V14, has been listed on the Colorful website. This motherboard marks the debut of Colorful's first-generation graphics card quick-release mechanism, featuring an "ON or OFF" switch placed just below the memory slots. Colorful advertises this proprietary design as being "really safe". The CVN X870 ARK FROZEN V14 motherboard features a standard ATX form factor with a striking white PCB and frost-themed heat dissipation armor. It boasts a 14+2+1 phase power supply design with 80 A DrMOS components and dual 8-pin EPS connectors for CPU power. In terms of memory, it has four DDR5 memory slots supporting up to 192 GB (single slot up to 48 GB) and allows up to 8000 MHz overclocked memory modules.

The PCIe configuration includes a PCIe 5.0 x16 slot directly connected to the CPU with metal reinforcement and quick-release support, a full-length PCIe 4.0 x4 slot (which shares lanes with the third M.2 slot), and a PCIe 4.0 x1 slot. For storage, users get two PCIe 5.0 x4 M.2 slots directly connected to the CPU and one PCIe 4.0 x4 M.2 slot via the chipset, which is mutually exclusive with the second PCIe slot. Additionally, the board includes four SATA III 6 Gbps ports. Networking options include a Realtek RTL8126-CG chip offering 5GbE wired connectivity and a MediaTek MT7925 module supporting Wi-Fi 7 and Bluetooth 5.4. The Realtek ALC1220 CODEC powers audio. The rear I/O provides HDMI 2.0, DisplayPort 1.2, multiple USB-A ports, a USB-C port with 40 Gbps bandwidth and DP Alt Mode support, a 5GbE RJ45 port, dual Wi-Fi antenna connectors, an S/PDIF out, and five standard audio jacks. According to ITHome, Colorful previously announced that the CVN X870 ARK FROZEN V14 will begin shipping around mid-April, pricing is yet to be revealed.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to announce a new high-speed memory overclock DDR5 specification with an ultra-high kit capacity - DDR5-8000 CL44 with 128 GB (64 GB x2) kit capacity. This is the world's first DDR5 memory kit with 64 GB high-capacity modules to reach the extreme overclock level of DDR5-8000, setting a new milestone for high-performance computing, content creation, AI applications, and advanced workstation workloads.

New Era of Overclocking High-Capacity DDR5 64 GB Modules
Engineered for high-capacity overclocked performance, the DDR5-8000 128 GB (64 GB x2) combines ultra-high memory speed with massive memory kit capacity, surpassing the previous module capacity maximum at 48 GB per module. At last, power users and content creators who seek overclock performance memory for capacity-hungry applications will have the ideal DDR5 memory solution. Refer to the validation screenshot below to see DDR5-8000 CL44-58-58 128 GB (64 GB x2) tested on the ASUS ROG CROSSHAIR X870E APEX motherboard with the AMD Ryzen 9 9950X desktop processor.

MAINGEAR, the leader in premium-quality, high-performance gaming PCs, today unveiled its new 2025 pre-configured MG-1 gaming systems, equipped with NVIDIA's cutting-edge GeForce RTX 50-Series GPUs and powered by the latest AMD Ryzen 9000 Series CPUs and Intel Core Ultra Series 2 processors. This exciting lineup offers gamers a significant leap in power, performance, and value, reinforcing MAINGEAR's commitment to redefining the gaming experience across all levels of play.

"2025 is bound to be the best year yet for PC gamers, and the introduction of our newest MG-1 systems continues to drive MAINGEAR's mission to deliver the ultimate gaming experience," said Wallace Santos, CEO of MAINGEAR. "With NVIDIA's RTX 50-Series GPUs, and the latest AMD Ryzen and Intel Core Ultra processors, we've got more options than ever before, ensuring the perfect fit for gamers of all skill levels and budgets."

Over a week ago, ASUS "quietly" unveiled a revamped Q-Release Slim mechanism—eagle-eyed hardware media outlet—Uniko's Hardware—spotted this revised quick release PCIe system on a freshly detailed premium ROG CROSSHAIR X870E APEX motherboard model. Wider press reportage jumped on the manufacturer's mixed bag of official responses; regarding reported damage inflicted by a "problematic" design. The ASUS North American office downplayed the severity of this matter, while colleagues in China launched a fairly comprehensive compensation program. According to VideoCardz, the latter organization has confirmed—as of last week—that a problem-free/improved Q-Release Slim system is on the way.

On Monday, Tweakers divulged its direct communication with ASUS—a spokesperson answered the Dutch site's query: "yes, a change has been made to the Q-Release Slim system for new X870 motherboards. Based on user feedback, we have modified the PCIe slot for the Q-Release Slim system, including removing a metal component to reduce the possibility of damage to the video card." The company representative noted that newly introduced/attached stickers will inform users about "correct system usage." Based on the aforementioned ASUS statement, Tweakers reported: "that both the original and revised versions of the system have been extensively tested and that users should study the included documentation to use the Q-Release Slim system properly. According to the manufacturer, both versions of the technology meet 'industry standards for wear resistance'." That last point suggests that ASUS will not be issuing a wide recall of currently released boards that feature original Q-Release Slim mechanisms.

G.Skill International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is announcing a new high-capacity, low-latency DDR5 specification of DDR5-6000 CL26 with a total of 96 GB (48 GB x2) kit capacity, intended for the AMD AM5 platform. Designed for PC enthusiasts, gamers, professionals, and AI applications who are looking for high performance, this new memory kit enables low-latency performance at high kit capacities on the latest AMD computing platforms.

High-Capacity & Low-Latency Performance DDR5 Memory for AMD AM5
G.Skill continues to push the limits of DDR5 memory with the new DDR5-6000 CL26 at a high kit capacity of 96 GB (48 GB x2). Featuring a very low latency timing of CL26-36-36-96, this memory kit is engineered to provide efficiency and responsiveness for high-performance computing tasks, such as content creation, 3D modeling, or AI applications, on the latest AMD AM5 platforms. See below for a Memtest validation screenshots on the ASUS ROG CROSSHAIR X870E HERO motherboard with the AMD Ryzen 9 9950X3D desktop processor, as well as on the MSI MPG X870E CARBON WIFI motherboard with the AMD Ryzen 9 9900X desktop processor.

Large language models (LLMs) love large quantities of memory—so much so, in fact, that AI enthusiasts are turning to multi-GPU setups to make even more VRAM available for their AI apps. But since many current LLMs are extremely large, even this approach has its limits. At times, the GPU will decide to make use of CPU processing power for this data, and when it does, the performance of your CPU cache and DRAM comes into play. All this means that when it comes to the performance of AI applications, it's not just the GPU that matters, but the entire pathway that connects the GPU to the CPU to the I/O die to the DRAM modules. It stands to reason, then, that there are opportunities to boost AI performance by optimizing these elements.

That's exactly what we've found as we've spent time in our R&D labs with the latest AMD Ryzen CPUs. AMD just launched two new Ryzen CPUs with AMD 3D V-Cache Technology, the AMD Ryzen 9 9950X3D and Ryzen 9 9900X3D, pushing the series into new performance territory. After testing a wide range of optimizations in a variety of workloads, we uncovered a range of settings that offer tangible benefits for AI enthusiasts. Now, we're ready to share these optimizations with you through a new BIOS feature: AI Cache Boost. Available through an ASUS AMD 800 Series motherboard and our most recent firmware update, AI Cache Boost can accelerate performance up to 12.75% when you're working with massive LLMs.

ASUS has discreetly modified its controversial Q-Release Slim mechanism in the newly launched ROG Crosshair X870E Apex motherboard, removing a metal bracket linked to GPU PCIe connector scratches. The unannounced revision, spotted by Uniko's Hardware, follows months of backlash from enthusiasts who reported cosmetic damage to high-end GPUs after repeated use of the quick-release feature. While ASUS has not formally addressed the redesign, it acknowledges the issue—a stark contrast to its earlier dismissal of concerns as "typical wear-and-tear" after 60+ removal cycles. The controversy, first spotted in January 2025, escalated when users shared evidence of scratched PCIe pins on platforms like Reddit and Bilibili.

ASUS's global responses varied sharply: its US division downplayed functional risks, while ASUS China rolled out compensation, including motherboard replacements and store credits, and confirmed a redesign was underway. This regional split shows differing consumer protection norms, with China's aggressive compensation contrasting Western markets' reliance on warranty assurances. Competitors seized the moment. GIGABYTE's AORUS Japan publicly mocked ASUS with a 100-cycle stress test of its EZ Latch Plus, showcasing zero GPU damage—a direct jab at Q-Release Slim's durability. The campaign, echoed by GIGABYTE's Western accounts, emphasized rivalries in the premium motherboard segment. ASUS's quiet hardware fix avoids a formal recall, likely due to the niche impact—frequent GPU swaps are rare among mainstream users.

Biwin, a world-renowned innovator in cutting-edge memory and storage solutions, proudly introduces the Biwin Black Opal OC Lab Gold Edition DW100 RGB DDR5 192 GB Memory Kit (48 GB x 4), available in DDR5-6400 CL30-39-39-108 1.4 V and DDR5-6000 CL28-36-36-102 1.4 V specifications. Breaking the capacity limits of traditional consumer memory, this ultra-large 192 GB kit offers the performance boost needed for AI computing, large-scale data processing, and next-gen computing.

Push Memory Performance with Revolutionary 192 GB Memory Kit
Biwin Black Opal DW100, delivering an ultra-high-capacity 192 GB (48 GB x4) configuration, redefines what's possible with desktop memory and exceptional memory bandwidth, stability, and efficiency. This breakthrough enables users to take full advantage of DDR5's enhanced data throughput to power fast, out-of-the-box speeds for AI computing, large language models (LLMs), generative AI, and edge computing, and other data-rich workloads.

GIGABYTE introduced its STEALTH series motherboard design at last summer's Computex event; where TechPowerUp staffers inspected a B650E AORUS STEALTH ICE sample model. The Taiwanese manufacturer was readying new board SKUs with backside connectors (power and I/O); destined to take on similar products from rival companies. GIGABYTE's debut wave of STEALTH did not include any AMD X670 chipset-based options, but a recent ECC filing points to possible forthcoming X870-based models. A weekend sleuthing session—performed by harukaze5719—unearthed multiple registrations of X870 and B850 boards. Two unannounced STEALTH ICE models were highlighted in the regional registry.

The X870 and B850 AORUS STEALTH ICE models are expected to arrive within the coming months, reportedly sporting familiar white designs—as seen on GIGABYTE's current-gen option. Insiders believe that a high-end X870E-based offering will not emerge, due to STEALTH occupying a very niche market segment. According to a Chinese leaker, B850 models could arrive in ATX and microATX form factors. Further up in product hierarchies, they reckon that the X870 AORUS STEALTH series: "comes standard with PCIe 5.0 and DDR5 overclocking support. The flagship model comes with dual Thunderbolt 4 interfaces." GIGABYTE's back-connected X870 and B850 board designs could demand high asking prices; their current B650E AORUS STEALTH ICE is not readily available, but in some regions it is selling for $320+.

A new case of catastrophic CPU failure has emerged involving AMD's Ryzen 7 9800X3D processor, marking the latest in a series of reported incidents within the last few days involving high-performance GPUs and CPUs. The failure occurred during routine use when a system equipped with the 9800X3D and an ASRock Nova X870E motherboard suddenly shut down, resulting in visible thermal damage to both components. The incident is particularly noteworthy as the system operated under stock settings, with only AMD EXPO memory optimization enabled. The affected user, who has two decades of PC building experience, reported that the system had been operational for approximately 20 days before the failure, with no temperature anomalies recorded through HWMonitor during its operation.

The hardware was running the ASRock BIOS version 3.16. This case differs significantly from the previous AMD Ryzen 7 9800X3D failure, where user error during installation was identified as the primary cause, with the user force-installing the CPU in the socket. The timing of the failure—during a low-intensity workload of streaming video content—further complicates the investigation into root causes. While isolated cases of hardware failure are not uncommon in the PC component market, this case may be the first one caused entirely by the CPU/motherboard combination, not user error. The user also faces uncertainty regarding warranty coverage, as the CPU and motherboard were purchased separately from different retailers. We hope the warranty case goes well, and the user gets a replacement!

Late last week, Colorful Technology revealed a brand-new series of "CVN" motherboards—the manufacturer's Bilibili account hinted at an upcoming launch and uploaded three highly-stylized promotional images. As reported by ITHome, Colorful's debut AMD X870 chipset-based board will be: "equipped with Colorful's first-generation graphics card quick-release device." Western press outlets have covered the functional validity of similar systems in recent times, but Colorful's teaser seems to be poking fun at a rival's current predicament. The incoming CVN X870 series will sport a unique selling point; its GPU removal system features an "ON or OFF" switch. Colorful advertises this proprietary design as being "really safe."

CVN X870 or X870E product pages have not appeared online, but ITHome reckons that this new range will sit in-between Colorful's familiar iGame and Tomahawk motherboard lines. The intended target audience appears to be "mainstream DIY" builders. According to one of the teaser images, Colorful reckons that its silver/white-tinted CVN X870 boards will "live up to expectations." The Chinese manufacturer has devised a new "Frost Armor" structure that covers a board's VRM sections—sporting "composite heat dissipation grooves and heat pipes." Lower-end CVN B840 and B850 models could be in the pipeline, but Colorful is likely testing the waters with its initial launch of X870-equipped fare.

ASRock, a global leader in motherboards, graphics cards, gaming monitors, small form factor PCs, and power supply units, proudly announces that its entire lineup of AM5 motherboards fully supports the AMD Ryzen 9 9950X3D and 9900X3D processors. With this seamless compatibility, gamers can harness the full potential of these flagship processors for an unparalleled gaming experience.

The AMD Ryzen 9 9950X3D and 9900X3D processors are the flagship models of the Ryzen 9000X3D series, designed for hardcore gaming enthusiasts who demand the ultimate in gaming performance. ASRock AM5 motherboards offer seamless compatibility with the Ryzen 9000X3D series, making them the ideal choice for gamers worldwide to experience the power of the AMD Ryzen 9 9950X3D and 9900X3D processors firsthand.

GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

MSI is proud to unveil its latest lineup of motherboards designed for AMD Ryzen B850 and B840 chipsets. These motherboards deliver a perfect blend of performance and innovation, ensuring exceptional reliability and ease of use. With their high performance and reliable design, they are built to empower mainstream users, gamers, and creators with next-level computing capabilities.

In addition to the new B850 and B840 motherboards, MSI is also expanding its X870E lineup with two new models: the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI. These additions offer even more options tailored to diverse user needs—top-tier performance and, most importantly, cutting-edge connectivity. With the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI, MSI continues to deliver innovative solutions that empower gamers, creators, and PC enthusiasts alike.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

When the initial batch of AMD X870/E motherboards were announced, there were no signs of Mini-ITX motherboards, but now Gigabyte has launched its first X870 Mini-ITX board and it's a bit of a hit and miss in our opinion. The X870I Aorus Pro Ice comes in white, as per the Ice moniker that Gigabyte likes to use for its white products and this might really appeal to some and put others off. Feature wise, we're looking at a single PCIe 5.0 x16 slot—as per most Mini-ITX boards—two NVMe M.2 slots, one PCIe 5.0 and one PCIe 4.0, but for some reason, Gigabyte decided that a single USB4 port was enough.

What makes the single USB4 port decision even worse is the fact that the board only has a USB 3.2 Gen 2 10 Gbps USB Type-C port and the front panel header is also limited to 10 Gbps. On a brand new board, this is really quite disappointing, but the Pro SKUs are usually feature limited models from Gigabyte. The rest of the ports around the back consists of an HDMI 2.1 port, although it too is limited to 4K 60 Hz output, which again is disappointing—the USB4 port is capable of 4K at 240 Hzvia DP Alt mode—two USB 3.2 Gen 2 10 Gbps USB Type-A ports, two USB 3.2 Gen 1 5 Gbps USB Type-A ports and two USB 2.0 Type-A ports, a 2.5 Gbps RJ45 Ethernet jack, a WiFi antenna connector for the onboard RTL8922AE WiFi 7 and Bluetooth 5.4 module and a pair of 3.5 mm audio jacks mounted on a separate PCB. There's also a BIOS flashing button around the back.

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About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.