GIGABYTE, the world's leading computer brand, unveils the new generation of Intel B860 and AMD B850 series motherboards at CES 2025. These new series are designed to unleash the performance of the latest Intel Core Ultra and AMD Ryzen processors by leveraging AI-enhanced technology and user-friendly design for a seamless gaming and PC-building experience. Equipped with all digital power and enhanced thermal design, GIGABYTE B800 series motherboards are the gateway to mainstream PC gamers.

GIGABYTE achieved the remarkable milestone of claiming the highest market share on X870 series motherboards due to fully supporting AMD Ryzen 5 7000 and 9000 series X3D processors. The new B800 series motherboards are also adopted with ultra-durable and high-end components and the revolutionary AI suite, D5 Bionics Corsa, integrates software, hardware, and firmware to boost DD5 memory performance up to 8600 MT/s on AMD B850 models and 9466 MT/s on Intel B860 motherboards. The AI SNATCH is an exclusive AI-based software for enhancing DDR5 performance with just a few clicks. Meanwhile, the AI-Driven PCB Design ensures low signal reflection for peak performance across multiple layers through AI simulation. Plus, HyperTune BIOS integrates AI-driven optimizations to fine-tune the Memory Reference Code on Intel B860 series motherboards for high-demand gaming and multitasking. Specially built for AMD Ryzen 9000 series X3D processors, GIGABYTE applies X3D Turbo mode on AMD B850 series motherboards by adjusting core count to boost gaming performance.

ASUS extended its line of motherboards at CES 2025, featuring a design that moves power connectors to the back of the board. The company calls this approach "BTF" (Back To Future), aiming to improve cable management in PC builds. The TUF GAMING B850-BTF WIFI and B860-PLUS WIFI models demonstrate this new design, which can deliver up to 600 watts through the motherboard to support modern graphics cards. The boards include Wi-Fi 7 connectivity, PCIe 5.0 support, and multiple M.2 slots for storage devices. In the high-end segment, ASUS presented the ROG Maximus Z890 HERO BTF, compatible with Intel's LGA1851 processors. This board features DDR5 memory support, dual Thunderbolt 4 ports, and tools like Q-Release for easier graphics card removal.

For professional users, ASUS released the ProArt Z890 CREATOR WIFI, equipped with Thunderbolt 4 ports and specialized cooling systems. The company also showed new gaming-focused models including the ROG Crosshair X870E APEX, for the fastest Ryzen 9000X3D series gaming processors. The motherboards share several technical features across different price points. All models support PCIe 5.0 for graphics cards and storage, while most include Wi-Fi 7 capabilities. ASUS has added tool-free installation mechanisms for M.2 drives across the lineup. ASUS has not yet announced pricing or specific release dates for the new motherboards. The BTF design represents a significant change in motherboard layout, though it will require compatible PC cases and power supplies to function as intended. This marks one of the first major changes to standard motherboard design since the ATX format became common in the 1990s.

At CES 2025, GIGABYTE unveiled an impressive lineup of motherboards designed for Intel and AMD platforms for gaming, content creation, and professional use, with support for the latest processors, PCIe 5.0, and Wi-Fi 7. GIGABYTE introduced several Z890 chipset motherboards for Intel's "Arrow Lake" Core Ultra 200S series. The flagship Z890 AORUS Master offers features like DDR5 memory overclocking, tool-free PCIe and M.2 installation, and Wi-Fi 7 connectivity. The compact Z890I AORUS Ultra targets Mini-ITX builds with its efficient 8+1+2 VRM solution and AI-enhanced BIOS profiles. Despite its small form factor, it delivers robust performance and thermal management. For those looking for aesthetics and reliability, the Z890 AORUS Elite WiFi 7 ICE impresses with a sleek white design, digital VRM capabilities, and simplified Wi-Fi EZ-Plug installation for improved connectivity. For more budget-friendly options, GIGABYTE showed B860M AORUS Elite WiFi6E ICE motherboard, too.

MSI is proud to unveil its latest lineup of motherboards designed for AMD Ryzen B850 and B840 chipsets. These motherboards deliver a perfect blend of performance and innovation, ensuring exceptional reliability and ease of use. With their high performance and reliable design, they are built to empower mainstream users, gamers, and creators with next-level computing capabilities.

In addition to the new B850 and B840 motherboards, MSI is also expanding its X870E lineup with two new models: the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI. These additions offer even more options tailored to diverse user needs—top-tier performance and, most importantly, cutting-edge connectivity. With the MPG X870E EDGE TI WIFI and MAG X870E TOMAHAWK WIFI, MSI continues to deliver innovative solutions that empower gamers, creators, and PC enthusiasts alike.

G.SKILL International Enterprise Co., Ltd, the world's leading brand of performance overclock memory and PC components, is thrilled to release new low CAS latency memory kits featuring AMD EXPO overclock profile for the new AMD Ryzen 9000 series processors and performance X870 chipset motherboards. These new specifications include DDR5-6000 CL26 2x16GB/2x32GB kits and 2x 24 GB/2x 48 GB memory kits under the Trident Z5 Royal Neo, Trident Z5 Neo RGB, and Ripjaws M5 RGB Neo series.

Aiming to provide high-performance overclock DDR5 memory for PC enthusiasts, G.SKILL is releasing a new low CAS Latency memory kit at DDR5-6000 CL26-36-36-96 with kit capacity configuration of 32 GB (2x16GB), as well as the world's first 64 GB (2x32GB) kit capacity for this low latency specification. Featuring the AMD EXPO memory overclocking profile, these new specifications are built for selected X870 series motherboards and AMD Ryzen 9000 series processors. The screenshot below demonstrates DDR5-6000 CL26 2x32GB kit's stability under the Memtest memory stress test on the ASUS ROG Crosshair X870E Hero motherboard and AMD Ryzen 9 9900X desktop processor.

In the first week of the 2025 International CES, Intel and AMD are expected to expand their desktop processor product stacks, with the introduction of 65 W models; and with them, more affordable motherboard chipset models. AMD is expected to launch the AMD B850 and AMD B840; while Intel debuts the Intel B860 and H810. Board Channels, a site that tracks hardware launches at the retail channel level, says that AMD is expected to set January 15 as the market availability date for motherboards based on the AMD B850 and B840. The chipset will be announced at AMD's January 7th event.

Meanwhile, Intel is expected to announce its mid-range Intel B860 and entry-level Intel H810 on its own event slated for January 7, but with product availability on January 13. The AMD B850 is essentially a rebadged B650, but motherboard vendors can optionally enable Gen 5 PEG instead of Gen 4, at which point the platform would essentially be an AMD X870, but without the mandatory discrete USB4 host controller. The AMD B850 supports CPU overclocking. The AMD B840 lacks this, and is functionally similar to the AMD B550 chipset from the Socket AM4 platform, except that it lacks CPU overclocking support. Meanwhile, the Intel B860 is expected to feature a similar I/O as the Intel B760 from the Socket LGA1700 platform. The H810 is expected to be a lean entry-level option. Both the Intel B860 and H810 are expected to lack CPU overclocking support, but the B860 probably retains memory overclocking capability.

MSI has unveiled a new performance-enhancing feature for its AM5 socket motherboards to improve DDR5 memory latency. Some latency issues that emerged following AMD's AGESA 1.2.0.2a microcode update, which added support for AMD's Ryzen 9000X3D processors, are now fixed. MSI has baked in its BIOS tuning to develop a new "Latency Killer" feature, which can be found in the advanced menu section, specifically within the overclocking submenu in BIOS of MSI X870E/X870 gaming motherboards like MEG X870E GODLIKE and MPG X870E CARBON WIFI. Users have three options to choose from: Auto, Enabled, and Disabled. While the default behavior of the Auto setting remains unclear, it is believed to be initially disabled to ensure system stability.

Recent benchmark testing of Uniko's Hardware using AIDA64 has demonstrated promising results, showing an eight nanosecond improvement in memory latency when the new feature is activated. The test was conducted using a Ryzen 7 9800X3D processor paired with an MPG X870E Carbon WiFi motherboard and DDR5-8000 CL38 memory, running in High-Efficiency mode at its maximum preset. Some Reddit users with AMD Ryzen 7 9800X3D on MSI Tomahawk X870 reported seeing 10-12 ns improvement from enabling the "Latency Killer." MSI motherboards complement its Latency Killer feature with additional memory optimization tools in the BIOS, including EXPO / A-XMP profiles, Memory Try It presets, High-Efficiency Mode, and comprehensive manual overclocking options for enthusiasts seeking maximum performance.

MSI has released a brief statement regarding the recent issue of a burned AMD Ryzen 7 9800X3D on the MSI Tomahawk X870 motherboard. The issue was reported over at Reddit, showing both burned CPU and socket, and currently it seems to be an isolated incident. MSI is stepping in to investigate the issue and has released a brief statement.

"Recently, we received a user report indicating damage to an AMD Ryzen 7 9800X3D processor on an MSI MAG X870 TOMAHAWK WIFI motherboard. At MSI, we are fully committed to the quality of our products and have begun investigating this incident. Additionally, we are working closely with AMD and are in contact with GamersNexus, which is independently investigating this incident. We will continue to provide updates as the investigation progresses," said MSI in its official statement.

When the initial batch of AMD X870/E motherboards were announced, there were no signs of Mini-ITX motherboards, but now Gigabyte has launched its first X870 Mini-ITX board and it's a bit of a hit and miss in our opinion. The X870I Aorus Pro Ice comes in white, as per the Ice moniker that Gigabyte likes to use for its white products and this might really appeal to some and put others off. Feature wise, we're looking at a single PCIe 5.0 x16 slot—as per most Mini-ITX boards—two NVMe M.2 slots, one PCIe 5.0 and one PCIe 4.0, but for some reason, Gigabyte decided that a single USB4 port was enough.

What makes the single USB4 port decision even worse is the fact that the board only has a USB 3.2 Gen 2 10 Gbps USB Type-C port and the front panel header is also limited to 10 Gbps. On a brand new board, this is really quite disappointing, but the Pro SKUs are usually feature limited models from Gigabyte. The rest of the ports around the back consists of an HDMI 2.1 port, although it too is limited to 4K 60 Hz output, which again is disappointing—the USB4 port is capable of 4K at 240 Hzvia DP Alt mode—two USB 3.2 Gen 2 10 Gbps USB Type-A ports, two USB 3.2 Gen 1 5 Gbps USB Type-A ports and two USB 2.0 Type-A ports, a 2.5 Gbps RJ45 Ethernet jack, a WiFi antenna connector for the onboard RTL8922AE WiFi 7 and Bluetooth 5.4 module and a pair of 3.5 mm audio jacks mounted on a separate PCB. There's also a BIOS flashing button around the back.

The holiday season is here! MSI's Ultra Connect to New ERA Steam Code Promotion is your gateway to free Steam codes with our latest, most powerful products. Don't miss out - join now and gear up for an unforgettable gaming holiday!

About EZ-DIY Features - Motherboard, Liquid Cooling, PC Case
MSI has unveiled a new lineup of DIY-friendly products designed to simplify PC building for everyone, from beginners to experienced enthusiasts. The X870 (E) & Z890 motherboards come equipped with the EZ M.2 CLIP II, which enables quick, tool-free M.2 SSD installation, along with the EZ PCIe Release for easy and secure graphics card removal at the push of a button. The MAG CORELIQUID I series liquid cooling system features a universal UNI Bracket compatible with both Intel and AMD sockets. Its pre-installed fans simplify cable management to just one cable, while optional cable covers provide a clean and personalized look. Additionally, MSI's MAG PANO series PC cases offer tool-free panels on the front, side, and top, ensuring unrestricted access for adding side fans or radiators. MSI's user-friendly lineup aims to make PC building smoother, faster, and more enjoyable for everyone.

MSI is thrilled to introduce the upcoming AMD Ryzen 7 9800X3D, an innovation built on the Zen 5 architecture and featuring AMD's groundbreaking 3D V-Cache technology. The Ryzen 7 9800X3D is designed for peak performance with improved IPC and superior power efficiency compared to the previous generation, promising an exhilarating leap in computing power.

The Ryzen 7 9800X3D integrates seamlessly with the AM5 socket ecosystem, providing users access to PCIe Gen 5 bandwidth and high-speed DDR5 memory support. Built on a 4 nm process, this processor establishes a new performance, power efficiency, and responsiveness benchmark, ideal for intensive gaming and content creation. MSI's X870(E) motherboards are fully compatible with the Ryzen 7 9800X3D, featuring a robust lineup from MEG X870E GODLIKE to MAG X870 TOMAHAWK WIFI. MSI's X870(E) motherboards and AMD's latest processors unlock peak gaming performance for users.

AMD has unveiled its latest chipset driver update 6.10.17.152, bringing new features and improvements to enhance system performance and compatibility, along with support for X870E / X870 chipsets. The release introduces expanded program support and optimized Windows 11 integration through CETCOMPACT implementation across select drivers, a security feature that helps protect against certain types of malware attacks by enforcing Control-flow Enforcement Technology (CET) in a compatible mode for legacy software. This technology ensures better security while maintaining compatibility with existing applications.

The update comes with several bug fixes addressing previous version issues. However, users should be aware of certain limitations that are currently present in this release. Some driver names may appear in English when running on non-English operating systems, users might encounter instances where the uninstall summary incorrectly displays a "Failed" status despite successful removal, and some users may experience installation or upgrade issues related explicitly to Ryzen PPKG. AMD recommends users backup their systems before updating and follow the standard installation procedures, with the company maintaining dedicated technical support resources through their customer service portal for users requiring additional assistance.

DOWNLOAD: AMD Chipset Drivers 6.10.17.152

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, is proud to announce the launch of X3D Turbo Mode, a revolutionary BIOS feature designed to maximize gaming performance on X870E, X870, and 600 series motherboards with AMD Ryzen 7000 X3D and Ryzen 9000 series processors.⁠

GIGABYTE X3D Turbo Mode is a cutting-edge BIOS feature that pushes the boundaries of gaming performance. Empirical testing demonstrates that this innovative BIOS feature delivers tangible benefits to gamers, with performance increases of up to 35% for incoming Ryzen 9000 X3D processors and an astounding 20% for Ryzen 9000 non-X3D processors. Moreover, X3D Turbo Mode's unique optimization parameters allow even Ryzen 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency by GIGABYTE's BIOS wizardry-X3D Turbo Mode.

MSI is thrilled to announce the Unknown 9: Awakening Game Bundle promotion, running from October 18 to November 18, 2024. Participants can enroll while supplies last for a chance to receive a free game code for the PC standard edition of Unknown 9: Awakening - Standard Edition PC valued at USD $49.99 with the purchase of select eligible X870/X870E motherboards.

Delve into the mysterious world of the Unknown 9, and uncover mysteries hidden in plain sight. You are Haroona, a Quaestor born with the ability to venture into a mysterious dimension that overlaps our own, known only as the Fold. On her quest for powerful hidden knowledge, Haroona will learn to master her unique connection to the Fold, which allows her to channel its powers into our world... But such power does not go unnoticed and Haroona quickly becomes the target of the Ascendants, who want to use the Fold to alter the course of human history.

MSI, a leading brand in gaming hardware, is thrilled to announce an exciting collaboration with SEGA, a prominent Japanese game publisher, to bring gamers on an epic journey through the expansive world of Metaphor: ReFantazio.

Embark on an epic journey in Metaphor: ReFantazio with MSI's Cutting-Edge Motherboards
From 2024 October 11th to November 11th, MSI is offering a special promotion: purchase an X870(E) motherboard and receive a Metaphor: ReFantazio Standard Edition PC digital game key for free.

AMD today made four key announcements for its Ryzen 9000 series "Granite Ridge" desktop processors based on the "Zen 5" microarchitecture. These mainly aim to improve upon the products as originally launched in August. To begin with, AMD announced a 105 W cTDP (configurable TDP) mode for the Ryzen 7 9700X and Ryzen 7 9600X processors, with full warranty coverage. This setting can be enabled in the UEFI setup program of a motherboard running its latest version of UEFI firmware, which encapsulates the AGESA ComboAM5 PI 1.2.0.2 microcode. The setting raises the PPT (package power tracking) value of the 9700X and 9600X to 140 W, and treats them as if they were 105 W TDP processors. These chips were originally launched by AMD with 65 W (88 W PPT), and as reviewers quickly found out, unlocking power improves performance at stock clock speeds, as it improves boost frequency residence of these chips.

Next up, is the AGESA PI 1.2.0.2 microcode itself, which introduces the 105 W cTDP mode for the 9700X and 9600X along with warranty coverage, which we just talked about; plus works to improve the core-to-core latency on the Ryzen 9 9900X and Ryzen 9 9950X. These are processors with two CPU complex dies (CCDs), each with either 8 or 6 cores enabled. To the software, this is still a single-socket (1P) CPU with 12 or 16 cores. Although some awareness of the dual-CCD architecture is added to the OS scheduler to help it localize certain kinds of workloads (such as games) to a single CCD, reviewers noted that core-to-core latency on the dual-CCD chips was still too high, which should affect performance when a software's threads are migrating between cores, or if a workload is multithreaded, such as media encoding. AMD addressed exactly this with the new AGESA PI 1.2.0.2 update.

Major AMD partners like ASUS, ASRock, GIGABYTE, and MSI have unveiled their latest AMD AM5 motherboards featuring the X870E and X870 chipsets. The new motherboards offer broad compatibility, supporting not only the latest AMD Ryzen 9000 series, but also the Ryzen 8000 and 7000 CPUs. These boards are aimed at high-end and enthusiast users, sporting optimized VRM designs and enhanced I/O capabilities, including WiFi 7 and USB 4 support.

The motherboards are all in ATX format; however, mATX/ITX models should follow later this year. They all support DDR5-5600 MT/s memory speeds natively, with some models supporting over 8000 MT/s memory speeds. In terms of chipset, the X870E series uses two Promontory 21 dies with support for USB 4 and Gen 5 GPU/SSD (24x Gen 5 CPU Lanes, 8x Gen 4 + 12x Gen 3 PCH Lanes). The X870 will use just one of the dies, retaining the Gen 5 lanes, however the PCH Lanes will be limited to 4x Gen 4 + 8x Gen 3.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, unveils cutting-edge AMD X870E/X870 motherboards. Designed with AI accelerated performance boost, premium thermal management, next-generation memory optimization, intuitive DIY-friendly features, state-of-the-art BIOS technology, GIGABYTE X870E/X870 motherboards maximize the capabilities of the latest AMD Ryzen 9000 series processors and power the gaming performance for AI era.

AORUS AI SNATCH
GIGABYTE X870E/X870 lineup boasts the innovative AORUS AI SNATCH, which can unleash ultimate performance with simple one click. Powered by an AI engine, the memory and system performance can be boosted with improved multitasking and overall system responsiveness. Users can overclock like an expert in a snap through simple interface while enjoy smart and safe overclocking. The AI processing is accelerated as well for better performance with optimal power efficiency.

ASRock, the global leading manufacturer of motherboards, graphics cards, mini PCs, and gaming monitors, today announced a full line-up of flagship to mainstream motherboards using the AMD X870E/X870 series chipset, which is designed expressly for the latest AMD Ryzen 9000 series processors using AM5 socket. New motherboards include the flagship series X870E Taichi and Taichi Lite, newly introduced flagship Phantom Gaming X870E Nova WiFi, mainstream gaming X870 Riptide WiFi, plus the always popular X870 Steel Legend WiFi, X870 Pro RS and Pro RS WiFi, which are both now available in a white design.

All the new ASRock X870E/X870 motherboards, from the flagship Taichi series to the mainstream Steel Legend and Pro RS WiFi, feature a highly robust design for extreme performance. The Taichi series combines SPS Dr.MOS power delivery of up to 24+2+1 phases, server-grade 8-layer PCBs enabling excellent memory overclocking up to DDR5-8200, and exclusive low-ripple 1000μf 20K black capacitors that guarantee stable and superior performance for the CPU.

T-FORCE, Team Group's gaming brand, and T-CREATE, its creator-focused brand, are launching dual-mode DDR5 overclocking memory modules for Intel and AMD platforms with speeds up to 8000 MHz. This highlights Team Group's industry-leading overclocking capabilities, delivering the ultimate performance for gamers and creators.

T-FORCE, known for pushing the boundaries of performance, and T-CREATE, focused on stable and efficient performance, will offer a range of DDR5 dual-mode overclocking memory modules under their product portfolio. These modules will come in eight speeds, ranging from 6400 MHz to 8000 MHz, catering to diverse needs and providing optimal performance for gaming enthusiasts and content creators managing complex workflows. The dual-mode memory modules will be available in 2x16GB and 2x24GB capacity options. A single 24 GB stick significantly expands memory capacity for handling large workloads, leading to smoother and more efficient performance. The memory modules are fully compatible with Intel XMP 3.0 (Extreme Memory Profile) and AMD EXPO (Extended Profiles for Overclocking) profiles, ensuring seamless one-click overclocking on the latest AMD X870E and Intel Z790 platforms, delivering an exceptional user experience across both platforms.

MSI unveils the X870E and X870 motherboards, designed to harness the full power of AMD's Ryzen 9000 Series desktop processors. The lineup includes four models: MEG X870E GODLIKE, MPG X870E CARBON WIFI, MAG X870 TOMAHAWK WIFI, and PRO X870-P WIFI. These motherboards deliver exceptional value and performance with cutting-edge features and exclusive MSI innovations. Offering top components, innovative features, and easy DIY options, MSI's X870E and X870 motherboards make building and using your PC seamless.

Introducing MSI's Ultra Connect feature in the X870E and X870 motherboards, offering next-gen networking, storage, and expansion. With built-in 5G LAN and Wi-Fi 7, users can enjoy lightning-fast speeds, reaching up to 5.8 Gbps. As well as TriLink Connectivity, Expansion is made to future-proof with PCIe Gen 5.0 for next-gen graphics cards and SSDs. The USB4 ports, which are Thunderbolt compatible, enable fast data transfers and support a wide range of next-gen devices, including display output through USB-C.

Intel is set to launch its Arrow Lake processors on October 24th, likely alongside the official release of the Z890 motherboards. Meanwhile, AMD is expected to launch its new X870 and X870E motherboards on September 30th. Ahead of these dates, we've already seen many of them showcased at Computex, however, today an Australian retailer listed several MSI motherboards, including one Z890 model (MSI Z890 Carbon WiFi) and three X870/X870E models (MSI MPG X870E Carbon WiFi, MSI MAG X870 Tomahawk WiFi, and MSI PRO X870-P WiFi).

MSI Z890 Carbon WiFi
This is a mid-range motherboard, however without an official spec sheet, we're left trying to decipher details from the pictures. From what we can see, it offers a solid set of features, including USB 3.2, USB Type-C ports, BIOS Flash, Clear CMOS, and Smart Buttons. The board itself includes an 8-pin PCI-E connector and at least three M.2 slots. Currently, there is no information about its retail price.

MSI is thrilled to introduce a groundbreaking feature on its X870(E) series motherboards. This innovative is designed with gamers and professionals in mind, provides the extra power required for AI computing and GPU-intensive applications. The supplemental PCIe Power feature, equipped with an integrated 8-pin PCIe power connector, delivers additional power for GPUs demanding higher wattage, ensuring they can achieve their peak performance. Paired with the ATX 3.1 power standard, which can hold up to a 2.5x power excursion for enhanced reliability and better power delivery, this feature ensures stable, efficient, and sustained performance, even under heavy loads. Whether gaming or tackling complex applications, this supplemental PCIe Power offers unmatched reliability and stability for the most demanding environments.

What is Supplemental PCIe Power?
Think of it as an extra battery pack for your motherboard. The system's 12 V power on the 24pin power connector from the motherboard basically handles all the PCIe interface, fans and RGB extensions. Still, the supplemental PCIe power ensures everything runs smoothly when your PC is pushed to the limit—like when running very intensive graphical games or maximizing all the fan dissipation for extreme performance.

Motherboard vendors have been sporadically announcing their new premium- and high-end motherboards based on the AMD X870E and AMD X870 desktop chipsets, however, we've had a hard time finding or ordering these online. It turns out that although AMD allowed its motherboard partners to tease or announce their products based on the new chipset models, their market availability is timed.

Apparently, you should be able to buy these motherboards starting September 30, 2024. In the run-up to their availability, various online retailers have put up these motherboards at fairly high prices. Motherboards based on the cheaper AMD X870 are typically priced above $250, while those based on the top X870E start around $325. It is widely rumored that the mid-range AMD B850 will launch early next year. Until then, you always have the option of older AMD B650 chipset motherboards. If you want to pair these with newer Ryzen 9000 series "Granite Ridge" processors, you can take advantage of the UEFI BIOS Flashback feature.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.