A new rumor circulating via VideoCardz reveals alleged Cinebench R23 rendering scores for the upcoming AMD Ryzen 9 9800X3D CPU series. The lineup supposedly includes 8-core, 12-core, and 16-core models, all featuring Zen5 architecture and 3D V-Cache technology. The leak consists of Cinebench R23 benchmark scores, however, there are no screenshots, so it should be treated with caution as it comes from CodeCommando, a relatively new source with only one verified leak to his name—the Ryzen 9000 slides that emerged shortly before AMD's official announcement.

Comparing the results posted from CodeCommando with TechPowerUp review data of the previous generation, the picture presents itself in a promising way for the upcoming AMD CPUs. The Ryzen 9 9950X3D is around 10% faster in single-core and 17% faster in multi-core compared with Ryzen 9 7950X3D, while Ryzen 7 9800X3D seems to be 20% faster in single-core and 28% faster in multi-core than Ryzen 7 7800X3D. These initial benchmark results show notable performance gains for the 8-core SKU, with both X3D models demonstrating higher multi-core scores than their non-X3D counterparts. While the 9800X3D shows slightly lower single-core performance than the 8-core 9700X, it exceeds the 9700X in multi-core tests. This multi-core advantage likely comes from a higher TDP, though specific power specifications haven't been revealed yet.

The title has no typo, and what you are reading is correct. Intel's flagship 128-core 256-threaded CPU Xeon 6980P compute monster processor carries a substantial $17,800 price point. Intel's Xeon 6 "Granite Rapids" family of processors appears to be its most expensive yet, with the flagship SKU now carrying more than a 50% price increase compared to the previous "Emerald Rapids" generation. However, the economics of computing are more nuanced than simple comparisons. While the last generation Emerald Rapids Xeon 8592+ (64 cores, 128 threads) cost about $181 per core, the new Granite Rapids Xeon 6980P comes in at approximately $139 per core, offering faster cores at a lower per-core cost.

The economics of data centers aren't always tied to the cost of a single product. When building total cost of ownership models, factors such as power consumption, compute density, and performance impact the final assessment. Even with the higher price of this flagship Granite Rapids Xeon processor, the economics of data center deployment may work in its favor. Customers get more cores in a single package, increasing density and driving down cost-per-core per system. This also improves operational efficiency, which is crucial considering that operating expenses account for about 10% of data center costs.

Intel's Arrow Lake Core Ultra 200 series CPUs have appeared in a number of leaks now, and some benchmarks of the new chips have even started appearing on sites like Geekbench, however, there are still some questions surrounding the launch date of the new CPUs. Previous leaks indicated that the original mid-October launch was pushed back to October 24, and new information from VideoCardz sheds more light on the exact specifics of the launch, with October 24 pegged as the day Arrow Lake reviews and sales will be available to the public.

According to the leak, Intel will host a private media briefing for a select few press outlets and influencers on October 7. This will be followed by the official public announcement on October 10 and the review embargo and official retail launch on October 24. The October 7 event will reportedly feature a keynote from both Robert Hallock, Intel's VP and general manager of Client AI and technical marketing, and Roger Chandler, vice president of enthusiast PC and workstation product marketing.

NVIDIA has reportedly discontinued its dual-rack GB200 NVL36x2 GPU model, opting to focus on the single-rack GB200 NVL72 and NVL36 models. This shift, revealed by industry analyst Ming-Chi Kuo, aims to simplify NVIDIA's offerings in the AI and HPC markets. The decision was influenced by major clients like Microsoft, who prefer the NVL72's improved space efficiency and potential for enhanced inference performance. While both models perform similarly in AI large language model (LLM) training, the NVL72 is expected to excel in non-parallelizable inference tasks. As a reminder, the NVL72 features 36 Grace CPUs, delivering 2,592 Arm Neoverse V2 cores with 17 TB LPDDR5X memory with 18.4 TB/s aggregate bandwidth. Additionally, it includes 72 Blackwell GB200 SXM GPUs that have a massive 13.5 TB of HBM3e combined, running at 576 TB/s aggregate bandwidth.

However, this shift presents significant challenges. The NVL72's power consumption of around 120kW far exceeds typical data center capabilities, potentially limiting its immediate widespread adoption. The discontinuation of the NVL36x2 has also sparked concerns about NVIDIA's execution capabilities and may disrupt the supply chain for assembly and cooling solutions. Despite these hurdles, industry experts view this as a pragmatic approach to product planning in the dynamic AI landscape. While some customers may be disappointed by the dual-rack model's cancellation, NVIDIA's long-term outlook in the AI technology market remains strong. The company continues to work with clients and listen to their needs, to position itself as a leader in high-performance computing solutions.

AMD continually sets the industry standard with its EPYC Embedded processors, offering exceptional performance, efficiency, connectivity, and innovation for networking, storage, and industrial applications. Today we are extending that leadership with the fourth-generation, AMD EPYC Embedded 8004 Series processors.

The AMD EPYC Embedded 8004 Series processor is designed for compute-intensive embedded systems, delivering exceptional performance for high-demand workloads while maximizing power efficiency in a compact form factor for space- and power-constrained applications. It also integrates a comprehensive suite of embedded features to further enhance system performance and reliability. Engineered to excel in the most demanding embedded environments, the AMD EPYC Embedded 8004 Series is perfectly suited for networking systems, routers, security appliances, enterprise and cloud warm/cold storage, and industrial edge applications, ensuring seamless handling of dynamic workloads.

Qualcomm debuted its Snapdragon X Elite/Plus series of laptop processors a few months ago, and the company is already testing the next-generation Snapdragon X2 series. Interestingly, the new "SC8480XP" SoC is carrying a codename "project Glymur." Up until now, Qualcomm has exclusively used codenames of places in Hawaii. However, with the Snapdragon X2 series, it shifts to Iceland, with the highest waterfall name being used for this next-generation processor. While we have almost zero clue about core counts and clocks, we know that the CPU cores will be an iteration of Nuvia's Oryon design, likely being pre-designed before the acquisition of the Nuvia design team.

According to Winfuture, Qualcomm started testing the next-generation SC8480XP SoC in July and August, testing various RAM and storage configurations. The company will likely evaluate the best configurations for the upcoming platform, tune the RAM speed with the SoC, and decide on guidelines for storage configurations. We are still waiting to see meaningful hints about the next-generation platform, and we are especially curious about the clocks and core counts that Qualcomm is preparing.

We've known about the upcoming AMD Ryzen 7 9800X3D for a good long while now, and previous leaks and rumors indicated that it would offer a rather significant boost in gaming performance thanks to changes to the 3D V-cache amounts and layouts. Now, a new leak, which purports to show off the official retail packaging for the new CPU, suggests that clock speeds will get a boost over the existing AMD Ryzen 7 78000X3D.

The leak, shared by Moore's Law Is Dead on YouTube, shows off a supposed retail box for the AMD Ryzen 7 9800X3D that was sent to AMD's partners for marketing, and along with that, he claims to have had access to the entire marketing slide deck, which is where the frequency boost information comes from. According to the leaker, the 9800X3D's marketing material specifically calls out the processor as being "designed for increased frequencies."

According to a new research report from leading analyst firm Jon Peddie Research (JPR), unit shipments in the add-in board (AIB) market increased in Q2'24 from last quarter and increased year over year. Meanwhile, Nvidia slightly increased market share from last quarter, as well as year over year. In Q2'24, total graphics card shipments increased to 9.5 million units, up from 8.7 million units last quarter.

AMD's quarter-to-quarter total desktop AIB unit shipments increased 9% and increased 3% from last year. Nvidia's quarter-to-quarter unit shipments increased 9.7% and increased 61.9% from last year while continuing to hold a dominant market share position at 88%. Intel, which entered the AIB market in Q3'22 with the Arc A770 and A750, remained flat, as the company has yet to gain significant traction in the add-in board market.Market share changes quarter to quarter and year to year.

Intel has released version 1.2 of its X86S architecture specification. The X86S project, first announced last year, aims to modernize the x86 architecture that has been the heart of PCs since the late 1970s. Over the decades, Intel and AMD have continually expanded x86's capabilities, resulting in a complex instruction set that Intel now sees as partially outdated. The latest specification primarily focuses on removing legacy features, particularly 16-bit and 32-bit support. This radical departure from x86's long-standing commitment to backward compatibility aligns with the simplification of x86. While the specification does mention a "32-bit compatibility mode," we are yet to how would 32-bit apps run. This ambiguity raises questions about how X86S might handle existing 32-bit applications, which, despite declining relevance, still play a role in many computing environments.

The potential transition to X86S comes at a time when the industry is already moving away from 32-bit support. However, the proposed changes are subject to controversy. The x86 architecture's strength has long been its extensive legacy support, allowing older software to run on modern hardware. A move to X86S could disrupt this ecosystem, particularly for users relying on older applications. Furthermore, introducing X86S raises questions about the future relationship between Intel and AMD, the two primary x86 CPU designers. While Intel leads the initiative, AMD's role in the potential transition remains uncertain, given its significant contributions to the current x86-64 standard.

Yesterday, Intel launched its Xeon 6 family of server processors based on P-cores manufactured on Intel 3 node. While the early reviews seem promising, Intel is preparing a more advanced generation of processors that will make or break its product and foundry leadership. Codenamed "Clearwater Forest," these CPUs are expected to be the first high-volume production chips based on the Intel 18A node. We have pictures of the five-tile Clearwater Forest processor thanks to Tom's Hardware. During the Enterprise Tech Tour event in Portland, Oregon, Tom's Hardware managed to take a picture of the complex Clearwater Forest design. With compute logic built on 18A, this CPU uses Intel's 3-T process technology, which serves as the foundation for the base die, marking its debut in this role. Compute dies are stacked on this base die, making the CPU building more complex but more flexible.

The Foveros Direct 3D and EMIB technologies enable large-scale integration on a package, achieving capabilities that previous monolithic single-chip designs could not deliver. Other technologies like RibbonFET and PowerVia will also be present for Clearwater Forest. If everything continues to advance according to plan, we expect to see this next-generation CPU sometime next year. However, it is crucial to note that if this CPU shows that the high-volume production of Intel 18A is viable, many Intel Foundry customers would be reassured that Intel can compete with TSMC and Samsung in producing high-performance silicon on advanced nodes at scale.

As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment. To meet this demand head-on, Intel today launched Xeon 6 with Performance-cores (P-cores) and Gaudi 3 AI accelerators, bolstering the company's commitment to deliver powerful AI systems with optimal performance per watt and lower total cost of ownership (TCO).

"Demand for AI is leading to a massive transformation in the data center, and the industry is asking for choice in hardware, software and developer tools," said Justin Hotard, Intel executive vice president and general manager of the Data Center and Artificial Intelligence Group. "With our launch of Xeon 6 with P-cores and Gaudi 3 AI accelerators, Intel is enabling an open ecosystem that allows our customers to implement all of their workloads with greater performance, efficiency and security."

Gaming giant Valve appears to be venturing into uncharted territory. Recent findings on SteamDB have revealed that the company may be working on integrating ARM architecture and Android app support into its ecosystem. A mysterious application, codenamed "ValveTestApp3043620," has been spotted with an update that includes interesting changes. The update features new tags for several popular games, including Left 4 Dead 2, Garry's Mod, and Kerbal Space Program. These tags, such as "proton-arm64" and "proton-arm64e," indicate that Valve is testing a version of Proton specifically designed for ARM64-based systems. Proton, Valve's brainchild developed in partnership with CodeWeavers, is the magic behind running Windows games on Linux systems. By extending this technology to ARM64, Valve could be paving the way for PC gaming on portable Arm-based devices, potentially signaling a new hardware strategy.

The plot thickens with mentions of "proton_experimental" and "proton-arm64ec-vanguard" in the changelog, hinting at ongoing tests and experimental builds. Additionally, references to Waydroid, a tool enabling Android apps on Linux, suggest that Valve's ambitions may extend beyond gaming, possibly aiming to broaden software accessibility of its platform. This development has sparked speculation about the possibility of Steam games running on Android smartphones and tablets or even a possible Arm-powered version of the Steam Deck. However, a more likely scenario could be testing for Windows support on Arm-based chips. The timing of these experiments aligns with recent announcements of laptops featuring Qualcomm's ARM64-based Snapdragon X CPUs. These devices can run Windows-based games through Microsoft and Qualcomm's emulation layer, Prism. If Valve's Proton can provide superior performance or more stable emulation for Windows-based games on Arm devices, it could position itself as a strong competitor to Prism.

Intel's Core Ultra 200 series "Arrow Lake" CPU generation is bringing a complete P/E core redesign and, allegedly, a new package. According to VideoCardz, Intel's flagship SKU—Core Ultra 9 285K—features a completely redesigned box with new accent colors. Colors of choice include blue, black, and gray tones with a futuristic look. At the center of the new box is grey plastic packaging that protects and holds the actual processor. As the recent leaks suggested, this SKU will boast 8 "Lion Cove" P-Cores and 16 "Skymont" E-Cores without Hyper-Threading and with a maximum boost of 5.7 GHz. All of this will be packed inside a 125-watt power envelope. While we await the official launch, supposedly scheduled for October 10 and released on October 24, we can preview the new packaging box that Intel prepared for its new CPU family.

A few days ago, we reported on AMD's newest expansion plans for Serbia. The company opened two new engineering design centers with offices in Belgrade and Nis. We were invited to join the opening ceremony and got an exclusive interview with one of AMD's top executives, Andrej Zdravkovic, who is the senior vice president and Chief Software Officer. Previously, we reported on AMD's transition to become a software company. The company has recently tripled its software engineering workforce and is moving some of its best people to support these teams. AMD's plan is spread over a three to five-year timeframe to improve its software ecosystem, accelerating hardware development to launch new products more frequently and to react to changes in software demand. AMD found that to help these expansion efforts, opening new design centers in Serbia would be very advantageous.

We sat down with Andrej Zdravkovic to discuss the purpose of AMD's establishment in Serbia and the future of some products. Zdravkovic is actually an engineer from Serbia, where he completed his Bachelor's and Master's degrees in electrical engineering from Belgrade University. In 1998, Zdravkovic joined ATI and quickly rose through the ranks, eventually becoming a senior director. During his decade-long tenure, Zdravkovic witnessed a significant industry shift as AMD acquired ATI in 2006. After a brief stint at another company, Zdravkovic returned to AMD in 2015, bringing with him a wealth of experience and a unique perspective on the evolution of the graphics and computing industry.Here is the full interview:

There is only a month left before the official launch of Intel new "Arrow Lake" CPUs. Now, we have a new leak revealing what appear to be the final specs for Intel's Core Ultra 200 'Arrow Lake' desktop CPUs series. According to Benchlife, Intel is preparing to release five SKUs. Although there is no KF version of the Core Ultra 9 285K yet, the new CPUs include: Intel Core Ultra 9 285K, Core Ultra 7 265K, Core Ultra 7 265KF, Core Ultra 5 245K, and Core Ultra 5 245KF. These processors will also be accompanied by new Z890 chipset motherboards.

The "K" model will have Xe-LPG-based integrated graphics, while the "KF" model will require a discrete GPU. Intel plans to expand its Arrow Lake lineup in early 2025 with non-K models. These new CPUs are expected to offer increased performance compared to their 13th and 14th generation predecessors. The new architecture aims to eliminate stability issues and reduce real-world power consumption.

AMD is about to extend its mobile CPU lineup with the introduction of new Ryzen AI APUs, which are going to include the Krackan Point series which has been greatly expected. These CPUs are aimed at mainstream platforms and are targeted to bring performance, AI capabilities, and memory support to a new level. Krackan Point is supposed to be a cheaper alternative to the premium Strix Point series. Jack Huynh, Senior Vice President and General Manager of the Computing and Graphics Business Group of AMD confirmed at IFA 2024 that Krackan will be released to the mass market early in 2025.

One of the highlights is the support for LPDDR5X-8000 memory, this feature is expected to place the Krackan Point APUs close to AMD's Strix Halo series and compete directly with Intel's Lunar Lake processors. The XDNA2 Neural Processing Unit and also the certification of AMD for Microsoft Copilot+PC will be the advantages of this enhancement of the product.

Apple today announced iPhone 16 and iPhone 16 Plus, built for Apple Intelligence, the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. The iPhone 16 lineup also introduces Camera Control, which brings new ways to capture memories, and will help users quickly access visual intelligence to learn about objects or places around them faster than ever before. The powerful camera system features a 48MP Fusion camera with a 2x Telephoto option, giving users two cameras in one, while a new Ultra Wide camera enables macro photography. Next-generation Photographic Styles help users personalize their images, and spatial photo and video capture allows users to relive life's precious memories with remarkable depth on Apple Vision Pro. The new A18 chip delivers a huge leap in performance and efficiency, enabling demanding AAA games, as well as a big boost in battery life.

iPhone 16 and iPhone 16 Plus will be available in five bold colors: black, white, pink, teal, and ultramarine. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

Apple today introduced iPhone 16 Pro and iPhone 16 Pro Max, featuring Apple Intelligence, larger display sizes, new creative capabilities with innovative pro camera features, stunning graphics for immersive gaming, and more—all powered by the A18 Pro chip. With Apple Intelligence, powerful Apple-built generative models come to iPhone in the easy-to-use personal intelligence system that understands personal context to deliver intelligence that is helpful and relevant while protecting user privacy. Camera Control unlocks a fast, intuitive way to tap into visual intelligence and easily interact with the advanced camera system. Featuring a new 48MP Fusion camera with a faster quad-pixel sensor that enables 4K120 FPS video recording in Dolby Vision, these new Pro models achieve the highest resolution and frame-rate combination ever available on iPhone. Additional advancements include a new 48MP Ultra Wide camera for higher-resolution photography, including macro; a 5x Telephoto camera on both Pro models; and studio-quality mics to record more true-to-life audio. The durable titanium design is strong yet lightweight, with larger display sizes, the thinnest borders on any Apple product, and a huge leap in battery life—with iPhone 16 Pro Max offering the best battery life on iPhone ever.

iPhone 16 Pro and iPhone 16 Pro Max will be available in four stunning finishes: black titanium, natural titanium, white titanium, and desert titanium. Pre-orders begin Friday, September 13, with availability beginning Friday, September 20.

Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.

The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.

Taipei, Taiwan－September 5th, 2024－Thermaltake, a leading PC DIY brand for premium hardware solutions, is pleased to announce that a total of 71 cooling products are fully compatible with the latest Intel Arrow Lake-S and AMD Ryzen 9000 series processors. The upcoming Intel 15th Gen CPUs feature the new LGA 1851 socket and retain compatibility with the LGA 1700 socket.

Meanwhile, the AMD Ryzen 9000 series is continually designed with the AM5 socket. This indicates that users can seamlessly upgrade to the brand-new Intel and AMD CPUs while pairing up with the existing Thermaltake coolers. Regardless of air coolers, all-in-one liquid coolers, or water blocks, Thermaltake offers a wide range of superior cooling solutions to these next-gen processors.

Ahead of IFA 2024, Qualcomm Technologies, Inc. announced the expansion of its Snapdragon X Series portfolio with the introduction of Snapdragon X Plus 8-core, a breakthrough platform that unleashes multiday battery life, unprecedented performance and AI-powered Copilot+ experiences to even more people.

The 8-core Qualcomm Oryon CPU powering this Snapdragon X Plus platform enables lightning-fast responsiveness and efficiency, delivering 61% faster CPU performance while competitor peak performance requires 179% more power. An integrated GPU and support for up to three external monitors ensures exceptional graphics and immersive visual experiences. At the heart of the Snapdragon X Plus 8-core is a powerful 45 TOPS NPU of AI processing power and leading performance per watt which, paired with the platform's significant advancements in connectivity, will push productivity to new heights in ultra-portable designs with incredible battery life. Whether creating presentations on-the-go or videoconferencing, the versatile functionality of this platform will enable transformative experiences.

Intel's 13th and 14th generation processors, codenamed "Raptor Lake" and "Raptor Lake Refresh," have been notoriously riddled with stability issues over the past few months, up until Intel shipped the 0x129 microcode update on August 10 to fix these issues. However, the upcoming Intel Core Ultra 200 "Arrow Lake" and 200V series "Lunar Lake" processors will not have these issues as the company confirmed that an all-new design is used, even for the segment of power regulation. The official company note states: "Intel confirms that its next generation of processors, codenamed Arrow Lake and Lunar Lake, are not affected by the Vmin Shift Instability issue due to the new architectures powering both product families. Intel will ensure future product families are protected against the Vmin Shift Instability issue as well."

Originally, Intel's analysis for 13th—and 14th-generation processors indicated that stability issues stemmed from excessive voltage during processor operation. These voltage increases led to degradation, raising the minimum voltage necessary for stable performance, which Intel refers to as "Vmin shift." Given that the design phase of new architectures lasts for years, Intel has surely anticipated that the old power delivery could yield problems, and the upcoming CPU generations are now exempt from these issues, bringing stability once again to Intel's platforms. When these new products launch, all eyes will be on the platform's performance, but with a massive interest in stability testing from enthusiasts.

Thermal Grizzly Holding GmbH presents the Intel Mycro Direct-Die RGB PRO V1, an optimized version of the Intel Mycro Direct-Die water cooler. In addition to a new design, the Pro version offers one thing above all: better cooling performance! Various changes to the microfin structure of the base plate, combined with a revised water flow, enable up to 6 degrees Celsius lower processor temperatures under full load.

The optimized cooling channel slot width on the surface of the Intel Mycro Direct-Die Pro RGB V1's copper base plate allows for 43 percent more cooling fins compared to the standard version. Additionally, a specially developed jet plate reduces the flow resistance of the cooler, enabling the Intel Mycro Direct-Die Pro RGB V1 to achieve a higher flow rate in liters per minute at the same pump speed as the Intel Mycro Direct-Die V1. This increased flow means that the pump can either be turned down to reduce noise or used to dissipate more waste heat at the same noise level.

Today, Efficient announced a strategic partnership with GlobalFoundries (GF) to bring to market a new high-performance computer processor that is up to 166x more energy-efficient than industry-standard embedded CPUs. Efficient is already working with select customers for early access and customer sampling by summer 2025. The official introduction of the category-creating processor will mark a new era in computing, free from restrictive energy limitations.

The partnership will combine Efficient's novel architecture and technology with GF's U.S.-based manufacturing, global reach and market expertise to enable a quantum leap in edge device capabilities and battery lifetime. Through this partnership, Efficient will provide the computing power to smarter, longer-lasting devices and applications across the Internet of Things, wearable and implantable health devices, space systems, and security and defense.

The zettascale era is officially on the map, as Japan has announced plans to develop a successor to its renowned Fugaku supercomputer. The Ministry of Education, Culture, Sports, Science and Technology (MEXT) has set its sights on creating a machine capable of unprecedented processing power, aiming for 50 ExaFLOPS of peak AI performance with zettascale capabilities. The ambitious "Fugaku Next" project, slated to begin development next year, will be headed by RIKEN, one of Japan's leading research institutions, in collaboration with tech giant Fujitsu. With a target completion date of 2030, the new supercomputer aims to surpass current technological boundaries, potentially becoming the world's fastest once again. MEXT's vision for the "Fugaku Next" includes groundbreaking specifications for each computational node.

The ministry anticipates peak performance of several hundred FP64 TFLOPS for double-precision computations, around 50 FP16 PFLOPS for AI-oriented half-precision calculations, and approximately 100 PFLOPS for AI-oriented 8-bit precision calculations. These figures represent a major leap from Fugaku's current capabilities. The project's initial funding is set at ¥4.2 billion ($29.06 million) for the first year, with total government investment expected to exceed ¥110 billion ($761 million). While the specific architecture remains undecided, MEXT suggests the use of CPUs with special-purpose accelerators or a CPU-GPU combination. The semiconductor node of choice will likely be a 1 nm node or even more advanced nodes available at the time, with advanced packaging also used. The supercomputer will also feature an advanced storage system to handle traditional HPC and AI workloads efficiently. We already have an insight into Monaka, Fujitsu's upcoming CPU design with 150 Armv9 cores. However, Fugaku Next will be powered by the Monaka Next design, which will likely be much more capable.