Starforge Systems, the leading pre-built PC manufacturer preferred by streamers, has released CPU upgrades to several of their top gaming PCs this week including the Explorer Pro, Explorer Elite, Voyager Pro and Voyager Elite. Through the latest upgrades, the Explorer Pro and Explorer Elite, the sleek wood-trimmed PC geared toward creatives and gamers, now features Intel Arrow Lake via Intel Core Ultra 7 265K on the Explorer Pro ($2,6949.99) and Intel Core Ultra 9 285K on the Explorer Elite ($4,699.99). With these upgrades, customers can expect added productivity performance, making these the perfect workstation PCs for those looking for a PC that can do it all.

Additionally, the Voyager Pro ($3,299.99) and Voyager Elite ($4,699.99) have been upgraded to include AMD's Ryzen 7 9800X3D CPU, bringing added productivity and gaming performance to the powerhouse PCs. Starforge Systems' Voyager line can be customized with a variety of case print bundle designs including the recently released Dragonlight case.

In an exclusive interview with Hot Hardware, Intel acknowledged that its recently launched Core Ultra 200 desktop processors, codenamed "Arrow Lake," have significant performance issues. However, Intel announced that a set of fixes are being developed. As our review confirmed, the launch of these new processors fell short of both consumer expectations and Intel's own projections, particularly in gaming performance, despite showing promise in productivity, content creation, and some AI workloads. In a discussion during a recent livestream, Intel's Robert Hallock, VP and general manager of client AI and technical marketing, addressed these concerns head-on, describing the Arrow Lake launch as "disastrous" and attributing the underwhelming performance to inadequately optimized systems.

Robert HallockI can't go into all the details yet, but we identified a series of multifactor issues at the OS level, at the BIOS level, and I will say that the performance we saw in reviews is not what we expected and not what we intended. The launch just didn't go as planned. That has been a humbling lesson for all of us, inspiring a fairly large response internally to get to the bottom of what happened and to fix it.

According to the market research firm Mercury Research, the desktop CPU market has witnessed a remarkable transformation, with AMD seizing a substantial 28.7% market share in Q3 of 2024—a giant leap since the launch of the original Zen architecture in 2017. This 5.7 percentage point surge from the previous quarter is a testament to the company's continuous innovation against the long-standing industry leader, Intel. Their year-over-year growth of nearly ten percentage points, fueled by the success of their Ryzen 7000 and 9000 series processors, starkly contrasts Intel's Raptor Lake processors, which encountered technical hurdles like stability issues. AMD's revenue share soared by 8.5 percentage points, indicating robust performance in premium processor segments. Intel, witnessing a decline in its desktop market share to 71.3%, attributes this shift to inventory adjustments rather than competitive pressure and still holds the majority.

AMD's success story extends beyond desktops, with the company claiming 22.3% of the laptop processor market and 24.2% of the server segment. A significant milestone was reached as AMD's data center division generated $3.549 billion in quarterly revenue, a new record for a company not even present in the data center in any considerable quantity just a decade ago. Stemming from strong EPYC processor sales to hyperscalers and cloud providers, along with Instinct MI300X for AI applications, AMD's acceleration of data center deployments is massive. Despite these shifts, Intel continues to hold its dominant position in client computing, with 76.1% of the overall PC market, held by its strong corporate relationships and extensive manufacturing infrastructure. OEM partners like Dell, HP, Lenovo, and others rely heavily on Intel for their CPU choice, equipping institutions like schools, universities, and government agencies.

Both pictures and videos of a partial teardown of Apple's recently launched Mac mini with the M4 SoC have appeared online courtesy of various Chinese sources. There are at least two interesting parts to these partial teardowns and they're related to storage and WiFi. On the storage front, Apple has moved away from having soldered NAND chips straight on the main PCB of the Mac mini, to instead having them on a custom PCB which is similar to M.2, but a custom Apple design. The PCB pictured contained a pair of 128 GB NAND chips and with the source of the teardown being from China, there's also a video showing a repair shop desoldering the two chips and replacing them with two 1 TB chips, or in other words, the SSD was upgraded from 256 GB to 2 TB.

The upgrade brought with it some extra performance as well, even if the write speed remained at a comparatively slow 2900 MB/s, the read speed went up from 2000 MB/s to 3300 MB/s which is a significant gain in performance. This is obviously not a consumer friendly upgrade path, but we'd expect to see third party upgrade options at some point in the future, assuming there's no black listing of third party storage modules. The NAND controller is still likely to be integrated into Apple's SoC, but the PCB that the NAND flash chips are mounted onto appears to have some kind of SPI flash on it as well, which might make third party upgrades a lot harder.

We are days away from the official November 7 launch of AMD's Ryzen 7 9800X3D CPU with 3D V-Cache, and we are already seeing some estimates of the speedup compared to the last-generation Ryzen 7 7800X3D CPU. According to a Geekbench submission discovered by Everest (Olrak29_) on X, the upcoming AMD Ryzen 7 9800X3D has been spotted running at a clock speed of 5.46 GHz. This is a 260 MHz increase from the official boost frequency of 5.2 GHz, which indicates overclocking has been applied. If readers recall, the last generations of X3D processors had overclocking disabled, and this time, things are looking different thanks to the compute die being placed on top of SRAM. AMD attributes this to CCD being closer to the heat spreader instead of memory and allowing it to spread heat more effectively, ensuring a stable overclock.

Regarding performance, the Ryzen 7 9800X3D outperforms its predecessor, the Ryzen 7 7800X3D, by an impressive 27.4% in the single-core Geekbench v6 test and 26.8% in the multicore test. The last generation CPU scored 2,726 points in single-core and 15,157 points in multicore tests, while the new Zen 5 design has managed to produce 3,473 points in single-core and 19,216 in multicore tests. These results are approximately 27% improvement over the Zen 4, suggesting that the Zen 5 architecture benefits greatly from better SRAM bandwidth and capacity. While these results only come from synthetic benchmarks, they give us a picture of what to expect from this CPU. We have to wait for more real-world test cases to fully conclude the improvement factor.

According to DigiTimes, NVIDIA is reportedly targeting the high-end segment for its first consumer CPU attempt. Slated to arrive in 2025, NVIDIA is partnering with MediaTek to break into the AI PC market, currently being popularized by Qualcomm, Intel, and AMD. With Microsoft and Qualcomm laying the foundation for Windows-on-Arm (WoA) development, NVIDIA plans to join and leverage its massive ecosystem of partners to design and deliver regular applications and games for its Arm-based processors. At the same time, NVIDIA is also scheduled to launch "Blackwell" GPUs for consumers, which could end up in these AI PCs with an Arm CPU at its core.

NVIDIA's partner, MediaTek, has recently launched a big core SoC for mobile called Dimensity 9400. NVIDIA could use something like that as a base for its SoC and add its Blackwell IP to the mix. This would be similar to what Apple is doing with its Apple Silicon and the recent M4 Max chip, which is apparently the fastest CPU in single-threaded and multithreaded workloads, as per recent Geekbench recordings. For NVIDIA, the company already has a team of CPU designers that delivered its Grace CPU to enterprise/server customers. Using off-the-shelf Arm Neoverse IP, the company's customers are acquiring systems with Grace CPUs as fast as they are produced. This puts a lot of hope into NVIDIA's upcoming AI PC, which could offer a selling point no other WoA device currently provides, and that is tried and tested gaming-grade GPU with AI accelerators.

Early benchmark results have revealed Apple's newest M4 Max processor as a serious competitor to Arm-based CPUs from Qualcomm and even the best of x86 from Intel and AMD. Recent Geekbench 6 tests conducted on the latest 16-inch MacBook Pro showcase considerable improvements over both its predecessor and rival chips from major competitors. The M4 Max achieved an impressive single-core score of 4,060 points and a multicore score of 26,675 points, marking significant advancements in processing capability. These results represent approximately 30% and 27% improvements in single-core and multicore performance, respectively, compared to the previous M3 Max. This is also much higher than something like Snapdragon X Elite, which tops out at twelve cores per SoC. When measured against x86 competitors, the M4 Max also demonstrates substantial advantages.

The chip outperforms Intel's Core Ultra 9 285K by 19% in single-core and 16% in multicore tests, surpassing AMD's Ryzen 9 9950X by 18% in single-core and 25% in multicore performance. Notably, these achievements come with significantly lower power consumption than traditional x86 processors. The flagship system-on-chip features a sophisticated 16-core CPU configuration, combining twelve performance and four efficiency cores. Additionally, it integrates 40 GPU cores and supports up to 128 GB of unified memory, shared between CPU and GPU operations. The new MacBook Pro line also introduces Thunderbolt 5 compatibility, enabling data transfer speeds up to 120 Gb/s. While the M4 Max presents an impressive response to the current market, we have yet to see its capabilities in real-world benchmarks, as these types of synthetic runs are only a part of the performance story that Apple has prepared. We need to see productivity, content creation, and even gaming benchmarks to fully crown it the king of performance. Below is a table comparing Geekbench v6 scores, courtesy of Tom's Hardware, and a random Snapdragon X Elite (X1E-00-1DE) run in top configuration.

Today, AMD unveiled new desktop computing products, delivering enhanced performance for gamers. The lineup features the new AMD Ryzen 7 9800X3D Desktop processor, based on the "Zen 5" architecture and utilizing 2nd Gen AMD 3D V-Cache technology.

With the AMD Ryzen 7 9800X3D processor, AMD has re-engineered its cutting-edge on-chip memory solution with 2nd Gen AMD 3D V-Cache technology. The 64 MB cache memory has been relocated below the processor, which puts the core complex die (CCD) closer to the cooling solution to help keep the "Zen 5" cores cooler, delivering high clock rates and providing up to an average 8% gaming performance improvement compared to our last-gen generation and up to an average 20% faster than the competition. This revolutionary change in placement allows for extreme overclocking of the processor. It's the first X3D processor to be fully unlocked, empowering enthusiasts and gamers to push its performance to new limits.

The launch of Intel's "Arrow Lake-S" Core Ultra 200S series of desktop processors has been a bit of a disappointment for gamers, given a slight regression in the new generation's gaming performance. While excelling in productivity tasks, these CPUs are not seemingly the top choice for gamers. According to data from Mindfactory, one of Germany's largest retailers, Intel's Arrow Lake CPUs didn't account for even one Intel-powered CPU sale since the October 24 launch. This is a massive contradiction to US-based retailers like Amazon and Newegg, which sold out their Arrow Lake stock swiftly. However, the German retailer paints a different picture.

In terms of units sold, there were 730 AMD CPU units sold, while only 40 Intel. AMD accounted for 94.81% of that week's sales, with an average selling price of 267 Euros and Intel's average selling price of 388 Euros per unit. It is worth pointing out that this information is only based on one week of sales and should not be a general guide for Intel Arrow Lake sales in Germany. We are still left to see how many units will be sold in the coming weeks, especially with the upcoming holiday season. Below is the picture from TechEpiphany on X, showing all the sold units and their quantity.

RISC-V is an industry standard instruction set architecture (ISA) born in UC Berkeley. RISC-V is the fifth iteration in the lineage of historic RISC processors. The core value of the RISC-V ISA is the freedom of usage it offers. Any organization can leverage the ISA to design the best possible core for their specific needs, with no regional restrictions or licensing costs. It attracts a massive ecosystem of developers and companies building systems using the RISC-V ISA. To support these efforts and grow the ecosystem, the brains behind RISC decided to form RISC-V International—a non-profit foundation that governs the ISA and guides the ecosystem.

We had the privilege of talking with Andrea Gallo, Vice President of Technology at RISC-V International. Andrea oversees the technological advancement of RISC-V, collaborating with vendors and institutions to overcome challenges and expand its global presence. Andrea's career in technology spans several influential roles at major companies. Before joining RISC-V International, he worked at Linaro, where he pioneered Arm data center engineering initiatives, later overseeing diverse technological sectors as Vice President of Segment Groups, and ultimately managing crucial business development activities as executive Vice President. During his earlier tenure as a Fellow at ST-Ericsson, he focused on smartphone and application processor technology, and at STMicroelectronics he optimized hardware-software architectures and established international development teams.

ASUS Republic of Gamers (ROG) today announced that new ROG Maximus Z890 Apex motherboards have been used to achieve 5 world records, 19 global first-place records and 31 first-place records. In the hands of some of the world's premier professional overclockers, the Maximus Z890 Apex has coaxed dazzling performance out of the latest Intel Core Ultra processor (Series 2) lineup and the latest high-performance memory kits.

Veterans of the overclocking scene will not be surprised to learn that these records were achieved with an Apex motherboard on the bench. This series has an undeniable pedigree. Since the very first model, ASUS has designed Apex motherboards for the singular purpose of helping the world's most talented overclockers shatter barriers on their way to new records.

Gigabyte, the world's leading computer brand, proudly announces that the AORUS Z890 series motherboards are now officially available for purchase. Designed to maximize the performance of the latest Intel Core Ultra processors, the groundbreaking D5 Bionic Corsa technology was introduced along with advanced thermal management and optimized power design on these boards. GIGABYTE's continuous partnership with HWiNFO further enhances the boards with real-time monitoring of CPU vCore power phase outputs and efficiency. With these powerful boards now on sale, users can enjoy unmatched performance and seamless customization, making them the ideal platform for enthusiasts and professionals.

D5 Bionic Corsa is the core technology for AORUS Z890 series motherboards, which leverages AI-enhanced innovations across software, hardware, and firmware to boost DDR5 memory speeds to an unprecedented 9500+ MT/s. The AI SNATCH Engine, powered by advanced AI overclocking models, optimizes configurations for DDR5 XMP memory and CPUs, enabling up to 20% faster speeds. With XMP AI BOOST and CPU AI BOOST, users can achieve world-class overclocking performance with just one click. The AI-driven PCB Design enhances signal integrity by reducing reflection by 28.2%, while HyperTune BIOS fine-tunes the Memory Reference Code (MRC) for peak performance. The VRM Thermal Balance mechanism ensures heat dissipation across the VRM with a heatpipe design, while optimized PWM firmware balances current output for superior stability.

Thermal Grizzly, a high-performance cooling solutions provider, unveils a new line-up of products specifically designed for Intel's LGA 1851 socket, the latest Intel Core Ultra 200 Arrow Lake CPUs. The product line consists of four new solutions tailored to the improvements of 15th generation CPUs, including a CPU contact frame, a direct die water block, a CPU delidding tool and a delidding heater. Today, three of these products are now officially launched and available for purchase on the Thermal Grizzly web shop and through its Partner Reseller Network.

Intel 1851 CPU Contact Frame V1
In addition to a new internal contour for the contact surface, the new Intel 1851 CPU Contact Frame V1 considers the position of the socket on the motherboard. The thermal hotspot has shifted with the Arrow Lake CPUs and is now located further north compared to its predecessor. With a slight shift of Socket 1851 compared to LGA1700, Intel has attempted to counter the hotspot shift. Thus, CPU coolers designed for Socket 1700 can also be used with Socket 1851. The shift in the socket makes previous contact frames for Socket 1700 incompatible with 1851, which is why Thermal Grizzly now offers the Intel 1851 Contact Frame V1.

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.

Corsair is excited to announce the launch of the Corsair NAUTILUS RS and NAUTILUS RS ARGB family of liquid CPU Coolers. These innovative coolers deliver high-performance CPU cooling with easy installation and outstanding compatibility with modern CPU sockets. The NAUTILUS RS family is available in black in both 240 mm and 360 mm sizes, while the NAUTILUS RS ARGB is available in both black and white in the same sizes, with added ARGB lighting to enhance your build.

GET COOLER WITH A NEW COLD PLATE
The NAUTILUS RS series features an efficient, low-noise pump and a slightly convex cold plate pre-applied with thermal paste in an optimized pattern, improving contact with the processor's integrated heat spreader for superior thermal transfer. Available in 240 mm or 360 mm radiator sizes and equipped with RS120 fans, NAUTILUS RS coolers effectively maintain optimal temperatures for high-end CPUs.

Details of what is claimed to be Google's upcoming Tensor G5 and G6 SoCs have popped up over on Notebookcheck.net and the site claims to have found the specs on a public platform, without going into any further details. Those that were betting on the Tensor G5—codenamed Laguna—delivering vastly improved performance over the Tensor G4, are likely to be disappointed, at least on the CPU side of things. As previous rumours have suggested, the chip is expected to be manufactured by TSMC, using its N3E process node, but the Tensor G5 will retain the single Arm Cortex-X4 core, although it will see a slight upgrade to five Cortex-A725 cores vs. the three Cortex-A720 cores of the Tensor G4. The G5 loses two Cortex-A520 cores in favour of the extra Cortex-A725 cores. The Cortex-X4 will also remain clocked at the same peak 3.1 GHz as that of the Tensor G4.

Interestingly it looks like Google will drop the Arm Mali GPU in favour of an Imagination Technologies DXT GPU, although the specs listed by Notebookcheck doesn't add up with any of the specs listed by Imagination Technologies. The G5 will continue to support 4x 16-bit LPDDR5 or LPDDR5X memory chips, but Google has added support for UFS 4.0 memory, something that's been a point of complaint for the Tensor G4. Other new additions is support for 10 Gbps USB 3.2 Gen 2 and PCI Express 4.0. Some improvements to the camera logic has also been made, with support for up to 200 Megapixel sensors or 108 Megapixels with zero shutter lag, but if Google will use such a camera or not is anyone's guess at this point in time.

The CHIEFTEC Iceberg is an all-in-one CPU cooler, featuring a 240 mm/360 mm water-cooling radiator and Snap-On interlocking (ARGB) PWM fans that ensure excellent heat dissipation. With fan speeds reaching up to 2200 rpm, it provides efficient cooling for a wide range of CPUs. The innovative parallel fin radiator design maximizes the contact area between water tubes and radiator fins, while maintaining a high surface area exposed to the cooling airflow, thereby enhancing overall thermal transfer and heat dissipation.

The Iceberg Series includes an infinity mirror ARGB cooling block and a 360-degree rotatable CHIEFTEC logo. Installation is hassle-free thanks to the robust braided steel tubing and the convenient mounting clip kit. The snap-on interlocking (ARGB) PWM fans minimize the number of cables ensuring an easy and clean build. The Iceberg Series is your trusted and reliable choice for pushing your CPU to maximum performance, while ensuring optimal thermals and noise levels.

At Snapdragon Summit, Qualcomm Technologies, Inc. unveiled the Snapdragon 8 Elite Mobile Platform, the most powerful and world's fastest mobile system-on-a-chip ever. Our flagship mobile platforms are now taking on the Elite name, showcasing the remarkable progress it represents for the industry. This platform debuts industry leading technologies such as the second generation custom-built Qualcomm Oryon CPU, Qualcomm Adreno GPU and enhanced Qualcomm Hexagon NPU, all of which deliver game changing performance improvements.

These innovations empower the Snapdragon 8 Elite to transform user experiences with their devices - making on-device multi-modal generative AI applications a reality on smartphones powered by Snapdragon. These technologies also fuel many other experiences across camera capabilities, with our most powerful AI-ISP, as well as next level gaming, super-fast web browsing and more.

AMD continues to expand the AM4 platform with new processors, despite having already released 145 AM4 SKUs over the past nine years. According to Videocardz, citing a post from @momomo_us on the X platform, AMD plans to launch two new ones: the Ryzen 5 5600T and 5600XT. The leak was later confirmed on ASUS and MSI websites, with these 6-core CPUs appearing on lists of supported motherboards. The MSI page confirms that (at least) the 5600T is a Vermeer processor without integrated graphics. Additionally, AMD intends to make the Ryzen 3 5300G available to consumers as a boxed retail product; until now, this model has been available exclusively for OEM markets since its launch in 2021.

Going into more detail, these new SKUs have the following specifications: The Ryzen 5 5600XT features a 6-core design, 32 MB L3 cache, 65 W TDP, and a base frequency of 3.8 GHz. The Ryzen 5 5600T also has a 6-core design, 32 MB L3 cache, and 65 W TDP, but with a lower base frequency of 3.5 GHz. The Ryzen 3 5300G comes with a 4-core design, 8 MB L3 cache, 65 W TDP, a base frequency of 4 GHz, and is equipped with 6CU scale core graphics (no information regarding turbo clocks for any of these SKUs yet). As mentioned, the current lineup for the AM4 platform includes 145 SKUs, with the Ryzen 5000 series alone already having 20 models. While AMD's dedication to supporting the AM4 platform is admirable, a simple question arises: who will buy or distinguish these new AM4 SKUs from such a vast offering?

Last week, we got a preview of Microsoft's Azure production-ready NVIDIA "Blackwell" GB200 system, showing that only a third of the rack that goes in the data center is actually holding the compute elements, with the other two-thirds holding the cooling compartment to cool down the immense heat output from tens of GB200 GPUs. Today, Google is showing off a part of its own infrastructure ahead of the Google Cloud App Dev & Infrastructure Summit, taking place on October 30, digitally as an event. Shown below are two racks standing side by side, connecting NVIDIA "Blackwell" GB200 NVL cards with the rest of the Google infrastructure. Unlike Microsoft Azure, Google Cloud uses a different data center design in its facilities.

There is one rack with power distribution units, networking switches, and cooling distribution units, all connected to the compute rack, which houses power supplies, GPUs, and CPU servers. Networking equipment is present, and it connects to Google's "global" data center network, which is Google's own data center fabric. We are not sure what is the fabric connection of choice between these racks; as for optimal performance, NVIDIA recommends InfiniBand (Mellanox acquisition). However, given that Google's infrastructure is set up differently, there may be Ethernet switches present. Interestingly, Google's design of GB200 racks differs from Azure's, as it uses additional rack space to distribute the coolant to its local heat exchangers, i.e., coolers. We are curious to see if Google releases more information on infrastructure, as it has been known as the infrastructure king because of its ability to scale and keep everything organized.

Yesterday, Arm has announced significant progress in its Total Design initiative. The program, launched a year ago, aims to accelerate the development of custom silicon for data centers by fostering collaboration among industry partners. The ecosystem has now grown to include nearly 30 participating companies, with recent additions such as Alcor Micro, Egis, PUF Security, and SEMIFIVE. A notable development is a partnership between Arm, Samsung Foundry, ADTechnology, and Rebellions to create an AI CPU chiplet platform. This collaboration aims to deliver a solution for cloud, HPC, and AI/ML workloads, combining Rebellions' AI accelerator with ADTechnology's compute chiplet, implemented using Samsung Foundry's 2 nm Gate-All-Around (GAA) FET technology. The platform is expected to offer significant efficiency gains for generative AI workloads, with estimates suggesting a 2-3x improvement over the standard CPU design for LLMs like Llama3.1 with 405 billion parameters.

Arm's approach emphasizes the importance of CPU compute in supporting the complete AI stack, including data pre-processing, orchestration, and advanced techniques like Retrieval-augmented Generation (RAG). The company's Compute Subsystems (CSS) are designed to address these requirements, providing a foundation for partners to build diverse chiplet solutions. Several companies, including Alcor Micro and Alphawave, have already announced plans to develop CSS-powered chiplets for various AI and high-performance computing applications. The initiative also focuses on software readiness, ensuring that major frameworks and operating systems are compatible with Arm-based systems. Recent efforts include the introduction of Arm Kleidi technology, which optimizes CPU-based inference for open-source projects like PyTorch and Llama.cpp. Notably, as Google claims, most AI workloads are being inferenced on CPUs, so creating the most efficient and most performant CPUs for AI makes a lot of sense.

Today, Lenovo announced its industry-leading ThinkSystem infrastructure solutions powered by AMD EPYC 9005 Series processors, as well as AMD Instinct MI325X accelerators. Backed by 225 of AMD's world-record performance benchmarks, the Lenovo ThinkSystem servers deliver an unparalleled combination of AMD technology-based performance and efficiency to tackle today's most demanding edge-to-cloud workloads, including AI training, inferencing and modeling.

"Lenovo is helping organizations of all sizes and across various industries achieve AI-powered business transformations," said Vlad Rozanovich, Senior Vice President, Lenovo Infrastructure Solutions Group. "Not only do we deliver unmatched performance, we offer the right mix of solutions to change the economics of AI and give customers faster time-to-value and improved total value of ownership."

AMD (NASDAQ: AMD) today announced the availability of the 5th Gen AMD EPYC processors, formerly codenamed "Turin," the world's best server CPU for enterprise, AI and cloud. Using the "Zen 5" core architecture, compatible with the broadly deployed SP5 platform and offering a broad range of core counts spanning from 8 to 192, the AMD EPYC 9005 Series processors extend the record-breaking performance and energy efficiency of the previous generations with the top of stack 192 core CPU delivering up to 2.7X the performance compared to the competition.

New to the AMD EPYC 9005 Series CPUs is the 64 core AMD EPYC 9575F, tailor made for GPU powered AI solutions that need the ultimate in host CPU capabilities. Boosting up to 5 GHz, compared to the 3.8 GHz processor of the competition, it provides up to 28% faster processing needed to keep GPUs fed with data for demanding AI workloads.

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, today announced the launch of its revolutionary Z890 motherboards. These next-generation motherboards are set to redefine the standards in performance, AI integration, and user experience for enthusiasts and professionals alike. Powered by state-of-the-art artificial intelligence, these motherboards push the boundaries of what's possible in computing.⁠

Infinite Memory Performance
GIGABYTE Z890 lineup equips the D5 Bionic Corsa technology to create phenomenal new peaks in memory performance to DDR5 XMP 9500 and above. A true marvel of AI-enhanced overclocking technology for DDR5 memory, D5 Bionic Corsa boasts four key technologies from software, hardware to firmware side. The AORUS AI SNATCH and AI SNATCH Engine present AI-overclocking for ultimate performance, while AI-Driven PCB Design and HyperTune BIOS deliver AI-design for signal enhancement on motherboards. The AORUS AI SNATCH is an auto-overclocking software by AI model, and enables users to unleash utmost performance with one-click activation. The AI SNATCH Engine is the AI model served as the core of AORUS AI SNATCH software, trained by AI TOP on diverse overclocking datasets to improve precision and optimize performance with stability. The AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups, while the Hypertune BIOS uses AI to optimize MRC and adapt to signals for peak efficiency, significant memory clock boost, and enhanced overall performance.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."