Monday, May 24th 2021
Intel LGA Socket 1700: Lower Height, New Hole Pattern Render Existing Cooling Solutions Incompatible
A few details have been let out on Intel's next socket, LGA 1700, which will be the one to accept next-gen Alder Lake CPUs. Apparently, Intel's LGA 1700 - which replaces the current LGA 1200 socket) will feature a lower height (by a full [1] millimeter, helping to further reduce socket load) as well as new mounting holes positions for cooling solutions. This would effectively render existing cooling solutions incompatible with Intel's next-gen CPUs - it will be up to your cooling solution provider to offer a new cooler bracket that's compatible with the new LGA 1700 socket. If the manufacturer doesn't, it's likely you'll have to get a newer cooling solution that actually ships with the required adapter.
It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.
Sources:
Igor's Lab, via Videocardz
It has also come to light that Intel's next-gen Alder Lake-S will eschew Intel's quadrangular design for their CPUs, and instead introduce a rectangular design that's 35.5×45.0 mm. An interesting approach that places these CPUs closer in design to Intel's HEDT platforms, but likely a necessary change due to the expected new Big-Little core design in Alder Lake-S. Current information out in the wild says that Intel will keep on offering boxed cooling solutions for < 65 W TDP CPUs, while higher-performance parts will still ship absent of it. Leaks place Intel as being working on developing a new Peltier-based cooling solution for socket LGA 1700 parts as well, after they partnered with Cooler Master for the MasterLiquid ML360 Sub-Zero cooler.
49 Comments on Intel LGA Socket 1700: Lower Height, New Hole Pattern Render Existing Cooling Solutions Incompatible
I can't come up with any pro's of having holes in a rectangular shape.MOTHERBOARD CLEARANCE. You're right, keep-out zone. When designing heatsinks, that space have to be treated like it's occupied with components, usually capacitors. Intel have made pics like that for ages.
Wow, Igor is really clueless here and really lets his imagination run wild, embarrassing. "Airtight cover", really? Has he never seen an Intel socket documentation before?
Have a look at the LGA 1156 below (the year 2009). The legend clearly shows different clearance for different areas, and they turned it into a 3D model, exactly like above.
Also, anyone complaining about Intel changing holes, I hear your pain, but come on, it's been TWELVE YEARS. Mounting hole standards usually stay for half that time.
Changing socket every year is a 1000 times worse.
Hopefully the whole thing is removable and proper cooling mounts can be used, such as the good old Secufirm2.
videocardz.com/newz/a-mockup-of-amd-zen4-raphael-am5-lga1718-package-has-been-leaked
Surely it would be more economical to leave the centre free where caps etc go.
Obviously who knows how close this is to the real thing or not.
I was more going with the overall shape, which is clearly too different to share a common cooler mount.
(See item D)
It is designed to prevent condensation. The software will try to keep the die temp above ambient by throttling the Peltier element, but the gasket-like seal (think the rubber side pleats on a hovercraft) is an additional measure. Igor is correct. The referenced baseplate illustration shows the lower assembly designed to snug up to the seal. Whether they actually intend for it to be mounted direct die, I don't know, but it's certainly possible.
Yeah well chip doesn't look bigger than 2066 socket to me just weird shape frankly just to be a pita but I'm sure the title is just wrong
Only thing incompatible is prior mounts not the entire cooling solutions it's just ghetto mount time lol
They are always changing things just so we have to spend more money.
There is no reason the old coolers won't work with the new processors.
And actually I think there is even a chance they could use the same mounting, as AMD has less of a problem with open source or using common standards then intel.Actually the CPU is longer, so it's possible that some coolers won't work properly.
And a longer socket makes sense, more space for the new DDR5 traces.
You can literally re-use a cooler from around 2010 on your consumer line 2021 CPU.
Intel does not sell coolers so why should they do it to make people spend money on cooling :laugh:
Did you also complain about AMD when AM3 coolers didnt work for AM4 CPU's? AM5 releases next year too, AM4 coolers won't work, I bet
But, worthless when CPU reaches %100 load, they were all inefficient. At idle, yes they provide 15 degrees around. But at load, they were passing 50 degrees and up. CPU's thermal output x 2 times the peltiers must have to cool! The coolers for this double times heat was really hard to fit in a case. Therefore, it is really being hard to cool a peltier system. Including that, the condensing is a real problem.
Instead of using this way, a water cooler with a weak & light peltiers may provide better performance. I mean, little 1 x 1 cm sized 4 units of peltiers around four different ways on water cooler radiator may provide better cooling, thus easy to cool, peltiers heat output by using a bit bigger fan on radiator....
My cooler (thermalright macho 120) has four long holes for :
-LGA1200 : 75x75 mm
-LGA2011 : 80x80 mm
The 78x78 mm of LGA1700 being in between, I'll just have to sand down the small separating bulges to be able to place a screw.
For the difference in height, I intend to put a small sheet of metal between the bracket and the cooler to push it further down.
I think many of the existing coolers will be adaptable with a bit tinkering.
i haven't assembled it yet but my asus board has holes for LGA-1200 => which is LGA-15xx comaptible so my backplane and the hole pattern fit 100% with not a single mm of size difference..
there are 8xhole around the cpu socket, only 4 are "new" style and they should fit too as some of the intel big coolers have the ability to move the screws diagonally,
only the backplate will be a problem.. i have a feeling that bending the board would be quite common with just 4 screws but that is none of my personal problem now
UPDATE:
Board is ASUS STRIX B660-F and CPU i5-12500 and cooler is ninja 3 rev. b from my old 3570k that is dead now :-/