Noctua announced in its Computex 2015 presentation that the company will give away adapters that let its CPU cooler models from as far as 2005 support Intel's upcoming socket LGA1151. The company will give away NM-115x retention module, which will let you install its CPU coolers on socket LGA1151 motherboards, which drive Intel's upcoming 6th generation Core "Skylake" processors. Products in Noctua's current product-stack already support LGA1151, as the socket features an identical mount-hole spacing to its predecessors, the LGA1150, LGA1155, and LGA1156. Those with older Noctua coolers that are upgrading from another socket (eg: LGA775 or LGA1366) should be able to write to Noctua with a few simple purchase details, and receive the adapter for free.

SilverStone is this week rolling out a new, super slim profile CPU cooler, the NT07-115X model part of the Nitrogon Series. The incoming cooler measures 90 (W) x 23 (H) x 90 (D) mm and features a copper base, extruded aluminum fins, and a 80 mm fan operating at 1200 to 3400 RPM (maximum sound output is 26 dBA).

The Nitrogon NT07-115X supports Intel Socket LGA1156/1155/1150 processors and can be found listed (pre-order) with a price tag of £14.83 (~ 24 USD).

DeepCool has just added a new CPU cooler to its product portfolio, a model known as IceEdge 400 E (Elite Edition) that supports Intel LGA1156/LGA1155/LGA1150/LGA775 and AMD FM2/FM1/AM3+/AM3/AM2+/AM2/940/939/754 processors with a TDP of up to 130 W.

Pictured below, DeepCool's creation measures 100 x 86 x 125.5 mm, it weighs 475 grams and features an aluminum heatsink, four direct touch copper heatpipes, and a 92 mm Hydro Bearing fan that operates at 2200 RPM and has a sound output of 26.3 dBA. The IceEdge 400 E's price tag was not announced.

After giving its Dark Knight SD1283 a pitch-black color-scheme with the Nighthawk Edition released last April, XIGMATEK announced availability of its polar opposite color scheme, the Frostbourne Edition. The aluminum-alloy fin tower-type heatsink's fins, three 8 mm-thick U-shaped heatpipes that make direct contact with the CPU, and the included fan, bear a matte white finish. The fins feature XIGMATEK's Stealth ceramic coating, which works to increase surface area for heat dissipation. The cooler is designed to handle TDP of up to 160W.

Measuring 120 x 50 x 159 mm (WxDxH) heatsink-only, and weighing 406 g, the Dark Knight SD1283 Frostbourne Edition includes an XOF-F1251 120 mm fan with 4-pin PWM connector. It spins in the range of 800 and 1,400 RPM, pushing up to 60 CFM of air, with a company rated noise output under 16 dBA. The cooler supports nearly all modern client CPU socket types, including Intel LGA2011, LGA1155/LGA1156, LGA775; AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. The Dark Knight SD1283 is expected to be priced around the $50 mark.

Korean PC cooling components maker Thermolab introduced LP53, a new low-profile CPU cooler. Measuring 100 x 94 x 53 mm (WxDxH), and weighing 410 g (owing to its material), the cooler is made of a dense copper fin stack that is arranged along the plane of the motherboard, to which heat drawn from a copper CPU base is conveyed by two 8 mm-thick copper heat pipes. The heatsink is ventilated by a 92 mm PWM-controlled fan, which spins at 1,000~2,000 RPM, with 16~27.1 dBA noise output. The cooler supports Intel LGA115x mount hole spacing, which makes it fit for LGA1156, LGA1155, and future LGA1150 socket types. It is priced around US $50.

EK-Supremacy Elite, the premium bundle containing the best CPU water block on the market and the best thermal interface on the market - the EK-TIM Indigo Xtreme - is now finally shipping. Please note that due to high demand this product may be shown as out of stock at the time of purchase. These water blocks are therefore manufactured on daily basis to ensure adequate supply and daily re-stock.

EK-Supremacy Elite is the premium bundle containing the best CPU water block on the market - the EK-Supremacy - Full Nickel - and the best thermal interface on the market - the EK-TIM Indigo Xtreme. EK-Supremacy is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in perfect performance every time. EK-Supremacy is truly the best product for performance seeking enthusiasts.

After a brief sighting at Computex 2012, we come across the Aeolus Big Frost dual-tower CPU cooler again. This time, the cooler appears polished and ready for market launch. The cooler is a simplified version of DeepCool's Assassin, retaining its dual aluminum fin tower design. The design consists of two symmetric aluminum fin stacks, through which six 6 mm-thick copper heat pipes pass, drawing heat from a copper CPU base. The fin-stack is then ventilated by two 120 mm fans in push-pull configuration.

The heatsink measures 126 x 136 x 159 mm, weighing 1,109 g (including fans). The fan pushing "fresh" air through the first fin stack is configured to spin at speeds of up to 1,300 RPM, with noise levels as high as 22.6 dBA, while the fan pulling air and conveying it to the second fin stack spins at speeds ranging in 900-1,500 RPM, with 21.4 to 32.1 dBA noise levels. The Big Frost supports a full range of CPU socket types available in the market today, including Intel LGA2011, LGA1155/LGA1156, LGA1366, LGA775, AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. In China, the cooler is expected to sell for 200 RMB (US $32).

Akasa also unveiled the third entry into its Venom series of CPU coolers, the Venom Medusa. This launch comes exactly an year after that of the Venom Voodoo. In the picture below, the Venom Medusa is shown between the original Venom, and Venom Voodoo. The Venom Medusa is a large aluminum fin dual-tower heatsink, with two symmetrical aluminum fin stacks. It is designed keeping in mind the thermal loads of the new LGA2011 processors.

Its design consists of a large base from which eight nickel-plated copper heat pipes pass, making direct contact with the CPU, and passing through the two aluminum fin stacks at ends. The Venom Medusa ships with two fans, a Viper 120 mm fan pushes fresh air through the first aluminum fin stack, while a larger 140 mm fan conveys air from the first stack to the second. There is provision for a third 120 mm fan, which pulls air from the second stack, for exhaust. The Venom Medusa supports nearly every modern CPU socket type, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3, and FM2/FM1.

GELID Solutions showed off its newest Gamer series Black Edition CPU Cooler (doesn't carry a GX## model number). The cooler's design consists of a dark aluminum fin dual-tower design à la NH-D14, Corator DS, etc., and uses no less than seven heat pipes (3x 8 mm-thick and 4x 6 mm-thick) to transport heat from the base to the aluminum fin stacks. In the space between the two fin-stacks, a standard-size 120 mm (25 mm-thick) fan pulls air through the first stack, and pushes it through the second one. Pushing in fresh-air through the first stack is care of a slim 120 mm (15 mm-thick) fan. The cooler will be designed to be compatible with all modern CPU socket types, including LGA2011, LGA1155/LGA1156, LGA1366, AM3+/AM3/AM2+/AM2, and FM2/FM1.

Streacom's newest duo of silent all-aluminum cases for HTPCs, the micro-ATX FC9, and the ATX FC10, inch closer to their Computex 2012 launch. Their specifications were leaked by the company's Chinese website. Both cases ensure the machines running in them stay quiet, and remain completely fanless, because their bodies double up as heatsinks for sensitive components, such as the processor. Both cases are made of brushed silver and black (sandblast finish) color options.

Measuring 348 x 289 x 100 mm (WxDxH), the Streacom FC9 supports motherboards in the micro-ATX and mini-ITX form-factors. It features one 2.5-inch drive bay, and a 3.5-inch bay, which supports 2.5-inch drives. It also has a bay for a slimline slot-loading optical drive. A CPU base makes contact with the processor (LGA775, LGA1155, LGA1156 supported), which conveys heat to a side panel via four copper heat pipes. All six panels of the case are made of thick aluminum sheets, some of which are ridged to increase surface area for heat dissipation. The case features three low-profile expansion slots.

First unveiled this January, Reeven's extreme-cooling pot (model: RECC-01) launched in various markets. In Japan, it is being marketed by Scythe. Measuring 70 x 70 x 160 mm (WxDxH), and weighing 900 g, the RECC-01 is a liquid nitrogen or dry-ice evaporator. Aluminum makes up most of its body, while nickel-plated copper makes up its base. Its base dissipation surface has 18 circular pits. An AEROFLEX polymer insulation sleeve is included. Also included are a retention module supporting Intel sockets LGA2011, LGA1155/LGA1156, LGA1366 and LGA775; and AMD sockets FM1/AM3+/AM3/AM2+/AM2; and a thermal probe port. It is priced at 19,980 JPY (US $242).

Titan Technology unveiled its latest Siberia CPU Cooler, the TTC-NC55TZ(RB). The cooler has an asymmetric aluminum fin tower design, which cools other hot components on the motherboard along with the CPU. The design consists of a nickel-plated copper base, from which five copper heat pipes pass. One end of these heat pipes pass through an aluminum fin stack that propagates along the plane of the motherboard, while the other passes though a stack that propagates perpendicular to this plane.

The stack that's along the plane of the motherboard is the larger of the two, and is ventilated by a 140 mm fan. The perpendicular stack is ventilated by a smaller 120 mm fan. The 140 mm fan spins at 700 ~ 1,800 RPM, pushing 34.78 ~ 89.43 CFM of air, with a noise output of 8.3 ~ 28.8 dBA. The 120 mm fan, on the other hand, spins at 800 ~ 2,200 RPM; pushing 24.23 ~ 66.2 CFM, with 15.0 ~ 35.0 dBA noise output. Both fans have 4-pin plugs and support PWM control. The heatsink itself measures 200 x 130 x 162 mm (WxDxH), weighing 755 g. All current sockets, including LGA2011, LGA1366, LGA1155/LGA1156, AM3+/AM3/AM2+/AM2, and FM1 are supported. It is priced at 6,980 JPY (US $91.6).

With Intel's third-generation Core processor family (codenamed: Ivy Bridge) on the horizon, the company is issuing product discontinuation notices to channel partners, and stopping production of as many as 25 desktop CPU models, spanning across various product lines. Intel notified partners to suspend supply of Core i5-661/660, Core i3-530, Pentium E5700 and Celeron E3500, it will cease production for these chips in the second quarter of 2012.

Moving on, production of several LGA1366, LGA1155 and LGA1156 Core i3/i5/i7 processors, including Core i7-960/950/930/870; Core i5-2300/680/670, and Pentium G960, will cease in Q2 2012. But before that, production of Core i7-875K, Core i7-860S, Core i5-760/750S/655K, and Celeron 450/430 will stop in Q1 2012. Apart from these, production of Core i7-880S/870S, Core Duo E7500/E7600, Pentium E6600/E550 and Celeron E3300 will stop in Q2 2012, sources revealed to industry observer DigiTimes.

"Visibly Smart" was the tagline with which Intel brought its 2nd Generation Core processor family codenamed "Sandy Bridge" into the market. What every Sandy Bridge chip in the LGA1155 package launched thus far has in common is its integrated graphics controller. Apparently, Intel is planning to launch three new Core i5 quad-core processors, which lack that integrated graphics. The processors very much will work on H61, H67, and Z68 chipset-based motherboards, only you can't use the integrated graphics, making them functionally-identical to first-generation LGA1156 Core i5 quad-core chips.

The Core i5-2550K, which has been talked about for the past few weeks, is one of these three models that will lack iGPU. This chip is geared for overclocking, as it features an unlocked base clock multiplier. The other two models are the Core i5-2450P, and Core i5-2380P. Intel is perhaps counting on the "P" marker to intuitively denote lack of iGPU, like with P67 chipset. Clocked at 3.10 GHz with a Turbo Boost speed of 3.40 GHz, the Core i5-2380P is clocked identically to the Core i5-2400, except of course it lacks the iGPU. The Core i5-2450P, on the other hand is a little unique, with a clock speed of 3.20 GHz and 3.50 GHz Turbo Boost speed. Pricing and availability are not known, though it is expected that some of these chips will be priced lower than existing models with iGPU.

Japanese company ASKTech introduced its latest ultra-compact, fan-less mini-ITX case, the NT-TX3000BK. Measuring 295 (W) x 270 (D) x 76 (H) mm, this case is designed for your living room shelf. It can hold mini-ITX motherboards that feature Intel LGA775 or LGA1155/LGA1156 sockets, specifically these sockets, because its bundled ZENO (zero-noise) fan-less CPU cooler. The sides of the case double up as a heatsink. Due to power supply limitations it only supports CPUs with TDP under 65W.

The ZENO cooler consists of a base with retention module, from it, two sets of heat pipes arise, that lead to the two sides of the case, where heat is dissipated to the air passively. The location of the base can be adjusted, as also the points where the heat pipes make contact with the sides of the case, so you don't have to worry about where the CPU socket of the board is located.

Since Ivy Bridge is still a few months away from release, Intel has decided to keep itself busy by sealing the fate of a bunch of older processors including the Core i7-930, i7-950, i7-960, i7-980 and i7-990X which are part of the LGA1366 platform, and the LGA1156-compatible Pentium G6950, G6960 and Core i3-540, i5-650, i5-660, i5-670, i5-680, i7-860 and i7-870.

These 45nm and 32nm CPUs are set to be available for further orders until June 29, 2012, and will continue to ship either until supplies are depleted (for the boxed versions) or until December 7th, 2012 (for the tray SKUs). As always, it's onwards and upwards.

The high-end CPU-Cooler from the newcomer PHANTEKS is available immediately at Caseking.de. This cooler with the name "TC14PE" already managed to receive numerous awards for its excellent performance. PHANTEKS employs multiple features to achieve such extraordinary results: a patented surface at the nano-level, twin tower design and two high-performance 140 mm fans. For the perfect looks to go with the installed hardware, the cooler is available in blue, orange red or silver.

The young company PHANTEKS has invested more than two years into the development of the TC14PE CPU coolers, as their goal was not simply to produce a good CPU cooler, but to lead the performance charts. Instead of focusing on the best heat dissipation of an open test bench, PHANTEKS has made sure that the TC14PE performs best in its intended setting - a closed system.

Japanese cooling expert Scythe announces the successor of Big Shuriken CPU Cooler. Big Shuriken 2 had to undergo further development on the heatsink and axial-fan side to provide better even performance and compatibility.

Applied improvements of heatsink are not obvious at first sight because main heatsink structure was inherited from Big Shuriken (1) CPU Cooler. Total amount of copper-heatpipes was increases from four to five pieces. Curved heatpipes are connecting the nickel-plated copper-base with the two upper layers of aluminum fins. Big Shuriken (1) was equipped with a solid heatsink on top of the copper-base which has been removed in the new version.

Intel is preparing to discontinue a couple of Core processors in the LGA1156 package, and a few older processors in the LGA775 package. These include the Core i5-661 and Core i3-530, two of the first Clarkdale dual-core processors, Pentium Dual-Core E5700, Celeron E3500 and E3400.

Intel will take orders for Core i5-661 and Core i3-530 till April 27, 2012, and will ship the last of them by October 5, 2012. Orders for Pentium E5700, Celeron E3500 and Celeron E3400 will be taken till December 30, 2011. While the last of the tray shipments will be completed by June 8th, 2012, boxed versions will ship till supplies are depleted in Intel's warehouses.

Back in August, it was reported that the retail packages of some, if not all, Intel's Sandy Bridge-E Core i7 LGA2011 processors will not pack the certified cooling solution like Core i7 LGA1366 processors do. It was also reported that Intel will sell its own-branded cooling solutions separately. It became a little obvious right then, that Intel won't selling dinky-little heatsinks that cost a couple of dozen Dollars. At the ongoing IDF event, Intel displayed its first retail-packaged cooling solution that's not only LGA2011-compatible, but also supports older socket types such as LGA1155, LGA1156, and LGA1366.

The cooling solution is a closed-loop (self-contained) liquid cooler made by water cooling OEM Asetek. Called the RTS2011LC, the cooler is rated to cool processors with TDP of up to 130W. The cooler consists of an exposed-copper block that also houses the pump, tough and flexible tubing that runs to the radiator assembly, which houses a reservoir, and a fancy-looking 120 mm fan. Along with the fan, the Intel logo on the block lights up blue. The radiator used looks similar to that on the Hydro Series H70, a popular cooler by Corsair, which is also made by Asetek. Expected to be available around the same time as Core i7 LGA2011 processors, the Intel RTS2011LC could command a price over $99.

Phanteks announced the launch of its Premier CPU cooler PH-TC14PE with patented C.P.S.C and P.A.T.S. technology. The PH-TC14PE will be available in four models, standard color and Blue/Red/Orange Edition

Phanteks coolers are designed with patented Cold Plasma Spraying Coating Technology (C.P.S.C), a brand new technologic forming deposit that displaces heat onto corresponding metals at a quicker rate. With this technology, Phanteks coolers enhances thermal conductivity on the soldered surfaces of the heatpipes through the copper deposits.

Thermal Solutions specialist GELID Solutions reveals the GX-7 CPU cooler of its GAMER product line. Engineers at GELID Solutions have created an outstanding new CPU cooler with 7 power heat pipes. Contrary to traditional heat pipe arrangement for this GAMER CPU cooler "GX-7", a special array of heat pipes was used to take full advantage of all 7 heat pipes heat transfer capacity. Further V-shaped aluminum fins were used in the center of the heat sink to allow airflow to reach the heat sink more evenly. Openings inside of the heat sink and near the heat pipes let fresh-air flows in from the top and the bottom to zones normally poorly ventilated, and eliminate the creation of hotspots. The unique heat sink shape supports dual fans.

Included in the GX-7 is the multi-award winning Wing 12 PL fan, allowing the cooler to reach remarkable temperature. The Wing 12 PL Blue features blue LEDs and unique Nanoflux bearing which ensures a friction-free and silent operation. Thanks to the clever design and magnetic bearing, the impeller can be detached for easy cleaning. Additionally, fan blade winglets were designed to achieve larger airflow and greater static pressure. The fan also includes a premium PWM control, so the temperature can be controlled precisely by the BIOS.

It is curtains for as many as 20 Intel processor models in H2 2011, according to a slide detailing the product lifecycle of Intel processors in the market. The 20 models will reach EOL (end of life) stage of their market-life. When a product is marked EOL, Intel stops taking orders for it from OEMs and channel vendors, clears outstanding orders, and stops its production. Intel will honor warranties on those products in accordance with its warranty policies.

Up for EOL are the socket LGA1366 Core i7-970, socket LGA1156 Core i7-880, Core i7-875K, Core i7-870S, Core i5-760, Core i5-750S, Core i5-655K, Core i3-530; and most socket LGA775 processor currently in the market. LGA775 models include Core 2 Quad Q9650, Q9550/Q9550S, Q9500, Q8400/Q8400S, Q8300; Core 2 Duo models E8600, E8500, and Pentium E5400. Several other products are marked PDN (product discontinuation notification), a stage that precedes EOL, which formally notifies OEMs and channel-vendors that they should place their last orders (and so they should choose quantities wisely).

GELID today announced a revision of its Tranquillo CPU cooler. Revision 2 of this aluminum fin tower-type cooler comes with three major changes, an updated heat pipe profile; a new AMD socket clip that allows 4x 90° installation; and an improved heatsink shape. To begin with, the four exposed-copper heat pipes project out of the fanned out better, with the heat pipes almost reaching the periphery of each of the fins. Next, a new AMD socket clip allows you to orient the heatsink in the same way you can with the square bolt layout of Intel sockets (90° in any direction). Lastly, in the space between the CPU base and the bottom of the aluminum fin stack, GELID put a larger heatsink than the one found on the original Tranquillo. The Tranquillo Rev. 2 is certified to work on Intel sockets LGA1366, LGA1156, LGA1155, and LGA775; AMD sockets AM3, AM2+, and AM2. The company did not give out pricing information, but usually revised SKUs carry the same market prices as the originals they're revisions of.

Prolimatech released a new variant of its iconic Megahalems CPU heatsink, called the Black Series Megahalems. With the same exact dimensions as the original at 130 x 158.7 x 74 mm (LxWxH), the new variant uses black colored aluminum fins. The coating doesn't make for a polished, glossy surface, but a grainy one, which increases surface area. The design remains the same: six nickel-plated copper heat pipes pass through a base, conveying heat to two aluminum fin stacks that are arranged along each arm of the U-shape the heat pipes make. The Black Series Megahalems is compatible with all the current CPU socket types, including AMD AM3+, AM3, AM2+, AM2; Intel LGA1155, LGA1156, LGA1366, and LGA775. The Prolimatech Megahalems Black Series is listed on Caseking.de for €54.90.