Japanese cooling expert Scythe presents two special editions of its CPU Cooler models Kotetsu Mark II and Choten as part of the ASUS TUF Gaming Alliance series. Both products bundle their unique advantages with the fancy design of the TUF Gaming Alliance series and gorgeous RGB illumination.

Scythe Kotetsu Mark II TUF Gaming Alliance Edition is based on the award-winning Kotetsu Mark II, offering outstanding performance even for overclocking purposes at impressively low noise levels. The Scythe Choten TUF Gaming Alliance on the other hand, aims for much more compact PC case environments while providing excellent balance between size, compatibility and performance.

The Core 2 Quad Q6600 quad-core processor is close to many a PC enthusiast's heart. It was the most popular quad-core processor by Intel in the pre-Nehalem LGA775 era, and continues to be found to this date on builds such as home-servers. Over a decade later, Intel's low-power Pentium Silver J5005 quad-core processor, which enthusiasts won't consider for anything, appears to have caught up with the Q6600. A CPU Passmark submission by a Redditor compares the J5005 with the Q6600, in which the latter is finally beaten. The J5005 scored 2,987 marks, compared to the Q6600's 2,959 marks. It's interesting to note here, that the J5005 is clocked at just 1.50 GHz, compared to the 2.40 GHz of the Q6600. Its TDP is rated at just 10W, compared to 95-105W of the Q6600.

Noctua announced in its Computex 2015 presentation that the company will give away adapters that let its CPU cooler models from as far as 2005 support Intel's upcoming socket LGA1151. The company will give away NM-115x retention module, which will let you install its CPU coolers on socket LGA1151 motherboards, which drive Intel's upcoming 6th generation Core "Skylake" processors. Products in Noctua's current product-stack already support LGA1151, as the socket features an identical mount-hole spacing to its predecessors, the LGA1150, LGA1155, and LGA1156. Those with older Noctua coolers that are upgrading from another socket (eg: LGA775 or LGA1366) should be able to write to Noctua with a few simple purchase details, and receive the adapter for free.

DeepCool has just added a new CPU cooler to its product portfolio, a model known as IceEdge 400 E (Elite Edition) that supports Intel LGA1156/LGA1155/LGA1150/LGA775 and AMD FM2/FM1/AM3+/AM3/AM2+/AM2/940/939/754 processors with a TDP of up to 130 W.

Pictured below, DeepCool's creation measures 100 x 86 x 125.5 mm, it weighs 475 grams and features an aluminum heatsink, four direct touch copper heatpipes, and a 92 mm Hydro Bearing fan that operates at 2200 RPM and has a sound output of 26.3 dBA. The IceEdge 400 E's price tag was not announced.

Reeven launched the RC-1401 large tower-type CPU cooler. Its design involves a conventional aluminum fin stack, to which heat is conducted by a combination of two 8 mm-thick, and three 6 mm-thick copper heat pipes. The 8 mm-thich ones spread out to the stack's periphery, while the 6 mm-thick ones to the central regions. The topmost fin is shrouded. These heat pipes draw heat from a nickel-plated copper base indirectly, which features a mirror finish.

A 140 mm fan ventilates the heatsink. One is included, although it supports a second one, for push-pull configurations. The included fan is a 25 mm-thick 140 mm spinner, which supports PWM control, and spins in the range of 300 to 1,300 RPM, pushing 27.2 to 70 CFM of air, with a noise output rated at 9.6 to 24.7 dBA. The RC-1401 measures 161 x 70 x 143 mm (HxWxD), weighing in at 820 g, excluding the fan. All modern CPU socket types are supported, including LGA115x, LGA2011, LGA775, AM3+/AM3/AM2+/AM2, and FM2/FM1. The company should begin shipping the cooler later this month.

Evercool announced the HPR 9225EA entry-level tower-type CPU cooler. It uses a stack of 43 aluminium fins, to which heat is conveyed by two 6 mm-thick copper heat pipes, which make direct contact with the CPU at the base. The stack is ventilated by a 92 mm fan that spins at speeds up to 2,200 RPM, pushing 35.6 CFM of air, with 26.3 dBA noise output. Measuring 97 x 73 x 118 mm (WxDxH), the cooler weighs about 400 g. It supports most modern CPU socket types, with the exception of LGA2011. Among the socket types supported are LGA115x, LGA775, AM3+/AM3/AM2+, and FM2/FM1. The company did not give out pricing information.

After giving its Dark Knight SD1283 a pitch-black color-scheme with the Nighthawk Edition released last April, XIGMATEK announced availability of its polar opposite color scheme, the Frostbourne Edition. The aluminum-alloy fin tower-type heatsink's fins, three 8 mm-thick U-shaped heatpipes that make direct contact with the CPU, and the included fan, bear a matte white finish. The fins feature XIGMATEK's Stealth ceramic coating, which works to increase surface area for heat dissipation. The cooler is designed to handle TDP of up to 160W.

Measuring 120 x 50 x 159 mm (WxDxH) heatsink-only, and weighing 406 g, the Dark Knight SD1283 Frostbourne Edition includes an XOF-F1251 120 mm fan with 4-pin PWM connector. It spins in the range of 800 and 1,400 RPM, pushing up to 60 CFM of air, with a company rated noise output under 16 dBA. The cooler supports nearly all modern client CPU socket types, including Intel LGA2011, LGA1155/LGA1156, LGA775; AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. The Dark Knight SD1283 is expected to be priced around the $50 mark.

Antec introduced V4 series design updates for its Kuhler H2O 620 and H2O 920 closed-loop CPU coolers. The new coolers are outfitted with a higher-pressure pump, and split-flow copper fin design in the radiators. The company claims the two innovations work to drop temperatures down a further 2-4°C, over temperatures previous versions achieve. Lastly, the coolers are labeled with guaranteed support for current and upcoming CPU socket types, including LGA2011, LGA115x, LGA775, FM2/FM1, and AM3+/AM3/AM2+. Prices remain unchanged.

Sapphire officially launched the Vapor-X CPU cooler it talked about at trade shows earlier this year. It uses a vapor-chamber plate to draw heat from the CPU, and convey it to four 7 mm-thick nickel-plated copper heat pipes, which then pass through a dense aluminum fin stack, that's ventilated by two 120 mm PWM controlled fans (replaceable) in push-pull configuration. Spinning at speeds ranging between 495 and 2,200 RPM, the fans push 77 CFM of air, each. Measuring 135 x 110.4 x 163.5 mm, the heatsink weighs about 925 g. Nearly every modern client CPU socket type is supported, including Intel sockets LGA2011, LGA115x, LGA775, and AMD sockets AM3+/AM3/AM2+/AM2, and FM2/FM1. Expect a sub-$80 price.

The processor-motherboard combination as PC enthusiasts know it could end, with Intel LGA1150 processors under the "Haswell" micro-architecture, likely to becoming the last client processors to ship in the retail channel (processor-in-box). Future Intel client processors, codenamed "Broadwell" could ship only in BGA (ball-grid array) packages, with existing motherboard vendors selling their products with processors permanently soldered onto them. The information comes from Japanese PC Watch, which cites sources in the PC industry.

With a compacted socket-processor launch cycle that spans nearly 2 years under the company's "tick-tock" product strategy, the scope for processor updates in the client computing industry might be lower than what it was in the LGA775 days. Perhaps statistics at Intel don't show a sizable proportion of people upgrading processors on existing motherboards, or upgrading motherboards while retaining the processor, rather buying a combination of the two, not to mention the fact that pre-built PCs outsell DIY assembled ones in major markets. With the processor being "tied" to the motherboard, Intel gets room to compact the platform further, combining processor and core logic completely into a single package. It's likely that Intel could still leave processor interchangeability to its HEDT (high-end desktop) platform, which sees processors start at $300, and motherboards at $200.

Cooler Master's new line of liquid CPU coolers include the Seidon 120M. The self contained (closed-loop) cooler combines a 150.3 x 118 x 27 mm aluminum fin radiator with a copper micro-channel block. The radiator and block+pump unit are factory fitted with flexible tubes. The radiator makes use of a 120 mm 600~2400 RPM PWM-controlled fan with 19~40 dBA noise output. The pump, on the other hand, can be as loud as 17 dBA. The cooler will include retention modules for all popular CPU socket types, including AMD AM3+/AM3/AM2+/AM2, FM2/FM1, Intel LGA1155/1156, LGA2011, LGA1366, and LGA775. Pricing and availability information is not available.

After a brief sighting at Computex 2012, we come across the Aeolus Big Frost dual-tower CPU cooler again. This time, the cooler appears polished and ready for market launch. The cooler is a simplified version of DeepCool's Assassin, retaining its dual aluminum fin tower design. The design consists of two symmetric aluminum fin stacks, through which six 6 mm-thick copper heat pipes pass, drawing heat from a copper CPU base. The fin-stack is then ventilated by two 120 mm fans in push-pull configuration.

The heatsink measures 126 x 136 x 159 mm, weighing 1,109 g (including fans). The fan pushing "fresh" air through the first fin stack is configured to spin at speeds of up to 1,300 RPM, with noise levels as high as 22.6 dBA, while the fan pulling air and conveying it to the second fin stack spins at speeds ranging in 900-1,500 RPM, with 21.4 to 32.1 dBA noise levels. The Big Frost supports a full range of CPU socket types available in the market today, including Intel LGA2011, LGA1155/LGA1156, LGA1366, LGA775, AMD AM3+/AM3/AM2+/AM2, and FM2/FM1. In China, the cooler is expected to sell for 200 RMB (US $32).

Streacom's newest duo of silent all-aluminum cases for HTPCs, the micro-ATX FC9, and the ATX FC10, inch closer to their Computex 2012 launch. Their specifications were leaked by the company's Chinese website. Both cases ensure the machines running in them stay quiet, and remain completely fanless, because their bodies double up as heatsinks for sensitive components, such as the processor. Both cases are made of brushed silver and black (sandblast finish) color options.

Measuring 348 x 289 x 100 mm (WxDxH), the Streacom FC9 supports motherboards in the micro-ATX and mini-ITX form-factors. It features one 2.5-inch drive bay, and a 3.5-inch bay, which supports 2.5-inch drives. It also has a bay for a slimline slot-loading optical drive. A CPU base makes contact with the processor (LGA775, LGA1155, LGA1156 supported), which conveys heat to a side panel via four copper heat pipes. All six panels of the case are made of thick aluminum sheets, some of which are ridged to increase surface area for heat dissipation. The case features three low-profile expansion slots.

First unveiled this January, Reeven's extreme-cooling pot (model: RECC-01) launched in various markets. In Japan, it is being marketed by Scythe. Measuring 70 x 70 x 160 mm (WxDxH), and weighing 900 g, the RECC-01 is a liquid nitrogen or dry-ice evaporator. Aluminum makes up most of its body, while nickel-plated copper makes up its base. Its base dissipation surface has 18 circular pits. An AEROFLEX polymer insulation sleeve is included. Also included are a retention module supporting Intel sockets LGA2011, LGA1155/LGA1156, LGA1366 and LGA775; and AMD sockets FM1/AM3+/AM3/AM2+/AM2; and a thermal probe port. It is priced at 19,980 JPY (US $242).

Japanese cooling expert Scythe announcing a new revision of the Top-Flow CPU cooler Grand Kama Cross. New Rev. B of the x-shaped cooler comes with reliable quality and performance for the same price as prior version. Main improvement is the compatibility to the new enthusiast socket LGA2011 from Intel. Furthermore Socket compatibility list includes latest Intel socket LGA1155, LGA1156, LGA775, LGA1366 as well as AMD socket 754, 939, 940, AM2, AM2+, AM3, AM3+ and FM1.

Well-proven Top-Flow design of grand Kama Cross Rev. B utilizes the created airflow to additionally cool surrounding components on the motherboard. Curved aluminum fin structure deflects the airflow, which has a positive influence on temperatures of Voltage regulator modules, chipset and RAM. Efficient airflow is achieved by the pre-assembled 140 mm axial fan. Scythe Slip Stream 140 PWM fan comes with PWN support and allows stepless fan speed adjustments from 500 to 1.300 RPM.

Enermax showed off the ELC-120, one of its first closed-loop (self-contained) CPU liquid coolers. While the cooler looks very similar to several other products in its class, Enermax claims to have dropped in some innovations of its own, such as a unique copper micro-channel base, which improves heat dissipation to the coolant, a powerful ceramic bearing pump for higher coolant flow, and Enermax' very own 120 mm Twister Bearing fan, that's silent, and comes with a very long life. The ELC-120 supports all current CPU socket types, Intel LGA775-thru-LGA2011, and AMD AM2-thru-FM1.

The market for socket LGA775 is still far from dead as there are large inventories of cheap Core 2, Pentium, and Celeron chips left in the market, as well as buyers upgrading their DDR2 systems to those with DDR3, to benefit from the DDR3 fire sale. Gigabyte introduced a new revision of its GA-EG41MFT-US2H, revision 1.4, with an updated gigabit Ethernet chip. The micro-ATX motherboard uses 3+1 phase VRM to power the processor, a wide range of Core 2 Duo and Core 2 Quad processors are supported. The processor is wired to Intel's G41 northbridge. Surprisingly, its graphics controller gives out an HDMI connection apart from DVI and D-Sub. It is wired to four DDR3 DIMM slots, supporting up to 8 GB of memory.

Expansion slots include two PCI, one each of PCI-Express 1.1 x16 and PCIe x1. The ICH7 southbridge drives four SATA 3 Gb/s ports, and an IDE connector. The gigabit ethernet controller has been updated to RTL8111E, from the 8111D found on the older revision. Other features include 8-channel HD audio, Firewire, FDC, COM, and a number of USB 2.0 ports. Expect a sub-$100 pricing for this board.

Japanese company ASKTech introduced its latest ultra-compact, fan-less mini-ITX case, the NT-TX3000BK. Measuring 295 (W) x 270 (D) x 76 (H) mm, this case is designed for your living room shelf. It can hold mini-ITX motherboards that feature Intel LGA775 or LGA1155/LGA1156 sockets, specifically these sockets, because its bundled ZENO (zero-noise) fan-less CPU cooler. The sides of the case double up as a heatsink. Due to power supply limitations it only supports CPUs with TDP under 65W.

The ZENO cooler consists of a base with retention module, from it, two sets of heat pipes arise, that lead to the two sides of the case, where heat is dissipated to the air passively. The location of the base can be adjusted, as also the points where the heat pipes make contact with the sides of the case, so you don't have to worry about where the CPU socket of the board is located.

Zalman took its first dip into water cooling after a while, with the CNPS20LQ, a self-contained (closed loop) CPU cooler. Designed and made originally by Asetek, a well-established brand name in OEM water cooling solutions, the CNPS20LQ uses a single-fan (dual-fan capable) radiator design. Its radiator measures 120 (W) x 158 (L) x 25 (H) mm. The radiator houses a small reservoir. The block houses a pump, which draws power from standard 4-pin CPU power header, and supports PWM control. The two are connected by flexible tubing. The block features a copper base with pre-applied thermal interface material. The CNPS20LQ supports all current socket types, including Intel LGA2011, LGA1155/1156, LGA1366, LGA775; AMD AM3+, FM1, and AM3/AM2+/AM2. It is priced at €69.90.

Intel is preparing to discontinue a couple of Core processors in the LGA1156 package, and a few older processors in the LGA775 package. These include the Core i5-661 and Core i3-530, two of the first Clarkdale dual-core processors, Pentium Dual-Core E5700, Celeron E3500 and E3400.

Intel will take orders for Core i5-661 and Core i3-530 till April 27, 2012, and will ship the last of them by October 5, 2012. Orders for Pentium E5700, Celeron E3500 and Celeron E3400 will be taken till December 30, 2011. While the last of the tray shipments will be completed by June 8th, 2012, boxed versions will ship till supplies are depleted in Intel's warehouses.

Phanteks announced the launch of its Premier CPU cooler PH-TC14PE with patented C.P.S.C and P.A.T.S. technology. The PH-TC14PE will be available in four models, standard color and Blue/Red/Orange Edition

Phanteks coolers are designed with patented Cold Plasma Spraying Coating Technology (C.P.S.C), a brand new technologic forming deposit that displaces heat onto corresponding metals at a quicker rate. With this technology, Phanteks coolers enhances thermal conductivity on the soldered surfaces of the heatpipes through the copper deposits.

Thermal Solutions specialist GELID Solutions reveals the GX-7 CPU cooler of its GAMER product line. Engineers at GELID Solutions have created an outstanding new CPU cooler with 7 power heat pipes. Contrary to traditional heat pipe arrangement for this GAMER CPU cooler "GX-7", a special array of heat pipes was used to take full advantage of all 7 heat pipes heat transfer capacity. Further V-shaped aluminum fins were used in the center of the heat sink to allow airflow to reach the heat sink more evenly. Openings inside of the heat sink and near the heat pipes let fresh-air flows in from the top and the bottom to zones normally poorly ventilated, and eliminate the creation of hotspots. The unique heat sink shape supports dual fans.

Included in the GX-7 is the multi-award winning Wing 12 PL fan, allowing the cooler to reach remarkable temperature. The Wing 12 PL Blue features blue LEDs and unique Nanoflux bearing which ensures a friction-free and silent operation. Thanks to the clever design and magnetic bearing, the impeller can be detached for easy cleaning. Additionally, fan blade winglets were designed to achieve larger airflow and greater static pressure. The fan also includes a premium PWM control, so the temperature can be controlled precisely by the BIOS.

It is curtains for as many as 20 Intel processor models in H2 2011, according to a slide detailing the product lifecycle of Intel processors in the market. The 20 models will reach EOL (end of life) stage of their market-life. When a product is marked EOL, Intel stops taking orders for it from OEMs and channel vendors, clears outstanding orders, and stops its production. Intel will honor warranties on those products in accordance with its warranty policies.

Up for EOL are the socket LGA1366 Core i7-970, socket LGA1156 Core i7-880, Core i7-875K, Core i7-870S, Core i5-760, Core i5-750S, Core i5-655K, Core i3-530; and most socket LGA775 processor currently in the market. LGA775 models include Core 2 Quad Q9650, Q9550/Q9550S, Q9500, Q8400/Q8400S, Q8300; Core 2 Duo models E8600, E8500, and Pentium E5400. Several other products are marked PDN (product discontinuation notification), a stage that precedes EOL, which formally notifies OEMs and channel-vendors that they should place their last orders (and so they should choose quantities wisely).

GELID today announced a revision of its Tranquillo CPU cooler. Revision 2 of this aluminum fin tower-type cooler comes with three major changes, an updated heat pipe profile; a new AMD socket clip that allows 4x 90° installation; and an improved heatsink shape. To begin with, the four exposed-copper heat pipes project out of the fanned out better, with the heat pipes almost reaching the periphery of each of the fins. Next, a new AMD socket clip allows you to orient the heatsink in the same way you can with the square bolt layout of Intel sockets (90° in any direction). Lastly, in the space between the CPU base and the bottom of the aluminum fin stack, GELID put a larger heatsink than the one found on the original Tranquillo. The Tranquillo Rev. 2 is certified to work on Intel sockets LGA1366, LGA1156, LGA1155, and LGA775; AMD sockets AM3, AM2+, and AM2. The company did not give out pricing information, but usually revised SKUs carry the same market prices as the originals they're revisions of.

Prolimatech released a new variant of its iconic Megahalems CPU heatsink, called the Black Series Megahalems. With the same exact dimensions as the original at 130 x 158.7 x 74 mm (LxWxH), the new variant uses black colored aluminum fins. The coating doesn't make for a polished, glossy surface, but a grainy one, which increases surface area. The design remains the same: six nickel-plated copper heat pipes pass through a base, conveying heat to two aluminum fin stacks that are arranged along each arm of the U-shape the heat pipes make. The Black Series Megahalems is compatible with all the current CPU socket types, including AMD AM3+, AM3, AM2+, AM2; Intel LGA1155, LGA1156, LGA1366, and LGA775. The Prolimatech Megahalems Black Series is listed on Caseking.de for €54.90.