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Soundpeats Announces Capsule3 Pro+ TWS Headphones Powered by xMEMS Technology

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world's leading all-silicon micro speakers, today announced collaboration with SOUNDPEATS to equip its all-new Capsule3 Pro+ TWS earbuds with its Cowell micro speaker. Cowell is the world's smallest full-range, all-silicon, solid-state speaker that delivers precise, high-fidelity, high-resolution audio, phase consistency, and high-frequency extension.
Capsule3 Pro+ are the first product from SOUNDPEATS to leverage xMEMS' solid-state micro speakers, and, as a result, excel in sound quality and elevate the user listening experience.

The Capsule3 Pro+ TWS earbuds use xMEMS' Cowell as the tweeter for exceptional high-frequency response and a 12 mm dynamic driver for mid-bass production. With the dual speakers working in tandem, the earbuds deliver well-balanced sound with both powerful bass and pristine high-frequency details - that overcome the typical sound quality limitations of TWS earbuds. Consumers can also expect a more comfortable and ergonomic fit with the Capsule3 Pro+ TWS earbuds due to the integration of xMEMS' compact hardware.

AMPACS Announces Industry's First 2-Way Over-Ear Headphone Reference Design based on xMEMS' MEMS Speakers

Furthering the integration of solid-state micro speakers in over-the-ear headphones, AMPACS, a global leader in electroacoustic product design, today announced a turnkey 2-way headphone solution designed in collaboration with MEMS audio and semiconductor pioneer xMEMS Labs. Pre-production prototypes are ready now, and the production-ready solution will be available in September.

The design leverages xMEMS' Cowell, the world's smallest solid-state micro speaker, for precisely rendered highs and mids, and AMPACS' dynamic driver providing deep, satisfying bass. The result is a ready-made, modular solution that headphone manufacturers can plug into virtually any headphone design, including open-back, closed-back, wired, and wireless, for next-level gaming and music listening experiences.

Sound from Ultrasound: Audio Pioneer xMEMS' New Silicon Speaker Reinvents How Humans Experience Sound

xMEMS Labs, pioneers in solid-state, all-silicon micro speakers, today announced a revolutionary breakthrough in sound reproduction, changing the way mass-market, true wireless stereo (TWS) earbuds create ultra high-quality, high-resolution sound experiences across all audio frequencies.

With the introduction of its groundbreaking new Cypress solid-state MEMS speaker, xMEMS engineers have replaced legacy push-air sound reproduction with the company's ultrasonic amplitude modulation transduction principle. Ultrasonic modulation turns ultrasonic air pulses into rich, detailed, bass-heavy, high-fidelity sound, representing the first no-compromise alternative to the moving-coil concept for high-volume consumer active noise canceling (ANC) earbud micro speakers.

Creative Announces the Aurvana Ace Series with xMEMS Based Drivers

Creative Technology today announced the release of the much-anticipated Creative Aurvana Ace and Creative Aurvana Ace 2, the latest true wireless earbuds featuring the groundbreaking solid-state, all-silicon MEMS-based drivers. The Creative Aurvana Ace series, powered by xMEMS drivers, has been expertly tuned to deliver remarkable audio clarity with a wider frequency response ranging from 5 Hz to 40 KHz. With this comprehensive range, users will get to enjoy a truly immersive and lifelike audio experience, whether it's for music, movies, or conference calls.

These latest wireless earbuds also feature LE Audio with LC3 codec, Bluetooth 5.3, and Hybrid Active Noise Cancellation (ANC) plus Ambient Mode, along with up to 24 hours of total playtime, making them the definitive choice for audio enthusiasts seeking the very best in true wireless earbuds.

ASML to Add 600 DUV Machines to China's Semiconductor Manufacturing Capacity by 2025

Thanks to the TMTPost interview with the Global Vice President and China President of ASML, Shen Bo, the Dutch semiconductor equipment manufacturer has revealed that around 1,400 of its deep ultraviolet (DUV) lithography and metrology machines are currently installed in China. The company is expected to achieve a global output of 600 DUV equipment units by the end of 2025. Shen Bo stated that the company aims to install 500-600 units of DUV machinery in China by late 2025 or early 2026. The growth in ASML's Chinese revenues was notably high, with China contributing 46% of the company's system sales in 3Q 2023, representing an 82% revenue increase from the previous quarter.

China plans to build 25 12-inch wafer fabs in the next five years, covering logic wafers, DRAM, and MEMS production. ASML currently has a substantial presence in China, with 16 offices, 12 warehouses, distribution centers, development centers, training centers, and maintenance centers. The company employs over 1,600 people for its China operations. Despite the export restrictions imposed by the US government, ASML anticipates that the new measures will have little impact on its financial outlook for 2023 as it strives to meet the growing demand for semiconductor manufacturing equipment in the global market.

Technics Expands its Portfolio of Next Generation TWS Earbuds with the EAH-AZ40M2

Today, Technics announced the launch of its new compact and lightweight earbuds, the EAH-AZ40M2. Joining the recently released EAH-AZ80 and EAH-AZ60M2, the EAH-AZ40M2 complete the brand's True Wireless portfolio, offering superb sound quality with the addition of Active Noise Cancelling Technology and unparalleled comfort for home, work and travel.

Technics tapped into its deep expertise as the legendary audio brand known for making pure sound quality to deliver its next generation of earbuds. Its engineers focused on every aspect of sound - drivers, acoustics, mechanical structure, and digital signal processing - to ensure you can hear every song or phone call with the clearest clarity. Offering the ability to shift from music to active noise-cancelling without interruption, seamless switching between up to three devices with industry-first Bluetooth Multipoint Connection, and a variety of customization settings, these new earbuds seamlessly integrate into any on-the-go lifestyle.

ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors

The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK's National Semiconductor Strategy. Dr. Shih-Chieh Chang, General Director of Electronic and Optoelectronic System Research Laboratories at the Industrial Technology Research Institute (ITRI) of Taiwan had an initial exchange with DSIT. During the exchange, Dr. Chang suggested that Taiwan can become a trustable partner for the UK and that the partnership can leverage collective strengths to create mutually beneficial developments. According to the Strategy, the British government plans to invest 1 billion pounds over the next decade to support the semiconductor industry. This funding will improve access to infrastructure, power more research and development and facilitate greater international cooperation.

Dr. Chang stressed that ITRI looks forward to more collaboration with the UK on semiconductors to enhance the resilience of the supply chain. While the UK possesses cutting-edge capabilities in semiconductor IP design and compound semiconductor technology, ITRI has extensive expertise in semiconductor technology R&D and trial production. As a result, ITRI is well-positioned to offer consultation services for advanced packaging pilot lines, facilitate pre-production evaluation, and link British semiconductor IP design companies with Taiwan's semiconductor industry chain. "The expansion of British manufacturers' service capacity in Taiwan would create a mutually beneficial outcome for both Taiwan and the UK," said Dr. Chang.

Technics Launches New ANC TWS Earbuds with Multipoint Support

Earbuds have become an indispensable part our lives. We are using wireless earbuds at different times of the day and for different things - for good noise-cancellation on the commute; as reliable microphones for meetings; and to deliver sweat-resistant, effective sound when working out. As Technics set out to design its next generation of true wireless headphones, an emphasis was put on creating earbuds that work well for all lifestyle needs, that remain comfortable to wear all day, and that avoid the need to switch between different headphones or sacrifice sound quality, comfort, or features.

The new EAH-AZ80 and EAH-AZ60M2 models allow you to freely enjoy impeccable sound quality and express your personal style. When designing the new earbuds, Technics used its expertise as the legendary audio brand to make the sound quality pure, focusing on every aspect of sound - driver, acoustic structure, mechanical structure, and digital signal processing - so you can hear every detail.

Minisforum MC560 Mini-PC with Integrated Projector Goes on Sale

Minisforum announced its first Mars series mini PC MC560 last December, and today it is finally going on sale. Unlike previous versions, the MC560 upgrades the CPU from Ryzen 5 5600U to Ryzen 5 5625U. It has 6 cores and 12 threads and is based on the Zen 3 architecture. The based clock is 2.30 GHz and can be boosted up to 4.30 GHz. The chip is manufactured on the 7 nm TSMC process. The MC560 is different from other mini PCs. It is an all-in-one conference mini PC that combines feature of computer, camera, mic and speakerphone all together to reduce wasted space and cross cabling by taking off unnecessary devices.

It has a 2.5K webcam with HDR support and a 93.8-degree field of view. The adjustable base offers 10°tilt change to the view. With the help of 4 Ω/3 W dual independent speaker design, the maximum sound distortion does not exceed 5%, reflecting authentic human voice. The microphone uses the MEMS dual array with an independent DSP chip for assistance. Combined with the AI intelligence algorithm, it can not only suppress the reverberation, intelligently recognize human voice, but also eliminate environmental noise, thereby accurately restoring human voice.

Global 200mm Semiconductor Fab Capacity Projected to Surge 20% to Record High by 2025

Semiconductor manufacturers worldwide are estimated to increase 200 mm fab capacity 20% from 2021 through 2025, adding 13 new 200 mm lines as the industry reaches a record high of more than 7 million wafers per month (wpm), SEMI announced today in its 200 mm Fab Outlook to 2025 report. Surging demand for automotive and other applications are driving the capacity expansion for power semiconductors and MEMS.

Chipmakers including ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics have announced new 200 mm fabs to meet growing demand.The SEMI 200 mm Fab Outlook to 2025 report shows fab capacity for automotive and power semiconductors growing at a rate of 58% from 2021 to 2025, followed by MEMS at 21%, foundry at 20% and analog at 14%.

USound is Leading the New Wave of Smaller and Smarter Earbuds With Its Ultra-compact Audio Module

USound, the leading provider of micro-electro-mechanical systems (MEMS) loudspeakers for hearables and wearables, announces the release of an audio module designed to enhance the performance of TWS and OTC hearing aids. The module design uses physical frequency crossover technology, with finished parts of acoustic design including sound chamber and pipes. This module is a ready-to-use solution for hearing aids and true wireless earbuds. Manufacturers can easily integrate the module in earphones by changing the venting volume to achieve a different sound experience.

The audio module is available in two versions: a two-way audio system and a full-range ultra-compact audio module. The two-way audio system includes a USound's MEMS speaker from the Conamara series as a tweeter and an electrodynamic speaker as a woofer. This combination allows for increased playtime, better sound quality, and performance.
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