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Micron Innovates From the Data Center to the Edge With NVIDIA

Secular growth of AI is built on the foundation of high-performance, high-bandwidth memory solutions. These high-performing memory solutions are critical to unlock the capabilities of GPUs and processors. Micron Technology, Inc., today announced it is the world's first and only memory company shipping both HBM3E and SOCAMM (small outline compression attached memory module) products for AI servers in the data center. This extends Micron's industry leadership in designing and delivering low-power DDR (LPDDR) for data center applications.

Micron's SOCAMM, a modular LPDDR5X memory solution, was developed in collaboration with NVIDIA to support the NVIDIA GB300 Grace Blackwell Ultra Superchip. The Micron HBM3E 12H 36 GB is also designed into the NVIDIA HGX B300 NVL16 and GB300 NVL72 platforms, while the HBM3E 8H 24 GB is available for the NVIDIA HGX B200 and GB200 NVL72 platforms. The deployment of Micron HBM3E products in NVIDIA Hopper and NVIDIA Blackwell systems underscores Micron's critical role in accelerating AI workloads.

AEWIN Unveils CB-1953 Series Network Appliance Powered by Intel Xeon 6 Processors

AEWIN is excited to unveil the SCB-1953 Series, 2U/1U performant network appliances powered by Intel's latest Xeon 6 processors built upon Intel 3. Equipped with a single Intel Xeon 6700/6500-series processor, it is a series of flagship products supporting up to 144 E-cores or 86 P-cores for high density and compute-intensive workloads pursued in the market. SCB-1953 series has multiple SKU with various PCIe slots options for exceptional scalability to fulfill customers' diverse solution requirements.

SCB-1953-2U is a 2U network computing platform with 8x DDR5 RDIMM up to 6400 MT/s or MRDIMM up to 8000 MT/s. The series of SCB-1953-2U has 4x 8038 fans with BMC control for optimized thermal management. One is SCB-1953A featuring 8x PCIe 5.0 expansion slots for AEWIN wide coverage NIC cards with 1G/10/25/40/100G/200G copper/fiber interfaces or other Accelerators & NVMe SSDs for flexible functionality enhancement. The other is SCB-1953C supporting 1x PCIe x16 slot by switching two PCIe slots to one standard PCIe form factor which can install off-the-shelf add-on card for expanded function required.

Avalue Technology Unveils HPM-GNRDE High-Performance Server Motherboard

Avalue Technology introduces the HPM-GNRDE high-performance server motherboard, powered by the latest Intel Xeon 6 Processors (P-Core) 6500P & 6700P.

Designed to deliver quality computing performance, ultra-fast memory bandwidth, and advanced PCIe 5.0 expansion, the HPM-GNRDE is the ideal solution for AI workloads, high-performance computing (HPC), Cloud data centers, and enterprise applications. The HPM-GNRDE will make its debut at embedded world 2025, showcasing Avalue's innovation in high-performance computing.

ASUS Unveils All-New Intel Xeon 6 Server Lineup

ASUS today announced an all-new series of servers powered by the latest Intel Xeon 6 processors, including the Xeon 6900-series, 6500P/6700P-series and 6300-series processors. These powerhouse processors deliver exceptional performance, efficiency and scalability, featuring up to 128 Performance-cores (P-cores) or 288 Efficient-cores (E-cores) per socket, along with native support for PCI Express (PCIe 5.0) and DDR5 6400 MT/s memory speeds. The latest ASUS server solutions also incorporate the updated BMC module within the ASPEED 2600 chipset, providing improved manageability, security and compatibility with a wide range of remote management software - and coincide with the unveiling of the latest Intel Xeon 6 processors.

Redefining efficiency and scalability
Intel Xeon 6 processors are engineered to meet the needs of modern data centers, AI-driven workloads and enterprise computing. Offering a choice between P-core and E-core architectures, these processors provide flexibility for businesses to optimize performance and energy efficiency based on specific workloads.

Lenovo Delivers Unmatched Flexibility, Performance and Design with New ThinkSystem V4 Servers Powered by Intel Xeon 6 Processors

Today, Lenovo announced three new infrastructure solutions, powered by Intel Xeon 6 processors, designed to modernize and elevate data centers of any size to AI-enabled powerhouses. The solutions include next generation Lenovo ThinkSystem V4 servers that deliver breakthrough performance and exceptional versatility to handle any workload while enabling powerful AI capabilities in compact, high-density designs. Whether deploying at the edge, co-locating or leveraging a hybrid cloud, Lenovo is delivering the right mix of solutions that seamlessly unlock intelligence and bring AI wherever it is needed.

The new Lenovo ThinkSystem servers are purpose-built to run the widest range of workloads, including the most compute intensive - from algorithmic trading to web serving, astrophysics to email, and CRM to CAE. Organizations can streamline management and boost productivity with the new systems, achieving up to 6.1x higher compute performance than previous generation CPUs with Intel Xeon 6 with P-cores and up to 2x the memory bandwidth when using new MRDIMM technology, to scale and accelerate AI everywhere.

Intel Reports Fourth-Quarter and Full-Year 2024 Financial Results

Intel Corporation today reported fourth-quarter and full-year 2024 financial results. "The fourth quarter was a positive step forward as we delivered revenue, gross margin and EPS above our guidance," said Michelle Johnston Holthaus, interim co-CEO of Intel and CEO of Intel Products. "Our renewed focus on strengthening and simplifying our product portfolio, combined with continued progress on our process roadmap, is positioning us to better serve the needs of our customers. Dave and I are taking actions to enhance our competitive position and create shareholder value."

"The cost reduction plan we announced last year to improve the trajectory of the company is having an impact," said David Zinsner, interim co-CEO and chief financial officer of Intel. "We are fostering a culture of efficiency across the business while driving toward greater returns on our invested capital and improved profitability. Our Q1 outlook reflects seasonal weakness magnified by macro uncertainties, further inventory digestion and competitive dynamics. We will remain highly focused on execution to build on our progress and unlock value."

Montage Technology Delivers Gen2 MRCD & MDB Samples for DDR5 MRDIMM

Montage Technology today announced that it has successfully sampled its Gen 2 Multiplexed Rank Registering Clock Driver (MRCD) and Multiplexed Rank Data Buffer (MDB) chipset to leading global memory manufacturers. Designed for DDR5 Multiplexed Rank DIMM (MRDIMM), this new chipset supports data rates up to 12800 MT/s, delivering exceptional memory performance for next-generation computing platforms.

The release comes at a crucial time, as AI and big data analytics drive increasing demands for memory bandwidth in data centers. MRDIMM technology has emerged as a key solution to address this challenge, particularly as server processors continue to increase in core count.

Supermicro Begins Volume Shipments of Max-Performance Servers Optimized for AI, HPC, Virtualization, and Edge Workloads

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

Micron at the 2025 CES: Scripting a Strong Comeback to the Client and PC-DIY Segments

Micron at the 2025 International CES showed us product that hint at the company planning a strong comeback to the client and PC-DIY market segments. The company's Crucial brand is already a high-volume player in the client segment, but the company never really approached the enthusiast segment. Products like the company's new T705 Pro and P510 NVMe SSDs, and DDR5 Pro Overclocking memory, seek to change this. We begin our tour with PC memory, and the DDR5 Pro OC CUDIMMs. Crucial has jumped onto the CKD bandwagon, introducing memory modules and kits that come with DDR5-6400 out of the box, but which are geared for manual overclocking to take advantage of the 1β DRAM chips underneath (hence the name).

The company also showed us their first DDR5 CSODIMM suitable for the next generation of notebooks with HX-segment processors. This module comes with a CKD and a DDR5-6400 JEDEC-standard SPD profile out of the box. Lastly, there's the Micron-branded LPCAMM2, which comes in speeds of up to LPDDR5X-8533, and is suitable for the next generation of ultraportables.

Renesas Unveils Industry's First Complete Chipset for Gen-2 DDR5 Server MRDIMMs

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry's first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).

The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.

New Ultrafast Memory Boosts Intel Data Center Chips

While Intel's primary product focus is on the processors, or brains, that make computers work, system memory (that's DRAM) is a critical component for performance. This is especially true in servers, where the multiplication of processing cores has outpaced the rise in memory bandwidth (in other words, the memory bandwidth available per core has fallen). In heavy-duty computing jobs like weather modeling, computational fluid dynamics and certain types of AI, this mismatch could create a bottleneck—until now.

After several years of development with industry partners, Intel engineers have found a path to open that bottleneck, crafting a novel solution that has created the fastest system memory ever and is set to become a new open industry standard. The recently introduced Intel Xeon 6 data center processors are the first to benefit from this new memory, called MRDIMMs, for higher performance—in the most plug-and-play manner imaginable.

Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs

Rambus Inc., a premier chip and silicon IP provider making data faster and safer, today unveiled industry-first, complete memory interface chipsets for Gen 5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs). These innovative new products for RDIMMs and MRDIMMs will seamlessly extend DDR5 performance with unparalleled bandwidth and memory capacity for compute-intensive data center and AI workloads.

"The voracious memory demands of AI and HPC require the relentless pursuit of higher performance through continued innovation and technology leadership," said Sean Fan, chief operating officer at Rambus. "With our 30-plus years of renowned high-speed signal integrity and memory system expertise, the Rambus Gen5 RCD, and next-generation MRCD, MDB, and PMIC will be critical enabling chips in future-generation servers leveraging DDR5 RDIMM 8000 and MRDIMM 12800."

AMD EPYC "Turin" with 192 Cores and 384 Threads Delivers Almost 40% Higher Performance Than Intel Xeon 6

AMD has unveiled its latest EPYC processors, codenamed "Turin," featuring Zen 5 and Zen 5C dense cores. Phoronix's thorough testing reveals remarkable advancements in performance, efficiency, and value. The new lineup includes the EPYC 9575F (64-core), EPYC 9755 (128-core), and EPYC 9965 (192-core) models, all showing impressive capabilities across various server and HPC workloads. In benchmarks, a dual-socket configuration of the 128-core EPYC 9755 Turin outperformed Intel's dual Xeon "Granite Rapids" 6980P setup with MRDIMM-8800 by 40% in the geometric mean of all tests. Surprisingly, even a single EPYC 9755 or EPYC 9965 matched the dual Xeon 6980P in expanded tests with regular DDR5-6400. Within AMD's lineup, the EPYC 9755 showed a 1.55x performance increase over its predecessor, the 96-core EPYC 9654 "Genoa". The EPYC 9965 surpassed the dual EPYC 9754 "Bergamo" by 45%.

These gains come with improved efficiency. While power consumption increased moderately, performance improvements resulted in better overall efficiency. For example, the EPYC 9965 used 32% more power than the EPYC 9654 but delivered 1.55x the performance. Power consumption remains competitive: the EPYC 9965 averaged 275 Watts (peak 461 Watts), the EPYC 9755 averaged 324 Watts (peak 500 Watts), while Intel's Xeon 6980P averaged 322 Watts (peak 547 Watts). AMD's pricing strategy adds to the appeal. The 192-core model is priced at $14,813, compared to Intel's 128-core CPU at $17,800. This competitive pricing, combined with superior performance per dollar and watt, has resonated with hyperscalers. Estimates suggest 50-60% of hyperscale deployments now use AMD processors.

ASUS Introduces All-New Intel Xeon 6 Processor Servers

ASUS today announced its all-new line-up of Intel Xeon 6 processor-powered servers, ready to satisfy the escalating demand for high-performance computing (HPC) solutions. The new servers include the multi-node ASUS RS920Q-E12, which supports Intel Xeon 6900 series processors for HPC applications; and the ASUS RS720Q-E12, RS720-E12 and RS700-E12 server models, embedded with Intel Xeon 6700 series with E-cores, will also support Intel Xeon 6700/6500 series with P-cores in Q1, 2025, to provide seamless integration and optimization for modern data centers and diverse IT environments.

These powerful new servers, built on the solid foundation of trusted and resilient ASUS server design, offer improved scalability, enabling clients to build customized data centers and scale up their infrastructure to achieve their highest computing potential - ready to deliver HPC success across diverse industries and use cases.

Supermicro Adds New Max-Performance Intel-Based X14 Servers

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, today adds new maximum performance GPU, multi-node, and rackmount systems to the X14 portfolio, which are based on the Intel Xeon 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP). The new industry-leading selection of workload-optimized servers addresses the needs of modern data centers, enterprises, and service providers. Joining the efficiency-optimized X14 servers leveraging the Xeon 6700 Series Processors with E-cores launched in June 2024, today's additions bring maximum compute density and power to the Supermicro X14 lineup to create the industry's broadest range of optimized servers supporting a wide variety of workloads from demanding AI, HPC, media, and virtualization to energy-efficient edge, scale-out cloud-native, and microservices applications.

"Supermicro X14 systems have been completely re-engineered to support the latest technologies including next-generation CPUs, GPUs, highest bandwidth and lowest latency with MRDIMMs, PCIe 5.0, and EDSFF E1.S and E3.S storage," said Charles Liang, president and CEO of Supermicro. "Not only can we now offer more than 15 families, but we can also use these designs to create customized solutions with complete rack integration services and our in-house developed liquid cooling solutions."

Supermicro Previews New Max Performance Intel-based X14 Servers

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is previewing new, completely re-designed X14 server platforms which will leverage next-generation technologies to maximize performance for compute-intensive workloads and applications. Building on the success of Supermicro's efficiency-optimized X14 servers that launched in June 2024, the new systems feature significant upgrades across the board, supporting a never-before-seen 256 performance cores (P-cores) in a single node, memory support up for MRDIMMs at 8800MT/s, and compatibility with next-generation SXM, OAM, and PCIe GPUs. This combination can drastically accelerate AI and compute as well as significantly reduce the time and cost of large-scale AI training, high-performance computing, and complex data analytics tasks. Approved customers can secure early access to complete, full-production systems via Supermicro's Early Ship Program or for remote testing with Supermicro JumpStart.

"We continue to add to our already comprehensive Data Center Building Block solutions with these new platforms, which will offer unprecedented performance, and new advanced features," said Charles Liang, president and CEO of Supermicro. "Supermicro is ready to deliver these high-performance solutions at rack-scale with the industry's most comprehensive direct-to-chip liquid cooled, total rack integration services, and a global manufacturing capacity of up to 5,000 racks per month including 1,350 liquid cooled racks. With our worldwide manufacturing capabilities, we can deliver fully optimized solutions which accelerate our time-to-delivery like never before, while also reducing TCO."

Micron Technology Unveils MRDIMMs to Scale Up Memory Densities on Servers

Micron Technology, Inc., today announced it is now sampling its multiplexed rank dual inline memory module (MRDIMMs). The MRDIMMs will enable Micron customers to run increasingly demanding workloads and obtain maximum value out of their compute infrastructure. For applications requiring more than 128 GB of memory per DIMM slot, Micron MRDIMMs outperform current TSV RDIMMs by enabling the highest bandwidth, largest capacity with the lowest latency and improved performance per watt to accelerate memory-intensive virtualized multi-tenant, HPC and AI data center workloads.1 The new memory offering is the first generation in the Micron MRDIMM family and will be compatible with Intel Xeon 6 processors.

"Micron's latest innovative main memory solution, MRDIMM, delivers the much-needed bandwidth and capacity at lower latency to scale AI inference and HPC applications on next-generation server platforms," said Praveen Vaidyanathan, vice president and general manager of Micron's Compute Products Group. "MRDIMMs significantly lower the amount of energy used per task while offering the same reliability, availability and serviceability capabilities and interface as RDIMMs, thus providing customers a flexible solution that scales performance. Micron's close industry collaborations ensure seamless integration into existing server infrastructures and smooth transitions to future compute platforms."
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