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ASUS Unveils First TUF Series Motherboard, Sabertooth 55i

ASUS, the leader in innovative motherboard solutions, today unveiled the first motherboard in its newly-developed "TUF" (The Ultimate Force) Series, the SABERTOOTH 55i. The TUF Series is specially developed to meet the heavy computing demands of power users and perform well even under extreme conditions. Such computer enthusiasts often demand high-quality motherboard components and the most stable computing platforms. To achieve uncompromising stability, TUF Series motherboards have undergone a more stringent testing program than what most motherboard producers currently undertake. Solidly constructed and equipped with resilient components that have passed demanding military-style testing, the TUF Series triumphs over the harshest operating conditions to deliver robust performance. The debut SABERTOOTH 55i model, designed around a "Marine Cool" concept, incorporates the Intel P55 chipset and "tough" features to give users a supremely solid and stable computing platform.

ASUS Marine Cool Motherboard Concept Becomes Official

Following the first news we heard of ASUS' new concept motherboard, they have now released an official press release, including some close-up imagery of the new cooling solution. The odd "backplate" to the rear of the board is in fact a built in UPS (uninterruptible power supply) through the use of a polymer battery. The board also features built in memory to guarantee a successfull boot in the event of installing faulty or incompatible RAM. Then of course is the new cooling solution utilizing a combination of ceramincs and metals which ASUS say doubles the cooling efficiency. The official press release follows.

ASUS Shines with New Marine Cool Motherboard Concept

This year ASUS will try to leave the competition far behind, by introducing a brand new motherboard concept, the Marine Cool series. The Marine Cool series design goes far ahead from current Republic of Gamers (R.O.G.) mainboard products. For starters, the new motherboard has a new back plate that utilizes "micro-porous ceramic" technology and spreads across the whole PCB. The heat-pipe system that cools the motherboard's main components is also different, compared to current shipping products. Although the cooling technology remains the same, the whole look of the system reminds of a robot armour. Finally, it looks that ASUS engineers have decided to use SO-DIMM modules to cope with current Core 2 processors (if I'm right that appears to be LGA775 socket). I know it sounds a bit crazy, but pictures don't lie. Have a look and write what you think. The ASUS Marine Cool prototype will make first appearance during this year's CeBIT 2009 in Hannover, Germany.
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Jul 24th, 2024 21:31 EDT change timezone

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