ASUS today introduced the X870 MAX Gaming WiFi7 motherboard. This Socket AM5 motherboard comes in two color-based variants—its default black, and the white X870 MAX Gaming WiFi7 W, which features a white PCB, besides white/silver heatsinks. The X870 MAX Gaming is positioned below even the TUF Gaming X870 Plus, and separate from the company's Prime series. It is designed to lure gaming PC builders away from the likes of the GIGABYTE Gaming X and MSI Gaming Plus series. The board is built in the ATX form-factor and draws power from a combination of 24-pin ATX and two 8-pin EPS connectors. It features a 12+2+1 phase CPU VRM that uses 80 A-rated power stages.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16 slot, and just the one M.2 Gen 5 x4 NVMe slot. The second CPU-attached NVMe interface is wired out as M.2 Gen 4 x4. The third M.2 slot is Gen 4 x4 and wired to the X870 FCH. The board also puts out four SATA 6 Gbps ports. Besides the main Gen 5 x16 PEG slot, the board has three other physical x16 slots, two of these are Gen 4 x1, and the last one Gen 3 x1. Display connectivity includes an HDMI, and a DisplayPort that's wired to the board's two 40 Gbps USB4 type-C ports. Other USB ports include a 10 Gbps USB 3.2 Gen 2; three 5 Gbps USB 3.1 Gen 1, and four USB 2.0, there is a 20 Gbps USB-C header, besides two additional 5 Gbps ports through a standard header.

MediaTek has introduced the Kompanio Ultra, the latest milestone in AI-powered, high-performance Chromebooks. Leveraging MediaTek's proven expertise in flagship innovation, this powerful new platform brings fantastic on-device AI capabilities, superior computing performance, and industry-leading power efficiency to the newest Chromebook Plus devices. "The Kompanio Ultra underscores our commitment to delivering groundbreaking computing performance and efficiency that MediaTek has shown as a leader in the mobile compute space for many years," said Adam King, Vice President & General Manager of Computing and Multimedia Business at MediaTek. "We worked closely with Google to ensure the newest Chromebook Plus devices enjoy next-generation on-device AI capabilities, superior performance per watt, and immersive multimedia."

The Kompanio Ultra is MediaTek's most powerful Chromebook processor to date, integrating 50 TOPS of AI processing power to enable on-device generative AI experiences. With MediaTek's 8th-generation NPU, users can expect real-time task automation, personalized computing, and seamless AI-enhanced workflows—with local processing for enhanced speed, security, efficiency, and support for AI workloads without an internet connection. Built on the cutting-edge (TSMC) 3 nm process, the Kompanio Ultra features an all-big-core CPU architecture with an Arm Cortex-X925 processor clocked at up to 3.62 GHz, delivering industry-leading single and multithreaded performance. Whether handling intensive applications like video editing, content creation, or high-resolution gaming, this processor ensures smooth, lag-free performance with unmatched multitasking capabilities.

According to Reuters, citing The Information, Google will collaborate with MediaTek to develop its seventh-generation Tensor Processing Unit (TPU), which is also known as TPU v7. Google maintains its existing partnership with Broadcom despite the new MediaTek collaboration. The AI accelerator is scheduled for production in 2026, and TSMC is handling manufacturing duties. Google will lead the core architecture design while MediaTek manages I/O and peripheral components, as Economic Daily News reports. This differs from Google's ongoing relationship with Broadcom, which co-develops core TPU architecture. The MediaTek partnership reportedly stems from the company's strong TSMC relationship and lower costs compared to Broadcom.

There is also a possibility that MediaTek could design inference-focused TPU v7 chips while Broadcom focuses on training architecture. Nonetheless, the development of TPU is a massive market as Google is using so many chips that it could use a third company, hypothetically. The development of TPU continues Google's vertical integration strategy for AI infrastructure. Google reduces dependency on NVIDIA hardware by designing proprietary AI chips for internal R&D and cloud operations. At the same time, competitors like OpenAI, Anthropic, and Meta rely heavily on NVIDIA's processors for AI training and inference. At Google's scale, serving billions of queries a day, designing custom chips makes sense from both financial and technological sides. As Google develops its own specific workloads, translating that into hardware acceleration is the game that Google has been playing for years now.

TrendForce reveals that the combined revenue of the world's top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase. The booming AI industry has fueled growth across the semiconductor sector, with NVIDIA leading the charge, posting an astonishing 125% revenue growth, widening its lead over competitors, and solidifying its dominance in the IC industry.

Looking ahead to 2025, advancements in semiconductor manufacturing will further enhance AI computing power, with LLMs continuing to emerge. Open-source models like DeepSeek could lower AI adoption costs, accelerating AI penetration from servers to personal devices. This shift positions edge AI devices as the next major growth driver for the semiconductor industry.

The Retroid Pocket Flip was launched with essentially the same specifications as the Pocket 3+. As the name suggests, the product's form factor allows it to fold in half, with the bottom panel functioning as the controller. The company has now announced its successor, the Pocket Flip 2. Although the pricing details are yet to be revealed, the Flip 2 does feature a bunch of notable upgrades which are likely to make the device command a slightly higher price tag than its ~$160 predecessor.

One of the biggest differences between the Flip and Flip 2 is certainly the substantially higher processing power that the Flip 2 has on tap, courtesy of its Snapdragon 865 or Dimensity 1100 SoC paired with 8 GB of memory. Both of these chips are undoubtedly far more capable than the Unisoc T618 SoC found in the original version, with the amount of memory being twice as much. That said, the Dimensity 1100 (Mali G77) variant will likely have the upper hand in GPU performance compared to the Snapdragon 865 variant (Adreno 650). The display has also witnessed a serious improvement, now boasting a 1080p OLED panel that is 5.5-inches in size, with a peak brightness of 500 nits.

Morse Micro, the world's leading provider of Wi-Fi HaLow chips, today announced the general availability of the world's first Wi-Fi 4 and Wi-Fi HaLow gateway - certified by Wi-Fi Alliance. Featuring FCC, IC, and RCM certification, this breakthrough device enables developers, system integrators, and manufacturers to harness the power of long-range, energy-efficient Wi-Fi HaLow combined with traditional Wi-Fi 4 (802.11n) connectivity in a single, compact gateway.

"The certification of the HaLowLink 1 reinforces the growing importance of reliable, interoperable Wi-Fi HaLow products in the connectivity ecosystem," said Maureen Gallagher, VP of Marketing at Wi-Fi Alliance. "With its extended range and low-power capabilities, Wi-Fi HaLow is a powerful solution for IoT applications, and Morse Micro is committed to accelerating adoption by delivering high-quality products through the Wi-Fi CERTIFIED program."

Report with market evolution powered by AI—The global artificial intelligence (AI) chips market size is estimated to grow by USD 902.6 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 81.2% during the forecast period. Increased focus on developing AI chips for smartphones is driving market growth, with a trend towards convergence of AI and IoT. However, dearth of technically skilled workers for ai chips development poses a challenge. Key market players include Advanced Micro Devices Inc., Baidu Inc., Broadcom Inc., Cerebras, Fujitsu Ltd., Google LLC, Graphcore Ltd., Huawei Technologies Co. Ltd., Intel Corp., International Business Machines Corp., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Qualcomm Inc., SambaNova Systems Inc., Samsung Electronics Co. Ltd., SenseTime Group Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and Tesla Inc.

Cadence today announced that MediaTek has adopted the AI-driven Cadence Virtuoso Studio and Spectre X Simulator on the NVIDIA accelerated computing platform for its 2 nm development. As design size and complexity continue to escalate, advanced-node technology development has become increasingly challenging for SoC providers. To meet the aggressive performance and turnaround time (TAT) requirements for its 2 nm high-speed analog IP, MediaTek is leveraging Cadence's proven custom/analog design solutions, enhanced by AI, to achieve a 30% productivity gain.

"As MediaTek continues to push technology boundaries for 2 nm development, we need a trusted design solution with strong AI-powered tools to achieve our goals," said Ching San Wu, corporate vice president at MediaTek. "Closely collaborating with Cadence, we have adopted the Cadence Virtuoso Studio and Spectre X Simulator, which deliver the performance and accuracy necessary to achieve our tight design turnaround time requirements. Cadence's comprehensive automation features enhance our throughput and efficiency, enabling our designers to be 30% more productive."

Microsoft's Windows-on-Arm (WoA) project has been going through an expansion phase, with the recent range of Snapdragon X SoCs powering many laptops. However, as we are about to get bombed with WoA devices in 2025, Microsoft has prepared an official ISO image of the Windows 11 operating system, available for users to download on the official website. The download size is about 5 GB and requires an Arm-based system to work, as expected. The need for Windows 11 ISO image for WoA comes from the increased number of desktop builds shipped to developers worldwide based on Arm. There are many workstations like the ones offered by ODMs, with an Ampere Altra or Altra Max processor inside.

This is also good news for enthusiasts waiting for the NVIDIA-MediaTek collaboration to drop its first goodies next year, and we expect to see some interesting solutions arise. With Microsoft investing its developer resources into producing Windows 11 Arm builds, it signals that the adoption of Arm-based devices is about to get much higher interest from the consumer standpoint.

According to DigiTimes, NVIDIA is reportedly targeting the high-end segment for its first consumer CPU attempt. Slated to arrive in 2025, NVIDIA is partnering with MediaTek to break into the AI PC market, currently being popularized by Qualcomm, Intel, and AMD. With Microsoft and Qualcomm laying the foundation for Windows-on-Arm (WoA) development, NVIDIA plans to join and leverage its massive ecosystem of partners to design and deliver regular applications and games for its Arm-based processors. At the same time, NVIDIA is also scheduled to launch "Blackwell" GPUs for consumers, which could end up in these AI PCs with an Arm CPU at its core.

NVIDIA's partner, MediaTek, has recently launched a big core SoC for mobile called Dimensity 9400. NVIDIA could use something like that as a base for its SoC and add its Blackwell IP to the mix. This would be similar to what Apple is doing with its Apple Silicon and the recent M4 Max chip, which is apparently the fastest CPU in single-threaded and multithreaded workloads, as per recent Geekbench recordings. For NVIDIA, the company already has a team of CPU designers that delivered its Grace CPU to enterprise/server customers. Using off-the-shelf Arm Neoverse IP, the company's customers are acquiring systems with Grace CPUs as fast as they are produced. This puts a lot of hope into NVIDIA's upcoming AI PC, which could offer a selling point no other WoA device currently provides, and that is tried and tested gaming-grade GPU with AI accelerators.

MediaTek today launched the Dimensity 9400, the company's new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek's flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm's v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek's second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek's previous generation flagship chipset, the Dimensity 9300. Built on TSMC's second-generation 3 nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

The OpenWrt One WiFi 6 router by Banana Pi has recently completed its journey from the first announcement in January 2024, through sampling in April, and is now available for retail to end-users. The OpenWrt One is the first board designed by Banana Pi in collaboration with the OpenWrt open-source community, with assistance from MediaTek. Banana Pi is also handling the manufacturing and distribution of the router board, with part of the generated income being used by OpenWrt to cover the costs of hosting and conferences, as well as donations to the Software Freedom Conservancy (SFC) organization.

The router uses MediaTek's MT7981B (Filogic 820) SoC and MediaTek MT7976C dual-band WiFi 6 chipset, offering 2x2 2.4 GHz and 3x3 5 GHz connectivity. It features a dual-core Cortex-A53 processor running at 1.3 GHz, 1 GB of DDR4 RAM, and 256 MB of SPI NAND flash storage. It also includes 16 MB of additional protected storage for system backup, and integrated M.2 2230/2242 NVMe PCIe 2x1 ports that can be used for adding external storage. The router comes with the board, including a heatsink, assembled in a metal case, three antennas, and an external power supply. In terms of connectivity, the OpenWrt One offers (aside from wireless connections) 1x Gigabit RJ45 and 1x 2.5GbE RJ45 ports, 1x USB 2.0 Type-A host port, and 1x USB Type-C port.

Lenovo elevates productivity and enjoyment on-the-go with Chromebook Duet (11", 9) and Chromebook Duet EDU G2, two 10.95-inch convertible laptops with 2K display that balance design and performance. Encased in a full metal chassis with Corning Gorilla Glass for ultimate durability and complemented by a soft protective folio, the Chromebook Duet (11", 9) is a portable companion that entertains, adapts, and encourages you to create. A learning resource for students and teachers, the Chromebook Duet EDU G2 takes durability to the next level with a rugged case and detachable keyboard.

"Modern society is constantly on the move, a challenge to traditional notions of productivity and leisure based on being stationary, while underscoring the necessity of having a portable and efficient laptop," said Benny Zhang, Executive Director and General Manager of Chromebooks in Lenovo's Intelligent Devices Group. "The Lenovo Chromebook Duet and Lenovo Chromebook Duet EDU G2 powered by MediaTek Kompanio 838 processor with AI-enabled NPU are versatile companions for work, play, learning and everything in between."

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.

Samsung Electronics today unveiled the Galaxy Tab S10 Ultra and Galaxy Tab S10+, Samsung's first tablets purposefully built for AI. The premium hardware includes 14.6-inch and 12.4-inch Dynamic AMOLED 2X displays—the ideal canvas for the intuitive S Pen bundled with both models. Performance upgrades for the Galaxy Tab S10 Ultra include an 18% increase in CPU, 28% increase in GPU and 14% increase in NPU compared to the Galaxy Tab S9 Ultra.

This improved processing power enables faster and more responsive AI features, which are now easily accessible with written prompts using the new Galaxy AI Key on the Book Cover Keyboards to customize AI assistant. Cutting-edge software includes features such as Note Assist and Drawing Assist, optimized for the tablet form factor. The Galaxy Tab S10 series also acts as a home AI device, with a 3D Map View that gives a visual overview of the home and all connected devices to streamline device management across the SmartThings ecosystem. Robust Samsung Knox security ensures data privacy and control, while innovative materials underscore Samsung's commitment to a more sustainable future.

Acer today introduced the new Iconia X12 (X12-11), an AMOLED-display tablet designed to boost productivity and entertainment experiences. Users can maximize the split-screen feature for work, high color contrast for content, and smooth frames when playing on its massive 12.6-inch AMOLED (2560X1600) panel with a fast 60 Hz refresh rate and 400 nits brightness. The Acer Iconia X12 is also equipped with quad stereo speakers for rich, immersive audio.

The tablet's usability is further enhanced with a series of accessories that boost productivity and creativity, including an option for an aluminium stylus pen, a portfolio case with a stylus slot and adjustable, multi-angle stand, plus a detachable Bluetooth keyboard with trackpad for added typing/scrolling options. The Iconia X12 also features a front 8 MP camera and a back 13 MP camera with flash and autofocus for great video calling and image capturing with true-to-life color reproduction. It runs on Android 14 and is powered by a MediaTek Helio G99 processor, built on a highly efficient 6 nm chip to enable fast display, smooth streaming, and reliable connectivity.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

VIA Technologies, Inc., a leading innovator in the development of embedded platforms and systems, today announced the launch of three new high-performance edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.

"These new platforms represent a significant leap forward in edge AI technology," said Epan Wu, General Manager, VIA Intelligent Solutions. "With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications."

New insights from Omdia's Desktop Monitor Intelligence Service show the gaming monitor market, featuring refresh rates over 120 Hz, is expected to grow by 9% YoY to 24.7 million units in 2024. Meanwhile, the smart monitor market, equipped with operating systems and streaming service portals, is projected to expand by 63% YoY to 1.2 million units.

In 1Q24, desktop monitor shipments hit 30.7 million units, a 5% increase year-on-year (YoY). The industry has been growing steadily since 3Q23, overcoming post-pandemic logistical disruptions. Notably, the gaming monitor market and smart monitors are expanding rapidly. This growth is driven by added value and high functionality, particularly in both monitor categories.

Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully completed verification of the industry's fastest 10.7 gigabit-per-second (Gbps) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on MediaTek's next-generation Dimensity platform.

The 10.7 Gbps operation speed verification was carried out using Samsung's LPDDR5X 16-gigabyte (GB) package on MediaTek's upcoming flagship Dimensity 9400 System on Chip (SoC), scheduled to be released in the second half of this year. The two companies have closely collaborated to complete the verification within just three months.

Gigabyte's new Stealth series of motherboards has to date only had a single product, the Z690 Aorus Elite Stealth, but now, Gigabyte has added its first Stealth board for AMD CPUs. The B650E Aorus Stealth Ice not only has all of its connectors on the back of the board, but it also has a white/silver PCB with a similarly coloured front and back cover. Apart from the DIMM slots, all connectors are also in somewhat matching colours, although judging by the pictures, the colours don't quite match on all the connectors and slots. That aside, the B650E Aorus Stealth Ice is a pretty competent board, as long as you're not interested in adding anything more than a graphics card and some NVMe SSDs, as it has zero additional PCIe expansion slots. It's a rather bold move by Gigabyte, but at the same time, most gamers and consumers don't tend to add PCIe devices to their computers outside of additional storage these days.

Besides the PCIe 5.0 x16 slot, you get two M.2 sockets wired to the CPU, one PCIe 5.0—with its own, larger heatsink—and one PCIe 4.0, as well as a third PCIe 4.0 M.2 socket via the chipset. There's also support for four SATA 6 Gbps drives if more storage is needed. Gigabyte has also added an internal HDMI 1.4 port that's limited to 1080p30, which is intended to be used with Gigabyte's LCD Edge View display. Other connectivity on the back of the PCB includes a USB 3.2 Gen 2x2 (20 Gbps) port, a USB 3.2 (5 Gbps) pin-header as well as the usual USB 2.0, fan headers and LED headers that you'd expect from a modern motherboard. The VRM design is a 12+2+2 design with a 60 Amp DrMOS configuration for the 12+2 phases for the CPU and GPU.

Today Lenovo introduced the Lenovo Tab Plus, an entertainment tablet that delivers an outstanding sonar experience with Eight JBL speakers with Hi-fi matrix structure tuned by Dolby Atmos. Designed for music lovers, the 11.5-inch tablet complements its premium sound with a 2K display for vivid visuals and an adjustable stand for optimal enjoyment from every angle.

"Tablets have evolved to meet the needs of people transitioning between work, study and play, offering a balanced combination of mobility and performance," said Tony Chen, vice president of Tablets, Intelligent Devices Group, Lenovo. "As the tablet market recovers, customers can expect increased Lenovo product differentiation through features that address their specific demands. The Lenovo Tab Plus is a prime example of a well-rounded tablet that delivers premium sound for a truly immersive entertainment experience."

Starlink today unveiled the Starlink Mini dish set. Priced at $299, this miniaturized version of the Starlink receiver is about the size and shape of an iPad Pro 13-inch with a kickstand. It measures 28.9 cm x 24 cm, and is about as thick as a mainstream laptop. This single device combines the dish, the receiver hardware, and a Wi-Fi 6 router. Wherever you are, you simply need to place and orient the device the right way, and it will configure itself. The main SoC of the device that handles both the satellite WAN and Wi-Fi switching, is made by MediaTek. The Starlink Mini isn't meant to replace the standard Starlink set. It offers a downstream speed of 100 Mbps, and an upstream speed of around 11 Mbps, which should be plenty for high-resolution Teams conferences anywhere on Earth that you can find the Starlink service.

MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm Neoverse Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems, telecommunications, and beyond.

"Together with Arm, we're enabling our customers' designs to meet the most challenging workloads for AI applications, maximizing performance per watt," said Vince Hu, Corporate Vice President at MediaTek. "We will be working closely with Arm as we expand our footprint into data centers, utilizing our expertise in hybrid computing, AI, SerDes and chiplets, and advance packaging technologies to accelerate AI innovation from the edge to the cloud."

MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.