Microsoft's Windows-on-Arm (WoA) project has been going through an expansion phase, with the recent range of Snapdragon X SoCs powering many laptops. However, as we are about to get bombed with WoA devices in 2025, Microsoft has prepared an official ISO image of the Windows 11 operating system, available for users to download on the official website. The download size is about 5 GB and requires an Arm-based system to work, as expected. The need for Windows 11 ISO image for WoA comes from the increased number of desktop builds shipped to developers worldwide based on Arm. There are many workstations like the ones offered by ODMs, with an Ampere Altra or Altra Max processor inside.

This is also good news for enthusiasts waiting for the NVIDIA-MediaTek collaboration to drop its first goodies next year, and we expect to see some interesting solutions arise. With Microsoft investing its developer resources into producing Windows 11 Arm builds, it signals that the adoption of Arm-based devices is about to get much higher interest from the consumer standpoint.

According to DigiTimes, NVIDIA is reportedly targeting the high-end segment for its first consumer CPU attempt. Slated to arrive in 2025, NVIDIA is partnering with MediaTek to break into the AI PC market, currently being popularized by Qualcomm, Intel, and AMD. With Microsoft and Qualcomm laying the foundation for Windows-on-Arm (WoA) development, NVIDIA plans to join and leverage its massive ecosystem of partners to design and deliver regular applications and games for its Arm-based processors. At the same time, NVIDIA is also scheduled to launch "Blackwell" GPUs for consumers, which could end up in these AI PCs with an Arm CPU at its core.

NVIDIA's partner, MediaTek, has recently launched a big core SoC for mobile called Dimensity 9400. NVIDIA could use something like that as a base for its SoC and add its Blackwell IP to the mix. This would be similar to what Apple is doing with its Apple Silicon and the recent M4 Max chip, which is apparently the fastest CPU in single-threaded and multithreaded workloads, as per recent Geekbench recordings. For NVIDIA, the company already has a team of CPU designers that delivered its Grace CPU to enterprise/server customers. Using off-the-shelf Arm Neoverse IP, the company's customers are acquiring systems with Grace CPUs as fast as they are produced. This puts a lot of hope into NVIDIA's upcoming AI PC, which could offer a selling point no other WoA device currently provides, and that is tried and tested gaming-grade GPU with AI accelerators.

MediaTek today launched the Dimensity 9400, the company's new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek's flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm's v9.2 CPU architecture, combined with the most advanced GPU and NPU for extreme performance in a super power-efficient design.

The Dimensity 9400 adopts MediaTek's second-gen All Big Core design, integrating one Arm Cortex-X925 core operating over 3.62 GHz, combined with 3x Cortex-X4 and 4x Cortex-A720 cores. This design offers 35% faster single-core performance and 28% faster multi-core performance compared to MediaTek's previous generation flagship chipset, the Dimensity 9300. Built on TSMC's second-generation 3 nm process, the Dimensity 9400 is up to 40% more power-efficient than its predecessor, allowing users to enjoy longer battery life.

The OpenWrt One WiFi 6 router by Banana Pi has recently completed its journey from the first announcement in January 2024, through sampling in April, and is now available for retail to end-users. The OpenWrt One is the first board designed by Banana Pi in collaboration with the OpenWrt open-source community, with assistance from MediaTek. Banana Pi is also handling the manufacturing and distribution of the router board, with part of the generated income being used by OpenWrt to cover the costs of hosting and conferences, as well as donations to the Software Freedom Conservancy (SFC) organization.

The router uses MediaTek's MT7981B (Filogic 820) SoC and MediaTek MT7976C dual-band WiFi 6 chipset, offering 2x2 2.4 GHz and 3x3 5 GHz connectivity. It features a dual-core Cortex-A53 processor running at 1.3 GHz, 1 GB of DDR4 RAM, and 256 MB of SPI NAND flash storage. It also includes 16 MB of additional protected storage for system backup, and integrated M.2 2230/2242 NVMe PCIe 2x1 ports that can be used for adding external storage. The router comes with the board, including a heatsink, assembled in a metal case, three antennas, and an external power supply. In terms of connectivity, the OpenWrt One offers (aside from wireless connections) 1x Gigabit RJ45 and 1x 2.5GbE RJ45 ports, 1x USB 2.0 Type-A host port, and 1x USB Type-C port.

Lenovo elevates productivity and enjoyment on-the-go with Chromebook Duet (11", 9) and Chromebook Duet EDU G2, two 10.95-inch convertible laptops with 2K display that balance design and performance. Encased in a full metal chassis with Corning Gorilla Glass for ultimate durability and complemented by a soft protective folio, the Chromebook Duet (11", 9) is a portable companion that entertains, adapts, and encourages you to create. A learning resource for students and teachers, the Chromebook Duet EDU G2 takes durability to the next level with a rugged case and detachable keyboard.

"Modern society is constantly on the move, a challenge to traditional notions of productivity and leisure based on being stationary, while underscoring the necessity of having a portable and efficient laptop," said Benny Zhang, Executive Director and General Manager of Chromebooks in Lenovo's Intelligent Devices Group. "The Lenovo Chromebook Duet and Lenovo Chromebook Duet EDU G2 powered by MediaTek Kompanio 838 processor with AI-enabled NPU are versatile companions for work, play, learning and everything in between."

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.

Samsung Electronics today unveiled the Galaxy Tab S10 Ultra and Galaxy Tab S10+, Samsung's first tablets purposefully built for AI. The premium hardware includes 14.6-inch and 12.4-inch Dynamic AMOLED 2X displays—the ideal canvas for the intuitive S Pen bundled with both models. Performance upgrades for the Galaxy Tab S10 Ultra include an 18% increase in CPU, 28% increase in GPU and 14% increase in NPU compared to the Galaxy Tab S9 Ultra.

This improved processing power enables faster and more responsive AI features, which are now easily accessible with written prompts using the new Galaxy AI Key on the Book Cover Keyboards to customize AI assistant. Cutting-edge software includes features such as Note Assist and Drawing Assist, optimized for the tablet form factor. The Galaxy Tab S10 series also acts as a home AI device, with a 3D Map View that gives a visual overview of the home and all connected devices to streamline device management across the SmartThings ecosystem. Robust Samsung Knox security ensures data privacy and control, while innovative materials underscore Samsung's commitment to a more sustainable future.

Acer today introduced the new Iconia X12 (X12-11), an AMOLED-display tablet designed to boost productivity and entertainment experiences. Users can maximize the split-screen feature for work, high color contrast for content, and smooth frames when playing on its massive 12.6-inch AMOLED (2560X1600) panel with a fast 60 Hz refresh rate and 400 nits brightness. The Acer Iconia X12 is also equipped with quad stereo speakers for rich, immersive audio.

The tablet's usability is further enhanced with a series of accessories that boost productivity and creativity, including an option for an aluminium stylus pen, a portfolio case with a stylus slot and adjustable, multi-angle stand, plus a detachable Bluetooth keyboard with trackpad for added typing/scrolling options. The Iconia X12 also features a front 8 MP camera and a back 13 MP camera with flash and autofocus for great video calling and image capturing with true-to-life color reproduction. It runs on Android 14 and is powered by a MediaTek Helio G99 processor, built on a highly efficient 6 nm chip to enable fast display, smooth streaming, and reliable connectivity.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

VIA Technologies, Inc., a leading innovator in the development of embedded platforms and systems, today announced the launch of three new high-performance edge AI solutions: the SOM-5000, VAB-5000, and ARTiGO A5000. These platforms are designed to meet the growing demand for intelligent edge computing across a wide range of industrial, commercial, and consumer applications.

"These new platforms represent a significant leap forward in edge AI technology," said Epan Wu, General Manager, VIA Intelligent Solutions. "With their advanced processing capabilities and versatile connectivity options, the SOM-5000, VAB-5000, and ARTiGO A5000 enable our customers to develop innovative and efficient edge AI applications."

New insights from Omdia's Desktop Monitor Intelligence Service show the gaming monitor market, featuring refresh rates over 120 Hz, is expected to grow by 9% YoY to 24.7 million units in 2024. Meanwhile, the smart monitor market, equipped with operating systems and streaming service portals, is projected to expand by 63% YoY to 1.2 million units.

In 1Q24, desktop monitor shipments hit 30.7 million units, a 5% increase year-on-year (YoY). The industry has been growing steadily since 3Q23, overcoming post-pandemic logistical disruptions. Notably, the gaming monitor market and smart monitors are expanding rapidly. This growth is driven by added value and high functionality, particularly in both monitor categories.

Samsung Electronics, the world leader in advanced memory technology, today announced it has successfully completed verification of the industry's fastest 10.7 gigabit-per-second (Gbps) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on MediaTek's next-generation Dimensity platform.

The 10.7 Gbps operation speed verification was carried out using Samsung's LPDDR5X 16-gigabyte (GB) package on MediaTek's upcoming flagship Dimensity 9400 System on Chip (SoC), scheduled to be released in the second half of this year. The two companies have closely collaborated to complete the verification within just three months.

Gigabyte's new Stealth series of motherboards has to date only had a single product, the Z690 Aorus Elite Stealth, but now, Gigabyte has added its first Stealth board for AMD CPUs. The B650E Aorus Stealth Ice not only has all of its connectors on the back of the board, but it also has a white/silver PCB with a similarly coloured front and back cover. Apart from the DIMM slots, all connectors are also in somewhat matching colours, although judging by the pictures, the colours don't quite match on all the connectors and slots. That aside, the B650E Aorus Stealth Ice is a pretty competent board, as long as you're not interested in adding anything more than a graphics card and some NVMe SSDs, as it has zero additional PCIe expansion slots. It's a rather bold move by Gigabyte, but at the same time, most gamers and consumers don't tend to add PCIe devices to their computers outside of additional storage these days.

Besides the PCIe 5.0 x16 slot, you get two M.2 sockets wired to the CPU, one PCIe 5.0—with its own, larger heatsink—and one PCIe 4.0, as well as a third PCIe 4.0 M.2 socket via the chipset. There's also support for four SATA 6 Gbps drives if more storage is needed. Gigabyte has also added an internal HDMI 1.4 port that's limited to 1080p30, which is intended to be used with Gigabyte's LCD Edge View display. Other connectivity on the back of the PCB includes a USB 3.2 Gen 2x2 (20 Gbps) port, a USB 3.2 (5 Gbps) pin-header as well as the usual USB 2.0, fan headers and LED headers that you'd expect from a modern motherboard. The VRM design is a 12+2+2 design with a 60 Amp DrMOS configuration for the 12+2 phases for the CPU and GPU.

Today Lenovo introduced the Lenovo Tab Plus, an entertainment tablet that delivers an outstanding sonar experience with Eight JBL speakers with Hi-fi matrix structure tuned by Dolby Atmos. Designed for music lovers, the 11.5-inch tablet complements its premium sound with a 2K display for vivid visuals and an adjustable stand for optimal enjoyment from every angle.

"Tablets have evolved to meet the needs of people transitioning between work, study and play, offering a balanced combination of mobility and performance," said Tony Chen, vice president of Tablets, Intelligent Devices Group, Lenovo. "As the tablet market recovers, customers can expect increased Lenovo product differentiation through features that address their specific demands. The Lenovo Tab Plus is a prime example of a well-rounded tablet that delivers premium sound for a truly immersive entertainment experience."

Starlink today unveiled the Starlink Mini dish set. Priced at $299, this miniaturized version of the Starlink receiver is about the size and shape of an iPad Pro 13-inch with a kickstand. It measures 28.9 cm x 24 cm, and is about as thick as a mainstream laptop. This single device combines the dish, the receiver hardware, and a Wi-Fi 6 router. Wherever you are, you simply need to place and orient the device the right way, and it will configure itself. The main SoC of the device that handles both the satellite WAN and Wi-Fi switching, is made by MediaTek. The Starlink Mini isn't meant to replace the standard Starlink set. It offers a downstream speed of 100 Mbps, and an upstream speed of around 11 Mbps, which should be plenty for high-resolution Teams conferences anywhere on Earth that you can find the Starlink service.

MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm Neoverse Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems, telecommunications, and beyond.

"Together with Arm, we're enabling our customers' designs to meet the most challenging workloads for AI applications, maximizing performance per watt," said Vince Hu, Corporate Vice President at MediaTek. "We will be working closely with Arm as we expand our footprint into data centers, utilizing our expertise in hybrid computing, AI, SerDes and chiplets, and advance packaging technologies to accelerate AI innovation from the edge to the cloud."

MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4 nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.

Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5 GHz paired with 4X Arm Cortex-A55 cores. The 4 nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

The PICO-ITX, a compact embedded single-board computer (SBC) based on a 100 mm x 72 mm form factor, serves as a more space-efficient alternative motherboard, ensuring a broad range of interfaces on a more readily deployable board.

GIGAIPC's PICO-G350A (Yocto OS) / PICO-G350B (Android OS) are the first Pico-ITX boards to feature an ARM SoC, powered by MediaTek MT8365 Arm Quad-Core Cortex -A53, to provide incredible energy efficiency and outstanding low power consumption that demonstrates impressive performance. Featuring a ruggedized design, it operates reliably across a wide temperature range from 0 to 60°C. Designed with flexibility and rich on-board interfaces, including USB 2.0 (hot and USB OTG), Micro SD expansion slots, and M.2 2230 E-Key for AW-CB451NF-D wifi module support, this solution is tailored to accommodate various application scenarios, such as smart retail, self-service terminals, industrial automation, intelligent medical health, and digital media.

ASUS today announced the ASUS Chromebook CZ series of laptops tailored for K12 students, which offer a portable and durable design for enduring value and empower engaged learning - anywhere. Featuring a 180° lay-flat or 360°-flippable design and an 11.6-inch (CZ1104C/F) or 12.2-inch (CZ1204C/F) 16:10 WUXGA display or touchscreen with TÜV-certified eye-care technology, the series not only enhances the visual experience but also prioritizes eye protection. ASUS Chromebook CZ series laptops are built for easy IT maintenance, with a modular design that minimizes downtime. The series boasts an extended battery life for uninterrupted use throughout an entire day of classes, empowering students to extend their learning beyond traditional limits.

A reliable study companion
For K12 students, an everyday-use laptop should be invincible. With lively and active users, scratches and knocks are an almost-inevitable part of their daily routine, so the ASUS Chromebook CZ series features an all-round rubber bumper for extra peace of mind. The laptops also feature a rugged design that's tested to meet or exceed the MIL-STD-810H US military-grade standard, and use tough Corning Gorilla Glass to protect the screen from scratches. Additionally, the spill-resistant keyboard can cope with minor water spills without harm, so minor splashes on the desk or at the dinner table can be easily drained, cleaned, and dried. Finally, the special fingerprint-resistant finish keeps the laptop cleaner for longer.

Phison Electronics, a leading provider of NAND controllers and NAND storage solutions, today announced a pivotal strategic collaboration with industry giant MediaTek to push forward innovations in generative artificial intelligence (Generative AI) computing and services, and meet demand for fine-tuning AI model computations across industries. Under the collaboration, Phison's cutting-edge AI computing service, aiDAPTIV+, will pair with MediaTek's premier generative AI service platform, MediaTek DaVinci, heralding a new epoch for AI computing and application services and accelerating the adoption of generative AI in everyday life.

MediaTek DaVinci is an advanced, open platform for generative AI services, built on the Generative AI Service Framework (GAISF). MediaTek DaVinci enables developers to build a variety of plugins for enterprise applications, fostering a vibrant ecosystem and enhancing the user experience. Phison's aiDAPTIV+ features a pioneering SSD-integrated AI computing architecture that breaks down large AI models for concurrent operation with SSDs. This approach significantly reduces infrastructure costs and boosts computational efficiency, enabling the training of substantial AI models with limited GPU and DRAM resources. aiDAPTIV+ has already demonstrated its effectiveness in the Industry 4.0 sector and is poised to accelerate AI transformation across various sectors, bolstering business competitiveness. Additionally, aiDAPTIV+ consumes less power than traditional AI server setups for the same AI model fine-tuning tasks and this aligns with the current trend of minimizing energy consumption and carbon footprint.

Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek (last week) announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G electrical links and 8x800G optical links for a more flexible deployment. It integrates both MediaTek's in-house SerDes for electrical I/O as well as co-packaged Odin optical engines from Ranovus for optical I/O. Leveraging the heterogeneous solution that includes both 112G LR SerDes and optical modules, this CPO demonstration delivers reduced board space and device costs, boosts bandwidth density, and lowers system power by up to 50% compared to existing solutions.

Additionally, Ranovus' Odin optical engine has the option to provide either internal or external laser optical modules to better align with practical usage scenarios. MediaTek's ASIC experience and capabilities in the 3 nm advanced process, 2.5D and 3D advanced packaging, thermal management, and reliability, combined with optical experience, makes it possible for customers to access the latest technology for high-performance computing (HPC), AI/ML and data center networking.

NVIDIA has been offering its GPU IP for more than a decade now ever since the introduction of Kepler uArch, and its IP has had relatively low traction in other SoCs. However, that trend seems to be reaching an inflection point as NVIDIA has given MediaTek a license to use its GPU IP to produce the next generation of processors for the auto industry. The newest MediaTek Dimensity Auto Cockpit family consists of CX-1, CY-1, CM-1, and CV-1, where the CX-1 targets premium vehicles, CM targets medium range, and CV targets lower-end vehicles, probably divided by their compute capabilities. The Dimensity Auto Cockpit family is brimming with the latest technology, as the processor core of choice is an Armv9-based design paired with "next-generation" NVIDIA GPU IP, possibly referring to Blackwell, capable of doing ray tracing and DLSS 3, powered by RTX and DLA.

The SoC is supposed to integrate a lot of technology to lower BOM costs of auto manufacturing, and it includes silicon for controlling displays, cameras (advanced HDR ISP), audio streams (multiple audio DSPs), and connectivity (WiFi networking). Interestingly, the SKUs can play movies with AI-enhanced video and support AAA gaming. MediaTek touts the Dimensity Auto Cockpit family with fully local AI processing capabilities, without requiring assistance from outside servers via WiFi, and 3D spatial sensing with driver and occupant monitoring, gaze-aware UI, and natural controls. All of that fits into an SoC fabricated at TSMC's fab on a 3 nm process and runs on the industry-established NVIDIA DRIVE OS.

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a new series of 5G RedCap module integrated with MediaTek's T300 5G modem, which is the world's first 6 nm radio frequency system-on-chip (RFSOC) single die solution for 5G RedCap. By integrating a single-core Arm Cortex-A3 processor in a significantly compact PCB area, the FM330 series are optimal solutions that offer extended coverage, increased network efficiency and device battery life for industry customers.

Compliant with 3GPP R17 standards, the FM330 series supports mainstream 5G frequency bands worldwide and is capable of reaching a maximum bandwidth of 20 MHz, thus ensuring the peak data rate of up to 227 Mbps downlink and 122 Mbps uplink, sufficient to meet the demand for 5G applications with less data throughput while balancing the power efficiency. In hardware design, it adopts the M.2form factor measured at 30x42mm benefiting from the unique RFSOC solution integrated with T300, in addition to the optimized antenna design in 1T2R, which significantly saves the PCB area. Moreover, FM330 series is pin-compatible with Fibocom LTE Cat 6 module FM101, easing the concerns for customers' migration from 4G to 5G. Furthermore, the module provides 64QAM/256QAM (optional) modulation scheme to greatly optimize the cost and size.

MediaTek revealed its (now current generation) flagship Dimensity 9300 flagship mobile processor last November, but we are already hearing about its successor's foundation. Digital Chat Station published some early insights on their Weibo micro-blog—the tipster appears to have an inside track at MediaTek's system-on-chip R&D department. The imaginatively named "Dimensity 9400" chipset is reportedly earmarked for mass production chez TSMC, with the foundry's second generation 3 Nm process being the favored node—this information aligns with official announcements as well as industry rumors from last autumn. MediaTek's Dimensity 9300 sports a "one-of-a-kind All Big Core design," with no provision for puny efficiency units—built on TSMC's third generation 4 nm process with four ARM Cortex-X4 cores (going up to 3.25 GHz) and four Cortex-A720 cores (maximum 2.0 GHz).

Digital Chat Station reckons that the 9300's All Big Core configuration will carryover to its next generation sibling, albeit with some major upgrades. MediaTek hardware engineers are alleged to have selected ARM's latest and greatest CPU and Mali GPU designs—the Cortex-X5 core could be a prime candidate in the first category. The rumor mill has the next batch of flagship Exynos SoCs utilizing ARM's fifth generation design. Digital Chat Station proposes that more smartphone manufacturers could adopt a top-flight Dimensity 2024 chip, if its performance can match the closest rivals. Industry experts posit both MediaTek and Qualcomm choosing TSMC's N3E process for their upcoming flagship chipsets—this node apparently "offers improved cost-effectiveness and superior yields" when compared to the first generation N3B process (as ordered by Apple for its latest M and B-series SoCs). Dimensity 9400 is expected to take on Snapdragon 8 Gen 4—this could be a tough fight, given that Qualcomm's offering is set to debut with custom Oryon cores.

MediaTek, one of the first adopters of Wi-Fi 7 technology, today announced that it is working closely within Wi-Fi Alliance to launch a complete first wave of Wi-Fi CERTIFIED 7 products, which will be featured as part of MediaTek's global ecosystem showcase at CES 2024. In an era where people rely on artificial intelligence to improve their lives and productivity, a fast and reliable network ensures consumers and professionals have the connectivity needed to utilize the latest AI tools. These devices, powered by MediaTek Filogic Wi-Fi CERTIFIED 7 chipsets, represent fast, reliable and always-on connected experiences for a wide variety of consumer and enterprise products, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

"As a technology leader, we make significant investments in formulating the standards that drive the industry, in addition to developing products that utilize those standards," said Alan Hsu, corporate vice president at MediaTek. "The recent announcement of our family of Wi-Fi CERTIFIED 7 chipset solutions has enabled us to work with Wi-Fi Alliance to provide testbeds for devices on both the access point and client sides, streamlining the product certification process for manufacturers."