Wi-Fi CERTIFIED 7 is here, introducing powerful new features that boost Wi-Fi performance and improve connectivity across a variety of environments. Cutting-edge capabilities in Wi-Fi CERTIFIED 7 enable innovations that rely on high throughput, deterministic latency, and greater reliability for critical traffic. New use cases - including multi-user AR/VR/XR, immersive 3-D training, electronic gaming, hybrid work, industrial IoT, and automotive - will advance as a result of the latest Wi-Fi generation. Wi-Fi CERTIFIED 7 represents the culmination of extensive collaboration and innovation within Wi-Fi Alliance, facilitating worldwide product interoperability and a robust, sophisticated device ecosystem.

Wi-Fi 7 will see rapid adoption across a broad ecosystem with more than 233 million devices expected to enter the market in 2024, growing to 2.1 billion devices by 2028. Smartphones, PCs, tablets, and access points (APs) will be the earliest adopters of Wi-Fi 7, and customer premises equipment (CPE) and augmented and virtual reality (AR/VR) equipment will continue to gain early market traction. Wi-Fi CERTIFIED 7 pushes the boundaries of today's wireless connectivity, and Wi-Fi CERTIFIED helps ensure advanced features are deployed in a consistent way to deliver high-quality user experiences.

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

GIGABYTE released the GC-WIFI7, a WLAN card in the PCIe add-on card form-factor, which, as its name suggests, gives your desktop the power of Wi-Fi 7. Given how the new wireless networking standard is exotic and provides a more than 2.2x gain in Wi-Fi bandwidth over Wi-Fi 6E, GIGABYTE decided to give this accessory its coveted AORUS Gaming branding and product design. The card supports tri-band, and a theoretical maximum bandwidth of 5800 Mbps, with support for 320 MHz and 160 Hz channels. The card also supports MLO, in which it simultaneously connects to a 2.4 GHz and 5/6 GHz network. The card comes with a stylish antenna array that supports up to 5 dBi signal strength. Besides Wi-Fi 7, the card also provides Bluetooth 5.3 connectivity.

The most interesting aspect about this product is that it has three hardware revisions at launch. The Rev 1.0 card is based on a Qualcomm chipset; Rev 1.1 is based on a MediaTek chipset, and Rev 1.2 is based on Intel, all three offering identical hardware specs and performance levels. Rev 1.0 is based on a Qualcomm QCA FastConnect 7800 controller; Rev 1.1 rocks a MediaTek MT7927 controller; while the Rev 1.2 uses an Intel BE200. All three revisions are sold under the same SKU, and it's only in a brick-and-mortar store that you can figure out what you want by looking closely at the barcode sticker, where the revision is mentioned. The company didn't reveal pricing.

MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.

Based on TSMC's 2nd generation 4 nm process, the Dimensity 8300 has an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm's latest v9 CPU architecture. With this powerful core configuration, the Dimensity 8300 boasts 20% faster CPU performance and 30% peak gains in power efficiency compared to the previous generation chipset. Additionally, the Dimensity 8300's Mali-G615 MC6 GPU upgrade provides up to 60% greater performance and 55% better power efficiency. Plus, the chipset's impressive memory and storage speeds ensure users can enjoy smooth and dynamic experiences in gaming, lifestyle applications, photography, and more.

MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with today's introduction of the company's new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.

SK hynix Inc. announced today that it has started supplying its customers with 16 gigabyte (GB) packages of Low Power Double Data Rate 5 Turbo (LPDDR5T), the fastest mobile DRAM available today that can transfer 9.6 gigabits per second (Gbps). Since the successful development of its LPDDR5T in January, SK hynix has been preparing to commercialize the product by conducting performance verification with global mobile application processor (AP) manufacturers.

SK hynix explained that LPDDR5T is the optimal memory to maximize the performance of smartphones, with the highest speed ever achieved. The company also emphasized that it would continue to expand the application range of this product and lead the generation shift in the mobile DRAM sector. The LPDDR5T 16 GB package operates in the ultra-low voltage range of 1.01 to 1.12 V set by the Joint Electron Device Engineering Council (JEDEC), and can process 77 GB of data per second, which is equivalent to transferring 15 full high-definition (FHD) movies in one second.

MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek's industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture and on-device generative AI processing.

"The Dimensity 9300 is MediaTek's most powerful flagship chip yet, bringing a huge boost in raw computing power to flagship smartphones with our groundbreaking All Big Core design," said Joe Chen, President at MediaTek. "This unique architecture, combined with our upgraded on-chip AI Processing Unit, will usher in a new era of generative AI applications as developers push the limits with edge AI and hybrid AI computing capabilities."

MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3 nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC, with both companies taking full advantage of their strengths in chip design and manufacturing to jointly create flagship SoCs with high performance and low power features, empowering global end devices.

"We are committed to our vision of using the world's most advanced technology to create cutting edge products that improve our lives in meaningful ways," said Joe Chen, President of MediaTek. "TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market."

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

Samsung Electronics and MediaTek completed the successful testing of 5G Standalone Uplink (UL) 2CC Carrier Aggregation (CA) with C-Band UL MIMO to reach top uplink speeds, marking a groundbreaking achievement in wireless mobile capabilities. This approach used three transmit (3Tx) antennas to improve upload experiences, ushering in an era of enhanced connectivity for consumers worldwide.

The demands on uplink performance are increasing with the rise of live streaming, multi-player gaming and video conferences. Upload speeds determine how fast your device can send data to gaming servers or transmit high-resolution videos to the cloud. As more consumers seek to document and share their experiences with the world in real-time, enhanced uplink experiences provide an opportunity to use the network to improve how they map out their route home, check player stats online and upload videos and selfies to share with friends and followers.

Banana Pi recently released the specifications of their upcoming BPI-R4 router SBC with a host of new connectivity and features over the last generation BPI-R3. The new BPI-R4 adds dual 10GbE via the SFP ports, with a second board design offering 10GbE+2.5GbE instead, as well as a large daughterboard addon that enables 36 Gbps tri-band WiFi 7 and fits to a pair of mPCIE connectors on the bottom. There is also now support for 5G cellular via a M.2 B-Key port laid over the top of a trio of NanoSIM card slots. Enabling this improvement in connectivity is the updated MediaTek 'Filogic 880' MT7988A SoC which features four Cortex-A73 cores at 1.8 GHz as well as a host of dedicated improvements specifically tuned for high speed networking which combines most functions into the single SoC. Now instead of surrounding the main processor with a host of co-processing chips like the BPI-R3 did, the BPI-R4 simply surrounds the SoC with 8 GB of DDR4 and an 8 GB eMMC flash module. The remaining wireless logic now lives on the NIC daughterboard. The BPI-R4 does give up one of its gigabit RJ-45 ports despite the topside space savings, but reuses this empty space by offering an optional plug-in POE module, and both a 12 V power input as well as 20 V USB-PD with the added Type-C port.

Features retained from previous generations are the M.2 M-Key for SSD storage expansion, a microSD card slot, rear facing USB 3.2 Type-A, the bootstrap toggle switch, and 26-pin GPIO. The BPI-R4 retains roughly the same physical dimensions as the BPI-R3 except for the additional height from the WiFi 7 module which hugs the bottom of the main board when installed. The BPI-R4, like its predecessors, will support Debian Linux and OpenWRT at launch with images available on the Banana Pi wiki product page. Banana Pi hopes to launch the BPI-R4 by Q1 2024 and has yet to announce any pricing. Our hope is that pricing stays roughly in line with the BPI-R3 which launched at just shy of $90 USD. Given the swath of new technologies on the BPI-R4 it's a fair guess that it is going to be over the $100 mark.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

A legal dispute between Realtek and MediaTek has kicked off over Realtek claiming that MediaTek has gotten a third party company to sue Realtek over some unspecified patents involving technology used in smart TVs and set-top boxes. The third party involved goes under the name of IPValue Management Inc and appears to be what is generally known as a patent troll, i.e. a company that buys up patents and uses them to take legal actions against other companies, without actually producing anything related to the patents in question. Realtek claims that MediaTek is conspiring with IPValue to drive Realtek out of the market, leaving Mediatek in a close to monopoly situation in the market.

According to Reuters, Realtek told the publication that it filed the lawsuit against MediaTek to "protect free and fair competition in the industry" and "prevent further harm to the public." Neither MediaTek or IPValue have commented on the lawsuit to the publication. What makes this entire mess even more peculiar, is that MediaTek is said to have a licensing agreement in place with a subsidiary of IPValue called Future Link System LLC, which was signed in 2019. This agreement was brought up by the U.S. International Trade Commission (ITC) in a separate lawsuit last year, with the ITC calling it alarming and the court calling it improper. After the ITC criticism last year, Future Link apparently settled with several other companies such as Amlogic, but not with Realtek, which is why the company is now taking things to court. Realtek claims that MediaTek is trying to force any allegedly infringing chips out of the market and trying to make Realtek look like an unreliable partner and supplier to its customers. As such, Realtek wants the court to end the alleged conspiracy and is also asking for damages. Time will tell if Realtek is successful or not, but it seems strange that a patent troll would agree to licence its patents to some parties, but not all, since the only reason for a patent troll to exist is to make money from its patents.

MediaTek, a leading innovator in connectivity and multimedia, is teaming with NVIDIA to bring drivers and passengers new experiences inside the car. The partnership was announced today at a COMPUTEX press conference with MediaTek CEO Rick Tsai and NVIDIA founder and CEO Jensen Huang.

"NVIDIA is a world-renowned pioneer and industry leader in AI and computing. With this partnership, our collaborative vision is to provide a global one-stop shop for the automotive industry, designing the next generation of intelligent, always-connected vehicles," said Tsai. "Through this special collaboration with NVIDIA, we will together be able to offer a truly unique platform for the compute-intensive, software-defined vehicle of the future."

"AI and accelerated computing are fueling the transformation of the entire auto industry," said Huang. "The combination of MediaTek's industry-leading system-on-chip plus NVIDIA's GPU and AI software technologies will enable new user experiences, enhanced safety and new connected services for all vehicle segments, from luxury to entry-level."

Acer today unveiled the Acer Connect Vero W6m mesh router, its first eco-friendly Wi-Fi 6E router that incorporates post-consumer recycled (PCR) materials in its chassis and features an Eco mode for efficient energy consumption. The router is powered by a quad-core 2 GHz processor and includes a bundle of enhanced connectivity, coverage, and security features, including Wi-Fi 6E Tri-Band AXE7800 capability.

"We are thrilled to expand Acer's portfolio of network devices with the launch of the Acer Connect Vero W6m Wi-Fi 6E mesh router, engineered with support for Wi-Fi 6E tri-band connectivity to provide swift and secure connections with vast network coverage within any home or office locations," said Wayne Ma, General Manger, IoB, Acer Inc. "The performance-driven router is also the latest addition to our growing Vero line of eco-conscious products, embodying Acer's commitment to fulfilling its environmental responsibility and helping minimize carbon footprint."
Fast and Seamless Wi-Fi 6E Connections

In its recent Second Quarter of the Fiscal Year 2023 conference, Synopsys issued interesting information about the recent moves of chip developers and their usage of artificial intelligence. As the call notes, over 200+ chips have been taped out using Synopsys DSO.ai place-and-route (PnR) tool, making it a successful commercially proven AI chip design tool. The DSO.ai uses AI to optimize the placement and routing of the chip's transistors so that the layout is compact and efficient with regard to the strict timing constraints of the modern chip. According to Aart J. de Geus, CEO of Synopsys, "By the end of 2022, adoption, including 9 of the top 10 semiconductor vendors have moved forward at great speed with 100 AI-driven commercial tape-outs. Today, the tally is well over 200 and continues to increase at a very fast clip as the industry broadly adopts AI for design from Synopsys."

This is an interesting fact that means that customers are seeing the benefits of AI-assisted tools like DSO.ai. However, the company is not stopping there, and a whole suite of tools is getting an AI makeover. "We unveiled the industry's first full-stack AI-driven EDA suite, sydnopsys.ai," noted the CEO, adding that "Specifically, in parallel to second-generation advances in DSO.ai we announced VSO.ai, which stands for verification space optimization; and TSO.ai, test space optimization. In addition, we are extending AI across the design stack to include analog design and manufacturing." Synopsys' partners in this include NVIDIA, TSMC, MediaTek, Renesas, and IBM Research, all of which used AI-assisted tools for chip design efforts. A much wider range of industry players is expected to adopt these tools as chip design costs continue to soar as we scale the nodes down. With future 3 nm GPU costing an estimated $1.5 billion, 40% of that will account for software, and Synopsys plans to take a cut in that percentage.

MediaTek is rumored to have partnered up with NVIDIA in a new joint effort to create graphically powerful mobile chipsets. DigiTimes Asia reports that the two fabless companies are collaborating on a flagship-level smartphone SoC that could arrive in early 2024. MediaTek is hoping that this tech union will help advance its application processors with AI enhancements and greater gaming functionalities. Insider sources also claim that the partnership extends to the development of WOA (Windows on Arm) platform products for notebook applications.

DigiTimes believes that NVIDIA is seeking new market scope - outside of its normal staple of gaming and enterprise GPUs - opportunities within the smartphone and notebook market are part of an overall expansion strategy, including the teaming up with MediaTek. Arch rival AMD has been working with Samsung for a number of years on RDNA-based "Xclipse" iGPUs, as featured in several existing and upcoming flagship Exynos mobile chipsets, and Team Green is seemingly interested in doing something similar. MediaTek is keen to expand its processor presence in the notebook world - its current offerings only target the entry-level segment - and the alliance with NVIDIA could result in forthcoming mid-range and high-end WOA platform products.

MediaTek has been unveiling some new mobile chipsets this week, but keen-eyed news outlets have noticed that the Taiwanese fabless semiconductor company is simply renaming and relaunching hardware from last year, with some tweaks here and there. Today's announcement of the Dimensity 8050 SoC was almost immediately questioned - GSMArena noticed that this "new" model was a near dead ringer, in terms of specifications, for last year's mid-range Dimensity 1300 and 1200 smartphone chipsets. There are some upgrades in terms of memory bandwidth, and MediaTek boasts that the 8050 has been updated with its sixth generation HyperEngine technology.

Alarm bells were ringing when folks realized that the much older Dimensity 8000 SoC was built on a 5 nm process - the supposedly superior (in terms of model number hierarchy) 8005 is a 6 nm chip. Last week the mobile specialist site also spotted that MediaTek's Dimensity 7050 chipset was yet another example of the smartphone tech company rolling out a "rebranding phase." The news outlet pointed out that this newly revealed mobile CPU was just a renamed Dimensity 1080 - with the original model having hit the market in November 2022. MediaTek seems to renaming several older chipsets based on TSMC's 6 nm process - it is possible that this effort is part of a company drive to clear surplus silicon.

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

TPU doesn't normally cover TVs, but at Touch Taiwan had a new gaming focused TV panel that might very well end up in some very high-end gaming "monitors" as well. The panel is a 65-inch model that supports 7680 x 4320 resolution at up to 120 Hz. However, the high-end specs don't stop there, as the panel has a 4,608 zone full array local dimming backlight, which gives it a typical brightness of 400 cd/m², but it can go up to 1,800 cd/m² at 10 percent areas in HDR mode.

As with the 4K display panel we wrote about earlier, this TB panel also features AUO's A.R.T. "reflectionless" feature, which should prevent it from being overly reflective in brightly lit areas. The demo panel was powered by MediaTek's Pentonic 2000 SoC, which is currently one of the highest-end 8K TV processors and potentially the only one with support for H.266 video decoding. Sadly we don't have any indication on which TV manufacturers will use the new display, but regardless of the brand, we expect the retail products to be very expensive.

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.

Softbank, the owner of Arm Ltd., is preparing everything it can to ensure a successful initial public offering (IPO) of Arm. However, ahead of the IPO, we have more information about Arm's plans to change its licensing and pricing structures to collect more royalties and ensure higher cash flow for future investors. Currently, Arm licenses technology in the form of intellectual property (IP), usually in different flavors of Cortex-A CPU cores that go inside processors for phones and laptops. Chipmakers that use the IP have additional expenses such as Arm ISA license fee and per-chip royalty, which is based on the chip's average selling price.

However, according to Financial Times, we have a new pricing structure that changes how Arm bills its partners and customers. From now on, Arm will grant licenses to chipmakers and ask them to only ship to device makers with an agreement with Arm. Additionally, these device makers now pay per-device royalty based on the device's average selling price (ASP). This ensures that Arm's fee applies to the higher margin product, which means that ultimately Arm will collect more cash flow from its customers and partners. Currently, the old model charges around 1-2 percents per chip in each smartphone, considering the ASP of smartphone chips to be $40 for Qualcomm, $17 for MediaTek, and $6 for Unisoc. However, taking the ASP of a mobile phone at $335, as recorded in 2022, the fee would be much higher. People familiar with the matter noted that Arm will apply this pricing structure as early as 2024. Apple and Samsung are not impacted by this change, as both companies enjoy their own agreements with Arm.

Today, Lenovo announced the latest 8th generation of Lenovo Legion Slim laptops, allowing gamers to harness the freedom that the newest series has to offer. The Lenovo Legion Slim series is all about empowering players to crush their gaming goals while also pursuing their creative passions, and there are more options than ever among the new Lenovo Legion Slim 7i and 7 (16", 8), Lenovo Legion Slim 5i and 5 (16", 8), and—an all-new size for this year—the Lenovo Legion Slim 5 (14", 8), which elevates laptop power and portability to a whole new level. This newest generation of the series is also the first to sport the Lenovo Artificial Intelligence (LA) family of chips. These are onboard physical AI chips that power Lenovo AI Engine+, which dynamically adjusts the Lenovo Legion ColdFront 5.0 thermals to optimize cooling on the fly and maintain maximum output with minimal noise.

Lenovo Legion Slim series laptops are designed to meet the multi-faceted needs of gamers, with an SD slot, rapid charging battery technology Windows 11, three months of free Xbox Game Pass Ultimate, as well as access to Nahimic by SteelSeries 3D immersive audio, and Lenovo Vantage helping users get the most out of their machines. Offering peace of mind, Lenovo's Legion Ultimate Support service is available with round-the-clock tech support, guidance and assistance so gamers don't have to miss a beat, and with Legion Arena, users can create their ultimate gaming hub with all their titles accessible in one place rather than having to switch between apps. Additionally, gamers looking to expand their horizons—literally—can look forward to the new Lenovo Legion R45w-30 44.5" 32:9 ultrawide curved display and the new Lenovo Legion Y34wz-30 Gaming Monitor that delivers extreme clarity and vivid color with its 34-inch mini-LED backlit panel.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

ASUS today announced the newest additions to the ASUS Chromebook family—the 14-inch ASUS Chromebook CM14 and ASUS Chromebook CM14 Flip. With a fresh, stylish look and flexible designs these dynamic laptops are primed to boost productivity and empower fun, all day, every day.

Powered by an efficient MediaTek Kompanio 520 processor and with up to a 15-hour battery life, the new CM14 models deliver the freedom to stay productive throughout the day. These attractive, modern laptops also open a gateway to the best of Google, including the rich library of apps for work and leisure found on Google Play, and benefit from WiFi 6 for fast, stable connectivity at home, at the office, in the classroom or on the go.