AMD (NYSE:AMD) today announced revenue for the second quarter of 2012 of $1.41 billion, net income of $37 million, or $0.05 per share, and operating income of $77 million. The company reported non-GAAP net income of $46 million, or $0.06 per share, and non-GAAP operating income of $86 million.

"Overall weakness in the global economy, softer consumer spending and lower channel demand for our desktop processors in China and Europe made the closing weeks of the quarter challenging," said Rory Read, AMD president and CEO. "We are taking definitive steps to improve our performance and correct the issues within our control as we expect headwinds will continue in the third quarter as the industry sets a new baseline. We remain optimistic about our core businesses as well as future opportunities with our competitively differentiated next-generation Accelerated Processor Units (APUs). Our recently launched Trinity APU continues to gain traction with customers. We are committed to driving profitable growth."

Today at the AMD Fusion Developer Summit (AFDS), global technology leaders came together to announce the formation of the Heterogeneous System Architecture (HSA) Foundation. The HSA Foundation is a non-profit consortium established to define and promote an open, standards-based approach to heterogeneous computing that will provide a common hardware specification and broad support ecosystem to make it easier for software developers to deliver innovative applications that can take greater advantage of today's modern processors.

AMD, ARM, Imagination Technologies, MediaTek Inc., and Texas Instruments (TI) are the initial founding members of the HSA Foundation. The companies will work together to drive a single architecture specification and simplify the programming model to help software developers take greater advantage of the capabilities found in modern central processing units (CPUs) and graphics processing units (GPUs), and unlock the performance and power efficiency of the parallel computing engines found in heterogeneous processors.

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, announced today the world's first 1T1R 802.11ac dual-band concurrent Wi-Fi router and dongle solutions. MT7620 + MT7610E and MT7610U provide the mass market with 1T1R 802.11ac router and dongle to enable high quality data transmission, voice and video applications in connected homes. MediaTek will demonstrate its latest wireless technologies, connectivity devices and applications to its customers during Computex Taipei 2012.

MT7620 family integrates a 2T2R 802.11n Wi-Fi radio, a 600 MHz MIPS 24KEc CPU, 5p FE switch, 2xrGMII, USB, PCIe, SD-HC. The PCI Express interface will connect to 2nd Wi-Fi chipset for 11n 2x2 DBC router or to an 11ac chipset for 1x1 DBC 11ac routers. The high performance USB 2.0 allows MT7620 to add 3G/LTE support on a router or can add a UVC cam to enable the best cost/performance IP-Cam. And to support the wireless storage application, MT7620 supports NAND flash interface, SD-HC, USB 2.0 and storage accelerator for NAS, Wi-Fi HDD and Wi-Fi card reader. Audio interface I2S and PCM will enable wireless speaker and VoIP applications. MT7620 also steps up to the leading Hardware Network Address Translation (HNAT) milestone by supporting 2Gbps wired speed with IPv6 forwarding. The cost effective rGMII iNIC interface (2.4G or dual-band concurrent) can be utilized for cable, PON, xDSL and broadband wireless router.

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced that its Wi-Fi system-on-a-chip (SoC), the RT6856, has been incorporated into D-Link's latest Wi-Fi cloud routers. As a global leader in connectivity, D-Link will be shipping several new cloud routers this spring.

The MediaTek RT6856 Wi-Fi SoC contains a powerful 700 MHz MIPS 34KEc CPU core and dual PCI Express interfaces to simultaneously enable two Wi-Fi streams for "dual band concurrent" home networks providing high quality data, voice and video applications. This powerful SoC allows consumers to create two wireless networks both running at full bandwidth speeds, thus offering a significant increase in total network capacity.

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced availability of its MT7650, the world's first and only 802.11ac plus Bluetooth 4.0+HS combo chip designed for mobile consumer platforms. The MediaTek MT7650 combines the latest IEEE 802.11ac technology, Bluetooth 4.0 LE functionality, and the company's unprecedented Wi-Fi/Bluetooth coexistence algorithm onto a single die to support high quality voice, data and video transmissions up to 433 Mbps, while enabling ultra low power Bluetooth Low Energy connectivity with health, fitness and other sensors. Moreover, with the complete 802.11ac system (MAC/Baseband/Radio) integrated, customers adopting the MediaTek MT7650 also benefit from easier implementation, faster time to market and reduced manufacturing costs.

The MediaTek MT7650 is compliant with the new 802.11ac standard and leverages the strengths of MediaTek's industry leading Wi-Fi plus Bluetooth combo chip technologies that are currently shipping in laptops and smartphones. It dramatically improves user experience with 2.8x data rate increase from 150Mbps of single stream 802.11n. This highly integrated chip supports dual band 2.4/5GHz configuration with 80 MHz channel bandwidth, 256-QAM modulation scheme for increased data transfer efficiency, receive beam forming for extended range and capacity, and Space-Time Block Codes (STBC) coding technologies for better wireless coverage. This chip also supports Wi-Fi Display, Wi-Fi Direct and TDLS for full peer-to-peer functionalities between mobile and home consumer products.

Rambus Inc., one of the world's premier technology licensing companies, announced today it has signed a patent license agreement with MediaTek Inc. This agreement covers the use of Rambus patented innovations in a broad range of integrated circuit (IC) products offered by MediaTek Inc. In addition, the two companies have settled all outstanding claims, including resolution of past use of Rambus' patented innovations. The term of this patent license agreement is five years. Other terms of the agreement are confidential.

"Consumer demand for increasing flexibility in electronic products is at the forefront of disruptive change. We are pleased to sign this agreement with MediaTek, one of the global leaders in SoC systems solutions, to enable greater mobility and accessibility for consumer devices," said Sharon Holt, senior vice president and general manager of the Semiconductor Business Group at Rambus. "We are committed to the development of innovative new technologies that help our licensees bring superior products to market."