Intel has plans to expands its chip packaging and testing operations in Chengdu, China. The company will put $300 million into Intel Products (Chengdu), as stated in a WeChat post by Chengdu's Reform and Development Commission, and reported by TrendForce. Intel announced its Chengdu plant in August 2003 as a semiconductor chip packaging and testing facility in the Chengdu Hi-Tech West Zone. The first phase began in February 2004 with the construction of a chipset factory, which was completed and put into production by the end of 2005. The second phase commenced in August 2005 and was completed in October 2006. By 2007, the packaging and testing facility was fully operational, handling Intel's most advanced processors.

Since its launch in 2003, Intel's Chengdu plant has handled over half of the packaging and testing for Intel's laptop processors. Even with rising US-China tensions, China remains Intel's biggest market making up 27 percent of its total income last year. The announced expansion will increase the packaging and testing ability of server chips and will add a new "customer solutions center." This center aims to make the supply chain more effective, give more support to Chinese customers, and speed up response times. Intel's Chengdu site plays a key role in the company's global supply chain, benefiting from the area's "favorable" business climate, CEO Patrick Gelsinger said during his visit last year.

Intel has been planning to build its next-generation semiconductor manufacturing plant in Germany for a long time. Today, we have more information thanks to the Handelsblatt business and financial newspaper. According to the Handelsblatt, Intel is in talks with the German government to get as much as 9.9 billion Euros in state subsidies, a target price much higher than the previously agreed 6.8 billion Euros. Federal Economics Minister Robert Habeck has been reportedly working intensively to get the amount of state aid for Intel to be this high. Intel's CEO Patrick Gelsinger is supposed to seal the deal on Monday when he will sign the agreement in the Chancellery.

As reported, the location of the next-generation facility will be Saxony-Anhalt, with the more precise location to be known on Monday. Also, we expect to hear what manufacturing node will the upcoming facility produce at the beginning.

The midnight bell seems to have struck for Intel CEO Bob Swan, with Intel announcing his departure from the CEO position effective February 15th. The news comes after a two-year tenure as Intel's CEO, in addition to seven additional months in which Bob Swan served as interim Intel CEO before officially assuming the position. VMWare CEO Pat Gelsinger will take over the CEO chair, and following this announcement, Intel's stock surged by more than 10%, while VMWare's stock dipped by 5% on the prospect of losing its CEO.

Patrick Gelsinger formerly served under Intel, where he climbed the ranks until reaching the coveted CTO position - and also served as Senior Vice-president and General Manager of the Digital Enterprise Group. He is also credited as being one of the driving forces behind the creation of standards such as USB and Wi-Fi, architected the 80486, and played key roles in 14 generations of Intel Core and Xeon processors. Investors expect Gelsinger's technical background to help steer Intel into less troubled waters when it comes to strategy and execution. in wake of Bob Swan's departure, Intel also announced that it expects fourth quarter 2020 revenue and earnings to exceed prior guidance, and that it will take to its January 21st earnings report to discuss the "strong progress" achieved by the company in the in-development 7 nm node.