Large on-die caches are expected to be a major contributor to IPC and gaming performance. The upcoming AMD Ryzen 7 5800X3D processor triples its on-die last-level cache using the 3D Vertical Cache technology, to level up to Intel's "Alder Lake-S" processors in gaming, while using the existing "Zen 3" IP. Intel realizes this, and is planning a massive increase in on-die cache sizes, although spread across the cache hierarchy. The next-generation "Raptor Lake-S" desktop processor the company plans to launch in the second half of 2022 is rumored to feature 68 MB of "total cache" (that's AMD lingo for L2 + L3 caches), according to a highly plausible theory by PC enthusiast OneRaichu on Twitter, and illustrated by Olrak29_.

The "Raptor Lake-S" silicon is expected to feature eight "Raptor Cove" P-cores, and four "Gracemont" E-core clusters (each cluster amounts to four cores). The "Raptor Cove" core is expected to feature 2 MB of dedicated L2 cache, an increase over the 1.25 MB L2 cache per "Golden Cove" P-core of "Alder Lake-S." In a "Gracemont" E-core cluster, four CPU cores share an L2 cache. Intel is looking to double this E-core cluster L2 cache size from 2 MB per cluster on "Alder Lake," to 4 MB per cluster. The shared L3 cache increases from 30 MB on "Alder Lake-S" (C0 silicon), to 36 MB on "Raptor Lake-S." The L2 + L3 caches hence add up to 68 MB. All eyes are now on "Zen 4," and whether AMD gives the L2 caches an increase from the 512 KB per-core size that it's consistently maintained since the first "Zen."

AMD already declared the CPU core counts of its EPYC "Genoa" and "Bergamo" processors to top out at 96 and 128, respectively, a core-count believed to have been facilitated by the larger fiberglass substrate of the next-gen SP5 CPU socket, letting AMD add more 8-core "Zen 4" chiplets, dubbed CPU complex dies (CCDs). Until now, AMD has used the chiplet as a common component between its EPYC enterprise and Ryzen desktop processors, to differentiate CPU core counts.

A fascinating theory that hit the rumor-mill, indicates that the company might leverage 5 nm (TSMC N5) carve out larger CCDs with up to 16 "Zen 4" CPU cores. Half of these cores are capped at a much lower power budget, essentially making them efficient-cores. This is a concept AMD appears to be carrying over from its 15-Watt class mobile processors, which see the CPU cores operate under an aggressive power-management. These cores still turn out a reasonable amount of performance, and are functionally identical to the ones on 105 W desktop processors with a relaxed power budget.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.60, Engineer 6.60, Business 6.60, and Network Audit 6.60 software. The latest AIDA64 update introduces optimized benchmarks for Intel "Alder Lake" and "Raptor Lake" processors, improvements for DDR5 memory modules and XMP 3.0 memory profiles, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.

The AIDA64 product family for Windows PCs consists of three business editions and a home edition. The company's flagship IT asset management offering with hardware diagnostic features is AIDA64 Business, while a dedicated network inventory solution called AIDA64 Network Audit is also available, for a lower license fee. Designed for corporate engineers and IT technicians, AIDA64 Engineer includes expert tools not available in AIDA64 Extreme, the home edition of the software. Today all four AIDA64 editions are updated to v6.60.

With Intel's Alder Lake processor generation launch, the platform merges support of two different DDR memory standards: DDR4 and DDR5. While there are motherboards that offer the latest DDR5 standard, there are boards that provide users to use the cheaper DDR4 memory option in their builds as we transition to the newer standard and newer memory becomes more available. The DDR5 products are currently on the expensive side, and DDR4 represents a good choice for creating a PC build in the following years, at least in the transition to DDR5 standard's better availability and lower prices.

According to Moore's Law is Dead Twitter account, the DDR4 support may reside for a little longer on Intel's platforms. As per their sources, Intel's 13th generation Core processors, codenamed Raptor Lake, will carry over DDR4 platform support and possibly retain compatibility with the 12th generation Alder Lake platform. That means that the Z690 and future H670/B660/H610 boards could be compatible with Raptor Lake-S and also carry support for the DDR4 memory protocol for it. This could indicate that Alder Lake-S buyers that build PCs with DDR4 memory could have a viable processor upgrade path without upgrading the memory. Of course, information like this should be taken with a grain of salt.

The Chinese source who published the first images of the Intel LGA1700 socket and Z690 chipset has now revealed some new information regarding the upcoming Alder Lake, Sapphire Rapids-X, and Raptor Lake products. The rumor claims that Intel will launch the W790 Workstation HEDT chipset in Q3 2022 alongside the 13th Generation Sapphire Rapids-X desktop series. This would be the first new HEDT launch from Intel in over 3 years with the previous 10th Gen Cascade Lake processors launching back in April 2019.

The rumor also states that Intel will launch the 13th Generation Raptor Lake desktop processors at the same time as their Sapphire Rapids-X HEDT lineup. There is also a note about Intel releasing the entire 600-series motherboard lineup in 2021 which is contrary to previous rumors which stated that Intel would only make the Z690 chipset available this year. This would be followed by a complete launch of all 12 Generation Alder Lake desktop processors and not just the overclockable K-series. This is the first time we have heard these rumors so while they come from a semi-reliable leaker we would recommend taking them with a healthy dose of skepticism.

Here's the first picture of Intel's upcoming mainstream desktop processor socket, the LGA1700, which was until now only seen in renders or technical drawings. The socket is characterized by a more rectangular contact pad than previous Intel sockets. The Socket H family (LGA115x and LGA1200) that ruled Intel MSDT sockets for over a decade, has a largely square pad. Intel's HEDT sockets such as the LGA1366, LGA2011 and LGA2066, on the other hand, had a rectangular pad, though not as pronounced (slender) as the LGA1700.

From the looks of it, the retention mechanism of the LGA1700 appears similar to that of Socket H and most other Intel LGA sockets (though dissimilar from the LGA2011/LGA2066). In its client desktop avatar, the LGA1700 has 100 unused pins. This is because the socket is physically identical to the LGA1800, which is speculated to be left for future generations of Intel processors with additional power or I/O pins. The Z-height of LGA1700 is lower than that of Socket H, which entails a major change in the retention module design of most aftermarket CPU cooling solutions.

Intel's 13th Gen Core "Raptor Lake-S" desktop processor could come with core counts as high as 24, overtaking AMD's number for mainstream desktops, for the first time since 2017. There is, however, a big catch, The 24-core chip could comprise of 8 "big" P-cores, and 16 "little" E-cores, according to a report by AdoredTV. The silicon features 8 "Raptor Cove" P-cores, which succeed "Golden Cove," introducing IPC and instruction-set improvements; while the type of low-power E-cores remains to be determined. AdoredTV predicts that the Core i9 brand extension could max out the silicon with 8+16 cores, while lower Core i7 SKUs could be 8+8 cores, and Core i5 6+8 cores. The TDP of Unlocked K SKUs could be rated at 125 W, and the other "locked" ones at 65 W.