Assassin's Creed Shadows is seemingly not out of hot water with gamers just yet, although this time, the flak seems to have been mostly unwarranted. Earlier this week, rumors popped up on Reddit claiming to reveal the Assassin's Creed Shadows Animus Hub, which was supposedly the upcoming RPG's dedicated launcher, and a host of in-game season passes and rewards. The leak purports to detail the first free battle pass, which is referred to as "Eye in the Dark" and will consist of 20 reward tiers. Completing the battle pass allegedly rewards 9,050 Isu coins, which can be used to purchase various cosmetics in the form of character, weapon, and mount customization options. Somewhat comically, there appear to be in-game collaborations with the likes of VISA, Red Bull, Intel, BAPE Clothing and Sprecher, although how these will play out in the game is a mystery. This news made quite a stir when it was first announced, since Ubisoft was very clear when it confirmed the game's delay last month that there would be no season passes in Assassin's Creed Shadows.

As it turns out, though, the rumors were kicking up enough speculation about the return of paid subscriptions, battle passes, and season passes that Ubisoft took to its official Discord server to address the rumors directly. Although Ubisoft confirmed that the Animus Hub is a piece of software it has been working on, all the content and rewards offered in the Animus Hub will be free content. Ubisoft was, however, careful with its words, not denying the existence of season passes and battle passes, instead only commenting that those passes will not be paid. Additionally, Ubisoft confirmed that there will be additional in-game content available for free in the Animus Hub.

Speculated lower-end Intel second generation Arc GPUs popped up via SiSoftware Sandra database entries around mid-March—evaluation samples are likely in the hands of trusted hardware partners. Yesterday, momomo_us happened upon another interesting shipping manifest, following a series of AMD-related leaks. The latest list reveals five "Battlemage" products—three utilizing the BMG-21 GPU, and the remaining two being based on the BMG-10 design. These identifiers have appeared in older leaks, although the latter has been viewed in place sight—chez Intel Malaysia's Failure Analysis Lab.

Previous leaks suggest that these second generation Arc models (Xe2) reside within a "High-Performance Graphics" (HPG) discrete GPU family—the Xe2-HPG BMG-10 range is likely targeting an "enthusiast" market segment, while the Xe2-HPG BMG-21 tier is rumored to offer mid-tier performance. Intel staffers have expressed confidence about a possible late 2024 launch window. Back in January, Tom "TAP" Petersen revealed that the Arc hardware team had already moved onto third-gen "Celestial" GPU endeavors: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing." The first-gen deck has not been cleared fully it seems—the Alchemist family could be joined by two new variants in the near future.

A CPU-Z screenshot has been shared by YuuKi_AnS—the image contains details about an alleged next-gen Intel Xeon Scalable processor engineering sample (ES). The hardware tipster noted in (yesterday's post) that an error had occurred in the application's identification of this chunk of prototype silicon. CPU-Z v2.09 has recognized the basics—an Intel Granite Rapids-SP processor that is specced with 80 cores, 2.5 GHz max frequency, a whopping 672 MB of L3 cache, and a max. TDP rating of 350 W. The counting of 320 threads seems to be CPU-Z's big mistake here—previous Granite Rapids-related leaks have not revealed Team Blue's Hyper-Threading technology producing such impressive numbers.

The alleged prototype status of this Xeon chip is very apparent in CPU-Z's tracking of single and multi-core performance—the benchmark results are really off the mark, when compared to finalized current-gen scores (produced by rival silicon). Team Blue's next-gen Xeon series is likely positioned to catch up with AMD EPYC's deployment of large core counts—"Granite Rapids" has been linked to the Intel 3 foundry node, reports from last month suggest that XCC-type processors could be configured with "counts going up to 56-core/112-threads." Micron is prepping next-gen "Tall Form Factor" memory modules, designed with future enterprise processor platforms in mind—including Intel's Xeon Scalable "Granite Rapids" family. Industry watchdogs posit that Team Blue will be launching this series in the coming months.

Shipping manifests appear to be great sources of pre-release information—only a few hours ago, the existence of prototype AMD "Strix Point" and "Fire Range" mobile processors was highlighted by hardware sleuth harukaze5719. A related leak has appeared online fairly quickly after the discovery of laptop-oriented "Zen 5" chips. momomo_us joined in on the fun, with their exposure of speculated desktop silicon. Two brand-new AMD OPN codes have been linked to the upcoming "Granite Ridge" series of AM5 processors.

100-000001404-01 is likely an eight-core/ sixteen-thread "Zen 5" Ryzen CPU with a 170 W TDP—a stepping designation, B0, indicates engineering sample status. The other listing, 100-000001290-21, seems to be an A0-type engineering sample—leaked info suggests that this a six-core/twelve-thread (105 W TDP) next-gen mainstream desktop processor. AMD is likely nearing the finish line with its Ryzen 9000-series—a new generation of chipsets, including X870E, is reportedly in the pipeline. Additionally, VideoCardz posits that a refresh of 700-series boards could be on the cards. "Granite Range" CPUs are expected to retain the current-gen 6 nm client I/O die (cIOD), as sported by "Raphael" Ryzen 7000-series desktop processors.

The Taiwanese Ministry of Economic Affairs (MOEA) managed to herd government representatives and leading Information and Communication Technology (ICT) industry figures together for an important meeting, according to DigiTimes Asia. The report suggests that the main topic of discussion focused on an anticipated growth of Taiwan's ICT industry—current market trends were analyzed, revealing that the nation absolutely dominates in the AI server segment. The MOEA has (allegedly) determined that Taiwan has shipped 90% of global AI server equipment—DigiTimes claims (based on insider info) that: "American brand vendors are expected to source their AI servers from Taiwanese partners." North American customers could be (presently) 100% reliant on supplies of Taiwanese-produced equipment—a scenario that potentially complicates ongoing international tensions.

The report posits that involved parties have formed plans to seize opportunities within an evergrowing global demand for AI hardware—a 90% market dominance is clearly not enough for some very ambitious industry bosses—although manufacturers will need to jump over several (rising) cost hurdles. Key components for AI servers are reported to be much higher than vanilla server parts—DigiTimes believes that AI processor/accelerator chips are priced close to ten times higher than general purpose server CPUs. Similar price hikes have reportedly affected AI adjacent component supply chains—notably cooling, power supplies and passive parts. Taiwanese manufacturers have spread operations around the world, but industry watchdogs (largely) believe that the best stuff gets produced on home ground—global expansions are underway, perhaps inching closer to better balanced supply conditions.

There has been plenty of leaked activity on the Xbox front lately—late last month a couple of extra details emerged regarding the oft-rumored physical media-less Xbox Series S refresh. Exputer's exclusive follow-up piece included a set of very low resolution shots—an insider managed to capture an apparent "white-colored Xbox Series X that features a digital-only format" out in an unknown environment/context. The images were sent via email according to the Exputer report. As expected, the less than adequate photos showcase a white device that shares the existing black Xbox Series X's overall design language, albeit minus a slot for optical media.

Exputer believes that: "peripherals and ports remain pretty much the same," when analyzing the unit's rear section. Many folks were expecting Microsoft to roll out the cylindrical "Project Brooklin" design (leaked in FTC court case documentation), but reports from last month indicated that the refresh would recycle the standard elongated cube aesthetic. Exputer has reiterated a rumored price point of "$50 to $100" below the standard Xbox Series X MSRP of $499. Internal upgrades are speculated to include an improved heatsink and a modernized wireless network card.

Samsung debuted its Mach-1 generation of AI processors during a recent shareholder meeting—the South Korean megacorp anticipates an early 2025 launch window. Their application-specific integrated circuit (ASIC) design is expected to "excel in edge computing applications," with a focus on low power and efficiency-oriented operating environments. Naver Corporation was a key NVIDIA high-end AI customer in South Korea (and Japan), but the leading search platform firm and creator of HyperCLOVA X LLM (reportedly) deliberated on an adoption alternative hardware last October. The Korea Economic Daily believes that Naver's relationship with Samsung is set to grow, courtesy of a proposed $752 million investment: "the world's top memory chipmaker, will supply its next-generation Mach-1 artificial intelligence chips to Naver Corp. by the end of this year."

Reports from last December indicated that the two companies were deep into the process of co-designing power-efficient AI accelerators—Naver's main goal is to finalize a product that will offer eight times more energy efficiency than NVIDIA's H100 AI accelerator. Naver's alleged bulk order—of roughly 150,000 to 200,000 Samsung Mach-1 AI chips—appears to be a stopgap. Industry insiders reckon that Samsung's first-gen AI accelerator is much cheaper when compared to NVIDIA H100 GPU price points—a per-unit figure of $3756 is mentioned in the KED Global article. Samsung is speculated to be shopping its fledgling AI tech to Microsoft and Meta.

AMD's next-gen EPYC Zen 5 processor family seems to be nearing launch status—late last week, momomo_us uncovered an unnamed motherboard's datasheet; this particular model will accommodate a single 9000-series CPU—with a maximum 400 W TDP—via an SP5 socket. 500 W and 600 W limits have been divulged (via leaks) in the past, so the 400 W spec could be an error or a: "legitimate compatibility issue with the motherboard, though 400 Watts would be in character with high-end Zen 4 SP5 motherboards," according to Tom's Hardware analysis.

AMD's current-gen "Zen 4" based EPYC "Genoa" processor family—sporting up to 96-cores/192-threads—is somewhat limited by its DDR5 support transfer rates of up to 4800 MT/s. The latest leak suggests that "Turin" is upgraded quite nicely in this area—when compared to predecessors—the SP5 board specs indicate DDR5 speeds of up to 6000 MT/s with 4 TB of RAM. December 2023 reports pointed to "Zen 5c" variants featuring (max.) 192-core/384-thread configurations, while larger "Zen 5" models are believed to be "modestly" specced with up to 128-cores and 256-threads. AMD has not settled on an official release date for its EPYC "Turin" 9000-series processors, but a loose launch window is expected "later in 2024" based on timeframes presented within product roadmaps.

The recent PlayStation 5 Pro specification leak has caused quite a stir—even games development studios were surprised by some of these details. Chris Dring (Head of GamesIndustry.biz) attended last week's GDC industry event, where he met many developers who "did not understand the point" of Sony's upcoming mid-generation console refresh. The most hardcore segment of the current PS5 userbase will likely enthusiastically embrace a more powerful variant, but Dring's observations indicate that development studios are not expressing as much excitement—over a refreshed model—as the gaming community. This topic was discussed during yesterday's GamesIndustry.biz Microcast—industry figures believe that the base PlayStation 5 model's full potential remains untapped.

This mirrors a debate over a possible upgraded Xbox Series variant—gaming fans have complained about restrictive 30 FPS performance, even on the more potent Series X console; but experts believe that developers need to spend more time optimizing their software or produce "truly next-gen" experiences. Dring's sources expressed doubt about the PS5 Pro's predicted ability to "grow the market" or "move the needle"—ultimately, Sony will make some more money and gain headline coverage post-launch. The refreshed variant is expected to reach retail later this year, but industry watchdogs reckon that momentum will be lost due to the absence of a system-selling title around launch time. Grand Theft Auto VI would be the ideal "killer app," but insider murmurs posit a delay into 2026.

An intriguing offshoot of Intel's Meteor Lake generation of processors has been discovered by hardware sleuth momomo_us—an iBase MI1002 motherboard specification sheet contains references to a 14th Gen Core Ultra (Meteor Lake-PS) family, with a next-gen LGA1851 socket listed as the desktop platform. The industrial iBase Mini-ITX workstation board is "coming soon" according to a promotional image—this could signal a revival of Meteor Lake outside of laptop platforms. 2023 was a bit of a rollercoaster year for MTL-S SKUs (on socket LGA1851)—one moment Team Blue confirmed that it was happening, then a couple of days later it was disposed of. The upcoming Arrow Lake processor generation seems to be the logical taker of this mantle, but the (leaked) existence of Meteor Lake-PS throws a proverbial spanner into the works.

iBase's MTL-PS-ready boards will be niche "industrial/embedded" items—according to Tom's Hardware: "Intel hasn't officially revealed Meteor Lake PS, but given the "PS" designation, these upcoming processors target the IoT market, similar to Alder Lake PS. Therefore, it's safe to assume that Intel is bringing the mobile Meteor Lake processors to the LGA1851 socket...Although the motherboard has (this) socket, no chipset is present because Meteor Lake PS is the spitting image of the Meteor Lake chip and doesn't need a PCH." Team Blue is hyping up Arrow Lake (ARL-S) as its next-gen mainstream desktop platform, with a launch window set for later in 2024—by sharp contrast, Meteor Lake PS parts are highly unlikely to receive much fanfare upon release.

Intel is quietly working on second generation Arc GPUs—we have not heard much about Xe2 "Battlemage" since CES 2024. Back in January, Tom "TAP" Petersen—an Intel fellow and marketing guru—casually revealed during an interview conducted by PC World: "I'd say about 30% of our engineers are working on Battlemage, mostly on the software side because our hardware team is on the next thing (Celestial)...Battlemage has already has its first silicon in the labs which is very exciting and there's more good news coming which I can't talk about right now." Intel appears to be targeting a loose late 2024 launch window; Petersen stated that he would like to see second generation products arrive at retail before CES 2025's commencement. The SiSoftware Sandra database was updated around mid-March with two very intriguing new Intel GPU entries—test systems (built on an ASUS PRIME Z790-P WIFI mainboard) were spotted running graphics solutions "equipped with 20 Xe-Core (160 EU) and 24 Xe-Cores (160 EU)."

Michael/miktdt commented on the freshly discovered database entries: "some smaller versions are on Sisoft...I guess they are coming. Single-float GP Compute looks quite good for just 160 VE/192 VE. Doesn't tell much about the release though, I guess anything between Q4 2024 and Q2 2025 is a possibility." Both models seem to sport 11.6 GB VRAM capacities—likely 12 GB—and 8 MB of L2 cache. Wccftech has guesstimated potential 192-bit memory bandwidth for these speculative lower-level GPUs. Team Blue has a bit more tweaking to do—based on leaked figures—but time is on their side: "the performance per core for Alchemist currently sits an average of 16% faster than the alleged Battlemage GPU which isn't a big deal since driver-level optimizations and final silicon can give a huge boost when the retail products come out."

The "iVRy VR" community-backed project has slowly chipped away at unlocking the PlayStation VR2's full potential—Sony's $550 (MSRP) virtual reality headset is locked into the PlayStation 5 ecosystem, but many gamers have requested that it become compatible with PC platforms. iVRy's progress on this front could be surpassed by first-party efforts—a month ago, Sony indicated that it was exploring new avenues: "we're pleased to share that we are currently testing the ability for PS VR2 players to access additional games on PC to offer even more game variety in addition to the PS VR2 titles available through PS5. We hope to make this support available in 2024, so stay tuned for more updates." Reports suggest that Sony's second generation product has not met sales expectations—insiders posit that company leadership has requested a pause of production. An entry into the PC market could boost the PS VR2's popularity, but it will face plenty of competition within an already "niche" segment.

iVRy has monitored Sony's progress with great interest—the former's social media account has disclosed the discovery of a new development milestone: "(their) latest firmware update enables PC access! This means it's no longer necessary to use driver/hardware workarounds to make it work on Windows. Still to be confirmed whether this update enables NVIDIA use, but all indications are that Sony's 'PC games' plans involve direct connection." The iVRy VR project has—so far—managed to (successfully) connect the PS VR2 to AMD GPU-based systems. Sony is expected to produce an official means of hooking up their headset to PCs. iVRy discussed this provision in their follow-up post: "a 'VirtualLink' adapter of some kind is still required due to PS VR2 hardware design. If Sony does intend to make 'official' PC drivers, they would need to provide this adapter to end-users."

ITHome has highlighted several third-party protective cases listings for 12.9-inch iPad Air and Pro 2024 models—the Amazon product pages state that these accessories "will be on the shelves on March 26." The publication believes that this date could align with an official Apple unveiling—Mark Gurman, a Bloomberg reporter, predicted a planned announcement "around the end of March or April" in a recent "Power On" newsletter. MacRumors has tracked relevant activity on Weibo—based on claims made by Instant Digital (a well known Chinese leaker) they reckon that a possible March 26 presentation could be used to introduce: "pre-order availability, with shipping dates to follow."

We last heard about the rumored 2024 lineup of iPad Pro and Air models sporting some "revised physical dimensions." It was speculated that an upgrade to OLED panels has granted slimmer profiles—these possess fewer layers when compared to custom mini-LED parts on current generation premium tablets. LG is reported to be contracted for mass manufacturing of upcoming 13-inch iPad OLED tech, while Samsung (allegedly) takes care of 11-inch panels. With the launch of their M3 chipset-equipped MacBook Air 2024 range out of the way, Apple can concentrate on its next wave of new generation portable products.

Yesterday, South Korea's National Radio Research Agency certified a brand new and very mysterious Xbox Development Kit—naturally, the "Xbox News for Koreans" social media account took credit for this intriguing discovery: "this means that you can use the device in Korea. It is likely to be distributed to game developers in Korea soon." The model's serial code—2089—does not correspond to any of Microsoft's current Xbox Series (X|S) development kits. The tipster shared a short history lesson: "Xbox Series X|S dev kit consoles were certified by the National Radio Research Agency on June 10-11, 2020. The release of the Xbox Series X|S console in Korea was on November 10, 2020." By referencing the current generation's five-month gap—between registration and release of finalized retail units—it is speculated that something new could be arriving around August time.

Industry experts reckon that the leaked devkit is not linked to a rumored "All-Digital" White Xbox Series X Refresh—the latter likely contains unchanged basic hardware designs. Windows Central posited that an Xbox handheld is another possibility—leaked product roadmaps (of 2022 vintage) revealed that Microsoft was considering a move into portable gaming segments. A month ago, Xbox leadership discussed the platform's future—Sarah Bond stated: "there's some exciting stuff coming out in hardware that we're going to share this holiday, and we're also invested in the next generation roadmap...and what we're really focused on there, is delivering the largest technical leap you will have ever seen in a hardware generation." Many media outlets believed that an Xbox Series "Pro" model was teased during the special Official Xbox Videocast.

Insider Gaming's Tom Henderson believes that Sony PlayStation leadership will tighten up development conditions, following recent leaks pertaining to the technological underpinnings of the heavily rumored "PS5 Pro" home console. An IGN report and another Henderson-authored article posit that last week's revelations are "legit," according to their respective networks of industry moles. Apparently top secret information was extracted from a technical document—reports suggest that Sony sent this paper to its third-party development partners, alongside a new batch of development kits.

Industry experts think that (slated) repercussions could affect smaller development houses—Henderson tweeted: "as expected, Sony has launched an internal investigation into the leaked documents on Trinity as it leaked during a third-party rollout...Not sure on the implications yet as I don't think they can catch one individual, but Sony could reduce its third-party developer pool for new tech as a result." Rumors of a "mid-gen hardware refresh" have been swirling for almost a year and a half, but PlayStation bosses seem to be rattled into action (this week). Microsoft maintained a cool exterior following the leak of next-gen Xbox details, but that information emerged from unredacted court documents. Phil Spencer and his colleagues claim that future Xbox product roadmaps are in constant flux.

The International Data Corporation (IDC) has been tracking sales of Sony's PlayStation VR2 virtual reality headset since launch time (February 2023)—a new report claims that a backlog of unsold units has accumulated. Bloomberg's analysis of IDC data reveals that PS VR2 sales have consistently declined each quarter, despite promising early numbers—the publication alleges that Sony Group Corporation has paused production of its ($550 MSRP) PS VR2 headset: "until it clears a backlog of unsold units, according to people familiar with its plans, adding to doubts about the appeal of virtual reality gadgets." Anonymous industry moles reckon that manufacturing facilities have pumped out over two million examples since launch time. Sony is unlikely to admit, publicly, that it is having a tough time shifting its second generation virtual reality headset—Bloomberg's network of insiders believe that "stocks of the device are building up."

The lack of AAA content, developed exclusively for the PS VR2's ecosystem, is cited as big stumbling block—Bloomberg (alongside numerous publications) reckons that sales have suffered due to an absence of system-selling titles. Horizon: Call of the Mountain (2023) was an impactful launch title, but the headset's software portfolio contains a lot of "novelty" items, casual experiences and glorified tech demos (according to community feedback). Late last month, Sony admitted that it was exploring options beyond the VR2's normal mode of operation (PS5 acting as host): "We're pleased to share that we are currently testing the ability for PS VR2 players to access additional games on PC to offer even more game variety in addition to the PS VR2 titles available through PS5. We hope to make this support available in 2024, so stay tuned for more updates." This surprising announcement arrived mere days before the firing of (around) 900 PlayStation employees. Company leadership revealed that Firesprite's headcount would be reduced. This VR-oriented studio collaborated with Guerrilla Games on the development of Horizon: Call of the Mountain. Sony's London Studio will be closed down—its team had previously worked on PlayStation VR Worlds (2016) and Blood & Truth (2019)—compatible with Sony's first generation headset.

TSMC is experiencing unprecedented demand from AI chip customers—unnamed parties have (fancifully) requested the construction of entirely new fabrication facilities. Taiwan's leading semiconductor contract manufacturer seems to concentrating on "sensible" expansions, mainly in the area of CoWoS packaging output—according to an Economic Daily report, company leadership and local government were negotiating over the construction of four new advanced packaging plants. Insiders propose that plans have been revised—an investment in excess of 500 billion yuan ($16 billion) will enable the founding of six new CoWoS-focused facilities. TSMC is expected to make an official announcement next month—industry moles reckon that construction work will start in April. Two (of the six total) advanced packaging plants could become fully operational before the conclusion of 2024.

Lately, TSMC has initiated an ambitious recruitment drive—targeting around 6000 new workers. A touring entity is tasked with the attraction of "talents with high enthusiasm for semiconductors." The majority of new recruits are likely heading to new or expanded Taiwan-based facilities. The Economic Daily report proposes that Chiayi City's technological hub will play host to TSMC's new CoWoS packaging plants. A DigiTimes Asia news piece (from January) posited that TSMC leadership anticipates CoWoS output reaching 44,000 units by the end of 2024. This predicted tally could grow, thanks to the (rumored) activation of additional factories. CoWoS packaging is considered to be a vital aspect of AI accelerators—insiders believe that TSMC's latest investment will boost production of NVIDIA H100 GPUs. The combined output of six new CoWoS plants will assist greatly in the creation of next-gen B100 chips.

Jensen Huang's opening GTC 2024 keynote is scheduled to happen tomorrow afternoon (13:00 Pacific time)—many industry experts believe that the NVIDIA boss will take the stage and formally introduce his company's B100 "Blackwell" GPU architecture. An enlightened few have been treated to preview (AI and HPC) units—including Dell's CEO, Jeff Clarke—but pre-introduction leaks have not flowed out. Team Green is likely enforcing strict conditions upon a fortunate selection of trusted evaluators, within a pool of ecosystem partners and customers.

Today, a brave soul has broken that silence—tech tipster, AGF/XpeaGPU, fears repercussions from the leather-jacketed one. They revealed a handful of technical details, a day prior to Team Green's highly anticipated unveiling: "I don't want to spoil NVIDIA B100 launch tomorrow, but this thing is a monster. 2 dies on (TSMC) CoWoS-L, 8x8-Hi HBM3E stacks for 192 GB of memory." They also crystal balled an inevitable follow-up card: "one year later, B200 goes with 12-Hi stacks and will offer a beefy 288 GB. And the performance! It's... oh no Jensen is there... me run away!" Reuters has also joined in on the fun, with some predictions and insider information: "NVIDIA is unlikely to give specific pricing, but the B100 is likely to cost more than its predecessor, which sells for upwards of $20,000." Enterprise products are expected to arrive first—possibly later this year—followed by gaming variants, maybe months later.

Samsung Electronics is all set to discuss the future of AI, alongside Jensen Huang, at NVIDIA's upcoming GTC 2024 conference. South Korean insiders have leaked the company's intentions, only days before the event's March 18 kickoff time. Their recently unveiled 36 GB HBM3E 12H DRAM product is expected to be the main focus of official presentations—additionally, a new storage subscription service is marked down for a possible live introduction. An overall "Redefining AI Infrastructure" presentation could include—according to BusinessKorea—a planned launch of: "petabyte (PB)-level SSD solution, dubbed 'PBSSD,' along with a subscription service in the US market within the second quarter (of 2024) to address the era of ultra-high-capacity data."

A Samsung statement—likely sourced from leaked material—summarized this business model: "the subscription service will help reduce initial investment costs in storage infrastructure for our customers and cut down on maintenance expenses." Under agreed upon conditions, customers are not required to purchasing ultra-high-capacity SSD solutions outright: "enterprises using the service can flexibly utilize SSD storage without the need to build separate infrastructure, while simultaneously receiving various services from Samsung Electronics related to storage management, security, and upgrades." A special session—"The Value of Storage as a Service for AI/ML and Data Analysis"—is alleged to be on the company's GTC schedule.

Industry insiders reckon that Samsung Electronics is transitioning to molded underfill (MR-MUF) production techniques—rival memory manufacturer, SK Hynix, champions this chip making technology. A Reuters exclusive has cited claims made by five industry moles—they believe that Samsung is reacting to underwhelming HBM production yields. The publication proposes that: "one of the reasons Samsung has fallen behind (competing producers) is its decision to stick with chip making technology called non-conductive film (NCF) that causes some production issues, while Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF's weakness." The report suggests that Samsung is in the process of ordering new MUF-related equipment.

One anonymous source stated: "Samsung had to do something to ramp up its HBM (production) yields... adopting MUF technique is a little bit of swallow-your-pride type thing for (them), because it ended up following the technique first used by SK Hynix." Reuters managed to extract a response from the giant South Korean multinational—a company spokesperson stated: "we are carrying out our HBM3E product business as planned." They indicated that NCF technology remains in place as an "optimal solution." Post-publication, another official response was issued: "rumors that Samsung will apply MR-MUF to its HBM production are not true." Insiders propose a long testing phase—Samsung is rumored to be sourcing MUF materials, but mass production is not expected to start this year. Three insiders allege that Samsung is planning to "use both NCF and MUF techniques" for a new-generation HBM chip.

Rumors from last week pointed to a possible $3.5 billion government defense-related investment—Intel was linked to this very lucrative semiconductor supply contract. Insiders posited that the US Department of Commerce was readying a rough $1 billion investment, while the Pentagon prepared around $2.5 billion. The latter has scrapped those plans, according to anonymous sources—Bloomberg believes that this: "move threatens to limit the total amount that Intel has been expecting to get in federal funding, setting up a contentious situation." The publication's moles have requested complete anonymity, due to the secretive nature of policy negotiations.

The US Department of Commerce deliberates over the nation's CHIPS Act—this fund could be utilized to "make up for the shortfall," following the Pentagon's reported last minute course change. The Department of Commerce could be forced to foot the entire bill—of $3.5 billion—if Intel's services are secured. Negotiations over a so-called "Secure Enclave" project have been ongoing since last year, according to insiders. It is possible that the "fast-moving" military spending bill set off alarms at the Pentagon—the Department of Defense's reasonings were not revealed by Bloomberg's investigation. Several media outlets have requested official comments from the two arms of government. Yesterday, Intel shares fell by 3%—as reported Investopedia—with the market reacting to rumors of cancelled plans.

SK Hynix believes that it leads the industry with the development and production of High Bandwidth Memory (HBM) solutions, but rival memory manufacturers are working hard on equivalent fifth generation packages. NVIDIA was expected to select SK Hynix as the main supplier of HBM3E parts for utilization on H200 "Hopper" AI GPUs, but a surprise announcement was issued by Micron's press team last month. The American firm revealed that HBM3E volume production had commenced: ""(our) 24 GB 8H HBM3E will be part of NVIDIA H200 Tensor Core GPUs, which will begin shipping in the second calendar quarter of 2024. This milestone positions Micron at the forefront of the industry, empowering artificial intelligence (AI) solutions with HBM3E's industry-leading performance and energy efficiency."

According to a Korea JoongAng Daily report, this boast has reportedly "shocked" the likes of SK Hynix and Samsung Electronics. They believe that Micron's: "announcement was a revolt from an underdog, as the US company barely held 10 percent of the global market last year." The article also points out some behind-the-scenes legal wrangling: "the cutthroat competition became more evident when the Seoul court sided with SK Hynix on Thursday (March 7) by granting a non-compete injunction to prevent its former researcher, who specialized in HBM, from working at Micron. He would be fined 10 million won for each day in violation." SK Hynix is likely pinning its next-gen AI GPU hopes on a 12-layer DRAM stacked HBM3E product—industry insiders posit that evaluation samples were submitted to NVIDIA last month. The outlook for these units is said to be very positive—mass production could start as early as this month.

JEDEC is currently presiding over standards for 6th generation high bandwidth memory (AKA HBM4)—the 12 and 16-layer DRAM designs are expected to reach mass production status in 2026. According to a ZDNET South Korea report, involved manufacturers are deliberating over HBM4 package thicknesses—allegedly, decision makers have settled on 775 micrometers (μm). This is thicker than the previous generation's measurement of 720 micrometers (μm). Samsung Electronics, SK Hynix and Micron are exploring "hybrid bonding," a new packaging technology—where onboard chips and wafers are linked directly to each other. Hybrid bonding is expected to be quite expensive to implement, so memory makers are carefully considering whether HBM4 warrants its usage.

ZDNET believes that JEDEC's agreement—settling on 775 micrometers (μm) for 12-layer and 16-layer stacked HBM4—could have: "a significant impact on the future packaging investment trends of major memory manufacturers. These companies have been preparing a new packaging technology, hybrid bonding, keeping in mind the possibility that the package thickness of HBM4 will be limited to 720 micrometers. However, if the package thickness is adjusted to 775 micrometers, 16-layer DRAM stacking HBM4 can be sufficiently implemented using existing bonding technology." A revised schedule could delay the rollout of hybrid bonding—perhaps pushed back to coincide with a launch of seventh generation HBM. The report posits that Samsung Electronics, SK Hynix and Micron memory engineers are about to focus on the upgrading of existing bonding technologies.

Naughty Dog's remaster of "The Last of Us Part II" released on January 16 of this year—the PlayStation 4-era survival horror classic was spruced up and released exclusively on Sony's current-generation console. Segments of the gaming community have continued to question the company's PS5/PS4-to-PC porting policy—timing remains the key sticking point here. PC platform enthusiasts have often waited around two to three years for expirations of PlayStation exclusivity. Sony leadership has absorbed some of this feedback—a small wave of PC ports have emerged in recent times, following a series of insider leaks. Crucially, Horizon Forbidden West Complete Edition's PC version is due to launch on March 21, followed by Ghost of Tsushima Director's Cut—almost two months later.

Iron Galaxy ported "The Last of Us Part 1" to PC platforms—their collaboration—with Naughty Dog—launched last March. Naturally, discussions immediately focused on the sequel's speculated release date—one year later, a "reliable" tipster has thrown in their two cents. Silknigth's recent track record includes the outing of Sucker Punch's Ghost of Tsushima Director's Cut PC port. The leaker stated: "Sony's upcoming PC game is The Last Of Us Part 2 Remastered. Its announcement is expected next month, although the exact date is unknown. There will be a longer-than-usual period between the announcement date and the release day." Reports suggest that Sony could unveil another batch of PC ports in the near future—these titles include: God of War Ragnarok, Gran Turismo 7 and Demon's Souls.

Qualcomm's Weibo social media account has teased an upcoming new product launch: "the spring dragon raises its head, and everything is reborn! The new Snapdragon flagship is about to be released. Let's welcome the New Year and the new era. On March 18, please stay tuned for the Snapdragon flagship new product launch conference." News outlets believe that a variant of the current top-of-the-line Snapdragon 8 Gen 3 (SM8650-AB) chipset will be introduced next week. Smartphone tech tipster, Digital Chat Station, revealed that a mysterious Qualcomm Snapdragon "SM8635" model was in the pipeline. Early February speculation pointed to a possible "Snapdragon 8s Gen 3" moniker—the added "s" implies that this mobile processor could emerge as a cheaper "sub-flagship" model.

Geekbench 6.2.2 results—posted by a trio of Realme "RMX3851" android smartphones—revealed speculated "8s Gen 3" specifications, including a 3.01 GHz "Big" Core clock, an Adreno 735 integrated GPU, and a 1+3+4 cluster configuration. The pre-release samples could not keep up with finalized Snapdragon 8 Gen 3 hardware in performance gauntlets. A mid-range "Snapdragon 7+ Gen 3" SoC could make an appearance on March 18, but tipsters believe that the event will be dedicated to a single new product. Digital Chat Station reckons that Qualcomm will market the Snapdragon 8s Gen 3 "as a Little 8G3."