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Team Group Industrial Enhances Temperature Control and Reduces Carbon Emissions with Innovative Solutions

The intensification of the greenhouse effect has caused unusually high summer temperatures and heat waves that continue to engulf Europe and the rest of the world. Extreme temperatures have caused numerous data centers in Europe to suspend operations to ensure the safety of their equipment and data. In view of this, Team Group has placed greater emphasis on developing more innovative solutions for high-temperature applications, providing consumers with more reliable and durable industrial storage products. Equipped with the industry's first temperature sensing and warning technology and exclusive liquid cooling technology (Taiwan Utility Model Patent: M626519), Team Group's industrial products can help maintain the continuous operation of industrial equipment and monitor equipment temperature to avoid unexpected problems. These solutions help industrial customers and equipment reduce carbon emissions and move towards the goal of sustainable development while remaining under stable operation.

Samsung Formally Launches the 990 PRO Flagship PCIe Gen4 SSD

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the 990 PRO, the company's high-performance NVMe SSD based on PCIe 4.0. Delivering lightning-fast speeds and superior power efficiency, the new SSD is optimized for graphically demanding games and other intensive tasks including 3D rendering, 4K video editing and data analysis.

"With continuing innovations in gaming, 4K and 8K technology as well as AI-driven applications, consumers' need for high-performance storage is growing exponentially," said KyuYoung Lee, Vice President of the Memory Brand Product Biz Team at Samsung Electronics. "The 990 PRO provides an optimal balance of speed, power efficiency and reliability, making it an ideal choice for avid gamers and creative professionals seeking uninterrupted work and play."

ASUS Republic of Gamers Releases New Gaming Gear at Gamescom 2022

ASUS Republic of Gamers (ROG) today announced the latest gaming gear at Gamescom 2022, including the AMD X670E series motherboards, AIO coolers, PSU, displays, networking products, and peripherals. Along with these products, ROG released its first music single Reality, with vocals by renowned voice actor and musician Troy Baker, more commonly known for his roles in video games like The Last of Us and Uncharted series. An anime-inspired interactive 360° music video featuring the song is available on YouTube.

ROG Swift OLED PG42UQ / PG48UQ: The 42-inch ROG Swift OLED PG42UQ is designed for immersive desktop gaming and features 4K visuals at an overclocked 138 Hz refresh rate. The OLED panel ensures the deepest hues, as well as vibrant colors thanks to a 98% DCI-P3 color gamut and Delta E < 2 color difference. An ultrafast 0.1 ms (GTG) response time ensures great viewing and gaming experiences. The larger, 48-inch ROG Swift OLED PG48UQ is ideal for those looking to play their games on an even bigger scale. ROG OLED monitors include a custom heatsink that offers more surface area for heat exchange, resulting in up to 8% lower operating temperatures compared to ROG monitors without a heatsink to ensure better OLED performance and longevity.

GIGABYTE Unveils AORUS Gen5 AIC Adaptor with 4 Built-in NVMe M.2 Slots

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the AORUS Gen5 AIC Adaptor with PCIe 5.0 support. It is a single-slot Add In Card, featuring four NVMe M.2 slots, supporting a maximum of four PCIe 5.0 SSDs with 16 TB storage. By configuring a RAID array, the bandwidth can boost up to 60 GB/s to allow massive data files to transfer in a snap. The eight integrated temperature sensors and active temperature-controlled double ball bearing fan should satisfy users with large-capacity, ultra-fast and ultra-cool data access.

"With the coming PCIe 5.0 platform, high-speed storage can reach access speed of more than 10 GB/s. For users who chase higher performance, GIGABYTE AORUS Gen5 AIC leads the way to extreme performance by building a disk array." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division. "Integrating four PCIe 5.0 slots, users can choose different NVMe M.2 SSDs with customized capacity and performance for the greatest flexibility. Meanwhile, the advanced thermal design prevents thermal throttling under high-speed operation which makes GIGABYTE AORUS Gen5 AIC the best choice when upgrading storage performance."

ADATA Launches its First Industrial-Grade PCIe Gen4x4 SSD: IM2P41B8

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products today announces its first industrial-grade PCIe Gen4 x4 M.2 2280 solid state drive, the IM2P41B8. Utilizing the ultra-high-speed PCIe Gen4 x4 interface, it delivers excellent read and write performance for processing large data loads, and the durability and security industrial-grade applications require.

The IM2P41B8 M.2 2280 is equipped with WDC's 112-layer 3D TLC flash memory with a maximum capacity of 4 TB. With the PCIe Gen4 x4 interface and NVMe 1.4 support, the IM2P41B8 offers performance that is 230% higher than PCIe 3.0, random read and write speeds of up to 220,000/175,000 IOPS, and sustained read and write speeds of up to 7000/6500 MB/s. What's more, it feature 3K P/E cycle rating for excellent durability.

Intel NUC 13 Extreme "Raptor Canyon" Compute Element Pictured

An alleged low-res picture of the next-generation NUC 13 Extreme "Raptor Canyon" compute element codenamed "Shrike Bay," was leaked to the web. NUC Extreme desktops over the past several generations have been using a form-factor where the CPU, chipset, memory, and SSD are located on a single add-on card with custom wiring; while the rest of the system consists of a PCIe backplane (analogous to the ISA backplane systems from the 1980s). The NUC 13 Extreme compute element rocks a 13th Gen Core "Raptor Lake" processor, possibly a switch to DDR5 from DDR4 on the NUC 12 Extreme, and processor options spanning the Core i9-K/KS, i7-K/KS, and i5-K. A liquid+air hybrid cooling solution much like that of the NUC 12 Extreme, could cool the various hot components on the compute element. According to leaked roadmaps, "Raptor Canyon" and the "Shrike Bay" compute element could debut within Q4-2022.

Transcend Rolls Out SSD225S SATA SSD with Up to 720TBW Endurance

Transcend rolled out the SSD225S, a 2.5-inch SATA client-SSD offering high endurance. The drive is available in 250 GB, 500 GB, 1 TB, and 2 TB variants, with the highest capacity offering an endurance of 720 TBW. The 1 TB variant offers 360 TBW, the 500 GB variant offers 180 TBW, and the 250 GB variant 90 TBW. Taking advantage of the SATA 6 Gbps interface, the drive offers up to 560 MB/s of sequential reads, up to 500 MB/s of sequential writes, and up to 80,000 IOPS 4K random access. The company didn't mention the NAND flash type, or controller make, but that it is DRAMless, offers SLC caching, LDPC, wear-leveling, and DEVSleep. Transcend is backing these with 3-year warranties.

Gigabyte Announces the AORUS Gen5 10000 SSD with Capacities up to 4 TB

GIGABYTE Technology, one of the top global manufacturers of motherboards, graphics cards, and hardware solutions, announces today the latest AORUS Gen5 10000 SSD with 10 GB/s read speed. Enhanced by the new generation PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, AORUS Gen5 10000 SSD provides boosted performance of more than 55% over PCIe 4.0 SSDs and comes in 1 TB to 4 TB capacity variants using an M.2 2280 interface to deliver easy installation and superb capability. Additionally, the separate SSD and heatsink offers more flexibility in system build and thermal options for users. GIGABYTE's exclusive SSD Tool Box application provides users real-time status of SSD to leverage performance, thermal, stability and capability.

"With PCIe 5.0 support on new motherboard platform, the bandwidth and transfer performance are raised to the next level. As the first manufacturer to have both motherboards and SSD product lines in the market, GIGABYTE is also the first to unveil the AORUS Gen5 10000 SSD. This new product brings blistering fast storage performance with ultra durability and compatibility to users for optimal quality and performance." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

Team Group Announces MP44L M.2 Gen4 SSD with Industry-First Graphene Heatspreader

Global memory brand, Team Group, has created numerous innovative SSD products over the years with its cutting-edge research and development to offer the very best solutions in the storage market. Today it has announced MP44L M.2 PCIe 4.0 SSD, featuring a unique breakthrough cooling technology: the industry's first SSD label to incorporate graphene copper foil. This less than 1 mm thick Heat Dissipating Graphene SSD Label has received Utility Patents and is tightly adhered to the SSD to provide precise and greater cooling. The design of MP44L M.2 PCIe 4.0 SSD's heat dissipating graphene SSD label eliminates the possibility of installation interference. Moreover, it allows users to enjoy double the cooling performance and the increased stability of PCIe Gen4 without the need to install additional thermal equipment when it's paired with an M.2 slot heatsink.

Team Group's brand new MP44L M.2 PCIe 4.0 SSD is a storage upgrade solution for Gen4 x4 SSDs. It offers a read speed of 5,000 MB/s and a write speed of 4,500 MB/s and supports SLC Cache technology, which provides over double the operation efficiency of Gen3 SSDs. By solving the problem of computer lag, it allows users to multitask with ease and enjoy fast and smooth performance. The MP44L SSD provides excellent data transfer accuracy due to its LDPC (Low-Density Parity Check Code) technology. It supports Windows TRIM optimization commands and the latest NVMe 1.4 standard.

Samsung 990 PRO PCIe 5.0 M.2 SSD Confirmed By PCI-SIG

The upcoming Samsung 990 PRO flagship consumer SSD has recently been listed as PCIe 5.0 compliant by PCI-SIG with the entry also confirming the drive's name and M.2 interface. The upgrade to PCIe 5.0 from 4.0 doubles the available bandwidth for the card with Samsung's existing enterprise PCIe 5.0 drives reaching speeds of 13,000 MB/s significantly above the 7000 MB/s of the best PCIe 4.0 drives. The latest Intel Alder Lake systems can support PCIe 5.0 drives on select motherboards with AMD support set to arrive with the launch of Ryzen 7000 and X670/B650 motherboards. Samsung is expected to release at least 1 TB and 2 TB variants of the drive however other details such as the exact length of the card and the controller used are currently unknown.

Apacer Returns to the AGE; Showcasing new Transformed SSDs with Scheduled Power Management

The Australasian Gaming Expo (AGE), which has been postponed for two years by the worldwide pandemic, officially returns this year. Apacer, the world's leading industrial storage and memory brand, will return to participate in the AGE in Sydney, Australia from August 9th to 11th, to celebrate the return of the AGE and demonstrate its long-term research and development capabilities in the casino gaming application market. Ultra-high-performance industrial PCIe SSDs and DDR5 memory solutions, which meet the high-definition image and data processing requirements of new gaming machines, will be displayed on-site. Aiming at durability, data integrity and power stability, which are the most important aspects of gaming applications, Apacer's latest software, firmware and hardware technologies will also be shown, and they are expected to become key players in the global gaming market.

Extending device management technology to gaming industry applications, Apacer developed the CoreSnapshot 1-second backup and recovery technology, as well as the Transformed SSD module with Scheduled Power Management. CoreSnapshot can perform remote recovery when the SSD operational status is abnormal, reducing customer complaints caused by sudden game interruptions. The Transformed SSD module with Scheduled Power Management integrates the real-time scheduling management function of power cycling with a simple and effective management interface, reducing the amount of time that operators need to check, maintain and confirm the power status of a gaming machine and effectively saving operating costs.

LattePanda Team and Global Partners Jointly Launch LattePanda 3 Delta - the Fast and Pocket-sized Single-board Computer

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

Historically Low 2023 DRAM Demand Bit Growth at Only 8.3%, NAND Flash Expected to Drive Installed Capacity Growth Due to Falling Prices

According to TrendForce, DRAM market demand bit growth will only amount to 8.3% in 2023, sub-10% for the first time in history, and far lower than supply-side bit growth of approximately 14.1%. Data indicates the DRAM market to be severely oversupplied at least in 2023 and prices may continue to decline. NAND Flash is still in a state of oversupply and, although prices are expected to fall in the first half of next year, NAND Flash has built-in price elasticity compared to DRAM and average prices are expected to stimulate density growth in the enterprise SSD market after declining for several consecutive quarters. Demand bits are expected to grow by 28.9%, while supply bits will grow by approximately 32.1%.

From the perspective of various applications, rising inflation continues to impact demand in consumer markets, so the primary goal of memory brands has been to prioritize inventory correction. Especially in the past two years, a shortage of upstream components caused by the pandemic led memory brands to overbook purchase orders while sluggish sales on the distribution channel side have resulted in slow depletion of current notebook inventory, resulting in a further weakening of notebook demand in 2023. In terms of PC DRAM, the proportion of DDR4 and LPDDR4X in PC applications will fall further while the penetration rate of LPDDR5 and DDR5 continues to rise. However, the price premium of DDR5 will limit the growth of density in PCs. DRAM density in PCs is estimate to increase by approximately 7% annually in 2023. If manufactures cut DDR5 pricing more aggressively next year, installed capacity may be driven up to 9%, depending on whether DDR5 price concessions can be effectively reconciled with DDR4.

OWC Announces Envoy Pro FX with Thunderbolt, Now in 4TB Capacity

OWC, a leading customer-focused creator of innovative solutions for over 30 years, has enabled individuals, businesses, content professionals, and educators to get maximum usefulness from their technology investment. Announces, the new OWC Envoy Pro FX Portable SSD with Thunderbolt and compatible with USB is available now in 4 TB capacity. You can transfer gigabytes of data in seconds anywhere by supporting outstanding performance capability of up to 2800 MB/s and built like a tank with dust/drop/waterproof certification.

The OWC Envoy Pro FX is ideal for everyone and every need for Mac and PC compatibility from 2010. Fast, tough, Bus-powered (no AC adapter needed) portability. That's many feature boxes checked off. The OWC Envoy Pro FX goes to the next level by being the ideal drive for various uses, ranging from photography, video, and document storage backups to a secondary/portable OS boot drive. The perfect on-set project drive for editing dailies, multi-angled camera shots, utilizing large sample libraries within audio projects, or portable Steam games library.

Transcend Delivers Embedded 112-Layer 3D NAND Wide-Temp SSDs

Transcend Information, has recently introduced a whole series of 112-layer 3D NAND solid-state drives featuring wide-temperature tolerance, operating stably from -40°C to 85°C and demonstrating remarkable endurance. The form factors include 2.5", M.2, and mSATA types, suitable for embedded devices, vehicle systems, and slim servers. With up to 4 TB capacity, this rugged solution overcomes the challenges of extreme industrial environments, empowering applications in smart factories, modern infrastructures, and surveillance in the IoT era.

Transcend utilizes 112-layer 3D NAND flash to build wide-temp SSDs, which support the mainstream SATA III interface and the high-speed PCIe interface. With up to 4 TB capacity, proven performance is delivered between -40°C and 85°C thanks to an in-house sorting process and rigorous temperature tests which ensure the SSDs can adapt to rapid temperature change and thermal shock. Meanwhile, anti-sulfur technology, Corner Bond, and 30µ" gold fingers are incorporated to enhance key component protection and effectively prolong SSD lifespan. All these features create higher reliability for demanding applications like roadside monitoring systems which are exposed to long hours of high temperatures, or industrial computers that have to ensure non-stop high-speed operation.

AMD Ryzen 7000 Series Processor Runs Phison PCIe 5.0 SSD with Micron 232-Layer NAND Flash

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

Silicon Motion Updates PCIe Gen 4 SSD Controller Lineup

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in NAND Flash controllers and solid-state storage devices, today announces it will be showcasing its unique suite of SSD controller solutions for Datacenter, Notebook PCs and Automotive / Industrial SSDs during the Flash Memory Summit from August 2-4 at the Santa Clara Convention Center, booth #311.

ATP Introduces High-Endurance M.2 2230 SSDs

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest 3D triple-level cell (TLC) flash storage solid state drives (SSDs): the N700 and N600 Series, which support the high-speed PCIe 3.0 interface x4 lanes and NVMe protocol. The new SSDs offer hardware-based security features, such as Write Protection and Quick Erase, by project and customer request. Enabled through the general input/output (GPIO) pins, HW Write Protect puts the SSD in "Read Only" mode, thus preventing the modification or tampering of stored data. HW Quick Erase, on the other hand, initiates a block-by-block data pattern write operation to systematically erase any trace of user data.

Available as M.2 2230 modules, they offer better power efficiency and are suitable for applications using small and light systems such as point-of-sale (POS) systems, mobile PCs, Internet of Things (IoT) devices, and server boot applications. The N700 and N600 Series accommodate a heatsink ball-grid array (HSBGA) on the M.2 2230 form factor. For customers who prefer a soldered-down, vibration-proof solution, ATP also offers M.2 Type 1620 HSBGA SSDs with the same firmware and NAND configuration.

YMTC Introduces X3-9070 3D NAND Flash Powered by Innovative Xtacking 3.0 Architecture

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Samsung Unveils Far-Reaching, Next-Generation Memory Solutions at FMS 2022

Samsung Electronics, the world leader in advanced memory technology, today unveiled an array of next-generation memory and storage technologies during Flash Memory Summit 2022, held at the Santa Clara (California) Convention Center, Aug. 2-4. In a keynote titled "Memory Innovations Navigating the Big Data Era," Samsung spotlighted four areas of technological advancement driving the big data market—data movement, data storage, data processing and data management—and revealed its leading-edge memory solutions addressing each field.

To maximize data center efficiency in an increasingly data-driven world, Samsung introduced a next-generation storage technology, "Petabyte Storage." The new solution will allow a single server unit to pack more than one petabyte of storage, enabling server manufacturers to sharply increase their storage capacity within the same floor space with a minimal number of servers. High server utilization will also help to lower power consumption.

SK hynix Develops World's Highest Stacked 238-Layer 4D NAND Flash

SK hynix Inc. announced today that it has developed the industry's highest 238-layer NAND Flash product. The company has recently shipped samples of the 238-layer 512Gb triple level cell (TLC) 4D NAND product to customers with a plan to start mass production in the first half of 2023. "The latest achievement follows development of the 176-layer NAND product in December 2020," the company stated. "It is notable that the latest 238-layer product is most layered and smallest in area at the same time."

The company unveiled development of the latest product at the Flash Memory Summit 2022 in Santa Clara. "SK hynix secured global top-tier competitiveness in perspective of cost, performance and quality by introducing the 238-layer product based on its 4D NAND technologies," said Jungdal Choi, Head of NAND Development at SK hynix in his keynote speech during the event. "We will continue innovations to find breakthroughs in technological challenges."

Solidigm (Intel's now-sold SSD Division) Introduces the P41 Plus QLC NVMe SSD

Solidigm has announced the Solidigm P41 Plus, the company's first branded solid-state storage drive (SSD) since becoming a company in December 2021. The P41 Plus is an innovative PCIe 4.0 product that delivers the industry's best combination of performance and value to PC users for everyday productivity and gaming. Capable of delivering up to 4,125 MB/s sequential read speed, the Solidigm P41 Plus represents a breakthrough in cost efficiency, delivering great PCIe 4.0 performance at a price that won't break the budget for everyday PC users. The Solidigm P41 Plus features 144-layer 3D NAND and is widely available in an M.2 2280 form factor in capacities of 512 GB, 1 TB, and 2 TB. For increased design flexibility, the Solidigm P41 Plus is also available to OEMs in 2230 and 2242 sizes.

In a move that reinforces Solidigm's commitment to being a new paradigm in solid-state storage, the company has invested significantly in storage software to unlock the best possible user experience. The result is Solidigm Synergy software, an optional but highly recommended suite that includes both a storage driver and a Windows application with robust drive health monitoring tools. The Solidigm Storage Driver supports host-managed caching by monitoring usage patterns to identify high-priority data, keeping the most important items in the cache, and enabling faster reads as the drive fills up.

Seagate Addresses Hyperscale Workloads with New Enterprise-Class Nytro SSDs Optimized to Lower TCO

Today, Seagate Technology Holdings plc (NASDAQ: STX), a world leader in mass-data storage infrastructure solutions, announced two additions to its Nytro portfolio, the Nytro 5550 SSD and Nytro 5350 SSD. Engineered with Phison technology for high performance, efficiency, and increased storage density in data centers, the new products comprise the Seagate Nytro 5050 NVMe SSD series. Designed to offer more computing with less energy consumption, they provide a cost-effective solution that eliminates bottlenecks, improves quality of service (QoS), and delivers the highest levels of data integrity and security for business applications.

The Nytro 5350 PCIe Gen4 NVMe SSD doubles the read throughput of the latest SAS SSDs, achieving over ten times the bandwidth of SATA to significantly improve QoS. Designed to give data centers more computing power while reducing total cost of ownership (TCO), the drive removes data bottlenecks with blistering up to 7.4 GB/s bandwidth and up to 195K IOPS random write speeds and up to 1.7M IOPS random read speeds to provide consistent response times. Perfectly tuned to increase density and boost capacity in ultra-dense environments, Nytro 5350 brings up to 15.36 TB in a 15 mm form factor and up to 7.68 TB in a 7 mm form factor with dual ports, supporting both U.2 and U.3 interfaces for active-active high availability. Designed to take on enterprise workloads, Nytro 5350 delivers 1 DWPD at 2.5M MTBF for enhanced endurance.

Phison Debuts the X1 to Provide the Industry's Most Advanced Enterprise SSD Solution

Phison Electronics Corp., a global leader in NAND flash controller and storage solutions, today announced the launch of its X1 controller based solid state drive (SSD) platform that delivers the industry's most advanced enterprise SSD solution. Engineered with Phison's technology to meet the evolving demands of faster and smarter global data-center infrastructures, the X1 SSD platform was designed in partnership with Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions. The X1 SSD customizable platform offers more computing with less energy consumption. With a cost-effective solution that eliminates bottlenecks and improves quality of service, the X1 offers more than a 30 percent increase in data reads than existing market competitors for the same power used.

"We combined Seagate's proprietary data management and customer integration capabilities with Phison's cutting-edge technology to create highly customized SSDs that meet the ever-evolving needs of the enterprise storage market," said Sai Varanasi, senior vice president of product and business marketing at Seagate Technology. "Seagate is excited to partner with Phison on developing advanced SSD technology to provide the industry with increased density, higher performance and power efficiency for all mass capacity storage providers."

ADATA Unveils LEGEND 960 PCIe Gen4 x4 M.2 2280 Solid State Drive

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announced the LEGEND 960 PCIe Gen4 x4 M.2 2280 solid state drive (SSD). With the advent of the Web 3.0 and a growing emphasis on the virtual world, the new LEGEND 960 delivers a new level of performance for advanced design applications, such as 3D animation, game design, virtual art, and beyond.

The ADATA LEGEND 960 gives users a major upgrade in performance with sequential read and write speeds of 7,400/6,800 MB per second, and is compliant with NVMe 1.4. This makes it up to 4 times faster than a standard PCIe Gen3 SSD. What's more, it supports the latest Intel and AMD platforms, desktop and notebook PCs, including Intel Evo certified laptops, and is backward compatible with PCIe 3.0 for added convenience.
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