Aetina, a subsidiary of the Innodisk Group and an expert in edge AI solutions, is pleased to announce its debut at Supercomputing (SC24) in Atlanta, Georgia, showcasing the innovative SuperEdge NVIDIA MGX short-depth edge AI server, AEX-2UA1. By integrating an enterprise-class on-premises large language model (LLM) with the advanced retrieval-augmented generation (RAG) technique, Aetina NVIDIA MGX short-depth server demonstrates exceptional enterprise edge AI performance, setting a new benchmark in Edge AI innovation. The server is powered by the latest Intel Xeon 6 processor and dual high-end double-width NVIDIA GPUs, delivering ultimate AI computing power in a compact 2U form factor, accelerating Gen AI at the edge.

The SuperEdge NVIDIA MGX server expands Aetina's product portfolio from specialized edge devices to comprehensive AI server solutions, propelling a key milestone in Innodisk Group's AI roadmap, from sensors and storage to AI software, computing platforms, and now AI edge servers.

MiTAC Computing Technology Corporation, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), is unveiling its new server lineup at SC24, booth #2543, in Atlanta, Georgia. MiTAC Computing's servers integrate the latest AMD EPYC 9005 Series CPUs, AMD Instinct MI325X GPU accelerators, Intel Xeon 6 processors, and professional GPUs to deliver enhanced performance optimized for HPC and AI workloads.

Leading Performance and Density for AI-Driven Data Center Workloads
MiTAC Computing's new servers, powered by AMD EPYC 9005 Series CPUs, are optimized for high-performance AI workloads. At SC24, MiTAC highlights two standout AI/HPC products: the 8U dual-socket MiTAC G8825Z5, featuring AMD Instinct MI325X GPU accelerators, up to 6 TB of DDR5 6000 memory, and eight hot-swap U.2 drive trays, ideal for large-scale AI/HPC setups; and the 2U dual-socket MiTAC TYAN TN85-B8261, designed for HPC and deep learning applications with support for up to four dual-slot GPUs, twenty-four DDR5 RDIMM slots, and eight hot-swap NVMe U.2 drives. For mainstream cloud applications, MiTAC offers the 1U single-socket MiTAC TYAN GC68C-B8056, with twenty-four DDR5 DIMM slots and twelve tool-less 2.5-inch NVMe U.2 hot-swap bays. Also featured is the 2U single-socket MiTAC TYAN TS70A-B8056, designed for high-IOPS NVMe storage, and the 2U 4-node single-socket MiTAC M2810Z5, supporting up to 3,072 GB of DDR5 6000 RDIMM memory and four easy-swap E1.S drives per node.

Hypertec proudly announces the launch of its latest breakthrough product, the TRIDENT iG series, an immersion-born GPU server line that brings extreme density, sustainability, and performance to the AI and HPC community. Purpose-built for the most demanding AI applications, this cutting-edge server is optimized for generative AI, machine learning (ML), deep learning (DL), large language model (LLM) training, inference, and beyond. With up to six of the latest NVIDIA GPUs in a 2U form factor, a staggering 8 TB of memory with enhanced RDMA capabilities, and groundbreaking density supporting up to 200 GPUs per immersion tank, the TRIDENT iG server line is a game-changer for AI infrastructure.

Additionally, the server's innovative design features a single or dual root complex, enabling greater flexibility and efficiency for GPU usage in complex workloads.

IBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients. This collaboration will also enable support for AMD Instinct MI300X accelerators within IBM's watsonx AI and data platform, as well as Red Hat Enterprise Linux AI inferencing support.

"As enterprises continue adopting larger AI models and datasets, it is critical that the accelerators within the system can process compute-intensive workloads with high performance and flexibility to scale," said Philip Guido, executive vice president and chief commercial officer, AMD. "AMD Instinct accelerators combined with AMD ROCm software offer wide support including IBM watsonx AI, Red Hat Enterprise Linux AI and Red Hat OpenShift AI platforms to build leading frameworks using these powerful open ecosystem tools. Our collaboration with IBM Cloud will aim to allow customers to execute and scale Gen AI inferencing without hindering cost, performance or efficiency."

According to The Information, NVIDIA's latest "Blackwell" processors are reportedly encountering significant thermal management issues in high-density server configurations, potentially affecting deployment timelines for major tech companies. The challenges emerge specifically in NVL72 GB200 racks housing 72 GB200 processors, which can consume up to 120 kilowatts of power per rack, weighting a "mere" 3,000 pounds (or about 1.5 tons). These thermal concerns have prompted NVIDIA to revisit and modify its server rack designs multiple times to prevent performance degradation and potential hardware damage. Hyperscalers like Google, Meta, and Microsoft, who rely heavily on NVIDIA GPUs for training their advanced language models, have allegedly expressed concerns about possible delays in their data center deployment schedules.

The thermal management issues follow earlier setbacks related to a design flaw in the Blackwell production process. The problem stemmed from the complex CoWoS-L packaging technology, which connects dual chiplets using RDL interposer and LSI bridges. Thermal expansion mismatches between various components led to warping issues, requiring modifications to the GPU's metal layers and bump structures. A company spokesperson characterized these modifications as part of the standard development process, noting that a new photomask resolved this issue. The Information states that mass production of the revised Blackwell GPUs began in late October, with shipments expected to commence in late January. However, these timelines are unconfirmed by NVIDIA, and some server makers like Dell confirmed that these GB200 NVL72 liquid-cooled systems are shipping now, not in January, with CoreWave GPU cloud provider as a customer. The original report could be using older information, as Dell is one of NVIDIA's most significant partners and among the first in the supply chain to gain access to new GPU batches.

ASUS today announced its groundbreaking next-generation infrastructure solutions at SC24, featuring a comprehensive lineup powered by AMD and Intel, as well as liquid-cooling solutions designed to accelerate the future of AI. By continuously pushing the limits of innovation, ASUS simplifies the complexities of AI and high-performance computing (HPC) through adaptive server solutions paired with expert cooling and software-development services, tailored for the exascale era and beyond. As a total-solution provider with a distinguished history in pioneering AI supercomputing, ASUS is committed to delivering exceptional value to its customers.

Comprehensive line-up for AI and HPC success
To fuel enterprise digital transformation through HPC and AI-driven architecture, ASUS provides a full lineup of server systems that powered by AMD and Intel. Startups, research institutions, large enterprises or government organizations all could find the adaptive solutions to unlock value and accelerate business agility from the big data.

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

Today at its inaugural IBM Quantum Developer Conference, IBM announced quantum hardware and software advancements to execute complex algorithms on IBM quantum computers with record levels of scale, speed, and accuracy.

IBM Quantum Heron, the company's most performant quantum processor to-date and available in IBM's global quantum data centers, can now leverage Qiskit to accurately run certain classes of quantum circuits with up to 5,000 two-qubit gate operations. Users can now use these capabilities to expand explorations in how quantum computers can tackle scientific problems across materials, chemistry, life sciences, high-energy physics, and more.

Innodisk, a leading global AI solution provider, has introduced its new E1.S SSD, which is specifically designed to meet the demands of growing edge computing applications. The E1.S edge server SSD offers exceptional performance, reliability, and thermal management capabilities to address the critical needs of modern data-intensive environments and bridge the gap between traditional industrial SSDs and data center SSDs.

As AI and 5G technologies rapidly evolve, the demands on data processing and storage continue to grow. The E1.S SSD addresses the challenges of balancing heat dissipation and performance, which has become a major concern for today's SSDs. Traditional industrial and data center SSDs often struggle to meet the needs of edge applications. Innodisk's E1.S eliminates these bottlenecks with its Enterprise and Data Center Standard Form Factor (EDSFF) design and offers a superior alternative to U.2 and M.2 SSDs.

Even more versatile in the second revision: Developed on the basis of its proven predecessor model, the new version of the Freezer 4U-M offers optimised cooling performance, not only for powerful server CPUs from AMD and Intel, but also for the ARM processors of the Ampere Altra series.

Multi-compatible with additional flexibility
The 2nd revision of the Freezer 4U-M also impresses with its case and socket compatibility. In addition, it has been specially adapted to support Ampere Altra processors with 32 to 128 cores.

In an era where data has become a core asset for modern enterprises, TerraMaster, a global leader in data storage and management solutions, has announced the official launch of five high-performance integrated backup servers: T9-500 Pro, T12-500 Pro, U4-500, U8-500 Plus, and U12-500 Plus. This product release not only enriches TerraMaster enterprise-level product line but also provides enterprise users with an integrated, efficient, and secure data backup solution - from hardware to software - by pairing these devices with the company proprietary BBS Business Backup Suite.

Key Features of the New Integrated Backup Servers

• T9-500 Pro & T12-500 Pro: As new members of TerraMaster high-end series, these products feature compact designs and are easy to manage. With powerful processors, large memory capacities, and dual 10GbE network interfaces, they ensure high-efficiency data backup tasks, catering to the large-scale data storage and backup needs of small and medium-sized enterprises.
• U4-500: Designed for SOHO, small offices, and remote work scenarios, the U4-500 features a compact 4-bay design and convenient network connectivity, making it an ideal data backup solution. Its user-friendly management interface allows for easy deployment and maintenance.
• U8-500 Plus & U12-500 Plus: These two rackmount 8-bay and 12-bay upgraded models feature fully optimized designs, high-performance processors, and standard dual 10GbE high-speed interfaces. They not only improve data processing speeds but also enhance data security, making them particularly suitable for small and medium-sized enterprises that need to handle large volumes of data backup and recovery.

According to the market research firm Mercury Research, the desktop CPU market has witnessed a remarkable transformation, with AMD seizing a substantial 28.7% market share in Q3 of 2024—a giant leap since the launch of the original Zen architecture in 2017. This 5.7 percentage point surge from the previous quarter is a testament to the company's continuous innovation against the long-standing industry leader, Intel. Their year-over-year growth of nearly ten percentage points, fueled by the success of their Ryzen 7000 and 9000 series processors, starkly contrasts Intel's Raptor Lake processors, which encountered technical hurdles like stability issues. AMD's revenue share soared by 8.5 percentage points, indicating robust performance in premium processor segments. Intel, witnessing a decline in its desktop market share to 71.3%, attributes this shift to inventory adjustments rather than competitive pressure and still holds the majority.

AMD's success story extends beyond desktops, with the company claiming 22.3% of the laptop processor market and 24.2% of the server segment. A significant milestone was reached as AMD's data center division generated $3.549 billion in quarterly revenue, a new record for a company not even present in the data center in any considerable quantity just a decade ago. Stemming from strong EPYC processor sales to hyperscalers and cloud providers, along with Instinct MI300X for AI applications, AMD's acceleration of data center deployments is massive. Despite these shifts, Intel continues to hold its dominant position in client computing, with 76.1% of the overall PC market, held by its strong corporate relationships and extensive manufacturing infrastructure. OEM partners like Dell, HP, Lenovo, and others rely heavily on Intel for their CPU choice, equipping institutions like schools, universities, and government agencies.

Samsung Electronics today reported financial results for the third quarter ended Sept. 30, 2024. The Company posted KRW 79.1 trillion in consolidated revenue, an increase of 7% from the previous quarter, on the back of the launch effects of new smartphone models and increased sales of high-end memory products. Operating profit declined to KRW 9.18 trillion, largely due to one-off costs, including the provision of incentives in the Device Solutions (DS) Division. The strength of the Korean won against the U.S. dollar resulted in a negative impact on company-wide operating profit of about KRW 0.5 trillion compared to the previous quarter.

In the fourth quarter, while memory demand for mobile and PC may encounter softness, growth in AI will keep demand at robust levels. Against this backdrop, the Company will concentrate on driving sales of High Bandwidth Memory (HBM) and high-density products. The Foundry Business aims to increase order volumes by enhancing advanced process technologies. Samsung Display Corporation (SDC) expects the demand of flagship products from major customers to continue, while maintaining a quite conservative outlook on its performance. The Device eXperience (DX) Division will continue to focus on premium products, but sales are expected to decline slightly compared to the previous quarter.

Microsoft Corp. today announced the following results for the quarter ended September 30, 2024, as compared to the corresponding period of last fiscal year:

• Revenue was $65.6 billion and increased 16%
• Operating income was $30.6 billion and increased 14%
• Net income was $24.7 billion and increased 11% (up 10% in constant currency)
• Diluted earnings per share was $3.30 and increased 10%

"AI-driven transformation is changing work, work artifacts, and workflow across every role, function, and business process," said Satya Nadella, chairman and chief executive officer of Microsoft. "We are expanding our opportunity and winning new customers as we help them apply our AI platforms and tools to drive new growth and operating leverage."

Today, Cisco announced new additions to its data center infrastructure portfolio: an AI server family purpose-built for GPU-intensive AI workloads with NVIDIA accelerated computing, and AI PODs to simplify and de-risk AI infrastructure investment. They give organizations an adaptable and scalable path to AI, supported by Cisco's industry-leading networking capabilities.

"Enterprise customers are under pressure to deploy AI workloads, especially as we move toward agentic workflows and AI begins solving problems on its own," said Jeetu Patel, Chief Product Officer, Cisco. "Cisco innovations like AI PODs and the GPU server strengthen the security, compliance, and processing power of those workloads as customers navigate their AI journeys from inferencing to training."

At Lenovo Tech World 2024, we announced new Supercomputing servers for HPC and AI workloads. These new water-cooled servers use the latest processor and accelerator technology from Intel and NVIDIA.

ThinkSystem SC750 V4
Engineered for large-scale cloud infrastructures and High Performance Computing (HPC), the Lenovo ThinkSystem SC750 V4 Neptune excels in intensive simulations and complex modeling. It's designed to handle technical computing, grid deployments, and analytics workloads in various fields such as research, life sciences, energy, engineering, and financial simulation.

Jabil Inc. announced today that it is expanding its server portfolio with the J421E-S and J422-S servers, powered by AMD 5th Generation EPYC and Intel Xeon 6 processors. These servers are purpose-built for scalability in a variety of cloud data center applications, including AI, high-performance computing (HPC), fintech, networking, storage, databases, and security — representing the latest generation of server innovation from Jabil.

Built with customization and innovation in mind, the design-ready J422-S and J421E-S servers will allow engineering teams to meet customers' specific requirements. By fine-tuning Jabil's custom BIOS and BMC firmware, Jabil can create a competitive advantage for customers by developing the server configuration needed for higher performance, data management, and security. The server platforms are now available for sampling and will be in production by the first half of 2025.

Hewlett Packard Enterprise announced the industry's first 100% fanless direct liquid cooling systems architecture to enhance the energy and cost efficiency of large-scale AI deployments. The company introduced the innovation at its AI Day, held for members of the financial community at one of its state-of-the-art AI systems manufacturing facilities. During the event, the company showcased its expertise and leadership in AI across enterprises, sovereign governments, service providers and model builders.

Industry's first 100% fanless direct liquid cooling system
While efficiency has improved in next-generation accelerators, power consumption is continuing to intensify with AI adoption, outstripping traditional cooling techniques.

NVIDIA is reportedly considering a significant design change for its GPU products, shifting from the current on-board solution to an independent GPU socket design following the GB200 shipment in Q4, according to reports from MoneyDJ and the Economic Daily News quoted by TrendForce. This move is not new in the industry, AMD has already introduced socket design in 2023 with their MI300A series via Supermicro dedicated servers. The B300 series, expected to become NVIDIA's mainstream product in the second half of 2025, is rumored to be the main beneficiary of this design change that could improve yield rates, though it may come with some performance trade-offs.

According to the Economic Daily News, the socket design will simplify after-sales service and server board maintenance, allowing users to replace or upgrade the GPUs quickly. The report also pointed out that based on the slot design, boards will contain up to four NVIDIA GPUs and a CPU, with each GPU having its dedicated slot. This will bring benefits for Taiwanese manufacturers like Foxconn and LOTES, who will supply different components and connectors. The move seems logical since with the current on-board design, once a GPU becomes faulty, the entire motherboard needs to be replaced, leading to significant downtime and high operational and maintenance costs.

Hewlett Packard Enterprise today announced the HPE ProLiant Compute XD685 for complex AI model training tasks, powered by 5th Gen AMD EPYC processors and AMD Instinct MI325X accelerators. The new HPE system is optimized to quickly deploy high-performing, secure and energy-efficient AI clusters for use in large language model training, natural language processing and multi-modal training.

The race is on to unlock the promise of AI and its potential to dramatically advance outcomes in workforce productivity, healthcare, climate sciences and much more. To capture this potential, AI service providers, governments and large model builders require flexible, high-performance solutions that can be brought to market quickly.

MiTAC Computing Technology Corporation, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Holdings Corporation (TSE:3706), today announced the launch of its new high-performance servers, featuring the latest AMD EPYC 9005 Series CPUs and AMD Instinct MI325X accelerators.

"AMD is the trusted data center solutions provider of choice for leading enterprises worldwide, whether they are enabling corporate AI initiatives, building large-scale cloud deployments, or hosting critical business applications on-premises," said Ravi Kuppuswamy, senior vice president, Server Business Unit, AMD. "Our latest 5th Gen AMD EPYC CPUs provide the performance, flexibility and reliability - with compatibility across the x86 data center ecosystem - to deliver tailored solutions that meet the diverse demands of the modern data center."

Dell Technologies (NYSE: DELL) expands the world's broadest generative AI (GenAI) solutions portfolio with Dell AI Factory additions tailored for AMD environments. These solutions offer enterprises enhanced AI capabilities, including greater scalability and flexibility, to stay competitive in the evolving technology landscape.

"By integrating AMD technology into the latest Dell servers, AI solutions and services through the Dell AI Factory, we're providing the performance and efficiencies enterprises need today and in the future," said Arthur Lewis, president, Infrastructure Solutions Group, Dell Technologies. "Together with AMD, we are setting new standards in AI performance, giving enterprises powerful and cost-effective solutions essential for modern data-driven environments."

ASRock Rack Inc., a leading innovative server company, announced upgrades to its extensive lineup to support AMD EPYC 9005 Series processors. Among these updates is the introduction of the new 6U8M-TURIN2 GPU server. This advanced platform features AMD Instinct MI325X accelerators, specifically optimized for intensive enterprise AI applications, and will be showcased at AMD Advancing AI 2024.

ASRock Rack Introduce GPU Servers Powered by AMD EPYC 9005 series processors
AMD today revealed the 5th Generation AMD EPYC processors, offering a wide range of core counts (up to 192 cores), frequencies (up to 5 GHz), and expansive cache capacities. Select high-frequency processors, such as the AMD EPYC 9575F, are optimized for use as host CPUs in GPU-enabled systems. Additionally, the just launched AMD Instinct MI325X accelerators feature substantial HBM3E memory and 6 TB/s of memory bandwidth, enabling quick access and efficient handling of large datasets and complex computations.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, announces the launch of a new series of servers, GPU-accelerated systems, and storage servers featuring the AMD EPYC 9005 Series processors and AMD Instinct MI325X GPUs. The new H14 product line represents one of the most extensive server families in the industry, including Supermicro's Hyper systems, the Twin multi-node servers, and AI inferencing GPU systems, all available with air or liquid cooling options. The new "Zen 5" processor core architecture implements full data path AVX-512 vector instructions for CPU-based AI inference and provides 17% better instructions per cycle (IPC) than the previous 4th generation EPYC processor, enabling more performance per core.

Supermicro's new H14 family uses the latest 5th Gen AMD EPYC processors which enable up to 192 cores per CPU with up to 500 W TDP (thermal design power). Supermicro has designed new H14 systems including the Hyper and FlexTwin systems which can accommodate the higher thermal requirements. The H14 family also includes three systems for AI training and inference workloads supporting up to 10 GPUs which feature the AMD EPYC 9005 Series CPU as the host processor and two which support the AMD Instinct MI325X GPU.

ASUS today announced a series of servers powered by the groundbreaking AMD EPYC 9005-series processors, setting new standards in performance and density for AI-driven data center workloads. The full line-up includes ASUS ESC A8A-E12U supporting AMD Instinct MI325X accelerators, and ASUS ESC8000A-E13P GPU servers, capable of supporting eight GPUs for large-scale AI model training, ensuring unmatched computational power. ASUS RS520QA-E13 is a multi-node server for EDA and cloud computing. ASUS offers versatile solutions including RS720A-E13, RS700A-E13, and RS521A and RS501A for general-purpose tasks. These servers are engineered to deliver excel performance across a wide range of applications, meeting the demands of the most rigorous workloads.

At the core of these servers lies AMD EPYC 9005-series processors, previously codenamed Turin, and based on the Zen 5 architecture with up to 192 cores / 384 threads and up to 5 GHz frequencies, powerhouse CPUs designed to elevate AI-driven data center workloads to unprecedented levels. With industry-leading vCPU density, EPYC 9005-series processors combine optimized compute and AI capabilities to deliver superior performance in AI inference, whether handling mixed or traditional tasks. This lineup diversity is unified by the x86 architecture, enables customers to easily integrate ASUS servers powered by AMD EPYC 9005-series processors into their existing x86 infrastructure. This allows for efficient transitions and migrations within the data center, ensuring continuity and maximizing operational efficiency.