Caseking, in partnership with overclocking prowess Der8auer, have introduced a new overclocking product for users that want to extract every little percentage of additional overclocking from their chips (they had already introduced 99.9% purity silver-based heatspreaders, too). The Skylake-X Direct-Die Cooling Frame is a solution that aims to replace Intel's Integrated Loading Mechanism (ILM), attaching itself to the CPU cooler mount holes, and enabling users to use direct-to-die cooling mechanisms (sans heatspreader). The idea is that users can "cut the middleman" and make do without both Intel's terrible TIM and their stock heatspreaders, achieving a much higher heat transfer form the CPU die to the CPU cooler and, therefore, higher heat dissipation, lower temperatures, and higher overclocking.