Advantech, a leading provider of AIoT platforms and services, proudly unveils its latest AI acceleration modules: the EAI-1200 and EAI-3300, powered by Hailo-8 AI processors. These modules deliver AI performance of up to 52 TOPS while achieving more than 12 times the power efficiency of comparable AI modules and GPU cards. Designed in standard M.2 and PCIe form factors, the EAI-1200 and EAI-3300 can be seamlessly integrated with diverse x86 and Arm-based platforms, enabling quick upgrades of existing systems and boards to incorporate AI capabilities. With these AI acceleration modules, developers can run inference efficiently on the Hailo-8 NPU while handling application processing primarily on the CPU, optimizing resource allocation. The modules are paired with user-friendly software toolkits, including the Edge AI SDK for seamless integration with HailoRT, the Dataflow Compiler for converting existing models, and TAPPAS, which offers pre-trained application examples. These features accelerate the development of edge-based vision AI applications.

EAI-1200 M.2 AI Module: Accelerating Development for Vision AI Security
The EAI-1200 is an M.2 AI module powered by a single Hailo-8 VPU, delivering up to 26 TOPS of computing performance while consuming approximately 5 watts of power. An optional heatsink supports operation in temperatures ranging from -40 to 65°C, ensuring easy integration. This cost-effective module is especially designed to bundle with Advantech's systems and boards, such as the ARK-1221L, AIR-150, and AFE-R770, enhancing AI applications including baggage screening, workforce safety, and autonomous mobile robots (AMR).

Today, AMD (NASDAQ: AMD) announced its third generation commercial AI mobile processors, designed specifically to transform business productivity with Copilot+ features including live captioning and language translation in conference calls and advanced AI image generators. The new Ryzen AI PRO 300 Series processors deliver industry-leading AI compute, with up to three times the AI performance than the previous generation, and offer uncompromising performance for everyday workloads. Enabled with AMD PRO Technologies, the Ryzen AI PRO 300 Series processors offer world-class security and manageability features designed to streamline IT operations and ensure exceptional ROI for businesses.

Ryzen AI PRO 300 Series processors feature new AMD "Zen 5" architecture, delivering outstanding CPU performance, and are the world's best line up of commercial processors for Copilot+ enterprise PCs. Laptops equipped with Ryzen AI PRO 300 Series processors are designed to tackle business' toughest workloads, with the top-of-stack Ryzen AI 9 HX PRO 375 offering up to 40% higher performance and up to 14% faster productivity performance compared to Intel's Core Ultra 7 165U. With the addition of XDNA 2 architecture powering the integrated NPU, AMD Ryzen AI PRO 300 Series processors offer a cutting-edge 50+ NPU TOPS (Trillions of Operations Per Second) of AI processing power, exceeding Microsoft's Copilot+ AI PC requirements and delivering exceptional AI compute and productivity capabilities for the modern business. Built on a 4 nm process and with innovative power management, the new processors deliver extended battery life ideal for sustained performance and productivity on the go.

Qualcomm Technologies, Inc., a global leader in wireless technology innovation, today announced the launch of the Qualcomm Networking Pro A7 Elite, a groundbreaking wireless networking platform set to transform how people will experience their networks with edge AI integration. Leveraging an AI co-processor with 40 TOPS of NPU processing power, the platform delivers elevated Wi-Fi 7 connectivity and networking performance, while also equipping connected devices with powerful and centralized generative AI processing capabilities.

This transformative integration of computing power into the network unlocks opportunities for operators and enterprises to deploy innovative applications and services in areas such as security and surveillance, energy management and automation, personalized virtual assistants, aging in place and health monitoring among others. Edge AI can enhance privacy by processing sensitive information on the gateway, while enabling personalization through contextualized understanding of the environment and immediacy through near real-time responses. This approach unlocks the power of advanced AI for more devices, even legacy ones, enabling a more reliable and harmonized user experience across connected devices.

Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint's latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC 'REGULUS' for on-device AI and high-performance acceleration chip 'ARIES' for on-premises AI.

The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year's summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.

LG Electronics (LG) is excited to announce that its newest LG gram laptop featuring the Intel Core Ultra processor (Series 2) will be showcased at the Intel Core Ultra Global Launch Event from September 3-8. Renowned for its powerful performance and ultra-lightweight design, the LG gram series now integrates advanced AI capabilities powered by the latest Intel Core Ultra processor. The LG gram 16 Pro, the first model to feature these new Intel processors, will be unveiled before its release at the end of 2024.

As the first on-device AI laptop from the LG gram series, it offers up to an impressive 48 neural processing unit (NPU) tera operations per second (TOPS), setting a new standard for AI PCs and providing the exceptional performance required for Copilot experiences. Powered by the latest Intel Core Ultra processor, the LG gram 16 Pro is now more efficient thanks to advanced AI functionalities such as productivity assistants, text and image creation and collaboration tools. What's more, its extended battery life helps users handle tasks without worry.

Industry leader AAEON has expanded its RISC computing product portfolio with the release of the SRG-IMX8PL and PICO-IMX8PL, a Mini PC and 2.5" PICO-ITX board, respectively. Both products are powered by the NXP i.MX 8M Plus platform, featuring a quad-core Arm Cortex -A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.

Built to provide cost-efficient IoT Gateway solutions in rugged environments, the SRG-IMX8PL and PICO-IMX8PL both offer wide temperature ranges of -40°C to 80°C with the use of a fanless heatsink, a 9 V to 36 V power input range. The SRG-IMX8PL Mini PC also features enhanced shock, drop, and vibration resistance. Dual LAN ports with IEEE 1588 and TSN capabilities, alongside Wi-Fi and 4G module support via M.2 2230 E-Key and full-size mini card, provide each device with broad connectivity options for industrial IoT use. Additionally, both the PICO-IMX8PL and SRG-IMX8PL support a wide range of operating systems, including Debian 11, Android 13, Windows 10 IoT, and Yocto, as well as data communication protocols such as Modbus, MQTT, and OPC Unified Architecture (OPC UA).

ASUS has revealed its upcoming ExpertBook P5 laptop, set to debut alongside Intel's highly anticipated "Lunar Lake" processors. This ultrabook aims to boost AI-capable laptop market, featuring an unspecified Intel Lunar Lake "Core Ultra 200V" CPU at its core. The ExpertBook P5 boasts impressive AI processing capabilities, with over 45 TOPS from its Neural Processing Unit and a combined 100+ TOPS when factoring in the CPU and GPU. The NPU provides efficient processing, with additional power coming from Lunar Lake's GPU with XMX cores, featuring the Xe2 Battlemage architecture. This is more than enough for the Copilot+ certification from Microsoft, making the laptop debut as an "AI PC." The ExpertBook P5 offers up to 32 GB of LPDDR5X memory running at 8333 MT/s, up to 3 TB of PCIe 4.0 SSD storage with two drives, and Wi-Fi 7 support.

The 14-inch anti-glare display features a 2.5K resolution and a smooth 144 Hz refresh rate, ensuring a premium visual experience. Despite its powerful internals, the ExpertBook P5 maintains a solid profile weighing just 1.3 kg. The laptop is housed in an all-metal military-grade aluminium body with a 180-degree lay-flat hinge, making it both portable and versatile. ASUS has also prioritized cooling efficiency with innovative technology that optimizes thermal management, whether the laptop is open or closed. Security hasn't been overlooked either, with the ExpertBook P5 featuring a robust security ecosystem, including Windows 11 secured-core PC framework, NIST-155-ready Commercial-Grade BIOS protection, and biometric login options. While an exact release date hasn't been confirmed, ASUS is preparing ExpertBook P5 and other Lunar Lake-powered laptops to hit the market in the second half of 2024.

During Computex 2024, Intel announced the next-generation compute platform for the notebook segment in the form of the Core Ultra 200V series, codenamed Lunar Lake. Set for release in September 2024, these processors are generating excitement among tech enthusiasts and industry professionals alike. According to the latest leak by VideoCardz, Intel plans to unveil nine variants of Lunar Lake, including Core Ultra 7 and Core Ultra 5 models, with a single high-end Core Ultra 9 variant. While exact specifications remain under wraps, Intel's focus on artificial intelligence capabilities is clear. The company aims to secure a spot in Microsoft's Copilot+ lineup by integrating its fourth-generation Neural Processing Unit (NPU), boasting up to 48 TOPS of performance. All Lunar Lake variants are expected to feature a hybrid architecture with four Lion Cove performance cores and four Skymont efficiency cores.

This design targets low-power mobile devices, striking a balance between performance and energy efficiency. For graphics, Intel is incorporating its next-generation Arc technology, dubbed Battlemage GPU, which utilizes the Xe2-LPG architecture. The leaked information suggests that Lunar Lake processors will come with either 16 GB or 32 GB of non-upgradable LPDDR5-8533 memory. Graphics configurations are expected to include seven or eight Xe2 GPU cores, depending on the model. At the entry level, the Core Ultra 5 226V is rumored to offer a 17 W base power and 30 W maximum turbo power, with performance cores clocking up to 4.5 GHz. The top-tier Core Ultra 9 288V is expected to push the envelope with a 30 W base power, performance cores boosting to 5.1 GHz, and an NPU capable of 48 TOPS. You can check out the rest of the SKUs in the table below.

At Computex 2024, Colorful has followed the success of their popular COLORFIRE MEOW Series gaming desktops. The company has unleashed two fierce new gaming laptops - the COLORFIRE MEOW R15 and R16. These portable laptops are adorned with designs inspired by Bobi, COLORFIRE's beloved office cat. From paw print patterns to a sleek orange tabby color scheme, the laptops are littered with feline flair. Under the cat-inspired hood, the MEOW laptops pack a serious punch. They are equipped with the latest AMD Ryzen 8000 Series processors tailored for gaming, content creation, and entertainment. AMD Ryzen AI technology provides a boost to artificial intelligence capabilities. Both run on the AMD Ryzen 7 8845HS processor with eight cores, 16 threads, and a 5.1 GHz maximum boost clock. The Ryzen AI engine delivers up to 39 TOPS for accelerated AI performance. For graphics, the laptops feature up to an NVIDIA GeForce RTX 4070 GPU with 140 W of power.

The R15 has a 15.6-inch 2560x1440 IPS panel with 100% sRGB color and 165 Hz refresh rate. The R16 goes even bigger with a 16-inch 2560x1600 IPS display, 100% sRGB, and 240 Hz refresh. AMD FreeSync is there as well to ensure a tear-free experience. Colorful has outfitted the laptops with dual turbo fans, a 6-heatpipe solution, and performance control software to tame the heat from the powerful components. When it's time to pounce on the latest games, these MEOW laptops have the fierce cooling to keep their claws out.

At Computex 2024, ASUS unveiled major updates to its popular laptop lineups, designed for the "Copilot+" era of AI computing. The first is the Zenbook S16 is a premium 16-inch laptop series powered by AMD's latest Ryzen AI 9 HX 370 processors with dedicated AI acceleration. Remarkably, ASUS has managed to pack this high-performance silicon into an ultra-portable 1.1 cm thin chassis weighing just 1.5 kg. The Zenbook S16 integrates AMD's new NPU capable of a 50 TOPS of AI compute for accelerating AI/ML workloads. The centerpiece is the laptop's stunning 16-inch 3K OLED display made with ASUS Lumina technology. It offers 100% vibrant DCI-P3 color gamut coverage, a blazing-fast 120 Hz refresh rate with 0.2 ms response time, and up to 600 nits brightness. ASUS paired this premium visual experience with a six-speaker audio system for an immersive multimedia experience.

During Computex 2024, GIGABYTE unveiled its new "AI TOP" series designed to empower users to develop and run AI applications locally on their systems. The AI TOP lineup includes AI-optimized motherboards, graphics cards, and complete system solutions. The flagship motherboard is called TRX50 AI TOP, which boasts support for AMD's Ryzen Threadripper 7000 PRO and a regular series of CPUs. The flagship TRX50 AI TOP motherboard features a special VRM design with beefy heatsinks, four PCIe 5.0 x16 slots for quad-GPU setup, eight-channel DDR5 memory with room for eight DIMMs, and a few M.2 PCIe Gen 5 slots. Next in the AI TOP line is the GIGABYTE GeForce RTX 4070 Ti SUPER AI TOP edition. Formed as a blower-style cooler, the RTX 4070 Ti SUPER AI TOP is envisioned for tight spaces and parallel installation with other GPUs to accelerate local AI development and inference.

Supposedly, there will be more AI TOP motherboards and GPUs than what is showcased. GIGABYTE may have an AI TOP makeover for Intel's upcoming Z890 AORUS Xtreme, and there could be more GPUs in the future with the blower-style AI TOP design. The goal of AI TOP series is optimization for AI workloads, which require lots of GPUs and lots of memory, like the TRX50 AI TOP motherboard shows.

The 63rd edition of the TOP500 reveals that Frontier has once again claimed the top spot, despite no longer being the only exascale machine on the list. Additionally, a new system has found its way into the Top 10.

The Frontier system at Oak Ridge National Laboratory in Tennessee, USA remains the most powerful system on the list with an HPL score of 1.206 EFlop/s. The system has a total of 8,699,904 combined CPU and GPU cores, an HPE Cray EX architecture that combines 3rd Gen AMD EPYC CPUs optimized for HPC and AI with AMD Instinct MI250X accelerators, and it relies on Cray's Slingshot 11 network for data transfer. On top of that, this machine has an impressive power efficiency rating of 52.93 GFlops/Watt - putting Frontier at the No. 13 spot on the GREEN500.

According to the report from BenchLife, NVIDIA has started the marketing campaign push for "Premium AI PC," squarely aimed at the industry's latest trend pushed by Intel, AMD, and Qualcomm for an "AI PC" system, which features a dedicated NPU for processing smaller models locally. NVIDIA's approach comes from a different point of view: every PC with an RTX GPU is a "Premium AI PC," which holds a lot of truth. Generally, GPUs (regardless of the manufacturer) hold more computing potential than the CPU and NPU combined. With NVIDIA's push to include Tensor cores in its GPUs, the company is preparing for next-generation software from vendors and OS providers that will harness the power of these powerful silicon pieces and embed more functionality in the PC.

At the Computex event in Taiwan, there should be more details about Premium AI PCs and general AI PCs. In its marketing materials, NVIDIA compares AI PCs to its Premium AI PCs, which have enhanced capabilities across various applications like image/video editing and upscaling, productivity, gaming, and developer applications. Another relevant selling point is the user base for these Premium AI PCs, which NVIDIA touts to be 100 million users. Those PCs support over 500 AI applications out of the box, highlighting the importance of proper software support. NVIDIA's systems are usually more powerful, with GeForce RTX GPUs reaching anywhere from 100-1300+ TOPS, compared to 40 TOPS of AI PCs. How other AI PC makers plan to fight in the AI PC era remains to be seen, but there is a high chance that this will be the spotlight of the upcoming Computex show.

Global PC shipments grew around 3% YoY in Q1 2024 after eight consecutive quarters of declines due to demand slowdown and inventory correction, according to the latest data from Counterpoint Research. The shipment growth in Q1 2024 came on a relatively low base in Q1 2023. The coming quarters of 2024 will see sequential shipment growth, resulting in 3% YoY growth for the full year, largely driven by AI PC momentum, shipment recovery across different sectors, and a fresh replacement cycle.

Lenovo's PC shipments were up 8% in Q1 2024 off an easy comparison from last year. The brand managed to reclaim its 24% share in the market, compared to 23% in Q1 2023. HP and Dell, with market shares of 21% and 16% respectively, remained flattish, waiting for North America to drive shipment growth in the coming quarters. Apple's shipment performance was also resilient, with the 2% growth mainly supported by M3 base models.

Sony is preparing to launch its next-generation PlayStation 5 Pro console in the Fall of 2024, right around the holidays. We previously covered a few graphics details about the console. However, today, we get more details about the CPU and the overall system, thanks to the exclusive information from Insider Gaming. Starting off, the sources indicate that PS5 Pro system memory will get a 28% bump in bandwidth, where the standard PS5 console had 448 GB/s, and the upgraded PS5 Pro will get 576 GB/s. Apparently, the memory system is more efficient, likely coming from an upgrade in memory from the GDDR6 SDRAM of the regular PS5. The next upgrade is the CPU, which has special modes for the main processor. The CPU uArch is likely the same, with clocks pushed to 3.85 GHz, resulting in a 10% frequency increase.

However, this is only achieved in the "High CPU Frequency Mode," which steals the SoC's power from the GPU and downclocks it slightly to allocate more power to the CPU in highly CPU-intense settings. The GPU we discussed here is an RDNA 3 IP with up to 45% faster graphics rendering. The ray tracing performance can be up to four times higher than the regular PS5, while the entire GPU delivers 33.5 TeraFLOPS of FP32 single-precision computing. This comes from 30 WGP running BVH8 shaders vs the 18 WGPs running BVH4 shaders on the regular PS5. There are PSSR upscalers present, and the GPU can output 8K resolution, which will come with future software updates. Last but not least, the AI front also has a custom AI accelerator capable of 300 8-bit INT8 TOPS and 67 16-bit FP16 TeraFLOPS. Audio codecs are getting some love, as well, with ACV running up to 35% faster.

AI workloads are split into two different categories: training and inference. While training requires large computing and memory capacity, access speeds are not a significant contributor; inference is another story. With inference, the AI model must run extremely fast to serve the end-user with as many tokens (words) as possible, hence giving the user answers to their prompts faster. An AI chip startup, Groq, which was in stealth mode for a long time, has been making major moves in providing ultra-fast inference speeds using its Language Processing Unit (LPU) designed for large language models (LLMs) like GPT, Llama, and Mistral LLMs. The Groq LPU is a single-core unit based on the Tensor-Streaming Processor (TSP) architecture which achieves 750 TOPS at INT8 and 188 TeraFLOPS at FP16, with 320x320 fused dot product matrix multiplication, in addition to 5,120 Vector ALUs.

Having massive concurrency with 80 TB/s of bandwidth, the Groq LPU has 230 MB capacity of local SRAM. All of this is working together to provide Groq with a fantastic performance, making waves over the past few days on the internet. Serving the Mixtral 8x7B model at 480 tokens per second, the Groq LPU is providing one of the leading inference numbers in the industry. In models like Llama 2 70B with 4096 token context length, Groq can serve 300 tokens/s, while in smaller Llama 2 7B with 2048 tokens of context, Groq LPU can output 750 tokens/s. According to the LLMPerf Leaderboard, the Groq LPU is beating the GPU-based cloud providers at inferencing LLMs Llama in configurations of anywhere from 7 to 70 billion parameters. In token throughput (output) and time to first token (latency), Groq is leading the pack, achieving the highest throughput and second lowest latency.

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.

The new HEATKILLER Multitop series for Lowara/Laing DDC pumps features a unique modular design and expandability. Each top is manufactured from a solid, 30 mm thick acetal block while the internal structure has been optimized for head and flow capacity. The series includes a SINGLETOP, a MULTITOP X2 as well as MULTITOP X3 and an EXPANSION-TOP. The SINGLETOP is designed to operate one DDC pump and, unlike the MULTITOPS, cannot be expanded.

The expandable MULTITOP X2 and X3 are designed to operate two respectively three DDC pumps in series, thereby significantly increasing the delivery head. For the MULTITOP X3, an EXPANSION TOP serves as connection between input and output. An expansion with additional EXPANSION TOPs is easily possible with both the MULTITOP X3 and X2, theoretically allowing infinite scaling.

The 56th edition of the TOP500 saw the Japanese Fugaku supercomputer solidify its number one status in a list that reflects a flattening performance growth curve. Although two new systems managed to make it into the top 10, the full list recorded the smallest number of new entries since the project began in 1993.

The entry level to the list moved up to 1.32 petaflops on the High Performance Linpack (HPL) benchmark, a small increase from 1.23 petaflops recorded in the June 2020 rankings. In a similar vein, the aggregate performance of all 500 systems grew from 2.22 exaflops in June to just 2.43 exaflops on the latest list. Likewise, average concurrency per system barely increased at all, growing from 145,363 cores six months ago to 145,465 cores in the current list.

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announced the Qualcomm Cloud AI 100, a high-performance AI inference accelerator, is shipping to select worldwide customers. Qualcomm Cloud AI 100 uses advanced signal processing and cutting-edge power efficiency to support AI solutions for multiple environments including the datacenter, cloud edge, edge appliance, and 5G infrastructure. The newly announced Qualcomm Cloud AI 100 Edge Development Kit is engineered to accelerate adoption of edge applications by offering a complete system solution for AI processing up to 24 simultaneous 1080p video streams along with 5G connectivity.

"Qualcomm Technologies is well positioned to support complete edge-to-cloud high performance AI solutions that lead the industry in performance per watt," said Keith Kressin, senior vice president and general manager, computing and edge cloud, Qualcomm Technologies. "Qualcomm Cloud AI 100 is now shipping to select worldwide customers and we look forward to seeing commercial products launch in the first half of 2021."

Tesla held an investor panel in the USA yesterday (April 22) with the entire event, focusing on autonomous vehicles, also streamed on YouTube (replay here). There were many things promised in the course of the event, many of which are outside the scope of this website, but the announcement of Tesla's first full self-driving hardware module made the news in more ways than one as reported right here on TechPowerUp. We had noted how Tesla had traditionally relied on NVIDIA (and then Intel) microcontroller units, as well as NVIDIA self-driving modules in the past, but the new in-house built module had stepped away from the green camp in favor of more control over the feature set.

NVIDIA was quick to respond to this, saying Tesla was incorrect in their comparisons, in that the NVIDIA Drive Xavier at 21 TOPS was not the right comparison, and rather it should have been against NVIDIA's own full self-driving hardware the Drive AGX Pegasus capable of 320 TOPS. Oh, and NVIDIA also claimed Tesla erroneously reported Drive Xavier's performance was 21 TOPS instead of 30 TOPS. It is interesting how one company was quick to recognize itself as the unmarked competition, especially at a time when Intel, via their Mobileye division, have also given them a hard time recently. Perhaps this is a sign of things to come in that self-driving cars, and AI computing in general, is getting too big a market to be left to third-party manufacturing, with larger companies opting for in-house hardware itself. This move does hurt NVIDIA's focus in this field, as market speculation is ongoing that they may end up losing other customers following Tesla's departure.

The United States has been being pushed down in the TOP500 standings for some time courtesy China, whom has taken the 1st and 2nd place seats from the US with their Sunway TaihuLight and Tianhe-2 Supercomputers (at a Linpack performance of 93 and 33.9 Petaflops, respectively). It seemed though the crown was stolen from America, 3rd place was relatively safe for the former champs. Not so. America has been pushed right off the podium in the latest TOP500 refresh... not by China though, but Switzerland?

ASUS GeForce GTX DirectCU, DirectCU OC, and DirectCU TOP graphics cards now arrive in a special World of Warcraft Mists of Pandaria edition. Customers get a bonus Pandaren Monk Pet downloadable character, coinciding with the release of the latest expansion to the globally-popular MMORPG. The TOP version uses a hand-picked GPU operating 157MHz faster than reference, and all cards make sure adventuring stays cool and quiet with DirectCU thermal innovation. Exclusive ASUS DIGI+ VRM and Super Alloy Power contribute greater stability, overclocking, and product longevity, plus GPU Tweak returns to give gamers easy access to diverse card tuning capabilities.

The ASUS GeForce GTX 680 DirectCU II TOP graphics card delivers a true flagship product for dedicated PC gamers and performance enthusiasts. The TOP-selected 28 nm NVIDIA GeForce GTX 680 GPU has been overclocked by ASUS to 1201 MHz to boost frame rates in games, offering users 143 MHz over reference. Its ASUS-designed DirectCU II thermal design runs 20% cooler than stock, while the twin 100 mm fans keep noise at bay with 14 dB quieter operation.

ASUS has added 10-phase DIGI+ VRM digitally regulated power delivery with 30% noise reduction, working in tandem with durable Super Alloy Power components that last 2.5 longer than reference. Users can tap the greater overclocking and overvolting capabilities of the card through both the hardware-level VGA Hotwire and the software-level GPU Tweak utility. Also released is the ASUS GeForce GTX 680 DirectCU II OC edition, with a 1019 MHz core capable of a 1084 MHz boost clock. This card uses the same DirectCU II cooler and PCB as the TOP version.

ASUS has launched an entire range of DirectCU II-enhanced graphics cards that include the latest technologies from both AMD and NVIDIA GPU rosters. On the AMD side, ASUS offers the HD 6970 and HD 6950 graphics cards with DirectCU II while for NVIDIA, the GTX 580, GTX 570 and new GTX 560 Ti all ship with the advanced cooling technology.

Based on ASUS DirectCU, which uses copper heat pipes in direct contact with the GPU core for up to 20% cooler performance, DirectCU II adds a custom cooler that uses twin 100mm fans for a massive 600% increase in airflow on HD 6970, HD 6950, GTX 580, and GTX 570 DirectCU II cards. ASUS has also launched the GTX 560 Ti DirectCU II TOP graphics card with dual 80mm fans for the best performance in its segment through doubled air power.