Applied Materials, Inc. today introduced the MAX OLED solution, a patented OLED pixel architecture and revolutionary display manufacturing technology designed to bring the superior OLED displays found in high-end smartphones to tablets, PCs and eventually TVs.

OLED is the display technology of choice for the world's leading smartphone manufacturers because it offers superior display quality, light and flexible form factors, and durability. However, until today, it has proven challenging to scale OLED display manufacturing to the larger glass panels used to make displays for tablets, PCs and TVs.

d-Matrix today unveiled Corsair, an entirely new computing paradigm designed from the ground-up for the next era of AI inference in modern datacenters. Corsair leverages d-Matrix's innovative Digital In-Memory Compute architecture (DIMC), an industry first, to accelerate AI inference workloads with industry-leading real-time performance, energy efficiency, and cost savings as compared to GPUs and other alternatives.

The emergence of reasoning agents and interactive video generation represents the next level of AI capabilities. These leverage more inference computing power to enable models to "think" more and produce higher quality outputs. Corsair is the ideal inference compute solution with which enterprises can unlock new levels of automation and intelligence without compromising on performance, cost or power.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard. JESD230G introduces speeds of up to 4800 MT/s, as compared to 400 MT/s in the first version of JESD230 published in 2011. Also, JESD230G adds a separate Command/Address Bus Protocol (SCA), delivering enhanced throughput and efficiency by allowing hosts and NAND devices to take maximum advantage of the latest interface speeds. JESD230G is available for free download from the JEDEC website.

"JEDEC is excited to release JESD230G," said David Landsman, Distinguished Engineer at Western Digital and Chair of the JEDEC NAND TG. He added, "This version of JESD230 further advances the capabilities of NAND flash devices to meet the growing demands of their expanding range of applications and continues the JEDEC tradition of building interoperable ecosystems through open industry standards."

QSAN Technology Inc., a leading provider of innovative storage solutions, is thrilled to announce the latest update to its enterprise NAS product line with enterprise unified storage manager - QSM 4, designed to set new standards for performance and management. The XN8100R and XN5100R series (single controller models) now deliver significantly enhanced capabilities for today's data-intensive business environments.

Enhanced Performance for Greater Efficiency with Enterprise NAS
QSAN's XCubeNAS models with the newly developed QFS (QSAN File System) demonstrate up to 10x faster data access than QSM 3 models. The high-core models of the XN8100R series work with SD4 NVMe SSD to further optimize latency and IOPS, delivering exceptional responsiveness and high-speed data access.

The CHERI Alliance CIC (Community Interest Company) today announced its official launch and the expansion of its membership, welcoming Chevin Technology (UK), Critical Technologies (USA), the Defence Science and Technology Laboratory (DSTL, UK), Google (USA), Light Momentum Technology Corporation (Taiwan), National Cyber Security Centre (NCSC, a part of GCHQ, UK), Parvat Infotech (India), SRI International (USA), TechWorks (UK), Trusted Computer Center of Excellence (USA), the University of Birmingham (UK), and the University of Glasgow (UK) as founding members.

Founded to unite hardware security leaders and system developers, the CHERI Alliance aims to establish CHERI (Capability Hardware Enhanced RISC Instructions) as the new standard for memory safety and scalable software compartmentalization.

At AAEON Technology, we recognize growing demand for secure and reliable industrial systems. In collaboration with Canonical, AAEON Technology validates Ubuntu Pro across our Intel-based industrial systems. Each unit comes with a preinstalled Ubuntu image, an Ubuntu Pro license sticker, and 10 years of Canonical-backed updates for ongoing security and maintenance. "This collaboration means our customers benefit from cutting-edge hardware paired with the secure, long-term support offered with Ubuntu Pro enabled. With ongoing updates, they're always protected, allowing them to focus on their core goals," said Victor Lai, Managing Director at AAEON.

Ubuntu Pro provides enterprise-level security, compliance, and long-term stability for industrial and edge applications. It meets strict regulatory standards while delivering high performance in demanding environments.

LG Display, the world's leading innovator of display technologies, announced today its unveiling of the world's first Stretchable display capable of expanding up to 50%, the highest rate of elongation in the industry. At LG Science Park in Seoul on Nov. 8, the company demonstrated the panel at a meeting of more than 100 South Korean industry, academia, and research stakeholders involved in a Stretchable display national project.

Stretchable displays are seen as the ultimate free-form screen technology because they can be freely transformed into any shape, including by stretching, folding, and twisting.

The 8th edition of the Samsung AI Forum was held on November 4th and 5th in Seoul, and among all the presentations and keynote speeches, one piece of information caught our attention. As reported by The Chosun Daily, Samsung is (again) turning its attention to Processing-in-Memory (PIM) technology, in what appears to be the company's latest attempt to keep up with its rival SK Hynix in this area. In 2021, Samsung introduced the world's first HBM-PIM, the chips showing impressive gains in performance (nearly double) while reducing energy consumption by almost 50% on average. PIM technology basically adds the processor functions necessary for computational tasks, reducing data transfer between the CPU and memory.

Now, the company hopes that PIM memory chips could replace HBM in the future, based on the advantages this next-generation memory technology possesses, mainly for artificial intelligence (AI) applications. "AI is transforming our lives at an unprecedented rate, and the question of how to use AI more responsibly is becoming increasingly important," said Samsung Electronics CEO Han Jong-hee in his opening remarks. "Samsung Electronics is committed to fostering a more efficient and sustainable AI ecosystem." During the event, Samsung also highlighted its partnership with AMD, which reportedly supplies AMD with its fifth-generation HBM, the HBM3E.

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES' Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.

As a key part of President Biden's Investing in America agenda, CHIPS for America is driven by the growing need to bolster the U.S. semiconductor supply chain, accelerate U.S. leading-edge R&D, and create good quality jobs around the country. This proposed facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation by providing NSTC members access to technologies, capabilities, and critical resources.

Samsung is currently mass-producing its 9th generation V-NAND flash memory chips with 286 layers unveiled this April. According to the Korean Economic Daily, the company targets V-NAND memory chips with at least 400 stacked layers by 2026. In 2013, Samsung became the first company to introduce V-NAND chips with vertically stacked memory cells to maximize capacity. However, stacking beyond 300 levels proved to be a real challenge with the memory chips getting frequently damaged. To address this problem, Samsung is reportedly developing an improved 10th-generation V-NAND that is going to use the Bonding Vertical (BV) NAND technology. The idea is to manufacture the storage and peripheral circuits on separate layers before bonding them vertically. This is a major shift from the current Co-Packaged (CoP) technology. Samsung stated that the new method will increase the density of bits per unit area by 1.6 times (60%), thus leading to increased data speeds.

Samsung's roadmap is truly ambitious, with plans to launch the 11th generation of NAND in 2027 with an estimated 50% improvement in I/O rates, followed by 1,000-layer NAND chips by 2030. Its competitor, SK hynix, is also working on 400-layer NAND aiming to have the technology ready for mass production by the end of 2025, as we previously mentioned in August. Samsung, the current HBM market leader with a 36.9% market share have also plans for its DRAM sector intending to introduce the sixth-generation 10 nm DRAM, or 1c DRAM by the first half of 2025. Then we can expect to see Samsung's seventh-generation 1d nm (still on 10 nm) in 2026, and by 2027 the company hopes to release its first generation sub-10 nm DRAM, or 0a DRAM memory that will use a Vertical Channel Transistor (VCT) 3D structure similar to what NAND flash utilizes.

Kingston Technology Company, Inc., a world leader in memory products, announced the upcoming release of Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel's new 800-series chipset (formerly codenamed Arrow Lake). Intel's 800-series chipset is the first platform to utilize Clock Drivers on CUDIMMs (Clocked Unbuffered Dual Inline Memory Modules). At 6400 MT/s DDR5, JEDEC mandates the inclusion of a Client Clock Driver (CKD) on UDIMMs and SODIMMs. This component buffers and redrives the clock signal from the processor, enhancing signal integrity to the module. To distinguish these advanced modules from standard DDR5 UDIMMs and SODIMMs, JEDEC has designated them as CUDIMMs and CSODIMMs, respectively.

Kingston FURY Renegade RGB and non-RGB CUDIMM modules start at an overclocked speed of 8400 MT/s and are available as 24 GB single modules and 48 GB dual channel kits. Since CUDIMMs and UDIMMs share the same 288-pin connector, Kingston FURY UDIMMs with XMP and EXPO profiles are also compatible with Intel 800-series motherboards. However, it's recommended to verify compatibility through the motherboard manufacturer's QVL (Qualified Vendor List) or by checking the Kingston Configurator for supported speeds and capacities.

Seagate Technology Holdings plc (NASDAQ: STX) (the "Company" or "Seagate"), a leading innovator of mass-capacity data storage, today reported financial results for its fiscal first quarter ended September 27, 2024. "Seagate is off to an outstanding start to the fiscal year, highlighted by gross margin expanding to the highest level in more than a decade," said Dave Mosley, Seagate's chief executive officer.

"We executed on our plans to aggressively ramp our 28-terabyte nearline drives and broaden the number of cloud customers entering qualification on HAMR-based Mozaic products. We are excited by the strong product momentum which positions us well to address customer demand while delivering profitable growth. Our confidence in Seagate's future opportunities is reflected in the decision to raise the quarterly dividend as announced today," Mosley concluded.

Kioxia Corporation, a world leader in memory solutions, today announced that the company's research papers have been accepted for presentation at IEEE International Electron Devices Meeting (IEDM) 2024, a prestigious international conference to be held in San Francisco, USA, from December 7th to 11th.

Kioxia is committed to the research and development of semiconductor memory, which is indispensable for the advancement of AI and the digital transformation of society. Beyond its state-of-the-art three-dimensional (3D) flash memory technology BiCS FLASH, Kioxia excels at research in emerging memory solutions. The company is constantly striving to meet the needs for future computing and storage systems with innovative memory products.

Emteq Labs, the market leader in emotion-recognition wearable technology, today announced the forthcoming introduction of Sense, the world's first emotion-sensing eyewear. Alongside the unveiling of Sense, the company is pleased to announce the appointment of Steen Strand, former head of the hardware division of Snap Inc., as its new Chief Executive Officer.

Over the past decade, Emteq Labs - led by renowned surgeon and facial musculature expert, Dr. Charles Nduka - has been at the forefront of engineering advanced technologies for sensing facial movements and emotions. This data has significant implications on health and well-being, but has never been available outside of a laboratory, healthcare facility, or other controlled setting. Now, Emteq Labs has developed Sense: a patented, AI-powered eyewear platform that provides lab-quality insights in real life and in real time. This includes comprehensive measurement and analysis of the wearer's facial expressions, dietary habits, mood, posture, attention levels, physical activity, and additional health-related metrics.

Credo Technology Group Holding Ltd (Credo), an innovator in providing secure, high-speed connectivity solutions that deliver improved energy efficiency as data rates and corresponding bandwidth requirements increase throughout the data infrastructure market, is excited to announce the company's first Toucan PCI Express (PCIe) 6, Compute Express Link (CXL) 3.x and Magpie PCIe 7, CXL 4.x retimers and OSFP-XD 16x 64GT/s (1 Tb) PCIe 6/CXL HiWire AECs. Credo will demonstrate the Toucan PCIe 6 retimers and HiWire AECs at the upcoming Open Compute Project (OCP) Summit October 15-17 in Booth 31 and the OCP Innovation Center.

Building on Credo's renowned Serializer/Deserializer (SerDes) technology, the new PCIe 6 and PCIe 7 retimers deliver industry-leading performance and power efficiency while being built on lower cost, more mature process nodes than competing devices. Credo will also include enhanced diagnostic tools, including an embedded logic analyzer and advanced SerDes tools driven by a new GUI designed to enable rapid bring up and debug of customer systems.

Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem.

Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor in their planned facility in Peoria, Arizona. TSMC will leverage these services to support its customers, particularly those using TSMC's advanced wafer fabrication facilities in Phoenix. The close collaboration and proximity of TSMC's front-end fab and Amkor's back-end facility will accelerate overall product cycle times.

Fujitsu Limited and Supermicro, Inc. (NASDAQ: SMCI), today announced they will collaborate to establish a long-term strategic engagement in technology and business, to develop and market a platform with Fujitsu's future Arm-based "FUJITSU-MONAKA" processor that is designed for high-performance and energy efficiency and targeted for release in 2027. In addition, the two companies will also collaborate on developing liquid-cooled systems for HPC, Gen AI, and next-generation green data centers.

"Supermicro is excited to collaborate with Fujitsu to deliver state-of-the-art servers and solutions that are high performance, power efficient, and cost-optimized," said Charles Liang, president and CEO of Supermicro. "These systems will be optimized to support a broad range of workloads in AI, HPC, cloud and edge environments. The two companies will focus on green IT designs with energy-saving architectures, such as liquid cooling rack scale PnP, to minimize technology's environmental impact."

Alongside German Chancellor Olaf Scholz, senior European government officials and European-based global enterprises, IBM (NYSE: IBM) today unveiled the first IBM Quantum Data Center located outside of the United States. It is the company's second quantum data center in the world and marks a significant expansion of its fleet of advanced, utility-scale quantum systems available to global users via the cloud.

Now online in Ehningen, Germany, Europe's first IBM Quantum Data Center includes two new utility-scale, IBM Quantum Eagle-based systems, and will soon feature a new IBM Quantum Heron-based system. These systems are capable of performing computations beyond the brute-force simulation capabilities of classical computers.

Corning Incorporated, one of the world's leading innovators in glass, ceramic, and materials science, today unveiled Corning EXTREME ULE Glass, a next-generation material that will support chip manufacturers in meeting the rapidly growing demand for advanced and intelligent technologies. The new material will help chipmakers improve photomasks - the stencils for chip design - which are critical for the mass production of today's most advanced and cost-efficient microchips.

Corning designed EXTREME ULE Glass to withstand the highest intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV, which is rapidly becoming an industry standard. EUV lithography allows manufacturers to use the most advanced photomasks to pattern and print the smallest, most complex chip designs. This process requires extreme thermal stability and a uniform glass material to help ensure consistent manufacturing performance.

LG Electronics (LG) has collaborated with Razer and MediaTek to introduce the world's first Bluetooth Ultra-Low Latency (BT ULL) Controller at LG webOS Summit 2024 on September 27. This groundbreaking technology was showcased through an LG webOS smart TV and Razer's Bluetooth gaming controller, demonstrating the game-changing 1 ms input lag.

The webOS summit, which welcomed 300 representatives from 140 partner companies - including content developers, producers and providers - from 24 countries, shared LG's strategic vision and future initiatives for expanding its AI webOS ecosystem and platform business.

Micron Technology, Inc. today announced results for its fourth quarter and full year of fiscal 2024, which ended August 29, 2024.

Fiscal Q4 2024 highlights

• Revenue of $7.75 billion versus $6.81 billion for the prior quarter and $4.01 billion for the same period last year
• GAAP net income of $887 million, or $0.79 per diluted share
• Non-GAAP net income of $1.34 billion, or $1.18 per diluted share
• Operating cash flow of $3.41 billion versus $2.48 billion for the prior quarter and $249 million for the same period last year

Fiscal 2024 highlights

• Revenue of $25.11 billion versus $15.54 billion for the prior year
• GAAP net income of $778 million, or $0.70 per diluted share
• Non-GAAP net income of $1.47 billion, or $1.30 per diluted share
• Operating cash flow of $8.51 billion versus $1.56 billion for the prior year

ESS Technology, Inc., the industry leader in audio semiconductor devices, today announces two 8-channel DACs with integrated line drivers with exceptional performance. The incorporated ESS patented Hyperstream IV architecture provides the listener with the legendary SABRE sound quality with improved audio performance and a refined and enjoyable listening experience.

The ES9082 SMART DAC and ES9081 DAC are ESS' next generation devices that deliver a True DNR of +120dB and -108dB THD+N with 2VRMS line driver for each of the 8 channels allowing for an amazing audio experience while reducing the Bill-Of-Material (BOM). Channels can be summed to improve performance in an application requiring fewer channels. A 2-channel differential configuration can achieve up to +127dB DNR with a 4VRMS output. ESS' True DNR performance does not rely on Dynamic Range Enhancement (DRE) technology that shows higher DNR but is known to cause pop noise in some applications.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of two new standards supporting Compute Express Link (CXL ) technology. These additions complete a comprehensive family of four standards that provide the industry with unparalleled flexibility to develop a wide range of CXL memory products. All four standards are available for free download from the JEDEC website.

JESD319: JEDEC Memory Controller Standard - for Compute Express Link (CXL ) defines the overall specifications, interface parameters, signaling protocols, and features for a CXL Memory Controller ASIC. Key aspects include pinout reference information and a functional description that includes CXL interface, memory controller, memory RAS, metadata, clocking, reset, performance, and controller configuration requirements. JESD319 focuses on the CXL 3.1 based direct attached memory expansion application, providing a baseline of standardized functionality while allowing for additional innovations and customizations.

Infineon Technologies AG today announced that the company has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

GaN-based power semiconductors find fast adoption in industrial, automotive, and consumer, computing & communication applications, including power supplies for AI systems, solar inverters, chargers and adapters, and motor-control systems. State-of-the art GaN manufacturing processes lead to improved device performance resulting in benefits in end customers' applications as it enables efficiency performance, smaller size, lighter weight, and lower overall cost. Furthermore, 300 mm manufacturing ensures superior customer supply stability through scalability.

E&R Engineering Corp. hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination of "E&R" and "Glass Core" inspired by the sound of "Ecosystem," led to the establishment of the "Glass Substrate Supplier E-Core System Alliance." The alliance aims to combine expertise to promote comprehensive solutions, providing equipment and materials for next-generation advanced packaging with glass substrates to both domestic and international customers.

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, HYAWEI OPTRONICS for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and other key component suppliers such as HIWIN, HIWIN MIKROSYSTEM, Keyence Taiwan, Mirle Group, ACE PILLAR CHYI DING), and Coherent.