Credo Technology Group Holding Ltd (Credo) an innovator in providing secure, high-speed connectivity solutions that deliver improved reliability and energy efficiency, today announced that its PCI Express (PCIe) 5.0 specification capable "Toucan" retimer has successfully passed the testing at the PCI-SIG Compliance Workshop #133 in Taipei. This milestone confirms the retimer's compliance with the rigorous standards required for PCIe 5.0 technology integrations, and it now will be officially listed on the PCI-SIG Integrators List.

"We are excited to announce that our Toucan retimer has passed the PCI-SIG Compliance Workshop, a critical step in ensuring Credo's PCIe technology solutions seamlessly integrate into the evolving high-performance AI infrastructure," said Phil Kumin, AVP of Product for PCIe/CXL at Credo. "Considering that retimers are required to undergo extensive testing, this achievement not only reinforces our leadership in high-speed connectivity but also provides our customers with the confidence that Credo's products meet the highest standards of interoperability and performance."

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, has demonstrated its first 2 nm silicon IP for next-generation AI and cloud infrastructure. Produced on TSMC's 2 nm process, the working silicon is part of the Marvell platform for developing custom XPUs, switches and other technology to help cloud service providers elevate the performance, efficiency, and economic potential of their worldwide operations.

Given a projected 45% TAM growth annually, custom silicon is expected to account for approximately 25% of the market for accelerated compute by 20281.

On February 27-28, the 2025 China RISC-V Ecosystem Conference was grandly held at the Zhongguancun International Innovation Center in Beijing. As a core promoter in the RISC-V field, SOPHGO was invited to deliver a speech and prominently launch a series of new products based on the SG2044 chip, sharing the company's cutting-edge practices in the heterogeneous fusion of AI and RISC-V, and contributing to the vigorous development of the global open-source instruction set ecosystem. During the conference, SOPHGO set up a distinctive exhibition area that attracted many attendees from the industry to stop and watch.

Focusing on AI Integration, Leading Breakthroughs in RISC-V Technology
At the main forum of the conference, the Vice President of SOPHGO RISC-V delivered a speech titled "RISC-V Breakthroughs Driven by AI: Integration + Heterogeneous Innovation," where he elaborated on SOPHGO's innovative achievements in the deep integration of RISC-V architecture and artificial intelligence technology. He pointed out that current AI technological innovations are driving market changes, and the emergence of DeepSeek has ignited a trillion-level computing power market. The innovation of technical paradigms and the penetration of large models into various sectors will lead to an explosive growth in inference demand, resulting in changes in the structure of computing power demand. This will also reshape the landscape of the computing power market, bringing significant business opportunities to domestic computing power enterprises, while RISC-V high-performance computing is entering a fast track of development driven by AI.

SoftBank Corp., ZutaCore and Hon Hai Technology Group ("Foxconn") today announced they implemented ZutaCore's two-phase DLC (Direct Liquid Cooling) technology in an AI server using NVIDIA accelerated computing, making it the world's first implementation of ZutaCore's two-phase DLC (Direct Liquid Cooling) technology using NVIDIA H200 GPUs. In addition, SoftBank designed and developed a rack-integrated solution that integrates each component of the server, including cooling equipment with two-phase DLC technology, on a rack scale, and conducted an operational demonstration and performance evaluation at its data center in February 2025. The demonstration results indicated the solution passed NVIDIA's temperature test (NVQual), thereby confirming the compatibility, stability and reliability of this rack-integrated solution. The solution also achieved pPUE (partial Power Usage Effectiveness) of 1.03 (actual measured value) per rack for cooling efficiency

With the spread and increased adoption of AI, demand for AI servers and other computing resources is expected to expand significantly, further increasing power consumption at data centers. At the same time, reducing power consumption from the perspective of reducing carbon dioxide (CO2) emissions has become a pressing issue worldwide, requiring data centers to become more efficient, consume less power, and introduce innovative heat removal solutions. Since May 2024, SoftBank has been collaborating with ZutaCore, a global leader in the development and business deployment of two-phase DLC technology, to develop solutions optimized for low power consumption at AI data centers.

Today, Amazon Web Services (AWS) announced Ocelot, a new quantum computing chip that can reduce the costs of implementing quantum error correction by up to 90%, compared to current approaches. Developed by the team at the AWS Center for Quantum Computing at the California Institute of Technology, Ocelot represents a breakthrough in the pursuit to build fault-tolerant quantum computers capable of solving problems of commercial and scientific importance that are beyond the reach of today's conventional computers.

AWS used a novel design for Ocelot's architecture, building error correction in from the ground up and using the 'cat qubit'. Cat qubits-named after the famous Schrödinger's cat thought experiment-intrinsically suppress certain forms of errors, reducing the resources required for quantum error correction. Through this new approach with Ocelot, AWS researchers have, for the first time, combined cat qubit technology and additional quantum error correction components onto a microchip that can be manufactured in a scalable fashion using processes borrowed from the microelectronics industry.

Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announce the availability of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, Material and Test developed in collaboration within the OCP Open Chiplet Economy Project. Leveraging the alliance between OCP and JEDEC, these design kits are now part of the Global Worldwide Standard JEDEC JEP30: Part Model Guidelines.

The release of the Assembly, Substrate, Material, and Test Design Kits build on earlier joint efforts between the OCP and JEDEC integrating OCP Chiplet Data Extensible Markup Language (CDXML) specification into JEDEC JEP30: Part Model Guidelines, enabling Chiplet builders to provide electronically a standardized Chiplet part description to their customers, paving the way for automating System-in-Package (SiP) design and build using Chiplets.

Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8 Gb/s NAND interface speed, superior power efficiency, and heightened density

Unveiled at ISSCC 2025, the new 3D flash memory innovation, together with the companies' revolutionary CBA (CMOS directly Bonded to Array) technology, incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol, a novel command address input method of its interface, and PI-LTT (Power Isolated Low-Tapped Termination) technology, which is instrumental in further reducing power consumption.

A recent rumor appears to have some good news in store for Apple display aficionados. The Cupertino giant has largely ignored its display lineup for several years at this point, considering that its $5,000 Pro Display XDR is almost six years old, while the $1,599 Studio Display is about to complete its third year on sale next month. According to reliable display analyst Ross Young, Apple is working on a mini LED upgrade for the Studio Display, which is expected to hit shelves towards the end of this year. It is unclear whether the rumored mini LED Studio Display will boast Apple's ProMotion technology, although it does seem quite likely given Apple's track record.

So far, only three Apple devices have boasted mini LED displays - MacBook Pro, iPad Pro, and the Pro Display XDR. The iPad Pro has moved to an OLED solution, and the MacBook Pro lineup is expected to follow in its footsteps towards the end of next year. While mini LED displays are not quite as contrast rich or fast as OLED displays, they sure are a massive improvement over the traditional LED-backlit displays found in Apple's iMacs and the Studio Display in terms of brightness, contrast, and if the ProMotion rumors are true, then refresh rate as well. Unsurprisingly, the affordable iMac 24" is not expected to sport mini LED technology anytime soon. As for the pricey Pro Display XDR, it is unclear what the future has in store for it, going by the absence of information.

The rapid evolution of generative AI has created countless opportunities for innovation across industry and research. As is often the case with state-of-the-art technology, this evolution has also shifted the landscape of cybersecurity threats, creating new security requirements. Critical infrastructure cybersecurity is advancing to thwart the next wave of emerging threats in the AI era. Leading operational technology (OT) providers today showcased at the S4 conference for industrial control systems (ICS) and OT cybersecurity how they're adopting the NVIDIA cybersecurity AI platform to deliver real-time threat detection and critical infrastructure protection.

Armis, Check Point, CrowdStrike, Deloitte and World Wide Technology (WWT) are integrating the platform to help customers bolster critical infrastructure, such as energy, utilities and manufacturing facilities, against cyber threats. Critical infrastructure operates in highly complex environments, where the convergence of IT and OT, often accelerated by digital transformation, creates a perfect storm of vulnerabilities. Traditional cybersecurity measures are no longer sufficient to address these emerging threats. By harnessing NVIDIA's cybersecurity AI platform, these partners can provide exceptional visibility into critical infrastructure environments, achieving robust and adaptive security while delivering operational continuity.

IBM and Lenovo today announced at LEAP 2025 a planned expansion of their strategic technology partnership designed to help scale the impact of generative AI for clients in the Kingdom of Saudi Arabia. IDC expects annual worldwide spending on AI-centric systems to surpass $300 billion by 2026, with many leading organizations in Saudi Arabia exploring and investing in generative AI use cases as they prepare for the emergence of an "AI everywhere" world.

Building upon their 20-year partnership, IBM and Lenovo will collaborate to deliver AI solutions comprised of technology from the IBM watsonx portfolio of AI products, including the Saudi Data and Artificial Intelligence Authority (SDAIA) open-source Arabic Large Language Model (ALLaM), and Lenovo infrastructure. These solutions are expected to help government and business clients in the Kingdom to accelerate their use of AI to improve public services and make data-driven decisions in areas such as fraud detection, public safety, customer service, code modernization, and IT operations.

Scientists have made a big step forward in data storage technology, they've managed to improve the manufacturing process for 3D NAND flash memory. This type of storage technology stacks memory cells on top of each other to obtain higher data density. A team of experts from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Lab came up with a better way to etch (the process of carving holes into alternating layers of silicon oxide and silicon nitride) by using hydrogen fluoride plasma. This new method cuts vertical channels through silicon-based materials twice as fast as before achieving 640 nanometers in just one minute.

The team found out that mixing in certain chemicals like phosphorus trifluoride helps the etching process. They also learned that some byproducts can slow down etching, but adding water can help fix this problem. "The salt can decompose at a lower temperature when water is present, which can accelerate etching", said Yuri Barsukov, a former PPPL researcher now working at Lam Research. This breakthrough is important as the need for data storage received a huge boost with the rise of AI programs, that need tons of storage.

3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

"As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines." said Steven Vander Louw, 3M's president of display and electronics product platforms. "The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges."

New technology from Chalmers University of Technology and the University of Gothenburg, Sweden, is helping the EU establish its own competitive computer manufacturing industry. Researchers have developed components critical for optimising on-chip memory, a key factor in enhancing the performance of next-generation computers.

The research leader, Professor Per Stenström, along with colleagues, has discovered new ways to make cache memory work smarter. A cache is a local memory that temporarily stores frequently accessed data, improving a computer's speed and performance. "Our solution enables computers to retrieve data significantly faster than before, as the cache can manage far more processing elements (PEs) than most existing systems. This makes it possible to meet the demands of tomorrow's powerful computers," says Per Stenström, Professor at the Department of Computer Science and Engineering at Chalmers University of Technology and the University of Gothenburg.

Kioxia Corporation, a world leader in memory solutions, today announced the open-source release of its new All-in-Storage ANNS with Product Quantization (AiSAQ) technology. A novel "approximate nearest neighbor" search (ANNS) algorithm optimized for SSDs, KIOXIA AiSAQ software delivers scalable performance for retrieval-augmented generation (RAG) without placing index data in DRAM - and instead searching directly on SSDs.

Generative AI systems demand significant compute, memory and storage resources. While they have the potential to drive transformative breakthroughs across various industries, their deployment often comes with high costs. RAG is a critical phase of AI that refines large language models (LLMs) with data specific to the company or application.

Element Six (E6), a pioneer in the development of synthetic diamond advanced material solutions, will launch an innovative Cu-diamond product at Photonics West 2025. Cu-Diamond is a copper plated diamond composite material that has a high thermal and electrical conductivity. Designed to address the increasingly critical thermal management challenges in advanced semiconductor devices, this cost-effective solution enables greater performance and reliability for applications such as Artificial Intelligence (AI), high-performance computing (HPC), and GaN RF devices.

As semiconductor devices have grown larger and more powerful, managing heat dissipation has become a significant challenge for the industry. More than 50 percent of all electronic device failures are heat-related, and data centers, which today consume 3.7 percent of total U.S. power demand, are predicted to reach 10 percent by 2029. As a result, thermal management innovation is critical to enabling next-generation performance and energy efficiency.

Montage Technology today announced the customer sampling of its PCIe 6.x/CXL 3.x Retimer -- M88RT61632, which is designed to enhance connectivity performance for demanding high-bandwidth applications such as AI and cloud computing. This milestone extends the company's PCIe product portfolio, building upon its successful PCIe 4.0 and PCIe 5.0/CXL 2.0 Retimer solutions.

The PCIe 6.x/CXL 3.x Retimer delivers excellent performance with data rates up to 64 GT/s, twice that of PCIe 5.0. Powered by Montage Technology's proprietary PAM4 SerDes IP, the chip achieves superior signal integrity with link budget up to 43dB while maintaining low latency. Its innovative DSP architecture effectively addresses PCIe 6.x system design challenges including crosstalk and signal reflection. In addition, the chip features advanced link training and enhanced telemetry, enabling comprehensive link monitoring and fault diagnostics for high-reliability AI cluster deployments.

Seagate Technology Holdings plc (the "Company" or "Seagate"), a leading innovator of mass-capacity data storage, today reported financial results for its fiscal second quarter ended December 27, 2024. "Seagate ended calendar 2024 on a strong note as we grew revenue, gross margin and non-GAAP EPS successively in each quarter of the year.

Our results demonstrate structural improvements in the business and our focus on value capture in an improving demand environment, highlighted by decade-high gross margin performance exiting the December quarter," said Dave Mosley, Seagate's chief executive officer. "We are advancing our technology roadmap to meet our customers' growing need for scalable, cost efficient and sustainable storage solutions in the age of AI. We began ramping HAMR-based Mozaic products to our lead cloud customer in the December quarter and are already sampling in capacities of up to 36 terabytes. Looking ahead, we believe Seagate is in a great position to deliver profitable growth in fiscal 2025," Mosley concluded.

Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new memory subsystem designs, Numem solutions are re-architecting the hierarchy of AI memory tiers to eliminate the bottlenecks that negatively impact power and performance.

The rapid growth of AI workloads and AI Processor/GPUs are exacerbating the memory bottleneck caused by the slowing performance improvements and scalability of SRAM and DRAM - presenting a major obstacle to maximizing system performance. To overcome this, there is a pressing need for intelligent memory solutions that offer higher power efficiency and greater bandwidth, coupled with a reevaluation of traditional memory architectures.

Global technology powerhouse Lenovo Group Limited (together with its subsidiary, "Lenovo" or the "Group") has announced that its subsidiary has entered into a definitive agreement to acquire Infinidat Ltd. ("Infinidat"), a global provider of high-end enterprise storage solutions. The acquisition is part of Lenovo's growth strategy to bring differentiated technology solutions to market. This move will further strengthen Lenovo's enterprise storage offerings globally and underscores a commitment to delivering innovative storage solutions that meet the evolving needs of modern data centers.

With the strong storage solutions and research & development capabilities of Infinidat, the transaction will create strategic synergies with the Group's infrastructure solutions business and enterprise storage capabilities.

Seagate Technology Holdings plc, an innovator of mass capacity data storage, today announced shipments of Exos M hard drive samples to select customers in industry-leading capacities up to 36 terabytes (TB). Based on Mozaic 3+, the company's breakthrough heat-assisted magnetic recording (HAMR) technology platform, Exos M delivers unprecedented storage scale for large-scale data center deployments.

Key Takeaways

• Adopted by Cloud Service Providers: Seagate is currently ramping Exos M to volume shipments on capacity points up to 32 TB with a leading cloud service provider. Separately, Seagate is also sampling drives on the Exos M platform of up to 36 TB.
• Mozaic 3+ and HAMR Innovation: Based on Seagate's Mozaic 3+ technology platform, the industry's first implementation of heat-assisted magnetic recording (HAMR), Exos M offers data center operators significant scale, total cost of ownership (TCO), and sustainability advantages, including 300% more storage capacity within the same data center footprint, a 25% cost reduction per terabyte and 60% reduction in power consumption per terabyte.
• Unrivalled Areal Density: Exos M, powered by HAMR-based Mozaic 3+ platform, now delivers capacity points up to 36 TB through a highly efficient 10-platter product design. Seagate is the only data storage company that can achieve areal densities of 3.6 TB per hard drive platter today, with a pathway to increasing per-platter capacity to 10 TB.

NVIDIA's deep learning super sampling (DLSS) has undergone many iterations to the current version 4 with the transformer model, delivering new technologies such as DLSS Multi Frame Generation, predicting multiple frames in advance to generate the upcoming frame, and increasing the frame output per second. However, not every NVIDIA GPU generation supports these more modern DLSS technologies. In an interview with Digital Foundry, Bryan Catanzaro, VP of Applied Deep Learning Research at NVIDIA, commented on trickling down some DLSS technologies to older GPU generations. For example, DLSS Ray Reconstruction, Super Resolution, and Deep Learning Anti-Aliasing (DLAA) work on NVIDIA GeForce RTX 20/30/40/50 series GPUs. However, the RTX 40 series carries an exclusive DLSS Frame Generation, and the newest RTX 50 series carries the DLSS Multi Frame Generation as an exclusive feature.

However, there is hope for older hardware. "I think this is primarily a question of optimization and also engineering and then the ultimate user experience. We're launching this Frame Generation, the best Multi Frame Generation technology, with the 50 Series, and we'll see what we're able to squeeze out of older hardware in the future." So, frame generation will most likely arrive on the older RTX 30 series, with even a slight possibility of the RTX 20 series getting the DLSS frame generation. Due to compute budget constraints, the multi-frame generation will most likely stay an RTX 50 series exclusive as it has more raw computing power to handle this technology.

Infortrend Technology, Inc., the industry-leading enterprise storage provider, introduces the latest additions to its high-density 4U 90-bay HDD solutions: unified storage EonStor GS 5090 and expansion enclosure JB 4090. The large capacity and high throughput performance of the solutions make them ideal for applications like High-Performance Computing and Media & Entertainment.

EonStor GS 5090 is a high-availability unified storage solution with a dual redundant controller design, ensuring uninterrupted operation. With its new hardware powered by the Intel Xeon Scalable Processor, the GS 5090 delivers ultra-high performance, achieving 45 GB/s read and 20 GB/s write—around three times the performance of the previous top-performing model, the GS 4090. The GS 5090 introduces ultra-fast 200GbE connectivity, setting a new benchmark for data transfer speed while simplifying deployment and management to meet the demands of today's high-performance enterprise workloads. It also supports SAS 24G expansion, doubling throughput compared to SAS 12G. Additionally, the GS 5090 features four dedicated U.2 NVMe SSD slots for cache, providing fast data access while fully leveraging the ample capacity of its 90-bay storage.

Lam Research Corporation today announced that its innovative dry photoresist (dry resist) technology has been qualified for direct-print 28 nm pitch back end of line (BEOL) logic at 2 nm and below by imec, a leading research and innovation hub in nanoelectronics and digital technologies. An advanced patterning technique introduced by Lam, dry resist enhances the resolution, productivity and yield of extreme ultraviolet (EUV) lithography, a pivotal technology used in the production of next-generation semiconductor devices.

"Lam's dry photoresist technology provides unparalleled low-defectivity, high-resolution patterning," said Vahid Vahedi, chief technology and sustainability officer at Lam Research. "We are excited to offer this technology to imec and its partners as a critical process in the design and manufacturing of leading-edge semiconductor devices."

Ventiva, the leader in thermal solutions, today announced that its Ventiva ICE9 thermal management suite is being featured in a fan-less proof-of-concept laptop design, powered by Intel Lunar Lake processors at CES. By collaborating with Dell Technologies and Intel on the PC design, this concept introduces a new level of silent productivity for sub-12 mm laptops.

"Ventiva ICE technology offers a revolutionary approach to help achieve thin, light, and silent laptop designs that offer great performance," said Josh Newman, Vice President, Client Computing Group, and General Manager, Product Marketing & Management, Intel. "Intel is excited about the result of the close co-engineering collaboration with Ventiva and Dell Technologies to help ready their technology for future Intel Core Ultra devices."

CES 2025, the world's largest annual consumer technology trade show, kicked off in Las Vegas of America on January 7th, 2025, with more than 130,000 attendees and over 4,800 companies. As a high-performance esports equipment brand incubated by Haier Group, THUNDEROBOT showcased its comprehensive innovation capabilities in high-performance esports equipment under the theme "Powerful Esports Momentum".

At this event, THUNDEROBOT unveiled a range of flagship products encompassing esports laptops, smart glasses, monitors, desktops, and peripherals. Among these, the world's first THUNDEROBOT ZERO series of high-performance gaming laptops took the spotlight. This series is powered by the latest Intel's Core Ultra 200HX (codenamed Arrow Lake-HX) processor and NVIDIA's GeForce RTX 5090 laptop GPU. Notably, the flagship ZERO 18 model incorporates a triple-fan "Xiu Technology 2.0" cooling system with seven copper heat pipes and phase-change thermal grease to ensure optimal thermal management even under intense use. Additionally, the introduction of an 18-inch Hummingbird eye-care display with high refresh rates has significantly enhanced the immersive user experience. Each machine will undergo default color calibration to provide accurate color settings.