Lenovo finally made the initiative to include a netbook powered by the VIA Nano processor. This IdeaPad S-12 uses the same exact name and chassis as the one powered by Intel Atom, based on i945 chipset, and exists merely as a variant in the S12 series. On the brighter side, it is priced $50 lower than its Atom-based cousin.

Its specifications include a 12-inch display with a resolution of 1280 x 800 pixels, VIA Nano ULV 2250 processor clocked at 1.30 GHz, 1 GB DDR2 memory, VIA VX855 chipset with S3 Chrome9 HC3 integrated graphics, 160 GB of storage, and a 6-cell battery, 1.3 MP web-camera, WLAN and Ethernet, and optional Bluetooth. It comes with Windows XP SP3 pre-installed. Backed by a one-year warranty, the S12 is priced at US $449.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the recently launched VIA Vinyl HD Audio codecs, the VIA Vinyl VT1818S and 1828S, are now supported by ArcSoft's universal multimedia player, ArcSoft TotalMedia Theatre.

With the rising demand for a realistic cinema experience in the comfort of the home, along with the growth in adoption of the Blu-ray Disc video format, VIA and ArcSoft have collaborated to provide an enhanced playback solution that makes home movie viewing more enjoyable than ever.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the adoption of the VIA Nano processor platform by Tongfong, one of China's leading notebook providers, for their new Tongfong S30A 13.3" thin and light notebook.

The Tongfong S30A includes the high performance yet power efficient 64-bit 1.3GHz+ VIA Nano U2250 processor coupled with the unified VIA VX800 MSP and discrete S3 Graphics Chrome 435 ULP graphics for an HD video proficient, DirectX 10.1 certified notebook. HD audio and an HDMI port ensure that Tongfong customers will be able to enjoy rich media content in its finest form.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today unveiled the next generation of VIA Vinyl HD Audio codecs, the VIA Vinyl VT1818S and 1828S, with support offered by CyberLink in their latest award-winning DVD player software, CyberLink PowerDVD.

The leading Blu-ray Disc and DVD playback software, CyberLink PowerDVD provides enhanced high-definition audio through the embedded VIA Vinyl HD VIA Vinyl 1828S Audio codecs, which also support Blu-ray Disc audio content protection, allowing for optimal audio output. Without content protection support, audio quality is dramatically reduced to that of a regular CD with a sampling rate of only 16-bit/48kHz.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that the VIA Nano processor and VIA VX855 digital media IGP chipset received the 'Best of Computex' award from the Taiwan Computer Association (TCA) and the Taiwan Trade Council (TAITRA) during a ceremony today.

Nominated in the LSI/VLSI Category for Mobile Platforms, the VIA entry was honored for its power efficiency, miniaturization and optimized performance, enabling system builders to design ever smaller, lighter, and more portable systems. And with increasing consumer focus on multimedia capabilities, also praised was the platform's ability to offer true 1080p HD video playback through support for full hardware acceleration of the widest variety of leading video standards including H.264, MPEG-2/4, VC-1 and WMV9.

Shuttle Inc. - the leading designer and manufacturer of small form factor (SFF) computers and accessories today announced the addition of its first VIA Nano-based models - XS29 and XS29F to the Embedded Slim series. Powered by the VIA Nano processors, the XS29 series ideally suit requirement of superb performance with great power efficiency. The XS29 series is geared at light PC users, Internet users, novices and office administrators.

"Consumers have long been looking for solutions that offer the best balance of compact, stylish design and functionality. It's even better with power efficient feature. Shuttle has dedicated to innovation following this concept and launched slim PCs in 2008 for the first time," said David Yu, chairman of Shuttle Inc. "This year, we reached a new milestone by rolling out the XS29 series and more embedded slim PCs which adapt VIA's processors of powerful performance and energy efficiency."

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will be showing examples of its customized security solution service at Computex 2009, helping customers to employ a comprehensive and effective security infrastructure in all segments.

VIA Nano, VIA C7 and VIA Eden processor platforms are the only processors that currently offer a built-in Advanced Cryptographic Engine. In order to better help customers access this unique feature, VIA is now offering a comprehensive security solution service that can accurately meet the security needs of individual customers across a range of embedded segments.

Prominent server builder Dell is looking to tap the potential of VIA's Nano processor, in building compact server called XS11-VX8, that will be ready for high-density web-server applications. The compact form-factor, coupled with its energy-efficient chipset made the 64-bit Nano the obvious choice.

Dell intends to make this a "hot-plug" server, which is not much larger than a 3.5" hard drive. Twelve of these servers could fit into a 2U chassis, so power cooling, and connectivity could be shared and managed better. Each server will have room for its dedicated hard drive, and will have up to 3 GB of RAM.

This product will be marketed by Dell's Data Center Solutions group, which targets customers who buy these in thousands of units at a time. There are reportedly 30~40 such companies worldwide. The server also uses low power consumption as one of its biggest selling points. According to Dell, it idles at a mere 19W, and consumes no more than 29W at full-load. The XS11-VX8 will be officially introduced in June.

Worldwide PC microprocessor shipments in the first calendar quarter of 2009 (1Q09) fell significantly for the second quarter in a row, according to new data from IDC. While the decline was slightly more than typically occurs between fourth quarter and first quarter, IDC believes that the market's decline is slowing.

In 1Q09, worldwide PC processor unit shipments declined -10.9% from 4Q08 to 1Q09, as compared to -17.0% from 3Q08 to 4Q08. Unit shipments declined -13.0% from 1Q08 to 1Q09.

Market revenue declined -11% from 4Q09 to 1Q09, as compared to -18.0% from 3Q08 to 4Q08. Revenue declined -25.1% from 1Q08 to 1Q09.

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, today announced a new study that indicates the end of the market for the popular integrated graphics chipset, known as the IGP.

After fifteen years of stellar growth the IGP will cease to exist, replaced by embedded graphics in the processor. Integrated graphics are used in desktop and net top PCs, notebooks, and netbooks, and various embedded systems such as point of sale, set-top boxes, and signage systems.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announces the VIA VB8002 Mini-ITX board targeted at media server markets. The VIA VB8002 brings the superior performance efficiency of the VIA Nano processor to consumer-focused server products that require the right blend of power efficiency and raw processing performance.

The VIA VB8002 Mini-ITX board continues VIA's drive into compact, power-efficient multimedia server markets and is designed to meet the needs of consumers who not only want to securely store, manage and share their media libraries, but also stream high quality content in their homes.

VIA Technologies, a leading innovator of power efficient x86 processor platforms, today announced financial results for fourth quarter 2008. Net sales for 4Q'08 and 4Q'07were NT$ 1,465 million and NT$ 2,502million respectively. Net income for the two quarters were negative NT$ 1,954 million and negative NT$ 2,310 million respectively; based on the weight average shares outstanding of 1,291.517 million shares and 1,291.239 million shares, earnings per share were reported as negative NT$1.51 and negative NT$1.79 for 4Q'08 and 4Q'07 respectively.
For the whole year 2008, net sales totaled NT$ 7,927 million and net income for the year was negative NT$ 4,016 million; based on weight average shares outstanding of 1,291.517 million shares, earnings per share for the year were reported at negative NT$3.11.

Last Friday, One Laptop Per Child (OLPC) organization announced that it is leaving Advanced Micro Devices (AMD) as main processor partner in favour of VIA Technologies. This is a step that will lower the price of OLPC's laptop further. From this point on VIA's C7-M processor instead of AMD's Geode will power OLPC's XO-1 laptops. The processor will be a VIA C7-M, with plans on using one whose clock speed ranges from 400 MHz (1.5 W) to 1 GHz (5 W). The clock may be throttled back automatically if necessary to meet thermal constraints. Gen 1.5 XO-1 laptop will come with the VIA VX855 all-in-one chipset solution, as well as with an updated HD Audio sound. The upgraded XO laptops will also include 1 GB of RAM and between 4 GB and 8 GB of storage, which is considerably more than the currently existing XO systems with 256 MB RAM and 1 GB of storage. There are two more changes being made, the network interface will be upgraded to an 88W8686 with wake-up functions, which halves the power consumption of current XO-1 network adapter, and a new OLPC OS 8.2.x will be installed to support all the hardware variations. Overall, the Gen 1.5 XO-1 laptop will remain the same from the outside - same display, same form, same power consumption, probably the same price - but come with upgraded internals.
Early versions of the hardware (bare board) should be available for driver development at the end of May. A larger number of prototype laptops (several hundred) for software development and testing will become available around the end of August. It's unclear when children will get their hands on the final product, though.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its entry into the design manufacturing service business to offer provide flexible system hardware solutions, starting with the new VIA NSD7200 home storage and media server.

Building on its success as a pioneer of system level innovation in small form factor and IPC markets, VIA can provide OEM and ODM customers with customized versions of home and SOHO storage platforms targeting specific markets. By combining energy-efficient processor platforms and high quality chassis designs with a full design manufacturing service and comprehensive engineering support, VIA enables customers to more accurately address the needs of system integrators and retailers by speeding up product cycles and reducing production costs.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first expansion HD module for the VIA EPIA-P710, the VIA P710-HD. Featuring the powerful 4300E embedded graphics processor from S3 Graphics, this first Pico-I/O module for stackable Pico-ITXe boards delivers Hi-Def video playback and advanced graphics in an extremely low power, compact form factor.

With multiple display support including dual DVI and HDMI, the VIA P710-HD module opens up a new realm of possibilities to system integrators of multimedia intensive embedded applications. Sophisticated digital signage, arcade gaming, kiosk and POI applications can now take advantage of multiple digital display configurations and cutting edge Hi-Def playback of resolutions up to and beyond 1080p.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms will showcase the VIA EITX-3000 Em-ITX board at ESC Silicon Valley 2009. Designed for ultra-thin, high-performance, fanless embedded systems at temperatures ranging from -10o to 70o Celsius, the VIA EITX-3000 uses unique processor placement to deliver leading performance in remarkably hot and cold environments.

The VIA EITX-3000 places the energy-efficient VIA Nano processor and VIA VX800 media system processor on the reverse side of the board, making greater real-estate available for passive cooling apparatus and thus negating the need for system fans. This makes the VIA EITX-3000 an exceptional choice for high performance systems in always-on applications such as high-end POS, Kiosk, ATM, HMI, factory automation, POI and digital signage.

Intel's Atom series of processors gets credit for reinvigorating the ULPC and SFF PC segments that had been niche markets run by smaller players such as VIA, Freescale, and ARM. The Atom Z500 series single-core chips operate at speeds ranging from 1.1 to 1.86 GHz, with phenomenally low energy footprints - under 2.2 Watts.

One of the company's newest additions to the range, the Z550, could hit the 2.00 GHz mark, while consuming less than 2.4 Watts. Another chip in the making, Z515, will have dynamic clock-speed between 800 MHz and 1.33 GHz depending on the processing load. The Z515 could end up being an MID maker's favourite, not that Z550 won't be used in devices that small. Sony just might pack the 2.00 GHz chip on an upcoming variant of the VAIO P.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today released the VIA IVP-7500 board, the first in a series of dedicated x86 in-vehicle platforms for developers of car PCs and intelligent transportation devices.

The continued evolution of the PC as a multimedia playback device for audio and video entertainment means that car owners are now demanding access to their digital media library whilst on the road. In-vehicle PCs offers access to intelligent global satellite positioning services for accurate location tracking, route planning and navigation.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Surfboard C855 Reference Design - an ultra-compact mainboard incorporating the VIA C7-M ULV processor, the brand new VIA VX855 unified IGP chipset, and advanced VIA multimedia and connectivity silicon, that has been specifically designed for easy integration into devices targeted at the rapidly growing mini-notebook market.

Unveiled today at the VIA Global Mobility Bazaar (GMB) Tech Forum Spring in Shenzhen, China - an event bringing together a host of PC manufacturing and infrastructure partners focused on delivering affordable, power efficient mini-notebooks to global markets - the VIA Surfboard C855 Reference Design will not only reduce development time and costs for system manufacturers, but offers the latest advancements in ultra-mobile technology including smooth playback of high bit-rate 1080p HD video and outstanding 8-channel HD audio.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VX855 Media System Processor (MSP) - an ultra power efficient, all-in-one chipset that addresses the key performance and entertainment requirements of today's small form factor and mobile PC systems.

Increasingly, content is being filmed in high-definition (HD), with movies, TV shows and sporting events taking advantage of the smooth playback, extraordinary picture clarity, and brilliant colors that HD video offers. However, until now the high bit-rates associated with quality HD video have posed a real challenge to the processing capabilities of power efficient PC systems such as those found in small form factor and mobile devices.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA Global Mobility Bazaar (GMB) Tech Forum Spring, which will be held on March 17th 2009 in Shenzhen, China. Building on the success of the first VIA GMB event in October of last year, the VIA GMB Tech Forum Spring will bring together a host of PC manufacturing and infrastructure partners focused on delivering affordable, power efficient mini-notebooks to global markets. The VIA GMB Alliance was established last year as part of VIA's long-term commitment to inspire innovation in mobile computing devices by sharing its leading-edge technology and expertise in power efficient x86 processor platforms.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest board form factor for embedded system developers; the Em-ITX form factor. Offering embedded developers a compact, versatile and highly integrated board form factor, VIA's Em-ITX establishes an off-the-shelf standard for ultra-slim embedded devices.

The Em-ITX form factor is a new open industry standard defined by VIA, and is 30% more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12cm x 17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring unrivalled flexibility and scalability. Benefits also include reduced time-to-market cycles for developers and access to a scalable processor platform that includes the latest 64-bit VIA Nano processor.

After spinning off its manufacturing division to The Foundry Co., AMD is left with all the engineering resources it needs to make processors. Contradicting older roadmap slides by the company predicting it would start selling 32 nm processors in 2011, Dirk Meyer, CEO of AMD in an interview with Information Week said that the company is on-track to ship smaller, more powerful processors built on the 32 nm manufacturing process by 2010.

The new manufacturing process would allow the chip maker to step up transistor counts to add more features and computational power. Tomorrow, on March 2, the AMD is expected to close the deal with Advanced Technology Investment Company (ATIC) of Abu Dhabi to form The Foundry Company (TFC). This would render AMD fabless. The company will then, like other fabless market heavyweights such as NVIDIA and VIA, will focus on designing processors, while TFC, its largest foundry partner will manufacture the processors. Currently AMD is tied up with foundry companies such as TSMC and UMC for manufacturing products of its Graphics Products Group, products such as GPUs and chipset.

AMD will be an year behind larger market rival Intel in selling processors built on the 32 nm technology. Intel plans to roll out 32 nm processors by Q4 2009. AMD's designs will be ready by mid-2010, following which volume production of its 32 nm chips will commence by Q4 2010.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that Samsung has adopted the VIA Nano processor in the new Samsung NC20 mini-notebook.

Mobility is enhanced by 802.11b/g and Bluetooth wireless connectivity, and a six-cell battery that provides up to 6.5 hours of use independent of any power supply, while storage options include either a solid state disk or a SATA hard disk drive. Other features include an integrated 1.3 mega pixel digital motion camera, 3-in-1 memory card reader and three built-in USB ports.

VIA Technologies, a leading innovator of power efficient x86 processor platforms, today announced the launch of VIA's first embedded box computer; the VIA AMOS-3000. Ideal for a variety of embedded applications, the VIA AMOS-3000 is a robust, custom-designed system based on the ultra compact and versatile VIA EPIA-P700 Pico-ITX board. Inspired by classical Chinese architecture, the VIA AMOS-3000 chassis combines heavy-duty steel, aluminum and copper in a unique heat fin design that offers superb heat dissipation. Using a total of only five mechanical pieces - top cover, bottom plate, front and rear I/O access plates and DOM module - and measuring only 13.5cm(w) x 4.5cm(h) x 13.1cm(d), the VIA AMOS-3000 is strong, durable and heat efficient, yet tiny enough to fit in the palm of your hand.