Known more for its VIA Nano and Intel Atom-powered fanless IPCs (industrial PCs), Habey is readying BIS-6763, a new IPC model that is driven by a robust Core i3 "Sandy Bridge" dual-core processor. Measuring 190 x 190 x 67 mm, the IPC is made of a metal chassis, a portion of which is ridged, to double up as a heatsink. Beneath it is a pair of cylindrical heat pipes that transport heat to the top panel (heatsink), which cool the Core i3-2367M processor (dual-core, 1.40 GHz, 3 MB L3, 17W TDP), and Intel HM65 Express PCH.

Sadly, the IPC does not take advantage of the processor's dual-channel DDR3 IMC, there's just the one DDR3 SO-DIMM slot, supporting up to 8 GB of DDR3-1333 MHz memory. For expansion, there are two mini-PCIe slots. The sole storage option is a 2.5-inch SATA 6 Gb/s SSD/HDD bay. Connectivity includes one serial RS232 interface, six USB 2.0, gigabit Ethernet, and Intel HD 3000 graphics that gives out an HDMI, and a D-Sub display output. With 2 GB of DDR3 memory included, the BIS-6763 is expected to be priced at US $499. A variant that's powered by Intel Celeron 857 (dual-core, 1.20 GHz, 2 MB L3, 17W TDP), is also expected to be available, at US $299.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today unveiled the $49 APC Android PC system.

Powered by a WonderMedia ARM processor, APC integrates memory, storage, and a full set of consumer I/O features in a small footprint Neo-ITX motherboard that can be connected to a TV or monitor. The system also features a custom build of Android that has been optimized for keyboard and mouse input, and comes with a browser and a selection of preinstalled apps.

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q1'12. The news was not good. AMD was able to grow shipments over last quarter by 0.3%, in a down quarter. Intel slipped 1.3% and Nvidia declined 4.5% from the last quarter.

Although this did not shape up to be a great quarter for the suppliers, it actually wasn't as bad as it could have been. We found that shipments during the first quarter of 2012 behaved according to past years with regard to seasonality, declining from the previous quarter; however, this quarter's decline (of 0.8%) was less than the ten-year average of 3.1%. If we use graphics as an indicator, the industry seems to be recovering from the floods in Thailand.

VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA EPIA-P900 Pico-ITX board. The VIA AMOS-3002 provides embedded customers with a system that delivers all the latest features and digital media standards required for a diversified range of embedded applications including telematics, in-vehicle control, machine to machine controller (M2M), digital signage and kiosks.

Leveraging the digital prowess of the combined 1.0GHz VIA Eden X2 dual core processor and the VIA VX900H media system processor (MSP) on the VIA EPIA-P900 board, the VIA AMOS-3002 offers a powerful, rugged and HD-ready industrial-class PC that combines all the benefits of high performance 64-bit computing in an ultra compact system. The highly integrated, all-in-one VIA VX900H boasts ruthless hardware acceleration of the most demanding codecs, including MPEG-2, WMV9 and H.264, in resolutions up to 1080p across the latest display connectivity standards, including native HDMI support, for next generation multimedia-intensive applications.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.

Measuring 84 mm x 55 mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA Eden X2 dual core processor and the VIA VX900 media system processor (MSP) providing a ruggedized, ultra compact solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, test and measurement, industrial (machine vision system) and military applications.

VIA Labs, Inc., a leading supplier of USB 3.0 integrated circuit controllers, today announced its 3rd generation USB 3.0 hub controller, the VIA Labs VL812. The VL812 USB 3.0 Hub Controller utilizes a new low-power design and features an industry-first integrated 5V DC-DC switching regulator, offering a single-chip solution that achieves both high power efficiency and greater system integration for further reduced BOM.

In typical configurations, the VIA Labs VL812 USB 3.0 Hub Controller consumes less than 0.5w under load, making it one of the market's low-power leaders. The low operational power consumption of the new VIA Labs VL812 USB 3.0 Hub allows users to attach an external 2.5" USB 3.0 hard drive, USB 2.0 Flash drive, and a USB Mouse simultaneously without the need for an AC adapter, when connected to a regular USB 3.0 port.

VIA is out with its latest addition to the Artigo family of compact barebones PCs, the Artigo A1200, the company's latest addition after Artigo A1150. The A1200 is powered by VIA Nano X2 E dual-core processor clocked at 1.20 GHz, and VIA VX900 chipset that packs integrated graphics with enough compute power for smooth 1080p video playback, with hardware-accelerated decoding of MPEG-2, WMV9 and H.264 HD video formats. The system packs one DDR3 DIMM slot, supporting up to 4 GB of memory. There is room for one SATA HDD. Display outputs include D-Sub and HDMI. Other connectivity includes two gigabit Ethernet interfaces, one USB 3.0 and four USB 2.0 ports, optional 802.11 b/g/n, Bluetooth, and one CFAST interface. The system is fan-less, and passively cooled by heatsinks. Pricing and availability information is not known.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles allowing customers to rapidly develop new and exciting devices.

Measuring 95mm x 95mm, the VIA COMe-8X92 is based on the industry standard Computer-on-Module (COM) Express Compact form factor, developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). The VIA COMe-8X92 module combines a 1.2GHz VIA NanoTM X2 E-Series dual core processor and the VIA VX900H media system processor (MSP) providing a ruggedized solution targeted at industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Worldwide PC microprocessor revenues in the fourth calendar quarter of 2011 (4Q11) rose to $10.9 billion, up 1.8% compared to 3Q11 and up 14.2% compared to 4Q10, according to the latest PC microprocessor market share study from International Data Corporation (IDC). For the year 2011 compared to 2010, PC microprocessor revenues rose 13.2% to more than $41 billion.

"The average selling price (ASP) that OEMs pay for PC microprocessors rose more than 9% in 2011, making 2011 the second consecutive year of notable ASP increases," said Shane Rau, director of Semiconductors: Personal Computing research at IDC.

Looking at processor unit shipments in 2011 compared to 2010, overall shipments grew 3.6%. By form factor, mobile PC processor unit shipments grew 3.9% in 2011, while x86 server processor unit shipments grew 9.0%, and desktop processor unit shipments grew 2.7%.

ENERMAX is proud to announce the launch of its first portable USB audio & amplifier, DreamBass Genie. With the latest audio-remix technology, it turns your music into solid bass enhancement, full surround sound as if you are in live concert, and lets you redefine the real-stereo experience.

The perfect bass with wide-scale high definition audio output is always a dream for the audiophiles. Yet the conventional PC or NB is usually depressed by its dull, vague, compressed, and noisy sound output due to low cost audio-chip, entry-level audio remix software or limited PCB layout. ENERMAX DreamBass USB audio & amplifier is the remedy for music fanatics. With the latest VIA VT1620A chips, plus ENERMAX audio expert's unique bass algorithm and delicated low-interference PCB layout technique, DreamBassTM Genie provides solid bass, crystal clear sound and perfect audio separation. It simply makes your PC audio output equivalent to high-end Hi-Fi stereo amplifier, and lets you touch every musical note and tone.

VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today announced net sales for February 2012 of NT$ 307.27 million (US$ 10.46 million approximately). This sales revenue represents a 1.44 % month-on-month increase over revenues of NT$ 302.94 million (US$ 10.31 million) in January 2012.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on dynamic application segments, including medical, advanced gaming, industrial automation and digital signage.

Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PICMG (PCI Industrial Computer Manufacturers Group). COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board. The modular approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world's first quad core Mini-ITX boards featuring the latest VIA QuadCore E-Series processor. The VIA EPIA-M900 and VIA EPIA-M910 are the first two Mini-ITX boards to feature the 1.2 GHz VIA QuadCore E-Series processor, offering enhanced multi-tasking and superb multimedia performance on the lowest quad core power budget for next generation embedded products.

The VIA QuadCore E-Series processor features a highly optimized, energy efficient multi-core architecture, which is natively 64-bit compatible and comes with a host of additional performance features including Adaptive Overclocking. To meet the low power demands of the embedded market, the VIA QuadCore E-Series processor offers industry-leading energy efficiency, with the VIA QuadCore E-Series 1.2+ GHz processor delivering a thermal design power (TDP) of only 27.5 W. The distributed power of the VIA QuadCore E-Series processor makes it ideal for handling the most demanding HD video formats for immersive multi-display applications and environments.

Tensilica, Inc. today announced that VIA has selected Tensilica's Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs). After conducting a technical evaluation, VIA determined that Tensilica's DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.

SSDs require faster and more efficient data management and manipulation to increase their throughput (measured in Input/Output Operations per Second, or IOPS). With conventional processors, increasing the clock speed is the common way to increase performance. However, this increases energy consumption and die size, especially as speeds increase so much that designers are forced to move to more complex multi-core solutions.

HP today announced the powerful new HP t610 Flexible Series Thin Client and HP t510 Thin Client with industry-leading performance and security, enabling businesses to protect their data more effectively while improving employees' user experience.

The HP t510 and HP t610 come standard with dual-core CPUs and offer graphics cores that offload computing from the server to the chipset, enabling users to easily stream multimedia and work with high-definition (HD) graphics. The HP t510 and HP t610 also enable the use of multiple monitors and remote connections.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M910 Mini-ITX board, the latest dual core Mini-ITX board featuring one of the richest I/O sets available for a wide range of embedded applications including ATM, kiosks, POS, digital signage, healthcare and digital media applications.

The VIA EPIA-M910 is available in both active and passive cooling configurations with the choice of either a performance oriented 1.6 GHz VIA Nano X2 dual core processor or a fanless 1.0 GHz VIA Eden X2 dual core processor and is paired with the VIA VX900 media system processor, which provides the ideal platform for today's HD-intensive applications.

With the ever-shrinking laptops of today, space constrains mean that each component on the logic board has lesser board space, as is the case with audio. The cylindrical capacitors and FETs on PC motherboards are reduced to weaker surface-mount ones to conserve board space, on laptop logic boards. Audio quality takes a beating. Hence there's a sizable market for USB audio devices that provide better audio for laptops. Enermax' entry into it is the DreamBass AP001, a 2-channel USB audio device. It is designed to look like a vacuum tube that gives it a classy analog amp look.

In reality, it is completely digital. At the heart of it is a VIA VT1620A USB 2.0 2-channel HD audio CODEC, which provides stereo output with 24-bit resolution and 96 kHz sample-rate. It has a signal-noise ratio of 80~90 dBA, which is not much of a departure from most laptops' HDA CODECs, if it isn't for the MOSFET-based amplifier circuit packed into the DreamBass AP001, that's capable of 80Hz/+6dB Bass. The device features a 3.5 mm stereo jack and mic input. Enermax also has a variant called the AP001E, which includes earphones that have 10 mm drivers, 95 dBA SNR, and 32 ohm impedance. The DreamBass AP001 is priced at 3,280 JPY (US $43); the AP001E goes for 3,980 ($52.2). It could be a good investment if you think your laptop's audio sounds like a greeting card.

Besides the MSH61DK mentioned earlier today, Gigabyte Technology has recently unveiled another Mini-ITX motherboard, one M7V90PI which is based around VIA's VX900 chipset and is equipped with one Nano U3300 (1.2 GHz) single-core processor.

Aimed for the embedded market, the M7V90PI also packs (just) one DDR3 SO-DIMM slot, Chrome9 HD (DirectX 9) integrated graphics, a VIA Vinyl VT1708S audio codec, two SATA 3.0 Gbps ports, one PCIe x1 slot, Gigabit Ethernet, six USB 2.0 connectors, and D-Sub, plus DVI outputs.

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, announced the VIA Labs VO510 5-Gigabit Optical Transceiver which was showcased at CES 2012. The VIA Labs V0510 Optical Transceiver is used in USB 3.0 Active Optical Cables (AOC) which enables rapid data transfers and high-definition multimedia across distances of over 100 meters. Developed in collaboration with FOCI, PCL, OpTarget and UMEC, USB 3.0 AOC solutions offer exciting new possibilities in the use of USB 3.0 technology.

"This USB 3.0 AOC was designed to be fully compliant with SuperSpeed USB electrical specifications," said Dr. Janpu Hou, Vice President of FOCI. "We are very pleased to be a partner on this collaboration team. This partnership will accelerate the deployment of breakthrough USB 3.0 technologies and enable new applications for all USB 3.0 developers." As a partner of FOCI, Dr. Thomas Liu, President of PCL said "As the world leading optical transceiver ODM/CM company, PCL Technologies is excited to build and demonstrate the optical USB 3.0 cable in collaboration with VIA Labs and Foci. With the USB 3.0 AOCs providing higher data rates across much longer distances, we will enable usage scenarios in Digital Signage, Surveillance, and Zero Client applications."

VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its proprietary USB2Expressway Dedicated Bandwidth Technology for USB 3.0 Hubs which dramatically improves USB 2.0 performance when multiple devices are utilized. USB 3.0 Hubs featuring the technology eliminate USB 2.0 bandwidth limitations by providing full, dedicated bandwidth per port, allowing multiple USB 2.0 devices to be connected and operated at their maximum capabilities.

USB 2.0 provides 30-40MB/s of actual throughput, and this is shared across all connected devices. When multiple devices such as external hard drives, flash drives, and webcams are connected, they share available bandwidth which results in severely degraded performance. Compared to USB 2.0, USB 3.0 offers 10x more bandwidth and allows transfers as fast as 300-400MB/s. VIA Labs USB2 Expressway Dedicated Bandwidth Technology allows USB 2.0 devices to utilize USB 3.0 bandwidth, eliminating bandwidth bottlenecks and freeing each connected device to reach its maximum performance potential.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VB7009 embedded Mini-ITX board. Measuring only 17cm x 17cm, the VIA VB7009 Mini-ITX is an extremely flexible embedded board with top class functionality and performance for POS and kiosks.

The VIA VB7009 is a cost effective solution offering a broad range of power efficient VIA CPU choices, including the dual core VIA NanoTM X2 processor, providing superior flexibility to match customers' embedded computing needs. Paired with the VIA VX900 unified all-in-one media system processor, the VIA VB7009 Mini-ITX embedded board delivers a highly optimized platform that boasts stunning HD video performance of the most demanding video formats at resolutions of up to 1080p.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Android support for VIA x86 embedded platforms, starting with support for the VIA EITX-3002 Em-ITX board. Running Android on an x86 platform offers increased flexibility, great multimedia support and cost saving advantages for embedded applications such as in-vehicle entertainment and interactive kiosks.

Key advantages for Android on x86 include leverage of Android development resources and existing apps, rich I/O flexibility, greater CPU performance as well as higher display resolutions of up to 1920 x 1080. In addition VIA has released SMART ETK, an Embedded Tool Kit which allows monitoring and control of peripheral devices through the Android OS, allowing for greater environmental control of kiosk and other installed environments.

Do you want a really small PC that fits in the palm of your hand? Well, if you do, then VIA Technology have got you covered with their new ARTiGO A1150. As you can see from the pictures, it has a high 'cuteness' factor, due to its diminutive size of just 5.7" x 3.9" x 2". For processing, it sports a 64-bit VIA 1.0 GHz dual core Eden X2 CPU and a VX900H media system processor supporting the latest HD video codecs including H.264, VC-1 and MPEG-2/4 at up to 1080p. Interfaces include HDMI and VGA ports, a Gigabit Ethernet port, five USB ports including one USB device port, three audio jacks with optional wireless IEEE 802.11 b/g/n and SD card reader modules.

Target uses include the usual home/office environments, use as a super space-saving desktop PC, a home server, media streaming and surveillance applications. Of course, the real question is what kind of performance can one expect out if it, given that it's targeted at the desktop PC market, so one hopes that it can run Windows 7 at a decent performance level. Oddly, the VIA press release doesn't say anything about the RAM, so it's not clear how much can be fitted, which type and what speed grades are supported.

VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VE-900 Mini-ITX Mainboard, immediately available worldwide at incredibly competitive pricing. The VIA VE-900 Mini-ITX provides the ideal platform for DIY enthusiasts to custom build stylish home desktop and media center PCs.

Featuring a high-performance 1.4GHz VIA Nano X2 dual core processor and the VIA VX900 unified all-in-one media system processor, the VIA VE-900 Mini-ITX Mainboard delivers a highly optimized platform that boasts stunning HD video performance of the most demanding video formats at resolutions of up to 1080p. The VIA VE-900 Mini-ITX also supports high fidelity surround sound through the VIA VT1708S HD audio codec which delivers amazing stereo 24-bit resolution and up to 192kHz sample rates and adds HDMI support in a compact, power-efficient package.

In late September, S3 Graphics, still a subsidiary of VIA Technology and soon to be transferred to HTC, dragged Apple Inc. to court over charges of patent infringement related to graphics component IP of nearly all Apple products, including iPhone, iPad, iPod touch, and iMac. Last month, AMD, now a main supplier of graphics processors for Apple's Mac products, intervened with a counter lawsuit claiming it owned the patents that S3 has asserted against Apple, and sought an immediate halt to S3's patent case against Apple.

In an October 28 filing with the ITC, S3 says that a federal judge struck down a request for an immediate halt into S3's case, but the Commission is scheduled to release its final decision on November 15. The case struck down is (rather was) Advanced Micro Devices Inc. v. S3 Graphics Co., 11cv965, U.S. District Court for the District of Delaware (Wilmington).